KR890017799A - 연질면의 반도체 소자 접속장치 - Google Patents

연질면의 반도체 소자 접속장치 Download PDF

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Publication number
KR890017799A
KR890017799A KR1019880012188A KR880012188A KR890017799A KR 890017799 A KR890017799 A KR 890017799A KR 1019880012188 A KR1019880012188 A KR 1019880012188A KR 880012188 A KR880012188 A KR 880012188A KR 890017799 A KR890017799 A KR 890017799A
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KR
South Korea
Prior art keywords
soft
semiconductor device
flexible
plastic layer
flexible plastic
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Application number
KR1019880012188A
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English (en)
Inventor
씨.데그리 다비드
제이.픽 허버트
엘.한손 케빈
Original Assignee
듀안 둔게이
더 버그퀴스트 캄파니
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Application filed by 듀안 둔게이, 더 버그퀴스트 캄파니 filed Critical 듀안 둔게이
Publication of KR890017799A publication Critical patent/KR890017799A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

연질면의 반도체 소자 접속장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2 도는 반도체 소자장치의 외장부와 이를 위한 설치 표면사이에 끼이게 되는 본 발명 상호접속 수단을 갖는 완전한 캡슐형 반도체 장치의 사시도. 제 3 도는 제 2 도에 도시된 완전한 캡슐형 반도체 소자장치의 측면도로, 전형적인 세트조립대 표면에 본 발명 소자장치가 장착되어 있음.

Claims (7)

  1. 캡슐형 반도체 장치의 외장부와 이를 위한 설치표면 사이에서 캡슐형 반도체 소자장치와 그 장착 표면 사이의 열전도도를 향상시키기 위해 적당한 장소에 놓을 수 있는 장착을 위한 상호접속 수단에 있어서, (a)캡슐형 반도체 장치의 외장부 평면표면에 결합된 실리콘 고무, 에폭시, 폴리에스테르 및 폴리우레탄으로 이루어진 그룹으로부터 선택된 부드럽고 유연한 합성수지 플라스틱층을 포함하며, (b) 이때 상기의 브드럽고 유연한 층이 약 10밀 이하의 두께와 A-쇼어 척도로 약 10 내지 60인 경도를 가짐을 특징으로 하는 접속장치.
  2. 제 1 항에 있어서, 상기의 부드럽고 유연한 층이 실리콘 고무임을 특징으로 하는 접속장치.
  3. 제 1 항에 있어서, 상기의 부드럽고 유연한 층이 미립 형태의 열전도성 고체와 화합됨을 특징으로 하는 접속장치.
  4. 제 3 항에 있어서, 상기의 열전도성 미립고체가 알루미나, 붕소 니트라이드, 알루미늄 니트라이드, 알루미나 및 붕소 니트라이드 혼합물 그리고 금속입자의 그룹으로부터 선택됨을 특징으로 하는 접속장치.
  5. 제 1 항에 있어서, 부드럽고 유연한 플라스틱 층이 A-쇼어 척도로 약 20듀로미터인 경도를 가짐을 특징으로 하는 접속장치.
  6. 제 5 항에 있어서, 상기 부드럽고 유연한 플라스틱층이 실리콘 고무로 이루어집을 특징으로 하는 접속장치.
  7. 제 1 항에 있어서, 상기의 부드럽고 유연한 플라스틱 층이 압력에 민감한 접착제 필름으로 코팅됨을 특징으로 하는 접속장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880012188A 1988-05-26 1988-09-21 연질면의 반도체 소자 접속장치 KR890017799A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19919588A 1988-05-26 1988-05-26
US07/199,195 1988-05-26

Publications (1)

Publication Number Publication Date
KR890017799A true KR890017799A (ko) 1989-12-18

Family

ID=22736595

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880012188A KR890017799A (ko) 1988-05-26 1988-09-21 연질면의 반도체 소자 접속장치

Country Status (6)

Country Link
JP (1) JPH01305548A (ko)
KR (1) KR890017799A (ko)
CA (1) CA1307355C (ko)
DE (1) DE3836002A1 (ko)
FR (1) FR2632119B1 (ko)
GB (1) GB2219133B (ko)

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FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
DE4108667C2 (de) * 1991-03-16 2000-05-04 Bosch Gmbh Robert Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung
DE4237763C2 (de) * 1992-11-09 1996-01-25 Siemens Ag Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen
DE4302917C1 (de) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
FR2718600B1 (fr) * 1994-04-11 1996-06-14 Sagem Dispositif de bridage de composants électriques de puissance sur un châssis.
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19543920C2 (de) * 1995-11-24 2000-11-16 Eupec Gmbh & Co Kg Leistungshalbleiter-Modul
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
DE19734110C1 (de) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
DE19835127A1 (de) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
JP4976718B2 (ja) * 2005-03-25 2012-07-18 住友化学株式会社 固体撮像装置及びその製造方法
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device
JP5996435B2 (ja) * 2010-11-22 2016-09-21 株式会社東芝 半導体モジュールおよび半導体モジュールの製造方法
JP6315229B2 (ja) * 2013-06-27 2018-04-25 株式会社リコー 放熱部品、電子機器

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Also Published As

Publication number Publication date
FR2632119A1 (ko) 1989-12-01
DE3836002A1 (de) 1989-11-30
GB2219133A (en) 1989-11-29
JPH01305548A (ja) 1989-12-08
GB8823716D0 (en) 1988-11-16
GB2219133B (en) 1991-11-20
CA1307355C (en) 1992-09-08
FR2632119B1 (ko) 1994-09-02

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