JP4976718B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a solid-state imaging device and a manufacturing method thereof.

Conventionally, a hollow glass / ceramic type case has been used for a solid-state imaging device. However, since the cost is high, a resin hollow case is being developed recently (see Patent Document 1).
However, the solid-state imaging device using the hollow resin case has several problems in practical use.
For example, a surplus of the resin melt that protrudes from the mold during case molding, so-called burrs, is often generated, and these burrs become dust during manufacture of the solid-state imaging device, and are difficult to remove completely even in the cleaning process. As a result, after the resin hollow case is closed, a part of the dust is scattered in the case and adheres to the light receiving surface of the solid-state image sensor, which may cause the image sensor to malfunction.
Moreover, as a lid material for closing the resin hollow case, a transparent plate such as transparent glass or transparent resin is mainly used, but the resin that forms the case and the metal or glass that forms the lid material, etc. Since the difference in thermal expansion is large, deformation such as warping of the case due to heat during molding or mounting is usually large. If such deformation occurs, the focus of the incident light is shifted, which may cause a problem that the solid-state imaging device cannot read an image accurately. In order to prevent the deformation as described above, it has been proposed to use an adhesive having an elastic modulus of 5 GPa or less as an adhesive used when the lid member is attached to the case (see Patent Document 2). However, the effect is not sufficient, and in the case of a long case such as a one-dimensional image sensor, warping still tends to occur.
As described above, there is a problem that the solid-state imaging device does not function correctly.
JP-A-6-163950 JP 2000-12719 A

  The present invention has been made in view of the above circumstances, and prevents malfunction of the solid-state imaging device due to dust caused by burrs or the like generated in the molding process of the resin hollow case, and further improves the airtightness of the hollow case. Another object of the present invention is to provide a solid-state imaging device capable of achieving at least one of improving the warpage of the resin hollow case itself and causing an accurate imaging function, and a manufacturing method thereof.

As a result of intensive studies, the present inventors have solved at least one of the above problems by forming the resin hollow case with a thermoplastic resin and providing a resin using a curable resin at a specific part of the case. The present inventors have found out what can be done and have completed the present invention. That is, the present invention provides a solid-state imaging device shown in [1] below.
[1] Thermoplastic which is integrally formed from a substantially rectangular resin bottom plate and a resin side wall substantially suspended from the periphery of the bottom plate, a metal lead terminal is inserted, and an opening is closed by a transparent plate A solid-state imaging device having a resin hollow case, a metal island is installed on the inner bottom surface of the hollow case, and a solid-state image sensor is fixed on the island,
(A) the inner surface of the hollow case,
(B) a boundary portion between the metal lead terminal and the inner surface of the hollow case, and (c) a joint portion between the hollow case and the transparent plate,
A solid-state imaging device, characterized in that a cured resin obtained by curing the curable resin-forming composition is disposed at any one of the positions, and the durometer hardness of the cured resin is 80 or less on an A scale.
[2] The cured resin includes at least one selected from the group consisting of epoxy resins, unsaturated polyester resins, phenol resins, urea / melamine resins, polyurethane resins, silicone resins, polyimide resins, and acrylate resins. It is preferable.
The present invention also provides a solid-state imaging device shown in the following [3] and [4] for a metal island including a solid-state imaging device and a bottom surface in a hollow case.
[3] The solid-state imaging device according to [1] or [2], including a pair of protrusions that are in contact with both ends of the island in the width direction and extend along the longitudinal direction of the island.
[4] The solid-state imaging according to any one of [1] to [3], wherein a groove is disposed in the inner bottom surface of the case along the longitudinal direction in the vicinity of the side surface of the island. apparatus.
Further, in the present invention, the cured resin-forming composition is preferably [5] as described below, which is convenient for production.
[5] The solid-state imaging device according to any one of [1] to [4], wherein the curable resin-forming composition is ultraviolet curable.
The present invention also provides the following manufacturing method according to the solid-state imaging device.
[6] (I) It is integrally formed from a substantially rectangular resin bottom plate and a resin side wall substantially suspended from the periphery of the bottom plate, a metal lead terminal is inserted, and the opening is formed by a transparent plate Molding a hollow case made of thermoplastic resin that can be closed;
(II) fixing the solid-state imaging device to the inner bottom surface of the case;
(III) electrically connecting the electrode of the solid-state imaging device and the metal lead terminal by a bonding wire;
(IV) closing the case opening with a transparent plate;
A manufacturing method of a solid-state imaging device provided in this order,
(I) Applying the curable resin-forming composition A to the inner surface of the case and curing it to form the cured resin A, whereby at least a part of the inner surface of the case and / or the lead terminal in the case and the inner surface of the case A step of covering the boundary part with a cured resin, and
(Ii) The curable resin-forming composition B was applied to the portion of the opening of the case that was in contact with the transparent plate, and the opening was closed with the transparent plate, and then the curable resin-forming composition B was cured. A step of sealing the opening with the cured resin B;
A method for manufacturing a solid-state imaging device, comprising at least one step selected from:
However, the following curable resin-forming composition A and cured resin composition B may be the same or different.
The curable resin-forming composition A in the production method of [6] is preferably any one of the following [7] to [9].
[7] The method for producing a solid-state imaging device according to [6], wherein the viscosity of the curable resin-forming composition A is 5,000 mPa · sec or less.
[8] The method for producing a solid-state imaging device according to the above [6] or [7], wherein the volume shrinkage due to the curing of the curable resin forming composition A is 5% or less.
[9] The method for producing a solid-state imaging device according to any one of [6] to [8], wherein the curable resin-forming composition A is ultraviolet curable.
When the curable resin-forming composition A shown in [9] above is ultraviolet curable, the following production method is particularly preferable.
[10] When the curable resin-forming composition A is irradiated with ultraviolet rays to form the curable resin A, the weight of the curable resin A is 99.8% of the weight of the curable resin-forming composition A before curing. The manufacturing method of the solid-state imaging device according to [9], which is 100% or less.
[11] In the step (i), an ultraviolet curable resin-forming composition A is applied to the inner surface of the hollow case, and the resin-forming composition A is irradiated with ultraviolet rays through the sealed transparent plate to form the cured resin A. Thus, the solid according to the above [9] or [10], which is a step of covering at least a part of the inner surface of the hollow case and a boundary portion between the metal lead terminal and the resin portion in the case with a cured resin. Manufacturing method of imaging apparatus.
On the other hand, it is preferable that the curable resin-forming composition B in the production method [6] is any one of the following [12] to [13].
[12] The method for producing a solid-state imaging device according to any one of [6] to [11], wherein the curable resin-forming composition B has a viscosity of 10,000 mPa · sec or more.
[13] The method for producing a solid-state imaging device according to any one of [6] to [12], wherein the curable resin-forming composition B is ultraviolet curable.
When the curable resin-forming composition A shown in [13] above is ultraviolet curable, the following production method is particularly preferable.
[14] In the step (ii), an ultraviolet curable resin-forming composition B is provided between the upper surface of the hollow case and the transparent plate, and the resin-forming composition is irradiated with ultraviolet rays through the transparent plate. A method of manufacturing a solid-state imaging device, which is a step of closing the case.
According to the manufacturing method shown in the above [6] to [14], the solid-state imaging device of the present invention, preferably the solid-state imaging device shown in the above [2] to [5] can be easily manufactured.

In this way, the solid-state imaging device of [15] is manufactured.
The present invention also provides a solid-state imaging device shown in [16] below.
[16] A resin case main body having a recess composed of a bottom plate and a side wall substantially suspended from the periphery of the bottom plate, an island provided on the inner bottom surface of the bottom plate and for fixing a solid-state imaging device, on the island A solid-state imaging device fixed to the lead, a lead terminal extending from the inside of the recess through the side wall to the outside of the case body, a bonding wire connecting the solid-state imaging device and the lead terminal, and both ends in the width direction of the island A solid-state imaging device comprising: a pair of protrusions (piers) extending along the longitudinal direction of the island; and a first cured resin in contact with each outer side surface of the protrusions .
The pair of protrusions can restrict movement of the island in the width direction. The light receiving surface of the solid-state imaging device is exposed, and a sufficient amount of light can be incident on the light receiving surface. The first cured resin is blocked by the outer side surface of the protrusion and does not exist on the light receiving surface. Therefore, according to the solid-state imaging device, accurate imaging can be performed.

