CN100576553C - Solid camera head and manufacture method thereof - Google Patents

Solid camera head and manufacture method thereof Download PDF

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Publication number
CN100576553C
CN100576553C CN200610071648A CN200610071648A CN100576553C CN 100576553 C CN100576553 C CN 100576553C CN 200610071648 A CN200610071648 A CN 200610071648A CN 200610071648 A CN200610071648 A CN 200610071648A CN 100576553 C CN100576553 C CN 100576553C
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CN
China
Prior art keywords
resin
mentioned
hardening resin
constituent
camera head
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Expired - Fee Related
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CN200610071648A
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Chinese (zh)
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CN1838422A (en
Inventor
佐藤知广
前田光男
吉田贺英
井手淳一
小西正芳
松见泰夫
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Toshiba Corp
Sumitomo Chemical Co Ltd
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Toshiba Corp
Sumitomo Chemical Co Ltd
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Publication of CN1838422A publication Critical patent/CN1838422A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Abstract

Certain 1 position at the junction surface of the boundary portion of inner surface portion, metallic conductor terminal and the hollow case inner surface of hollow case and hollow case and transparent panel, the configuration hardening resin forms the hardening resin after the constituent sclerosis, and the duro-meter hardness of hardening resin is below 80 in the A level.

Description

Solid camera head and manufacture method thereof
Technical field
The present invention relates to solid camera head and manufacture method thereof.
Background technology
Now, on solid camera head, be to use glass ceramics flask of hollow, but because the cost height, so just developing resin system hollow case (with reference to patent documentation 1) recently.
But, use the solid camera head of resin hollow system box on practicability, to remain some problems.
For example, the generation tree lipoprotein solution overflows the fin of metal pattern when the box of being everlasting is shaped, promptly so-called flash, and this flash becomes break flour when the manufacturing of solid camera head, even utilize matting also to be difficult to remove fully.As a result, seal this resin hollow system box after break flour in box, disperse, on the sensitive surface attached to solid-state imager, often cause the misoperation of imaging apparatus.
Again, lid material as sealing resin system hollow case, the main transparent panels such as clear glass, transparent resin that use, but because the resin that forms box is big with the thermal expansion difference that forms the metal that cover material or glass etc., institute so that usually when being shaped or the warpage of the box that causes of the heat in when installation etc. be out of shape increase.When having such distortion, on the focus of incident light deviation takes place often, there are the incorrect problems such as image that read of solid-state imager.In order to prevent distortion as described above, the bonding agent that uses for will cover material and be attached on the box time proposes to use the product (with reference to patent documentation 2) of spring rate below 5GPa.But its effect is good inadequately, particularly during the such rectangular box of one dimension imageing sensor, warpage takes place easily still.
Therefore, there is the problem that can not correctly bring into play function in solid camera head.
Patent documentation 1: the spy opens flat 6-163950 communique
Patent documentation 2: the spy opens the 2000-12719 communique
Summary of the invention
The present invention In view of the foregoing makes, purpose is to provide: can prevent the misoperation of the solid-state imager that break flour that flash of producing in the forming process because of resin system hollow case etc. causes causes, and realize one at least at aspect the air-tightness of improvement hollow case or the warpage aspect of improved resin system hollow case self, can correctly bring into play the solid camera head and the manufacture method thereof of camera function.
The result that present inventors further investigate, discovery is by utilizing the thermoplastic resin above-mentioned resin system hollow case that is shaped, and the privileged site at box has the resin that has used hardening resin, can solve at least one of above-mentioned problem, thereby has finished the present invention.That is, the invention provides the solid camera head shown in following [1].
