GB8823716D0 - Soft-faced semiconductor component backing - Google Patents

Soft-faced semiconductor component backing

Info

Publication number
GB8823716D0
GB8823716D0 GB888823716A GB8823716A GB8823716D0 GB 8823716 D0 GB8823716 D0 GB 8823716D0 GB 888823716 A GB888823716 A GB 888823716A GB 8823716 A GB8823716 A GB 8823716A GB 8823716 D0 GB8823716 D0 GB 8823716D0
Authority
GB
United Kingdom
Prior art keywords
soft
semiconductor component
component backing
faced
faced semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB888823716A
Other versions
GB2219133B (en
GB2219133A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Publication of GB8823716D0 publication Critical patent/GB8823716D0/en
Publication of GB2219133A publication Critical patent/GB2219133A/en
Application granted granted Critical
Publication of GB2219133B publication Critical patent/GB2219133B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
GB8823716A 1988-05-26 1988-10-10 Thermally conductive mounting for a semiconductor component Expired - Fee Related GB2219133B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19919588A 1988-05-26 1988-05-26

Publications (3)

Publication Number Publication Date
GB8823716D0 true GB8823716D0 (en) 1988-11-16
GB2219133A GB2219133A (en) 1989-11-29
GB2219133B GB2219133B (en) 1991-11-20

Family

ID=22736595

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8823716A Expired - Fee Related GB2219133B (en) 1988-05-26 1988-10-10 Thermally conductive mounting for a semiconductor component

Country Status (6)

Country Link
JP (1) JPH01305548A (en)
KR (1) KR890017799A (en)
CA (1) CA1307355C (en)
DE (1) DE3836002A1 (en)
FR (1) FR2632119B1 (en)
GB (1) GB2219133B (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI88452C (en) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Design to improve cooling of a power transistor
DE4037488A1 (en) * 1990-11-24 1992-05-27 Bosch Gmbh Robert POWER COMPONENTS WITH ELECTRICALLY INSULATING THERMAL CONNECTION
DE4105152A1 (en) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Electronic circuit mounted onto heat sink for efficient cooling - has elements interconnected by bridging strips and uses common base of electrical insulating material
DE4108667C2 (en) * 1991-03-16 2000-05-04 Bosch Gmbh Robert Composite arrangement of a metallic base plate and a ceramic printed circuit board and method for their production
DE4237763C2 (en) * 1992-11-09 1996-01-25 Siemens Ag Device for the isolated fastening of heat-generating semiconductor components
DE4302917C1 (en) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Arrangement for heat dissipation of power components mounted on printed circuit boards
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
FR2718600B1 (en) * 1994-04-11 1996-06-14 Sagem Device for clamping electrical power components on a chassis.
DE19506664A1 (en) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Electric control apparatus for vehicle IC engine electromechanical mechanism
DE19543920C2 (en) * 1995-11-24 2000-11-16 Eupec Gmbh & Co Kg Power semiconductor module
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
DE19734110C1 (en) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Electrical device with heat sink mat for electronic component board
JPH11186003A (en) * 1997-12-25 1999-07-09 Yazaki Corp Heat sink structure of ptc device
JP4086946B2 (en) 1998-01-05 2008-05-14 日東電工株式会社 Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same
DE19835127A1 (en) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Circuit board with a heatsink and method for attaching a heatsink
JP3740117B2 (en) * 2002-11-13 2006-02-01 三菱電機株式会社 Power semiconductor device
JP4154325B2 (en) * 2003-12-19 2008-09-24 株式会社日立産機システム Electrical circuit module
JP4976718B2 (en) * 2005-03-25 2012-07-18 住友化学株式会社 Solid-state imaging device and manufacturing method thereof
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device
JP5996435B2 (en) * 2010-11-22 2016-09-21 株式会社東芝 Semiconductor module and method for manufacturing semiconductor module
JP6315229B2 (en) * 2013-06-27 2018-04-25 株式会社リコー Heat dissipation parts, electronic equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1086003A (en) * 1964-03-13 1967-10-04 Ass Elect Ind Mounting arrangements for electronic devices
GB1265007A (en) * 1968-12-09 1972-03-01
US3846824A (en) * 1973-06-13 1974-11-05 Gen Electric Improved thermally conductive and electrically insulative mounting systems for heat sinks
US4394530A (en) * 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
DE2860441D1 (en) * 1977-12-23 1981-02-26 Ibm A thermal interface between surfaces of a heat source and heat sink
EP0042693B1 (en) * 1980-06-21 1985-03-27 LUCAS INDUSTRIES public limited company Semi-conductor power device assembly and method of manufacture thereof
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
JPS6028252A (en) * 1983-07-26 1985-02-13 Toshiba Corp Resin-sealed semiconductor device
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
GB8610814D0 (en) * 1986-05-02 1986-06-11 Trw Transport Elect Ltd Adhesive mountings
DE3784906T2 (en) * 1987-01-28 1993-10-07 Unisys Corp Method using an elastic film to manufacture an integrated circuit package with contact pads in a stepped pit.

Also Published As

Publication number Publication date
GB2219133B (en) 1991-11-20
CA1307355C (en) 1992-09-08
DE3836002A1 (en) 1989-11-30
JPH01305548A (en) 1989-12-08
KR890017799A (en) 1989-12-18
FR2632119B1 (en) 1994-09-02
FR2632119A1 (en) 1989-12-01
GB2219133A (en) 1989-11-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20041010