The present invention also provides a solid-state imaging device shown in [17] below.
[17] The solid-state imaging device according to [16], further including a transparent plate that closes the concave portion of the case body, and a second cured resin interposed between the case body and the transparent plate. The second cured resin can bond the transparent plate and the case main body.
The present invention also provides a solid-state imaging device shown in [18] below.
[18] The solid-state imaging device according to [17], wherein the first curable resin and the second curable resin are continuous.
The first cured resin and the second cured resin can be applied in the same process, and the structure is simplified.
The present invention also provides a solid-state imaging device shown in [19] below.
[19] The solid-state imaging device according to any one of [16] to [18], wherein the first cured resin covers a connection portion between the bonding wire and the lead terminal.
Since the first cured resin covers the connection portion, the deterioration of the connection portion can be prevented.

  According to the above-described invention, malfunction of the solid-state imaging device due to dust can be prevented, and airtightness in the hollow case can be further ensured. For this reason, it is possible to prevent moisture from entering from outside the case and preventing condensation inside the case. In addition, according to the present invention, it is possible to significantly reduce the warpage of the solid-state imaging device after sealing the transparent plate. The solid-state imaging device having such effects can provide a more practical solid-state imaging device among solid-state imaging devices including a resin hollow case that can be expected to reduce costs. Therefore, according to the solid-state imaging device, accurate imaging can be performed.

  Hereinafter, a solid-state imaging device and a manufacturing method thereof according to embodiments will be described. The same reference numerals are used for the same elements, and redundant description is omitted.

  One embodiment of the solid-state imaging device of the present invention is integrally formed from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery thereof, and a metal lead terminal 40 is inserted. The resin hollow case 20 whose opening can be closed by the transparent plate 26, wherein at least a part of the resin part on the inner surface of the hollow case 20 and the boundary part between the lead terminal 40 and the resin part are cured with the resin forming composition. It is covered with a cured resin 32.

  Also, one embodiment of the method for manufacturing a solid-state imaging device according to the present invention is integrally formed from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery thereof, and a metal lead terminal. The step of fixing the solid-state imaging device 12 to the inner bottom surface of the resin hollow case 20 in which the opening 40 is inserted and the opening can be closed by the transparent plate 26, the electrode of the solid-state imaging device 12 and the metal lead terminal 40 are bonded to the bonding wire 42 A step of electrically connecting the inner surface of the hollow case 20 and applying a resin-forming composition to the inner surface of the hollow case 20 to form a cured resin 32, whereby at least a part of the resin portion on the inner surface of the resin case 20 and the leads in the case The step of covering the boundary portion between the terminal 40 and the resin portion with the cured resin is included in this order.

  1 is a schematic cross-sectional view (II-I cross-sectional view) of the solid-state imaging device shown in FIG. 2 cut at a portion where lead terminals are inserted.

  A solid-state imaging device 10 of the present invention shown in FIG. 1 has a resin hollow case 20 that houses a solid-state imaging element 12 and a transparent plate 26 that closes the opening of the hollow case. A provided metal island 30 (hereinafter, also simply referred to as “island”) is provided for fixing the solid-state imaging device 12. The solid-state imaging device 12 can image light incident from outside the imaging device through the transparent plate 26, and electrical information recorded in response to the incident light by the solid-state imaging device 12 is electrically connected to the solid-state imaging device 12. It can be taken out of the solid-state imaging device 10 through the lead terminal 40 connected to the.

  Instead of the lead terminal 40, a metal protrusion may be provided on the electrode pad, and a wiring board made of an insulating film and a conductor wiring may be electrically connected via the metal pad.

  The solid-state imaging device 12 includes a pixel array that generates signal charges in response to incident light and a reading unit that has a function of sequentially reading the signal charges in the pixel array. The solid-state imaging device is preferably a semiconductor imaging device having a large number of pixel arrays. For example, a one-dimensional image sensor (linear sensor) having a one-dimensional pixel array and a two-dimensional image array sensor (area sensor) having a two-dimensional pixel array. Broadly divided. In the solid-state imaging device or the manufacturing method thereof of the present invention, a linear sensor or an area sensor can be used as the solid-state imaging device, but a linear sensor can be preferably used. Examples of the image sensor include a CCD image sensor, a CMOS image sensor, a CMD, a charge injection device, an infrared image sensor, and the like. Moreover, the typical length of a linear sensor is 2-15 cm, Preferably it is 3-10 cm.

  Examples of the solid-state imaging device of the present invention include a facsimile, a scanner, and a barcode reader.

  The resin hollow case 20 is integrally formed from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery of the bottom plate 22. Both the substantially rectangular resin bottom plate 22 and the resin side wall 24 have appropriate thicknesses so as to have mechanical strength.

  That the resin bottom plate 22 is “substantially rectangular” means that it includes a substantially rectangular shape in addition to a square shape and a rectangular shape. The term “substantially rectangular” means that it has parallel long sides, but includes a shape that is not perpendicular to the long side even if the short side is a straight line, or that the short side is not a straight line, and a very long ellipse. is there. In addition, the shape of the bottom plate of the hollow case 20 having parallel long sides may be a shape that lacks the four corners of a rectangle, a shape in which a rectangular corner is rounded, or a shape in which a short side is not a straight line but a semicircle. Are included in the “substantially rectangular shape”.

  The resin side wall 24 is substantially suspended from the periphery of the substantially rectangular resin bottom plate 22. The shape and outer area of the resin side wall 24 in contact with the resin bottom plate 22 are substantially the same as those of the resin bottom plate 22. The term “substantially vertically” is intended to include not only a resin side wall provided strictly vertically but also a resin side wall provided slightly extending toward the opening. “Slightly spread” means having an inclination within 45 °, preferably within 30 ° from the vertical direction.

  The overall shape of the hollow case can be formed by arbitrarily combining the shape of the resin bottom plate and the installation angle of the resin side wall. The hollow case has a region where a metallic island can be placed on the inner bottom surface of the hollow case 20 regardless of the overall shape.

  A metal lead terminal 40 is inserted (embedded) in the resin hollow case 20 used in the present invention.

  The lead terminal 40 electrically and mechanically connects the solid-state imaging device and an external circuit. The lead terminal 40 is made of metal, and a known metal can be used. Examples of the metal include copper, a copper alloy, and an iron alloy, and 42 alloy that is an alloy of copper or iron 58% nickel 42% can be preferably used. These metals (alloys) can be used after being plated, and examples of the plating material include gold, silver, nickel, and solder.

  The lead terminal 40 preferably uses a lead frame, is molded integrally with the resin composition when the hollow case 20 is molded, and is then subjected to processing such as bending or cutting to form a lead terminal.

  The solid-state imaging device 12 fixed on the island 30 is connected to a lead terminal 40 for guiding the read signal charge to the outside of the solid-state imaging device 10. In FIG. 1, the solid-state imaging device 12 is connected to a lead terminal 40 by a bonding wire 42. In order to guide the signal charges read from the solid-state imaging device to the outside of the solid-state imaging device, the electrodes of the solid-state imaging device and lead terminals are connected by bonding wires or the like. The bonding wire 42 is a fine metal wire, and is preferably made of gold, aluminum, copper, and an alloy containing them as a main component. The bonding wire connection method depends on the material of the conductive wire, and examples thereof include a ball bonding method and a wedge bonding method.

  After performing electrical wiring using a bonding wire or the like, the solid-state imaging device 10 is obtained by sealing the opening of the hollow case 20 with the transparent plate 26. For sealing, a radiation curable, moisture curable, or thermosetting resin-forming composition can be used, which will be described in detail later.

  You may provide the notch which inserts a transparent board in the inner periphery of the opening part of the resin-made side walls 24. FIG.

  The hollow case 20 is closed by the transparent plate 26. Here, the transparent plate refers to a plate-like member having a transmittance of 80% or more, preferably 90% or more in incident light used for imaging, generally visible light (400 to 700 nm) and near infrared region. When the imaging device is a barcode reader, the transmittance of the red semiconductor laser at a wavelength of 650 nm is important.

  Examples of the material of the transparent plate 26 include glass, acrylic resin, polycarbonate, and cycloolefin unit-containing polymer.

  After the hollow case opening is closed with the transparent plate 26, the opening can be sealed with a thermosetting or photocurable adhesive RE. The resin forming composition 32 for covering the inner surface of the case and sealing the transparent plate may be cured by irradiating ultraviolet rays through the transparent plate 26. After the case inner surface coating resin-forming composition 32 is thermally cured, the transparent plate sealing resin-forming composition (adhesive RE) can be photocured. The transparent plate 26 made of glass or a polymer containing a cycloolefin unit is preferably used from the viewpoints of ultraviolet light transmittance and heat resistance.