[1] a kind of solid camera head, have by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on its periphery integrally formed, and plug the metallic conductor terminal, the thermoplastic resin system hollow case that peristome is sealed by transparent panel, the inner bottom surface of this hollow case is provided with the metallic island, cementation has solid-state imager on this island, it is characterized in that:
(a) inner surface portion of above-mentioned hollow case,
(b) the boundary portion of above-mentioned metallic conductor terminal and above-mentioned hollow case inner surface and
(c) at least 1 position at the junction surface of above-mentioned hollow case and above-mentioned transparent panel, the configuration hardening resin forms the hardening resin after the constituent sclerosis, and the duro-meter hardness of aforementioned hardening resin is below 80 in the A level.
Again, [2] hardening resin preferably comprises at least a kind that selects from epoxy resin, unsaturated polyester resin, phenolic resins, urea melamine resin, polyurethane resin, silicone resin, polyimide resin and acrylic resin group.
Again, metallic island and the hollow case inner bottom surface of the present invention about being provided with solid-state imager provides the solid camera head shown in following [3] [4].
[3] be as above-mentioned [1] or [2] described solid camera head, it is characterized in that: on above-mentioned metallic island along the jetty portion that vertically is provided with of above-mentioned solid-state imager.
[4] be as any one described solid camera head of above-mentioned [1]~[3], it is characterized in that: the side near above-mentioned metallic island on the inner bottom surface of above-mentioned box, vertically is equipped with groove along it.
And the present invention makes easier, preferred when above-mentioned hardening resin formation constituent is following [5].
[5] be as any one described solid camera head of above-mentioned [1]~[4], it is characterized in that: this hardening resin constituent comprises uv-hardening resin.
The invention provides the following manufacture method of above-mentioned solid camera head again.
[6] be a kind of manufacture method of solid-state imager, be provided with in the following order,
(I) be shaped integrally formedly, and plug the metallic conductor terminal by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on this base plate periphery, and the operation of the thermoplastic resin system hollow case that can be sealed by transparent panel of peristome;
(II) operation of cementation solid-state imager on the inner bottom surface of this box;
(III) utilize closing line to be electrically connected the operation of electrode and this metallic conductor terminal of this solid-state imager;
(IV) seal the operation of this box peristome by transparent panel;
It is characterized in that having at least one operation of selecting in the following operation:
(i) form constituent A and make its sclerosis form hardening resin A by give hardening resin at this box inner surface, thereby utilize at least a portion that hardening resin covers this box inner surface with and/or this box in this conductor terminal and the operation of the boundary portion of this box inner surface, and
(ii) give hardening resin constituent B, and after utilizing transparent panel to seal this peristome, utilize hardening resin B after this hardening resin constituent B sclerosis to shut the operation of this peristome at the position that contacts with this transparent panel of the peristome of this box.
But following hardening resin form constituent A and hardening resin constituent B can be the same also can be different.
It is described any that hardening resin in the manufacture method of above-mentioned [6] forms constituent A preferably following [7]~[9].
[7] be as the manufacture method of above-mentioned [6] described solid camera head, it is characterized in that: above-mentioned hardening resin forms the viscosity of constituent A below 5000mPasec.
[8] be as the manufacture method of above-mentioned [6] or [7] described solid camera head, it is characterized in that: follow above-mentioned hardening resin to form the cubical contraction of sclerosis of constituent A below 5%.
[9] be as the manufacture method of any one described solid camera head of above-mentioned [6]~[8], it is characterized in that: it is UV cured property that above-mentioned hardening resin forms constituent A.
Hardening resin shown in above-mentioned [9] form constituent A be UV cured property the time, wherein also preferred following manufacture method.
[10] be manufacture method as above-mentioned [9] any one described solid camera head, it is characterized in that: form irradiation ultraviolet radiation on the constituent A at above-mentioned hardening resin, when forming hardening resin A, the weight of this hardening resin A is more than 99.8%, below 100% of weight that presclerotic hardening resin forms constituent A.
[11] be manufacture method as above-mentioned [9] or [10] described solid camera head, it is characterized in that: above-mentioned operation (i) is, the hardening resin of giving UV cured property on above-mentioned hollow case inner surface forms constituent A, make this resin-shaped become constituent A to become hardening resin A by the transparent panel irradiation ultraviolet radiation of shutting, thus utilize at least a portion that hardening resin covers this hollow case inner surface with and/or this box in the metallic conductor terminal and the operation of the boundary section of resin part.
