JPS55127035A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55127035A
JPS55127035A JP3443179A JP3443179A JPS55127035A JP S55127035 A JPS55127035 A JP S55127035A JP 3443179 A JP3443179 A JP 3443179A JP 3443179 A JP3443179 A JP 3443179A JP S55127035 A JPS55127035 A JP S55127035A
Authority
JP
Japan
Prior art keywords
cavity
cap
base
chip
active area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3443179A
Other languages
Japanese (ja)
Inventor
Masatoshi Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3443179A priority Critical patent/JPS55127035A/en
Publication of JPS55127035A publication Critical patent/JPS55127035A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the amount of incident α-rays over the active area on the chip surface for preventing malfunctions in the active area by forming an α-ray-shielding resin layer on the whole inner face of the cavity of a cap.
CONSTITUTION: To the periphery of the upper surface of an insulating base 10 made of ceramics, many leads 12 are bonded through a glass layer 11 of a low melting point. To the base of the cavity in the center of the upper surface of the base 10, a semiconductor chip 14 is bonded through a bonding layer 13. The chip 14 has an active area liable to malfunction by the α-ray irradiation on its surface. An insulating cap 16 made of ceramics has a cavity 16a in the center of one of its principal planes. The base 10 and the cap 16 are bonded together so that the cavity 16a is opposed to the chip 14. The whole inner face of the cavity 16a of the cap 16 is previously coated with an α-ray-shielding resin 18.
COPYRIGHT: (C)1980,JPO&Japio
JP3443179A 1979-03-26 1979-03-26 Semiconductor device Pending JPS55127035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3443179A JPS55127035A (en) 1979-03-26 1979-03-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3443179A JPS55127035A (en) 1979-03-26 1979-03-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55127035A true JPS55127035A (en) 1980-10-01

Family

ID=12414021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3443179A Pending JPS55127035A (en) 1979-03-26 1979-03-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55127035A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817642A (en) * 1981-07-10 1983-02-01 シ−メンス・アクチエンゲゼルシヤフト Protecting device for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817642A (en) * 1981-07-10 1983-02-01 シ−メンス・アクチエンゲゼルシヤフト Protecting device for semiconductor device

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