JPS5577164A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5577164A
JPS5577164A JP15163878A JP15163878A JPS5577164A JP S5577164 A JPS5577164 A JP S5577164A JP 15163878 A JP15163878 A JP 15163878A JP 15163878 A JP15163878 A JP 15163878A JP S5577164 A JPS5577164 A JP S5577164A
Authority
JP
Japan
Prior art keywords
lead
paste
shortcircuit
joining
lead strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15163878A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15163878A priority Critical patent/JPS5577164A/en
Publication of JPS5577164A publication Critical patent/JPS5577164A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To join fine electrode pattern, without allowing occurrence of shortcircuit, by joining a semiconductor's electrode section with a matching lead terminal by coating electroconductive paste on them.
CONSTITUTION: AgPd paste is screen-printed at an electrode section 2 surrounding a pellet 1 formed with Al wire 5 through an SiO2 film on an Si substrate 3. Ag paste is print-coated onto a lead strip piece 7 of a lead frame 6. After completion of positioning of a group of lead strip pieces 7 and pellet electrodes 2, top-end section of the lead strip piece is pressured, adhered and thermally hardened. By using this method, it is possible to prevent occurrence of shortcircuit even in the case of joining of fine electrode.
COPYRIGHT: (C)1980,JPO&Japio
JP15163878A 1978-12-07 1978-12-07 Semiconductor device Pending JPS5577164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15163878A JPS5577164A (en) 1978-12-07 1978-12-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15163878A JPS5577164A (en) 1978-12-07 1978-12-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5577164A true JPS5577164A (en) 1980-06-10

Family

ID=15522918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15163878A Pending JPS5577164A (en) 1978-12-07 1978-12-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5577164A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507675A (en) * 1981-03-05 1985-03-26 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS647645A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0465441U (en) * 1990-10-19 1992-06-08
US6646355B2 (en) 1997-07-10 2003-11-11 International Business Machines Corporation Structure comprising beam leads bonded with electrically conductive adhesive

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507675A (en) * 1981-03-05 1985-03-26 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS647645A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0775253B2 (en) * 1987-06-30 1995-08-09 株式会社日立製作所 Semiconductor device and manufacturing method thereof
JPH01232735A (en) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0465441U (en) * 1990-10-19 1992-06-08
US6646355B2 (en) 1997-07-10 2003-11-11 International Business Machines Corporation Structure comprising beam leads bonded with electrically conductive adhesive

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