On the other hand, it is described any that the hardening resin in the manufacture method of above-mentioned [6] forms constituent B preferably following [12]~[13].
[12] be as the manufacture method of above-mentioned [6] any one described solid camera head, it is characterized in that: above-mentioned hardening resin forms the viscosity of constituent B more than 10000mPasec.
[13] be as the manufacture method of above-mentioned [6] or [11] any one described solid camera head, it is characterized in that: it is UV cured property that this hardening resin forms constituent B.
Hardening resin constituent A shown in above-mentioned [13] be UV cured property the time, wherein also preferred following manufacture method.
[14] a kind of manufacture method of solid camera head, it is characterized in that: above-mentioned operation (ii) be on above-mentioned hollow case with transparent panel between give UV cured property resin-shaped become constituent B, thereby make this resin-shaped become constituent to become the operation that hardening resin seals this box by this transparent panel irradiation ultraviolet radiation.
If adopt the manufacture method shown in above-mentioned [6]~[14], then can make solid camera head of the present invention easily, the solid camera head shown in preferably above-mentioned [2]~[5].
Like this, produce the solid camera head of [15].
The invention provides the solid camera head shown in following [16] again.
[16] a kind of solid camera head is characterized in that: have: the resinous box main body (hollow case) with recess; Be located at the island on the bottom surface of recess; Be fixed on the solid-state imager on the island; Sidewall via box main body in the recess extends to outside conductor terminal; The closing line that connects solid-state imager and conductor terminal; Contact with the Width two ends on island, along a pair of jut (jetty portion) of the longitudinal extension on island; And with contacted the 1st hardening resin of each outer lateral side of jut.
A pair of jut can limit island moving on Width.The sensitive surface of solid-state imager exposes, and the light of sufficient light quantity is incided on this sensitive surface.The 1st hardening resin is stopped by the side in the jut outside, is not present on the sensitive surface.Therefore, according to this solid camera head, can carry out correct shooting.
The invention provides the solid camera head shown in following [17] again.
[17] be as above-mentioned [16] described solid camera head, it is characterized in that: have: the transparent panel of the recess of enclosure main body; And be installed at the 2nd hardening resin between box main body and the transparent panel.The 2nd hardening resin can bonding transparent panel and box main body.
The invention provides the solid camera head shown in following [18] again.
[18] be as above-mentioned [17] described solid camera head, it is characterized in that: the 1st hardening resin and the 2nd hardening resin are continuous.
The 1st hardening resin can apply in identical operation with the 2nd hardening resin, and is simple in structure.
The invention provides the solid camera head shown in following [19] again.
[19] be as above-mentioned [16] described solid camera head, it is characterized in that: the connecting portion of the 1st hardening resin lining closing line and conductor terminal.
The connecting portion because the 1st hardening resin has been covered is so can prevent this connecting portion deterioration.
If the employing foregoing invention then can prevent the misoperation of the solid-state imager that causes because of break flour, make the air-tightness in the hollow case more reliable.Therefore, can prevent also that moisture from invading outside box and in box dewfall.If adopt the present invention, then can significantly reduce the warpage of the solid camera head behind the sealing transparent panel again.The solid camera head that has these effects simultaneously even in the solid camera head with the resin system hollow case that is expected cost degradation, also can provide practicality better solid camera head.Therefore, if adopt this solid camera head, then can carry out correct shooting.
Description of drawings
Fig. 1 is the summary profile that an example of solid camera head of the present invention is cut open at the central portion of this device.
Fig. 2 is the vertical view of an example that expression can be used for the resin system hollow case of solid camera head of the present invention.
Fig. 3 is the stereogram of an example of the model utility resin system hollow case of representing to can be used for solid camera head of the present invention.Hardening resin is diagram not.
Fig. 4 is the detail perspective view that has the solid camera head of solid shooting element collection box.
