JPS647645A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS647645A
JPS647645A JP16133187A JP16133187A JPS647645A JP S647645 A JPS647645 A JP S647645A JP 16133187 A JP16133187 A JP 16133187A JP 16133187 A JP16133187 A JP 16133187A JP S647645 A JPS647645 A JP S647645A
Authority
JP
Japan
Prior art keywords
pad
sections
lead
chip
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16133187A
Other languages
Japanese (ja)
Other versions
JPH0775253B2 (en
Inventor
Aizo Kaneda
Shozo Nakamura
Kunihiko Nishi
Hajime Murakami
Masao Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62161331A priority Critical patent/JPH0775253B2/en
Publication of JPS647645A publication Critical patent/JPS647645A/en
Publication of JPH0775253B2 publication Critical patent/JPH0775253B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To shorten a distance between the end of an LSI chip and the end of a package and to house a large chip into the package in small width while reducing thermal stress by forming a protruding section at the nose of a lead, connecting the protruding section and a pad section with conductive paste and sealing the lead and the chip with a resin. CONSTITUTION:A plurality of bonding pad sections 8 for an LSI chip 2 are disposed onto a chip 2 while protruding sections 7 are shaped at the noses of a lead 1 corresponding to each pad section 8, the protruding sections 7 from the lead 1 and said pad sections 8 are connected electrically with conductive paste 11, and these sections are sealed 5 with a resin. Bonding pad rows A, B in the LSI chip 2 are respectively localized and arranged oppositely to both end sections of the chip 2 while the protruding sections 7 are shaped at the noses of the lead 1 corresponding to each pad 8 in said pad rows A, B, and the protruding sections 7 in the lead 1 and the pads 8 are connected electrically with soft conductive paste 11. The pad rows A, B are disposed so that the pad rows A, B and both pin rows of a dual-in-line package are crossed at right angles, and sealed 5 with the resin.
JP62161331A 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof Expired - Lifetime JPH0775253B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62161331A JPH0775253B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62161331A JPH0775253B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS647645A true JPS647645A (en) 1989-01-11
JPH0775253B2 JPH0775253B2 (en) 1995-08-09

Family

ID=15733052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62161331A Expired - Lifetime JPH0775253B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0775253B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04124864A (en) * 1990-09-14 1992-04-24 Matsushita Electric Works Ltd Lead frame
EP0508462A2 (en) * 1991-04-12 1992-10-14 Texas Instruments Incorporated Microelectronic device incorporating an improved packaging scheme
EP0712159A3 (en) * 1994-11-08 1997-03-26 Oki Electric Ind Co Ltd Structure of resin molded type semiconductor
JP2003023133A (en) * 2001-07-06 2003-01-24 Matsushita Electric Ind Co Ltd Lead frame, plastic molded type semiconductor device using the same and its manufacturing method
JP2006186229A (en) * 2004-12-28 2006-07-13 Mitsui High Tec Inc Lead frame and semiconductor apparatus using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542354U (en) * 1978-09-13 1980-03-18
JPS5577164A (en) * 1978-12-07 1980-06-10 Nec Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542354U (en) * 1978-09-13 1980-03-18
JPS5577164A (en) * 1978-12-07 1980-06-10 Nec Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04124864A (en) * 1990-09-14 1992-04-24 Matsushita Electric Works Ltd Lead frame
EP0508462A2 (en) * 1991-04-12 1992-10-14 Texas Instruments Incorporated Microelectronic device incorporating an improved packaging scheme
EP0712159A3 (en) * 1994-11-08 1997-03-26 Oki Electric Ind Co Ltd Structure of resin molded type semiconductor
US6002181A (en) * 1994-11-08 1999-12-14 Oki Electric Industry Co., Ltd. Structure of resin molded type semiconductor device with embedded thermal dissipator
JP2003023133A (en) * 2001-07-06 2003-01-24 Matsushita Electric Ind Co Ltd Lead frame, plastic molded type semiconductor device using the same and its manufacturing method
JP2006186229A (en) * 2004-12-28 2006-07-13 Mitsui High Tec Inc Lead frame and semiconductor apparatus using the same

Also Published As

Publication number Publication date
JPH0775253B2 (en) 1995-08-09

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