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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to JP15107676ApriorityCriticalpatent/JPS5374382A/en
Publication of JPS5374382ApublicationCriticalpatent/JPS5374382A/en
PURPOSE: To avoid deterioration of the dielectric strength caused by soldering the lead wire by forming an electrode covering the concave area of the Si substrate which is formed using SiO2 film as a mask and adhering a vicid material on the side surface of the electrode.