Fig. 5 is the stereogram that has the solid shooting element collection box central portion on the island with otch.
Fig. 6 is the stereogram that has the solid shooting element collection box central portion on the island of cutting apart.
Fig. 7 is the figure that is used to illustrate the manufacture method of solid shooting element collection box.
Embodiment
Below, the solid camera head and the manufacture method thereof of form of implementation are described.Same part adopts same mark, saves the explanation of repetition.
Solid camera head of the present invention is integrally formed by the resin system base plate 22 of essentially rectangular and the roughly vertical resin system sidewall 24 that is located on its periphery, and plug metallic conductor terminal 40, and on the resin system hollow case 20 that peristome can be sealed by transparent panel 26, at least a portion of the resin part of resin system hollow case 20 inner surfaces and conductor terminal 40 are become the hardening resin 32 after constituent hardens to be covered with the boundary portion of resin part by resin-shaped.
Again, the manufacture method of solid camera head of the present invention, comprise in the following order: integrally formed by the resin system base plate 22 of essentially rectangular and the roughly vertical resin system sidewall 24 that is located on its periphery, and plug conductor terminal 40, and the operation of fixed solid imaging apparatus 12 on the inner bottom surface of the resin system hollow case 20 that can be sealed by transparent panel 26 of peristome; Utilize closing line to be electrically connected the operation of the electrode and the conductor terminal 40 of solid-state imager 12; Thereby and become constituent to form the operation that hardening resin 32 utilizes at least a portion of resin part of hardening resin covering resin system box 20 inner surfaces and the conductor terminal in the box 40 and the boundary portion of resin part by give resin-shaped at the inner surface of resin system hollow case 20.
Fig. 1 is with the solid camera head shown in Figure 2 summary profile (I-I arrow profile) that part is cut open that plugs at conductor terminal.
The transparent panel 26 of the peristome that solid camera head 10 of the present invention has the resin system hollow case 20 of taking in solid-state imager 12, seal this hollow case has the metallic island 30 (following also only be called " island ") on the inner bottom surface that is arranged on this hollow case 20 for cementation solid-state imager 12.Solid-state imager 12, can be to light shooting by transparent panel 26 incident outside camera head, this solid-state imager 12 is replied incident light and the signal of telecommunication that writes down, can take out outside the solid camera head 10 by conductor terminal 40 grades that are electrically connected with solid-state imager 12.
Also can replace conductor terminal 40, metal protuberance is set on electrode tip holder, the wiring substrate that insulating film and conductor wirings are constituted is electrically connected by the former electrodes seat.
Solid-state imager 12 has the portion of reading, and the portion of reading has the arrangement of the pixel of replying incident light and calling over the generation signal charge and the function of the signal charge that pixel is arranged.Solid-state imager preferably has the semiconductor camera element that a plurality of pixels are arranged, and roughly is divided into the one dimension imageing sensor (linear transducer) of one dimension shape pixel arrangement and the two-dimensional image sensor (face sensor) that two-dimentional shape pixel is arranged.In solid camera head of the present invention or its manufacture method,, both can use linear transducer also can use face sensor, but preferably use linear transducer as solid-state imager.As imaging apparatus, but illustration ccd image sensor, C0MS imageing sensor, CMD, charge injection device, infrared image sensor etc.Again, the representative length of linear transducer is 2~15cm, preferred 3~10cm.
As solid camera head of the present invention, but illustration facsimile machine, scanner, bar code reader.
Resin system hollow case 20, by the resin system base plate 22 of essentially rectangular and the resin system sidewall 24 on the periphery be located at base plate 22 that roughly hangs down integrally formed.The resin system base plate 22 of essentially rectangular and resin system sidewall 24 all have suitable thickness in order to have mechanical strength.