  At least a part of the resin part on the inner surface of the hollow case and the boundary part between the lead terminal 40 and the resin part (the inner surface of the case) are covered with a cured resin 32 obtained by curing the resin forming composition. By covering with the cured resin 32, even if dust based on burrs generated during molding of the hollow resin case is mixed in the case, it can be prevented from being scattered and the transparent plate 26 is sealed in the opening. Thus, the airtightness of the closed hollow case can be further ensured, so that the malfunction of the image sensor can be prevented. For the purpose of preventing the generation of dust and improving the airtightness, as shown in FIG. 1, all or almost all of the resin part of the inner surface of the hollow case and the boundary part of the resin part / metal lead terminal part are formed. It is preferable that all and the entire surface of the lead terminal 40 are covered with the cured resin 32. Here, “almost all” means 80% or more of the resin portion on the inner surface of the case.

  In one embodiment of the method for manufacturing a solid-state imaging device of the present invention, the step of fixing the solid-state imaging device 12 to the inner bottom surface of the resin hollow case 20, the electrodes of the solid-state imaging device 12 and the metal lead terminals 40 are bonded to the bonding wires 42. Subsequent to the electrical connection step, the resin-forming composition is applied to the inner surface of the hollow case 20 to form the cured resin 32, whereby at least a part of the resin portion of the inner surface of the resin case and the leads in the case are formed. A step of covering the boundary between the terminal 40 and the resin portion with the cured resin 32;

  It is preferable to wash the hollow case 20 before fixing the solid-state imaging device 12. For this cleaning, known cleaning methods such as ultrasonic cleaning, jet cleaning, and spray cleaning can be used.

  As the cured resin 32 for sealing the transparent plate and covering the inner surface of the hollow case, known thermosetting resins, moisture curable resins, visible light curable resins and ultraviolet curable resins can be used, and epoxy resins, Examples thereof include unsaturated polyester resins, phenol resins, urea / melamine resins, polyurethane resins, silicone resins, polyimide resins, and acrylate resins. Resin-forming compositions that form these resins include additives such as polymerization initiators, cross-linking agents, reaction accelerators, and other inorganic fillers for the monomers, oligomers, and polymers that form the resin. Etc. are appropriately combined according to the application. The same resin may be used as the curable resin for sealing the transparent plate and the curable resin for covering the inner surface of the hollow case, or different curable resins may be used.

  As the curable resin 32 for sealing the transparent plate and for covering the inner surface of the hollow case, it is preferable to use an ultraviolet curable resin among the above-mentioned various curable resins because it can be cured in a short time. It is most preferable that both the fixing resin for fixing the inner surface and the inner surface of the hollow case are ultraviolet curable resins. When both the cured resin for sealing the transparent plate and the cured resin for coating the inner surface of the hollow case are ultraviolet curable resins, a resin-forming composition that covers the inner surface of the hollow case and a resin-forming composition that seals the transparent plate In addition, after the upper surface of the hollow case is closed with a transparent plate, it can be cured at the same time by irradiating ultraviolet rays from the upper surface of the case, and the manufacturing cost can be reduced.

  Examples of ultraviolet curable resins include acrylate resins formed by radical polymerization from acrylate monomers, polyester acrylate oligomers, urethane acrylate oligomers, epoxy acrylate oligomers, etc., epoxy resins formed by cationic polymerization from epoxy compounds, octacene compounds, and polysiloxanes. Examples thereof include silicone resins formed from derivatives by radical polymerization or cationic polymerization. Of these, epoxy resins and silicone resins are preferably used.

  The ultraviolet curable resin-forming composition used in the present invention is not limited as long as it is cured by irradiation with ultraviolet rays (several tens to 400 nm), and is visible light (over 400 to 700 nm) curable, thermosetting, or moisture. It may have a curable property.

  The ultraviolet curable resin-forming composition for coating the inner surface of the hollow case has a ratio of change in cured weight due to ultraviolet irradiation (percentage of the weight of the cured resin after curing with respect to the weight of the resin-forming composition before curing) of 99.8%. The content is preferably 100% or less and more preferably 99.9% or more and 100% or less. Further, as the solid-state imaging device of the present invention, the ultraviolet curable resin-forming composition exhibiting such a rate of change in cured weight is applied to a predetermined portion of the inner surface of the hollow case, and the predetermined portion is covered by irradiating with ultraviolet rays. It is preferable to be made. If the weight of the cured resin after curing is significantly smaller than the weight of the resin-forming composition before curing, the components volatilized during curing may adversely affect the solid-state image sensor, and ultraviolet rays may be transmitted through the transparent plate. When irradiated, volatilized components may adhere to the transparent plate and cause fogging.

The cured weight change rate is measured under the following conditions. The weight of the cured resin after curing is about 3,000 mJ / weight relative to the uncured resin-forming composition placed in a glass container having an open top surface of about 25 mm in diameter so as to have a thickness of about 3 mm. This is the weight immediately after curing of the cured resin that was cured by irradiating it with ultraviolet rays (365 nm) of cm ² in an atmosphere of 23 ° C. and 50% RH, and the weight of the resin-forming composition before curing is hermetically sealed ultraviolet shielding It is the weight of the resin-forming composition immediately after taking out from the conductive container and putting it in the glass container.

  It is preferable that the cured resin used for sealing the hollow case opening also has the above-mentioned cured weight change rate.

  As a method of applying the resin forming composition to at least a part of the inner surface of the hollow case and the boundary portion between the lead terminal 40 and the resin portion, a method of injecting the resin forming composition into the hollow case from a nozzle using a dispenser Is exemplified.

  FIG. 2 is a plan view of the solid-state imaging device 10. FIG. 3 is a perspective view of the solid-state imaging device 10 shown in FIG. In the figure, the transparent plate is removed.

  The metal island 30 is an optional member, and can be used as a flat portion for fixing the solid-state imaging device 12. When the metal island 30 is provided, the metal island 30 can be formed on the inner bottom surface of the resin hollow case 20 having a concave cross section so as to be in contact therewith. The solid-state imaging device 12 can be fixed on the island 30. There is no particular limitation on the fixing means. The solid-state imaging device 12 can be fixed to the island with an adhesive, solder, or the like, preferably fixed with an adhesive, and more preferably fixed with an insulating adhesive. The adhesive used for fixing the solid-state imaging device 12 preferably has high thermal conductivity, more preferably 1 W / mK or more, and still more preferably 3 W / mK or more.

  The inner bottom surface of the hollow case is covered with a cured resin 32 obtained by curing the resin forming composition.

  When the metal island 30 is provided, the shape thereof is not particularly limited, but is preferably a rectangle having an aspect ratio of 4 or more, and more preferably an aspect ratio of 4 to 100.

  It is also preferable to provide a notch adjacent to one or more side edges in the longitudinal direction of the island. The adjacent cutouts are alternately provided from the opposite side of the opposing long side of the island. Moreover, this notch is not uniformly provided in the longitudinal direction of the island, and when a plurality of adjacent notch groups are provided, it is preferable to provide them at a certain distance.

  The island 30 is made of metal, but examples of the metal include copper, copper alloy, aluminum, aluminum alloy, and iron alloy, and copper, aluminum, aluminum alloy, gold-plated copper, and 42 alloy can be preferably used. The island 30 may have a protruding portion that protrudes in a direction perpendicular to the longitudinal direction, and the protruding portion may form an island pressing portion that is partially embedded in the case and fixed.

  The resin hollow case used in the present invention can be formed by injection molding, injection compression molding, compression molding, transfer molding, or the like. Resins that can be used for molding can be broadly classified into moldable thermosetting resins and thermoplastic resins, and any resin is preferably selected from the viewpoints of flame retardancy, electrical insulation, strength and rigidity. From the viewpoint that the molding cycle can be shortened and the molding cost can be reduced, it is preferable to use a thermoplastic resin and form the hollow case by an injection molding method.

  Examples of thermosetting resins that can be used to manufacture the hollow case include phenolic resins, urea resins, melamine resins, diallyl phthalate resins, epoxy resins, polyurethane resins, polyimide resins, and unsaturated polyester resins. Epoxy resins are preferably used.

  The thermoplastic resin that can be used in the present invention includes polystyrene resin, acrylic resin, polycarbonate resin, polyester resin, polyamide resin, polyacetal resin, polyphenylene ether resin, fluorine resin, polyphenylene sulfide resin, polysulfone resin, polyarylate resin, polyether. Examples thereof include imide resins, polyether sulfone resins, polyether ketone resins, liquid crystalline polymers, polyamide imide resins, polyimide resins and the like, and polyester resins, polyamide resins, polyphenylene sulfide resins, and liquid crystalline polymers are preferably used. These resins may be used alone or in combination as a polymer alloy. The liquid crystal polymer can be preferably used in the present invention because it is excellent in fluidity, heat resistance and rigidity.

