KR880009429A - 반도체 소자 고정용 내열 접착필름 - Google Patents

반도체 소자 고정용 내열 접착필름 Download PDF

Info

Publication number
KR880009429A
KR880009429A KR1019880000060A KR880000060A KR880009429A KR 880009429 A KR880009429 A KR 880009429A KR 1019880000060 A KR1019880000060 A KR 1019880000060A KR 880000060 A KR880000060 A KR 880000060A KR 880009429 A KR880009429 A KR 880009429A
Authority
KR
South Korea
Prior art keywords
heat
adhesive film
resistant adhesive
semiconductor devices
fixing semiconductor
Prior art date
Application number
KR1019880000060A
Other languages
English (en)
Inventor
유끼노리 사꾸모또
아쯔시 고시무라
히로시 마쯔시따
마사끼 쓰시마
Original Assignee
원본미기재
가부시끼 가이샤 도모에 가와세이시쇼
신꼬 덴기 고교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 가부시끼 가이샤 도모에 가와세이시쇼, 신꼬 덴기 고교 가부시끼 가이샤 filed Critical 원본미기재
Publication of KR880009429A publication Critical patent/KR880009429A/ko
Priority to KR2019940021708U priority Critical patent/KR940007545Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음.

Description

반도체 소자 고정용 내열 접착필름
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3 도는 본 발명의 내열 접착 필름이 적용되는 리드 프레임의 사시도.
제 4 도는 본 발명의 내열 접착 필름의 층구성을 도시하는 도면.
제 5 도는 본 발명의 내열 접착 필름을 사용한 반도체 장치의 단면도.

Claims (1)

  1. 내열성 필름으로 되는 지지체의 편면에 필요에 따라 표면처리층을 설치하고 또다른 한쪽의 면에 반경화상인 열경화성 수지로 되는 접착층을 설치한 것을 특징으로 하는 반도체 소자 고정용 내열 접착필름.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000060A 1987-01-09 1988-01-08 반도체 소자 고정용 내열 접착필름 KR880009429A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940021708U KR940007545Y1 (ko) 1987-01-09 1994-08-26 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1987001075U JPH073636Y2 (ja) 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム
JP?62-1075 1987-01-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019940021708U Division KR940007545Y1 (ko) 1987-01-09 1994-08-26 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device)

Publications (1)

Publication Number Publication Date
KR880009429A true KR880009429A (ko) 1988-09-15

Family

ID=30778641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000060A KR880009429A (ko) 1987-01-09 1988-01-08 반도체 소자 고정용 내열 접착필름

Country Status (2)

Country Link
JP (1) JPH073636Y2 (ko)
KR (1) KR880009429A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668576B2 (ja) * 1989-02-23 1997-10-27 株式会社 巴川製紙所 接着テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102137U (ko) * 1980-12-12 1982-06-23
JPS58169912A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd 半導体装置
JPS59146963U (ja) * 1983-03-22 1984-10-01 凸版印刷株式会社 リ−ドフレ−ム
JPS59231825A (ja) * 1983-06-14 1984-12-26 Toshiba Corp 半導体装置
JPS60167454A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS63110034U (ko) 1988-07-15
JPH073636Y2 (ja) 1995-01-30

Similar Documents

Publication Publication Date Title
KR900008701A (ko) 반도체 장치의 제조방법
KR920000091A (ko) 정특성더미스터와 그 제조방법 및 정특성더미스터를 이용한 저항기
DE3778079D1 (de) Polysiloxankontaktklebstoff.
KR880003427A (ko) 반도체 장치 및 그에 사용되는 리드프레임
DK203186D0 (da) Praeformet struktur samt kombination af to saadanne strukturer
DE3789518D1 (de) Verbundfolie und antistatische Verbundfolie.
KR920011768A (ko) 열전사지용 원지 및 그 원지를 사용한 열전사지
KR890017799A (ko) 연질면의 반도체 소자 접속장치
DE68902067D1 (de) Silikonkautschuk-klebefilm mit verbesserter adhaesion.
KR920003566A (ko) 반도체 발광장치
KR880000891A (ko) 프린터 탑재 단말기
KR880009450A (ko) 고체촬상 장치
KR920010792A (ko) 반도체 장치
ATE133499T1 (de) Lichtempfindliches element
KR880009429A (ko) 반도체 소자 고정용 내열 접착필름
DE3779202D1 (de) Amorphe duennfilmtransistoranordnung.
KR890003025A (ko) 칩고정 테이프
NO892611D0 (no) Silikon klebemiddel av smeltetype.
DE3870827D1 (de) Silikonkautschuk-klebstoffilm.
CH537977A (fr) Film thermostable recouvert d'une pellicule adhésive
KR900004040A (ko) 반도체 집적회로 디바이스
KR920007509A (ko) 박형 메모리 모듈
KR890006119A (ko) 접착층을 갖고 있는 표면 장착 장치
KR880009364A (ko) 카세트 리일
KR850002815A (ko) 액자의 유리상 코팅방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
WICV Withdrawal of application forming a basis of a converted application