So-called resin system base plate 22 is " essentially rectangulars ", refers to comprise the shape of general rectangular except that square and rectangular shape.So-called " general rectangular ", even be meant to have parallel long limit but the minor face linearity is not the shape of straight line with growing limit quadrature or minor face yet, and the ellipse etc. of lengthwise extremely.In addition, have the base plate shape of the hollow case 20 on parallel long limit, it is not that linearity but semicircular shape also are contained in above-mentioned " shape of general rectangular " that rectangle lacks four jiaos the shape of angle band circle of shape, rectangle or minor face.
Resin system sidewall 24 roughly hangs down on the periphery of the resin system base plate 22 be located at essentially rectangular.Shape that resin system sidewall 24 contacts with resin system base plate 22 and profile area and resin system base plate 22 much the same.So-called " roughly hang down and establish " is meant except that strict vertically disposed resin system sidewall, also comprises the resin system sidewall that a little is provided with towards peristome with enlarging.So-called " enlarging a little ", be meant have from 45 ° of vertical direction with interior, preferred 30 ° with interior inclination.
But the shape of the resin system base plate that combination in any is above and resin system sidewall angle being set and design the global shape of hollow case.Hollow case, irrelevant with above-mentioned global shape, on the inner bottom surface of hollow case 20, have the zone that the metallicity island can be set.
Plug (burying underground) metallic conductor terminal 40 in the resin system hollow case of in the present invention, using 20.
Conductor terminal 40, electric and mechanical connection solid camera head and external circuit.Conductor terminal 40 is metal, can use metal well-known form.But, can preferably use 42 alloys as the alloy of copper or iron 58% nickel 42% as metal illustration copper, copper alloy, ferroalloy.These metals (alloy) can apply coating and use, but are used for material illustration gold, silver, nickel and the scolding tin of coating.
Conductor terminal 40 is preferred: use lead frame when hollow case 20 is shaped and resin combination integrally formed, carry out processing such as bending or cut-out afterwards, as conductor terminal.
The solid-state imager 12 that cements on the island 30 is electrically connected with the conductor terminal 40 that the signal charge that is used for reading is delivered to solid camera head 10 outsides.In Fig. 1, solid-state imager 12 utilizes closing line 42 to be connected with conductor terminal 40.In order to pass to the outside of solid camera head, utilize closing line etc. to connect the electrode and the conductor terminal of solid-state imager from the signal charge that solid-state imager is read.Closing line 42 is metal fines, is that the alloy of main component constitutes by gold, aluminium, copper and with them preferably.The method of attachment of closing line is determined according to the material of lead etc., but can be exemplified ball bonding method or wedge bonding method etc.
After utilizing electric wirings such as closing line, utilize transparent panel 26 to shut the peristome of hollow case 20 and obtain solid camera head 10.Shut, can use radioactive ray hardening, humidity-hardening or thermosetting resin-shaped to become constituent, the back is described in detail.
On the inboard periphery of the peristome of resin system sidewall 24, also the grooving of imbedding transparent panel can be set.
Hollow case 20 is sealed by transparent panel 26.At this, so-called transparent panel refers to the incident light that is used to make a video recording, generally visible light (400~700nm) and near infrared region transmitance more than 80%, preferred plate-shaped member more than 90%.When camera head is bar code reader, the transmitance of red semiconductor Wavelength of Laser 650nm importantly.
As the material of transparent panel 26, but illustration glass, allyl resin, Merlon, contain the polymer of cycloalkene unit.
After utilizing transparent panel 26 sealing hollow case peristomes, can utilize the bonding agent RE of thermosetting or photo-hardening to seal this peristome.Also can make the resin-shaped of box inner surface lining usefulness and transparent panel sealing usefulness become constituent 32 sclerosis by transparent panel 26 irradiation ultraviolet radiations.After also can making the lining of box inner surface become constituent 32 thermmohardenings, make the resin-shaped of transparent panel sealing usefulness become constituent 32 (bonding agent RE) photo-hardening with resin-shaped.Glass or contain the transparent panel 26 that the polymer of cycloalkene unit constitutes preferably uses for ultraviolet permeability and stable on heating viewpoint.