  The outline of the resin is described in “Polymer Dictionary” (published by Maruzen Co., Ltd., September 20, 1994) and references cited therein.

  When forming the hollow case used for this invention, the resin composition which added the suitable filler to resin can be used. The filler to be used can be appropriately selected from the purposes of improving strength, rigidity, heat resistance, improving dimensional accuracy, lowering the linear expansion coefficient, and the like. Fillers that can be used for such purposes include glass fiber (milled glass fiber, chopped glass fiber, etc.), glass beads, hollow glass sphere, glass powder, mica, talc, clay, silica, alumina, titanic acid. Potassium, wollastonite, calcium carbonate, magnesium carbonate, sodium sulfate, calcium sulfate, barium sulfate, calcium sulfite, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicate, silica sand, silica, quartz, titanium oxide, Zinc oxide, iron oxide, graphite, molybdenum, asbestos, silica alumina fiber, alumina fiber, gypsum fiber, carbon fiber, carbon black, white carbon, diatomaceous earth, bentonite, sericite, shirasu, graphite and other inorganic fillers, potassium titanate Muwisuka, alumina whisker, aluminum borate whisker, silicon carbide whisker, and the like can be exemplified metal whiskers or non whiskers such as silicon nitride whiskers. It is preferable to use carbon black that provides a light shielding effect and an effect of preventing irregular reflection of light inside the case.

  Next, the cured resin 32 that covers at least a part of the inner surface of the resin case and the boundary between the lead terminal and the resin portion in the case will be described in detail.

  One embodiment of the method for manufacturing the solid-state imaging device 10 of the present invention is integrally formed from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery thereof, and the metal lead terminal 40. Are inserted, and the step of molding the resin hollow case 20 whose opening can be closed by the transparent plate 26, the step of fixing the solid-state imaging device 12 to the inner bottom surface of the case, the electrodes of the solid-state imaging device 12 and the metal lead terminals 40 is electrically connected by a bonding wire 42, and a resin-forming composition is applied to the inner surface of the hollow case 20 to form a cured resin 32, thereby forming at least a part of the inner surface of the resin case and the inside of the case. A method of manufacturing a solid-state imaging device including the steps of covering the boundary portion between the lead terminal 40 and the resin portion with the cured resin 32 in this order, wherein the viscosity of the resin-forming composition is 25 ° C. Oite, is less than or equal to 10,000mPa · sec.

  Here, the viscosity of the resin-forming composition is measured according to the single cylinder rotational viscometer method described in JIS K7233. It is preferable that the viscosity of the resin forming composition is 10,000 mPa · sec or less because the resin forming composition supplied into the case 20 has sufficient fluidity and spreads as a thin film in the case 20 in a short time.

  In addition, after forming the hollow case 20, it is preferable to wash and dry the hollow case 20 before fixing the solid-state imaging device 12. For this cleaning, known cleaning methods such as ultrasonic cleaning, jet cleaning, and spray cleaning can be used.

  The resin-forming composition for coating the inner surface of the hollow case preferably has a viscosity at 25 ° C. of 10,000 mPa · sec or less, more preferably 10 to 10,000 mPa · sec, and more preferably 10 to 5,000 mPa · sec. More preferably. Here, said viscosity is a value obtained by the measurement based on the single cylinder rotational viscometer method described in JIS K7233.

  When the viscosity of the resin-forming composition before curing is high, workability for the application of the resin-forming composition to the resin case inner surface with a dispenser (liquid precision quantitative discharge device) or the like is reduced, or bubbles are mixed, When the thickness of the resin-forming composition covering the inner surface of the case is increased, curing by ultraviolet irradiation may be insufficient.

  In addition, in order to adjust the viscosity or volume shrinkage of the resin-forming composition, or to adjust the durometer A hardness of the cured resin, a monofunctional curable component is appropriately used in combination with a polyfunctional curable component. be able to.

  In order to seal the opening with the transparent plate, the above-mentioned cured resin for covering the inner surface of the hollow case can be used. The same resin may be used as the curable resin for sealing the transparent plate and the curable resin for covering the inner surface of the hollow case, or different curable resins may be used.

  The cured resin used in the present invention preferably has a predetermined indentation hardness.

  The curable resin 32 for coating the inner surface of the hollow case preferably has a durometer hardness (Shore hardness) defined in JIS K7215 of type A (also referred to as “durometer A hardness”) of 80 or less. More preferably, it is 50, and it is further more preferable that it is 1-30. When the durometer hardness is in the above range, the cured resin has an appropriate hardness, so that the cured resin 32 does not peel off from the inner wall of the resin case to generate dust, and the airtightness in the case. This is preferable because it does not cause a decrease in the thickness of the bonding wire 42 and the bonding wire 42 that connects the lead terminal 40 and the image sensor 12.

  The curable resin (adhesive RE) used for the adhesive layer for sealing the opening with a transparent body also preferably has a durometer A hardness of 80 or less, more preferably 1 to 50, and 1 to 30. More preferably it is. When the adhesive RE has the durometer A hardness, since the adhesive layer has an appropriate hardness, the transparent plate 26 resulting from the difference in linear expansion coefficient between the resin case 20 and the transparent plate 26 is sealed. It is preferable because it is possible to prevent the subsequent occurrence of warpage of the solid-state imaging device and to prevent the imaging performance of the imaging element from being hindered.

  The volume shrinkage ratio is determined by measuring the density of the resin-forming composition and the cured product obtained by curing the resin by curing the resin cured at room temperature according to the method specified in Appendix 3 of JIS K6901: 1999. Based on this value, the volume shrinkage is calculated by the following formula.

  Volumetric shrinkage = ((D2-D1) / D2) × 100

Here, D1 represents the density of the resin-forming composition before curing, and D2 represents the density of the cured product. The UV curing reaction is measured at 23 ± 0.1 ° C. with respect to a cured resin obtained by using a mercury lamp having a dominant wavelength of 365 nm and irradiating ultraviolet rays of 3,000 mJ / cm ² or more.

  With respect to a resin composition that cures at a temperature higher than room temperature, the volume shrinkage can be measured by the method specified in Appendix 3 above. The specific measurement operation conforms to the operation specified for the epoxy resin or unsaturated polyester resin.

  The resin-forming composition used in the present invention preferably has a volume shrinkage with curing of 5% or less, more preferably 4% or less.

  When the volumetric shrinkage is in the above range, there is no concern of damaging the wire bonding with the formation of the cured resin, and the generated cured resin does not peel from the inner surface of the case, so the airtightness of the hollow case Is preferable because it can be stably maintained.

  The open end of the hollow case can be sealed with a thermosetting or photocurable adhesive or the like. The resin forming composition for covering the inner surface of the case and sealing the transparent plate may be simultaneously cured by irradiating ultraviolet rays through the transparent plate. The resin-forming composition for sealing a transparent plate can be photocured after the case-covering resin-forming composition is thermally cured.

  Next, the adhesive RE for attaching the transparent plate to the case will be described.

  One embodiment of a method for manufacturing a solid-state imaging device according to the present invention is formed integrally from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery of the bottom plate 22, and a metal lead terminal. The step of forming the resin hollow case 20 having the opening 40 inserted therein, the step of fixing the solid-state image pickup device 12 to the inner bottom surface of the hollow case 20, the electrode of the solid-state image pickup device 12 and the metal lead terminal 40 are electrically connected. A solid-state imaging device including a step of connecting, and a step of applying an adhesive RE to the opening of the hollow case and closing the opening with the transparent plate 26 and then curing the adhesive RE to seal the opening The viscosity of the adhesive RE is 10,000 mPa · sec or more, and the durometer hardness of the adhesive RE after curing is 80 or less on the A scale.

The details will be described below.
The adhesive RE used in the method for manufacturing a solid-state imaging device of the present invention preferably has a viscosity of 10,000 mPa · sec or more, and preferably has a durometer hardness after curing of 80 or less on an A scale. Here, the viscosity of the adhesive RE is measured according to the single cylinder rotational viscometer method described in JIS K7233. Further, the durometer hardness of the cured adhesive RE is measured according to the indentation hardness measurement method described in JIS K7215.

  The adhesive used in the present invention has a viscosity at 25 ° C. of preferably 10,000 mPa · sec or more, more preferably 10,000 to 150,000 mPa · sec, and more preferably 30,000 to 100,000 mPa · sec. More preferably, it is sec. Here, said viscosity is a value obtained by the measurement based on the single cylinder rotational viscometer method described in JIS K7233. It is preferable that the viscosity of the adhesive is 10,000 mPa · sec or more because the adhesive layer between the hollow case and the transparent plate has a sufficient thickness, and the hollow case is less likely to be warped or distorted. .