Hardening resin 32 after at least a portion of the resin part of this hollow case inner surface and conductor terminal 40 are hardened by resin combination with the boundary portion of resin part (box inner surface) covers.Utilize the covering of this hardening resin 32, even the break flour that the flash that produces when being shaped owing to the hollow resin box brings is mixed in the box, can prevent that also it from dispersing, and sealing transparent panel 26 can make the air-tightness of hollow case of sealing more reliable on peristome, so can prevent the misoperation of solid-state imager.For preventing the purpose that break flour produces and improving bubble-tight purpose, as shown in Figure 1, preferably cover all places on the surface of all places of the resin part at all places of box inner surfaces or nearly all place and this resin part/metallic conductor terminal boundary portion partly and conductor terminal 40 by hardening resin 32.At this, so-called " nearly all place " is meant more than 80% of resin part of box inner surface.
The manufacture method of solid camera head of the present invention, on the inner bottom surface of aforementioned resin system hollow case 20 operation of cementation solid-state imager 12, utilize closing line 42 to be electrically connected after the operation of the electrode of solid-state imager 12 and metallic conductor terminal 40, has following operation: become constituent to form hardening resin 32 by give resin-shaped at the inner surface of this hollow case 20, thereby utilize the resin at least a portion partly and the operation of conductor terminal in this box 40 and resin boundary portion partly of hardening resin 32 covering resin system box inner surfaces.
Clean hollow case 20 before the preferred cementation solid-state imager 12.This cleaning can be used well-known cleaning methods such as ultrasonic waves for cleaning, jet cleaning, spraying cleaning.
Hardening resin 32 as transparent panel sealing usefulness and hollow case inner surface lining usefulness, can use well-known thermosetting resin, humidity-hardening resin, visible light hardening resin and uv-hardening resin, but illustration epoxy resin, unsaturated polyester resin, phenolic resins, urea melamine resin, polyurethane resin, silicone resin, polyimide resin, acrylic resin etc.The resin-shaped that forms these resins becomes constituent, to forming monomer or the oligomer or the polymer of resin, as required, cooperate the polymerization of purposes appropriate combination to begin additives such as agent, crosslinking agent, reaction promoter, and inorganic filler such as silicon dioxide etc. and constituting.On the hardening resin of transparent panel sealing, can use, also can use different respectively hardening resins with a kind of material with hardening resin, hollow case inner surface lining usefulness.
Hardening resin 32 as transparent panel sealing usefulness and hollow case inner surface lining usefulness, but for the short time sclerosis, the preferred uv-hardening resin that uses in above-mentioned various hardening resins, the transparent panel sealing with and both uv-hardening resins most preferably of the hardening resin of hollow case inner surface lining usefulness.Transparent panel sealing is covered hardening resin two sides of usefulness when being uv-hardening resin with hardening resin and hollow case inner surface, can make the resin-shaped that covers the hollow case inner surface become constituent to become constituent to harden simultaneously by back irradiation ultraviolet radiation above box on utilize transparent panel sealing hollow case, can reduce manufacturing cost with the resin-shaped of sealing transparent panel.
As uv-hardening resin, exemplify the acrylate resin of utilizing radical polymerization to form according to acrylate monomer, polyester-acrylate oligomer, urethane-acrylate oligomer, epoxy-acrylate oligomer etc., epoxy resin according to epoxy compounds, octazone compound compound (オ キ セ Application) etc. utilizes cationic polymerization to form utilizes the silicone resin of radical polymerization or cationic polymerization formation etc. according to polyorganosiloxane ramification.Wherein preferably use epoxy resin, silicone resin.
The resin-shaped of the UV cured property of using among the present invention becomes constituent, is to utilize ultraviolet ray (tens of~400nm) irradiation and getting final product of hardening also can have visible light simultaneously and (400 surpass~700nm) character of hardening, thermosetting or humidity-hardening.