  The adhesive RE used in the present invention preferably has a durometer hardness (Shore hardness) after curing of type A (A scale) (also referred to as “durometer A hardness”) of 80 or less. It is more preferably 1 to 50, and further preferably 1 to 30. Here, said durometer hardness is a value obtained by the measurement based on the indentation hardness measuring method described in JIS K7215. If the durometer hardness of the adhesive after curing exceeds 80, the warpage in the solid-state imaging device after sealing the opening, which is caused by the difference in the linear expansion coefficient between the resin case and the transparent plate, may occur. This cannot be prevented, and the imaging performance of the solid-state imaging device is degraded.

  As a method of applying the adhesive RE to the opening of the hollow case, a known method can be used, and a method of applying an adhesive from a nozzle to a target site using a dispenser is exemplified.

  As the adhesive RE used in the present invention, a radiation curable, moisture curable, or thermosetting adhesive satisfying the above viscosity and durometer hardness can be used. It is preferable to use a curable resin, a thermosetting resin, and a moisture curable resin.

  In addition, the adhesive used in the present invention may have ultraviolet ray (several tens to 400 nm) curable properties, visible light (over 400 to 700 nm) curable properties, thermosetting properties, or moisture curable properties.

  Specific examples of these resins include acrylate resins, epoxy resins, silicone resins, unsaturated polyester resins, phenol resins, urea / melamine resins, polyurethane resins, and polyimide resins.

  Among them, it is preferable to use an ultraviolet curable resin as the adhesive used in the present invention. When the adhesive is an ultraviolet curable resin, it can be cured in a short time, so that the productivity is excellent, and the temperature rise of the case and the transparent plate 26 is low at the time of curing. It is difficult for stresses such as warpage and distortion to occur due to differences in the linear expansion coefficients.

  The ultraviolet curable resin is as described above.

  In the adhesive used in the present invention, if necessary, additives such as a polymerization initiator, a crosslinking agent, a reaction accelerator, an inorganic filler such as silica, a rubber component, etc. may be added according to the use, These additives, fillers and the like may be used in appropriate combination.

  Further, in order to adjust the viscosity of the adhesive or to adjust the durometer A hardness of the adhesive after curing, the monofunctional curable component can be appropriately made into a polyfunctional curable component, They can also be used in combination.

  One embodiment of a method for manufacturing a solid-state imaging device according to the present invention is formed integrally from a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery of the bottom plate 22, and a metal lead terminal. The step of forming the resin hollow case 20 having the opening 40 inserted therein, the step of fixing the solid-state image pickup device 12 to the inner bottom surface of the hollow case 20, the electrode of the solid-state image pickup device 12 and the metal lead terminal 40 are electrically connected. And connecting the adhesive RE to the opening of the hollow case 20 and closing the opening with the transparent plate 26, and then curing the adhesive RE to seal the opening. Each of the above steps is a general step per se, and a known method can be used.

  When forming the hollow case 20 used in the present invention, a resin composition in which an appropriate filler is added to a resin can be used.

  Hereinafter, a specific configuration of the solid-state imaging device including the above-described solid-state imaging element housing case will be described.

  FIG. 4 is a detailed exploded perspective view of the solid-state imaging device including the solid-state imaging element housing case.

The solid-state imaging device 10 of the present invention shown in FIG. 4 is made of a resin having a recess composed of a bottom plate 22 (not shown in FIG. 4; see FIGS. 1 and 3, etc.) and a side wall 24 substantially suspended from the periphery thereof. The case body 20, the island 30 for fixing the solid-state image sensor 12 provided on the inner bottom surface of the bottom plate 22, the solid-state image sensor 12 fixed on the island 30, and penetrating the side wall 24 from within the recess. The lead terminal 40 extending to the outside of the case body 20, the bonding wire 42 (not shown in FIG. 4, refer to FIGS. 1 to 3, etc.) for connecting the solid-state imaging device 12 and the lead terminal 40, the island A pair of protrusions 101 (not shown in FIG. 4; see FIGS. 5 to 7, etc.) that are in contact with both ends in the width direction of the island 30 and extend along the longitudinal direction of the island 30, and the outer sides of the protrusions 101 ~ side Characterized in that it comprises a first hardening resin 32 in contact with.
In FIG. 4, the solid-state image sensor housing case 100 has a housing recess DP in which the solid-state image sensor 12 is to be placed, and the length direction X dimension is three times or more the width direction dimension. A case main body (hollow case) 20 made of a material and a plurality of lead terminals 40 extending from the inside of the housing recess DP to the outside through side walls 24 parallel to the longitudinal direction X of the case main body 20 are provided.

  This solid-state imaging device includes a solid-state imaging device housing case 100, a solid-state imaging device 12 provided in the housing recess DP, and a transparent plate 26 that closes the opening of the housing recess DP. The aspect ratio of the case main body in FIG. When a liquid crystal polymer is used as the material of the case body 20 having a high aspect ratio, a polymer alignment state aligned in the longitudinal direction can be obtained, and the heat resistance, strength characteristics, and low thermal expansion properties are excellent. Moreover, as mentioned above, the filler which consists of an inorganic material is suitably contained in resin. That is, rigidity can be further increased by including a filler made of an inorganic material in the resin. A case having high rigidity synergistically can be constituted by a combination of the liquid crystal polymer and the inorganic material filler. The filler is composed of a plurality of fibrous bodies or needle-like bodies, and the aspect ratio of each individual fibrous body or needle-like body is preferably 5 or more.

  The aspect ratio of the solid-state image sensor 12 is preferably 3 or more. The solid-state image sensor 12 is a one-dimensional CCD (line sensor). Since the solid-state imaging device 12 having a high aspect ratio is easily bent, the present invention is particularly effective when such a solid-state imaging device 12 is used. Note that the solid-state imaging element 12 may be fixed to the island 30 only at both ends in the longitudinal direction of the island 30.

  Reinforcing portions 105 are provided at both ends in the longitudinal direction of the solid-state image sensor housing case 100. The reinforcing portion 105 is formed integrally with the side wall 24 and protrudes outward along the longitudinal direction X from both longitudinal ends of the case body 20. The XY cross section of the reinforcing portion 105 forms a substantially U shape together with both end portions of the case body 20. The reinforcing portion 105 suppresses warping and bending in a direction perpendicular to the side wall 24. A part of the lead frame may be exposed in the space inside the reinforcing portion 105.

  The side wall 24 of the case main body 20 has a plurality of concave portions (meat stealing portions: concave grooves) 104 extending in the longitudinal direction X with the width direction Y being the depth direction. Thereby, the flow of the resin at the time of resin molding can be made uniform, and the weight can be reduced.

  FIG. 5 is a perspective view of the central portion of the case for housing a solid-state imaging device including the island 30 having the slits (notches) 132. 6 is a cross-sectional view of the solid-state imaging device storage case shown in FIG.

  The case body 20 is provided with a pair of resin ribs 103 provided integrally with the bottom plate 22 along the longitudinal direction X of the bottom plate 22 of the case body 20. A concave groove LGR is formed between the pair of ribs 103. Although the case body 20 has a high aspect ratio that is likely to cause distortion and is made of resin, this apparatus has the rib 103 extending in the longitudinal direction X, so that the longitudinal direction of the case body 20 is increased. Warpage and bending in a direction perpendicular to the direction X can be suppressed. The number of ribs 103 is preferably plural, and from the viewpoint of increasing rigidity, the rib 103 is preferably located on an extension line in the height direction Z of the side wall 24.

  The solid-state image sensor housing case 100 is provided on the bottom surface of the recess DP, and extends into the island 30 to which the solid-state image sensor 12 is to be fixed, and the side wall 24 that is continuous with the island 30 and extends along the longitudinal direction of the case body 20. The island holding part 34 is provided. Since the island pressing portion 34 extends to the inside of the side wall 24, the movement of the island 30 with respect to the case body 20 can be restricted. Therefore, the warpage of the island 30 and the warpage of the solid-state imaging device 12 are suppressed, The deterioration of the characteristics can be suppressed. Further, heat can be radiated to the outside through the island pressing portion 34.

  The island 30 includes slits (notches) 132 extending from one end in the width direction toward the other end at positions excluding both ends. Stress is easily concentrated on the island portion in the vicinity of the slit 132, the island portion bends, and the expansion / contraction is absorbed. Therefore, the bending of the solid-state imaging device 12 can be suppressed.

The solid-state imaging element housing case 20 includes at least a pair of island pressing portions 34 that are continuous with the island 30 and extend into the side wall 24 along the longitudinal direction of the case body 20. The pair of island pressing portions 34 are separated along the longitudinal direction X, and the slit 132 is provided in the vicinity of the central position J between the pair of island pressing portions 34. The position of the island pressing part 34 is defined by the position of the center line of the island pressing part 34 along the width direction of the island 30. When the distance between the pair of island pressing portions 34 is X ₀ , the distance X ₁ from the position of one island pressing portion 34 to the central position J and the distance X ₂ from the other island pressing portion 34 to the central position J are: , it is equal to X _0/2.

  As described above, since the pair of island pressing portions 34 exists, warping of the island 30 is suppressed, but the position of the pair of island pressing portions 34 is fixed to the side wall 24, so that the island 30 between them is fixed. The stress is likely to be applied in the vicinity of the central position J. Since the slit 132 is provided in the vicinity of the central position J, stress is absorbed at this position, the island portion is bent, and the expansion / contraction is absorbed, so that bending of the solid-state imaging device 12 is suppressed. I can do this.

  The slit 132 includes a first slit 132A and a second slit 132B. The first slit 132A extends from one end to the other end in the width direction of the island 30, and the second slit 132B The first slit 132 </ b> A and the second slit 132 </ b> B are arranged with the central position J in between, extending from the other end in the width direction of the island toward the one end.

  In this case, the twist direction around the longitudinal direction of the island 30 at the formation position of the first slit 132A is opposite to the twist direction around the longitudinal direction of the island 30 at the formation position of the second slit 132B. Further, the twist around the longitudinal direction of the island 30 can be offset, and the twist around the longitudinal direction of both ends of the island 30 can be suppressed. Further, since the first slit 132A and the second slit 132B have a point-symmetric tendency around the point P on the island 30 between the first slit 132A and the second slit 132B, the island 30 When the thermal expansion in the longitudinal direction occurs, the movement in the width direction of the island 30 relative to the center line in the longitudinal direction of the island 30 is suppressed.

  The deepest portion D of the slit 132 is formed by a curved surface. This curved surface partially includes a cylindrical surface centered on the Z axis parallel to the thickness direction of the island 30. In this case, when stress concentrates on the island 30 in the formation part of the slit 132, since local stress concentration in the deepest part D can be relieved, the durability of the island 30 is excellent. In addition, since the deepest part of the slit is formed of a curved surface, it is possible to reduce the occurrence of burrs during molding.

  The inside of the slit 132 is filled with a relatively soft cured resin 32, and the island 30 at the site where the slit 132 is formed can be easily bent and can absorb expansion and contraction. The cured resin 32 is applied to the inner surface portion of the case main body 20 and is also applied to the boundary portion between the lead terminal 40 and the inner surface of the case main body 20. The curable resins 32 and RE have a durometer hardness of 80 or less on the A scale.

  Further, the case body 20 includes a pair of protrusions (piers) 101 that are in contact with both ends of the island 30 in the width direction. The protrusion 101 extends along the longitudinal direction of the island 30. The pair of protrusions 101 can restrict the movement of the island 30 in the width direction. The width in the short direction of the protrusion is preferably 0.1 to 1 mm, and more preferably 0.2 to 0.5 mm. Further, the widths of the pair of protrusions may be different from each other. The case main body 100 includes a pair of concave grooves SGR extending along the longitudinal direction of the island 30, and the side surface of each protrusion 101 constitutes one side surface of each concave groove SGR. That is, in the vicinity of the side surface of the island 30, a concave groove (groove) SGR is disposed along the longitudinal direction on the inner bottom surface of the case. The protrusion 101 is located at the position where the slit 132 is formed. It is not provided, and the island 30 in the formation part of the slit 132 can be easily deformed.

  Further, the light receiving surface of the solid-state imaging device 12 is exposed, and a sufficient amount of light can be incident on the light receiving surface. The first cured resin 32 is blocked by the outer side surface of the protrusion 101 and does not exist on the light receiving surface. Therefore, according to the solid-state imaging device, accurate imaging can be performed.

  The transparent plate 26 (see FIG. 4) closes the concave portion DP of the case body 20, but the second cured resin RE is interposed between the case body 20 and the transparent plate 26. That is, the cured resin RE is present at the joint between the case body 20 and the transparent plate 26. The second cured resin RE can bond the transparent plate 26 and the case body 20 together.

  Further, it is preferable that the first cured resin 32 and the second cured resin RE are continuous, that is, the first cured resin and the second cured resin are partially in contact with each other. Since the first cured resin 32 and the second cured resin RE can be applied in the same process, the structure is simplified. The first cured resin 32 covers the connection portion between the bonding wire 42 and the lead terminal 40 (see FIG. 1), and can prevent deterioration of the connection portion.

  FIG. 7 is a perspective view of the central portion of the case for housing a solid-state imaging device provided with divided islands.

  The pair of islands 30, 30 are separated along the longitudinal direction of the case body 20. That is, the islands 30 and 30 are separated, and the island is not fixed to the case body part 20A between the two islands 30 and 30, so the case body part 20A is easily bent and absorbs expansion and contraction. It is possible to suppress the bending of the solid-state imaging device 12. Further, the central portion of the solid-state imaging device having no island in the lower portion may be a cavity from the lower portion of the device to the bottom surface of the case, and a resin portion having the same height as the island as shown in FIG. 7 is formed. May be.

  FIG. 8 is a diagram for explaining a method for manufacturing the case for storing a solid-state imaging device.

  When performing the above-described injection molding of the case for housing the solid-state imaging device, the resin RE1 is poured between the first mold M1 and the second mold M2 having the above-described case-shaped cavity between the opposing surfaces. The first mold M1 and the second mold M2 constitute a case molding mold. A lead frame 50 is inserted between the first mold M1 and the second mold M2.

  The second mold M2 has a tapered resin introduction hole M21 extending in the Z direction, and has a communication passage M22 extending in the X direction from the tip of the resin introduction hole M21. The leading end of the communication passage M22 forms a gate portion, from which resin RE1 is introduced into the cavity, and the resin flows in the cavity along the X direction. Therefore, when the resin RE1 is a liquid crystal polymer, the orientation of the polymer constituting the resin RE1 is preferably aligned in the X direction.

  After filling and solidifying the resin, when the solidified resin is pushed in the direction of the second mold M2 with a plurality of ejector pins EP penetrating the first mold M1, a case for housing a solid-state imaging device is completed. That is, the method of the present invention includes a step of injecting and solidifying a resin into the cavities of the molds M1 and M2. Thereafter, the solid-state image pickup device 12 is fixed on the island 30, and then the solid-state image pickup device 12 and the lead terminal 40 are electrically connected by a bonding wire. Finally, the upper opening of the case is connected to the transparent plate 26. Sealing is performed to complete the above-described solid-state imaging device.

  As described above, one embodiment of the above-described method for manufacturing a solid-state imaging device is integrally formed from (I) a substantially rectangular resin bottom plate 22 and a resin side wall 24 substantially suspended from the periphery of the bottom plate 22. At the same time, a step of forming the hollow case 20 made of thermoplastic resin in which the metal lead terminal 40 is inserted and the opening can be closed by the transparent plate 26, and (II) the solid-state imaging device 12 on the inner bottom surface of the case 20. (III) a step of electrically connecting the electrode of the solid-state imaging device 12 and the metal lead terminal 40 with a bonding wire, and (IV) a step of closing the case opening with the transparent plate 26. It prepares in this order.

  Further, (i) by applying the resin-forming composition A to the inner surface of the case and curing it to form a cured resin A (32), at least a part of the inner surface of the case and / or the lead terminal 40 in the case and the inner surface of the case And (ii) applying the curable resin-forming composition B (RE) to the portion of the opening of the case that contacts the transparent plate 26, and opening the opening with the transparent plate 26. After the closing, at least one step selected from the step of sealing the opening with the cured resin B obtained by curing the curable resin-forming composition B is provided.

  The viscosity of the curable resin-forming composition A is preferably 5,000 mPa · sec or less, and the curable resin-forming composition A has a volume shrinkage ratio of 5% or less accompanying the curing of the curable resin-forming composition A. It is preferable that when the curable resin forming composition A is irradiated with ultraviolet rays to form the curable resin A, the weight of the curable resin A is curable resin forming composition A before curing. 99.8% or more and 100% or less of the weight.

  In the step (i), an ultraviolet curable resin-forming composition A is applied to the inner surface of the hollow case, and ultraviolet rays are irradiated through the sealed transparent plate 26 to make the resin-forming composition A a curable resin A. Thus, at least a part of the inner surface of the hollow case and a boundary portion between the metal lead terminal 40 and the resin portion in the case are covered with the cured resin 32.

  Further, as described above, the viscosity of the curable resin-forming composition B is preferably 10,000 mPa · sec or more.

  The curable resin forming composition B is preferably UV curable, and the step (ii) provides the UV curable resin forming composition B (RE) between the upper surface of the hollow case and the transparent plate 26. This is a step of closing the case by irradiating ultraviolet rays through the transparent plate 26 and using the resin forming composition as a cured resin.

  Hereinafter, the present invention will be described in detail with reference to examples.

(Comparative Example 1)
A resin-made hollow in which lead terminals are inserted by inserting a lead frame made of gold-plated copper alloy into the mold and injection-molding a liquid crystalline polymer (Sumika Super E6008 B (manufactured by Sumitomo Chemical Co., Ltd.)) A case (width 50 mm × depth 10 mm × height 4 mm, thickness 2 mm) was obtained. The obtained resin hollow case was washed with ultrapure water in a Class 1000 clean room, then immersed in 500 ml of ultrapure water, and subjected to ultrasonic cleaning (38 kHz) for 20 seconds. The number of dust present in the water after removal was measured. In-particle particle counter CLS-700 (manufactured by PMS) was used for the measurement of the number of dust. As a result of the measurement, dust having a size of 2 microns or more existing in water after ultrasonic cleaning was about 1,030 particles / ml.

Example 1
After applying a UV curable silicone resin-forming composition (TB 3161 manufactured by ThreeBond Co., Ltd.) to the inner surface of the resin hollow case obtained in Comparative Example 1 using a dispenser, about 3000 mJ / cm by a mercury lamp. ^The resin-forming composition was cured by irradiating ² ultraviolet rays (365 nm). The number of dusts was measured in the same manner as in Comparative Example 1 for the obtained resin hollow case. As a result of the measurement, there are about 180 particles / ml of dust with a size of 2 microns or more present in the water after ultrasonic cleaning. By coating the inner surface of the case with resin, dropping of the dust from the inner surface of the case is greatly suppressed. The effect was confirmed. In addition, the UV cure weight change rate of the said TB3161 was 99.93%.

(Comparative Example 2)
After applying the above-mentioned ultraviolet curable silicone resin forming composition (TB3161 manufactured by ThreeBond Co., Ltd.) to the resin hollow case obtained in Comparative Example 1 using a dispenser at the transparent plate sealing position on the upper surface of the case The upper surface of the case was closed with a glass transparent plate, and then the resin-forming composition was cured by irradiating an ultraviolet ray (365 nm) of about 3,000 mJ / cm ² with a mercury lamp, and the hollow case was sealed. As a result of evaluating the airtightness of the obtained hollow case using a helium gas leak tester HELEN A-250M-LD (manufactured by Anerva Technics Co., Ltd.), helium gas leak was detected.

(Example 2)
In contrast to the resin hollow case obtained by coating the inner surface of the case obtained in Example 1 with a cured resin, a hollow case having an upper surface closed with a transparent plate was obtained in the same manner as in Comparative Example 2. As a result of evaluating the airtightness of the obtained hollow case in the same manner as in Comparative Example 2, almost no helium gas leak was detected, and the resin part / metal lead terminal part boundary on the inner surface of the case was coated with a cured resin. As a result, the effect of improving the airtightness of the case was confirmed.

Example 3
The resin-made hollow case with lead terminals manufactured in Example 1 was washed with ultrapure water in a class 1000 clean room, then immersed in 500 ml of ultrapure water and subjected to ultrasonic cleaning (38 kHz) for 20 seconds. The resin hollow case was washed and dried. After fixing the linear sensor to the inner surface of the resin case with an adhesive, the linear sensor and the lead terminal were wired with a bonding wire.

Apply the UV curable silicone resin-forming composition (TB 3161 manufactured by ThreeBond Co., Ltd.) to the inner surface of the wired resin hollow case using a dispenser, and also between the transparent plate and the opening. After coating the silicone resin composition, the resin-forming composition was cured by irradiating an ultraviolet ray (365 nm) of about 3,000 mJ / cm ^{2 with} a mercury lamp to obtain a solid-state imaging device. When the obtained resin hollow case was observed, cloudiness was not confirmed on the transparent plate.

Example 4
A resin-made hollow in which lead terminals are inserted by inserting a lead frame made of gold-plated copper alloy into the mold and injection-molding a liquid crystalline polymer (Sumika Super E6008 B (manufactured by Sumitomo Chemical Co., Ltd.)) A case (width 50 mm × depth 10 mm × height 4 mm, thickness 2 mm) was obtained.

  The resin hollow case with the lead terminal is washed with ultrapure water in a class 1000 clean room, then immersed in 500 ml of ultrapure water, and subjected to ultrasonic cleaning (38 kHz) for 20 seconds. The hollow case made was washed and dried. After fixing the linear sensor to the inner surface of the resin case with an adhesive, the linear sensor and the lead terminal were wired with a bonding wire.

An ultraviolet curable silicone resin-forming composition using a dispenser on the inner surface of a wired resin hollow case (TB 3080, manufactured by Three Bond Co., Ltd.) has a viscosity of 500 mPa · sec at 25 ° C. And the same silicone resin composition (adhesive RE) was applied between the transparent plate 26 and the opening. The resin-forming composition supplied to the inner surface of the case with the dispenser spread almost uniformly and thinly on the inner surface of the case. The resin-forming composition was cured by irradiating ultraviolet rays (365 nm) of about 3,000 mJ / cm ^{2 with} a mercury lamp to obtain a solid-state imaging device.

The resin test piece obtained by curing the TB3080 had a durometer A hardness of A10.
Even after UV curing, no peeling of the cured resin from the inner surface of the case was observed.

(Comparative Example 3)
In Example 4, instead of using TB3080 manufactured by ThreeBond Co., Ltd., TB3164 manufactured by ThreeBond Co., Ltd. (viscosity 50,000 mPa · sec, volume shrinkage 0.39%, durometer A hardness after curing is A30) The procedure was exactly the same except that was used. The resin forming composition (cured resin 32) supplied by the dispenser did not spread uniformly on the inner surface of the case, and air bubbles were likely to remain between the inner surface of the case and the cured resin composition.

(Comparative Example 4)
In Example 4, instead of using TB3080 manufactured by ThreeBond Co., Ltd., TB3026 manufactured by ThreeBond Co., Ltd. (viscosity 19,000 mPa · sec, volume shrinkage 7.5%, durometer D hardness after curing is D85) The procedure was exactly the same except that was used. It was confirmed that the resin-forming composition (cured resin 32) supplied by the dispenser did not spread uniformly on the inner surface of the case, and the resin cured by ultraviolet irradiation was partially peeled from the inner surface of the case. .

(Example 5)
A resin-made hollow in which lead terminals are inserted by inserting a lead frame made of gold-plated copper alloy into the mold and injection-molding a liquid crystalline polymer (Sumika Super E6008 B (manufactured by Sumitomo Chemical Co., Ltd.)) A case (width 50 mm × depth 10 mm × height 4 mm, thickness 2 mm) was obtained.

  The resin hollow case with the lead terminal is washed with ultrapure water in a class 1000 clean room, then immersed in 500 ml of ultrapure water, and subjected to ultrasonic cleaning (38 kHz) for 20 seconds. The hollow case made was washed and dried. After fixing the linear sensor to the inner bottom surface of the resin case with an adhesive, the linear sensor and the lead terminal were wired with a bonding wire.

After drying the resin-made hollow case that has been wired, an ultraviolet curable adhesive Loctite 5088 (manufactured by Henkel Japan Co., Ltd., viscosity at 25 ° C .: 65,000 mPa · sec) is applied to the opening using a dispenser, After the opening was closed with a transparent plate, the adhesive was cured by irradiating an ultraviolet ray (365 nm) of about 3,000 mJ / cm ^{2 with} a mercury lamp to obtain a solid-state imaging device.

  The resin test piece obtained by curing the Loctite 5088 had a durometer A hardness of 30.

  In the obtained solid-state imaging device, the maximum amount of warp based on a straight line connecting both ends in the longitudinal direction of the case bottom plate was 20 μm.

(Comparative Example 5)
In Example 5, UV curable adhesive XE17-303 (manufactured by GE Toshiba Silicone Co., Ltd., viscosity at 25 ° C .: 4,000 mPa · sec, durometer A hardness after curing: 17) was used as the adhesive. Produced a solid-state imaging device in exactly the same manner as in Example 1.
The maximum amount of warpage of the obtained solid-state imaging device was 55 μm.

(Comparative Example 6)
In Example 5, UV curable adhesive (manufactured by Chemitech Co., Ltd., viscosity at 25 ° C .: 600 mPa · sec, durometer D hardness after curing: 80) was used as the adhesive. A solid-state imaging device was manufactured in the same manner. In addition, durometer D hardness was calculated | required by the measurement based on the indentation hardness measuring method as described in JISK7215 similarly to durometer A hardness.

  The maximum amount of warpage of the obtained solid-state imaging device was 102 μm, and peeling was observed on a part of the adhesive surface between the transparent plate and the resin case opening.

It is the cross-sectional schematic which cut | disconnected the example of the solid-state imaging device of this invention in the apparatus center part. It is a top view which shows an example of the resin-made hollow cases which can be used for the solid-state imaging device of this invention. It is a perspective view which shows typically an example of the resin-made hollow cases used for the solid-state imaging device of this invention. The cured resin is not shown. It is a detailed exploded perspective view of an example of a solid-state imaging device provided with a case for storing a solid-state imaging element. It is a perspective view which shows an example of the solid image pick-up element storage case center part provided with the island which has a notch. It is kk sectional drawing of the case for solid-state image sensor accommodation shown in FIG. It is a perspective view which shows an example of the solid image pick-up element storage case center part provided with the divided | segmented island. It is a figure for demonstrating an example of the manufacturing method of the case for a solid-state image sensor accommodation.

Explanation of symbols

10: Solid-state image pickup device 12: Solid-state image pickup device 20: Resin hollow case (case main body)
20A: Case body portion 22: Resin bottom plate 24: Resin side wall 26: Transparent plate 30: Metal island 32: Cured resin (resin forming composition)
34: Island holding part 40: Lead terminal 42: Bonding wire 50: Lead frame 100: Solid-state imaging device storage case 101: Projection part 103: Rib 104: Meat stealing part 105: Reinforcing part 132, 132A, 132B: Slit RE: Adhesive LGR: Groove SGR between the pair of ribs: Groove groove extending along the longitudinal direction of the island on the bottom surface of the case DP: Recess inside the case J: Center position X ₀ between the pair of island pressing parts: Pair Distances X ₁ and X ₂ between the island pressing portions: distance P from the island pressing portion to the center position J: point D between the first slit 132A and the second slit 132B on the island D: the deepest portion of the slit M1, M2: Mold RE1: Resin M21: Resin introduction hole M22: Communication passage EP: Ejector pin

Claims (18)

A hollow made of thermoplastic resin that is integrally formed from a substantially rectangular resin bottom plate and a resin side wall that is substantially suspended from the periphery of the bottom plate, a metal lead terminal is inserted, and the opening is closed by a transparent plate A solid-state imaging device having a case, a metal island is installed on the inner bottom surface of the hollow case, and a solid-state imaging device is fixed on the island;
(A) the inner surface of the hollow case,
(B) a boundary portion between the metal lead terminal and the inner surface of the hollow case, and (c) a joint portion between the hollow case and the transparent plate,
A cured resin obtained by curing the curable resin-forming composition is disposed in at least one part of the resin, and the durometer hardness of the cured resin is 80 or less in A scale,
A solid-state imaging device, comprising: a pair of protrusions that contact both ends of the island in the width direction and extend along the longitudinal direction of the island. A hollow made of thermoplastic resin that is integrally formed from a substantially rectangular resin bottom plate and a resin side wall that is substantially suspended from the periphery of the bottom plate, a metal lead terminal is inserted, and the opening is closed by a transparent plate A solid-state imaging device having a case, a metal island is installed on the inner bottom surface of the hollow case, and a solid-state imaging device is fixed on the island;
(A) the inner surface of the hollow case,
(B) a boundary portion between the metal lead terminal and the inner surface of the hollow case, and (c) a joint portion between the hollow case and the transparent plate,
A cured resin obtained by curing the curable resin-forming composition is disposed in at least one part of the resin, and the durometer hardness of the cured resin is 80 or less in A scale,
In proximity to the side surface of the island, the inner bottom surface of the case, are arranged a pair of concave grooves extending along its longitudinal direction,
A pair of protrusions in contact with both ends of the island in the width direction and extending along the longitudinal direction of the island;
A solid-state imaging device, wherein a side surface of each of the protrusions constitutes one side surface of each of the concave grooves . The cured resin is an epoxy resin, unsaturated polyester resin, phenol resin, urea-melamine resins, polyurethane resins, silicone resins, polyimide resins, and claims comprises at least one member selected from the group consisting of acrylate resin 1 or 2. The solid-state imaging device according to 2. The solid-state imaging device according to any one of claims 1-3 wherein the curable resin-forming composition is a UV curable. (I) It is integrally formed from a substantially rectangular resin bottom plate and a resin side wall substantially suspended from the periphery of the bottom plate, a metal lead terminal is inserted, and the opening can be closed by a transparent plate A hollow case made of thermoplastic resin, in which a metal island is installed on the inner bottom surface of the case, and further, a pair of protrusions that are in contact with both ends of the island in the width direction and extend along the longitudinal direction of the island Forming a hollow case comprising:
(II) fixing a solid-state image sensor on the island;
(III) electrically connecting the electrode of the solid-state imaging device and the metal lead terminal by a bonding wire;
(IV) closing the case opening with a transparent plate;
A manufacturing method of a solid-state imaging device provided in this order,
(I) Applying the curable resin-forming composition A to the inner surface of the case and curing it to form the cured resin A, whereby at least a part of the inner surface of the case and / or the lead terminal in the case and the inner surface of the case A step of covering the boundary part with a cured resin, and
(Ii) The curable resin-forming composition B was applied to the portion of the opening of the case that was in contact with the transparent plate, and the opening was closed with the transparent plate, and then the curable resin-forming composition B was cured. A step of sealing the opening with the cured resin B;
A method for manufacturing a solid-state imaging device, comprising at least one step selected from: The method for manufacturing a solid-state imaging device according to claim 5, wherein the curable resin-forming composition A has a viscosity of 5,000 mPa · sec or less. The method for manufacturing a solid-state imaging device according to claim 5 or 6 , wherein a volumetric shrinkage due to curing of the curable resin-forming composition A is 5% or less. The method for producing a solid-state imaging device according to any one of claims 5 to 7 , wherein the curable resin-forming composition A is ultraviolet curable. When the curable resin-forming composition A is irradiated with ultraviolet rays to form the curable resin A, the weight of the curable resin A is 99.8% to 100% of the weight of the curable resin-forming composition A before curing. The method for manufacturing a solid-state imaging device according to claim 8 , wherein: In the step (i), an ultraviolet curable resin-forming composition A is applied to the inner surface of the hollow case, and the resin-forming composition A is used as a cured resin A by irradiating ultraviolet rays through a sealed transparent plate. the method for manufacturing a solid-state imaging device according to claim 8 or 9, which is a step of coating at least a portion, metallic lead terminals and curing the boundary portion between the resin part resin in the case of the hollow inner surface of the case. Method for manufacturing a solid-state imaging device according to any one of claims 5-10 viscosity of the curable resin-forming composition B is 10,000 mPa · sec or more. The method for producing a solid-state imaging device according to any one of claims 5 to 11 , wherein the curable resin-forming composition B is ultraviolet curable. In the step (ii), an ultraviolet curable resin-forming composition B is provided between the upper surface of the hollow case and the transparent plate, and ultraviolet rays are irradiated through the transparent plate to make the resin-forming composition a curable resin. The method of manufacturing a solid-state imaging device according to claim 12 , wherein the case is a step of closing the case. A solid-state imaging device manufactured by the manufacturing method according to any one of claims 5-13. A resin case main body having a recess composed of a bottom plate and a side wall substantially suspended from the periphery thereof;
An island for fixing a solid-state imaging device, provided on the inner bottom surface of the bottom plate;
A solid-state imaging device fixed on the island;
A lead terminal extending from the inside of the recess to the outside of the case body through the side wall;
A bonding wire for connecting the solid-state imaging device and the lead terminal;
A solid material comprising: a pair of protrusions that are in contact with both ends of the island in the width direction and extending along the longitudinal direction of the island; and a first cured resin that is in contact with the outer side surface of each of the protrusions. Imaging device. A transparent plate for closing the concave portion of the case body;
A second cured resin interposed between the case body and the transparent plate;
The solid-state imaging device according to claim 15 . The solid-state imaging device according to claim 16 , wherein the first cured resin and the second cured resin are continuous. Wherein the first curable resin, the solid-state imaging device according to any one of the bonding wire and claims the covering the connecting portion between the lead terminals 15-17.

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