The lining of hollow case inner surface becomes constituent preferably to utilize the sclerosis weight rate (the presclerotic relatively resin-shaped of the weight of the hardening resin after the sclerosis becomes the percentage of the weight of constituent) of ultraviolet irradiation more than 99.8%, below 100%, more preferably more than 99.9%, below 100% with the resin-shaped of UV cured property.Again, as solid camera head of the present invention, the resin-shaped that preferably will have the UV cured property of such sclerosis weight rate becomes constituent to give the specified location of the inner surface of hollow case, irradiation ultraviolet radiation and cover this specified location.When the presclerotic relatively resin-shaped of the weight of the hardening resin after sclerosis becomes the weight of constituent to significantly reduce, the composition that volatilizees during sclerosis may cause harmful effect to solid-state imager, the composition that volatilizees during again, by the transparent panel irradiation ultraviolet radiation may be smudgy attached to causing on the transparent panel.
This sclerosis weight rate utilizes following condition to measure.The weight of the hardening resin after the so-called sclerosis is to put into presclerotic resin-shaped in the container of the glass opened to become constituent to reach the about 3mm of thickness on the about 25mm of diameter, in 23 ℃, the atmosphere of 50%RH it is shone about 3000mJ/cm 2Ultraviolet ray (365nm) and the sclerosis firmization of hardening resin after weight; So-called presclerotic resin-shaped becomes the weight of constituent, is to take out and the resin-shaped of just having put into above-mentioned glass container becomes the weight of constituent from airtight UV-preventing container.
The hardening resin that is used to seal the hollow case peristome also preferably has above-mentioned sclerosis weight rate.
As resin-shaped being become constituent give at least a portion of hollow case inner surface and this conductor terminal 40 method with the boundary portion of resin part, illustration uses injector to become constituent to inject method in the hollow case from nozzle resin-shaped.
Fig. 2 is the vertical view of solid camera head 10.Fig. 3 is the stereogram of solid camera head 10 shown in Figure 2.Transparent panel is removed in figure.
Metallic island 30 is parts arbitrarily, can be used as the par of cementation solid-state imager 12.When metallic island 30 is set, on the inner bottom surface of the resin system hollow case 20 of cross section concavity, form contiguously with it.Can be on this island 30 cementation solid-state imager 12.This fixing means is not particularly limited.Solid-state imager 12 can utilize cementations such as bonding agent, scolding tin, preferably utilizes the bonding agent cementation, more preferably uses the resin-bonded of insulating properties.The preferred thermal conductivity of bonding agent that is used for cementation solid-state imager 12 is high, and preferred thermal conductivity is more than 1W/mK, more preferably more than the 3W/mK.
The inner bottom surface of hollow case becomes the hardening resin 32 of constituent sclerosis to be covered with by resin-shaped.
When metallic island 30 was set, its shape had no particular limits, but preferably had the rectangle of the aspect ratio more than 4, more preferably had 4~100 aspect ratio.
Also preferably more than the place of lateral margin adjacent otch is set longitudinally on the island.This adjacent otch is provided with alternately from the opposition side on the long limit in opposite directions on island.Again, this otch in the vertically setting similarly on island, be not provided with a plurality of adjacent otch group times, and setting at a certain distance preferably scatter.
Island 30 is metal, but as metal illustration copper, copper alloy, aluminium, aluminium alloy, ferroalloy, can preferably use copper, aluminium, aluminium alloy, gold-plated copper and 42 alloys.Island 30 also can have to perpendicular to the outstanding protuberance of direction longitudinally, and this protuberance forms its part and is embedded in island compressed part fixing in the box.
The resin system hollow case that the present invention uses can be utilized formation such as injection molding method, ejection compress moulding method, compression forming method, multistation forming process.As the resin that can be used for being shaped, can roughly be divided into shapable thermosetting resin and thermoplastic resin, any resin is also preferably selected from the viewpoint of anti-flammability, electrical insulating property, strength rigid.From shortening forming period, can cut down the viewpoint of shaping cost and set out, preferably use thermoplastic resin, utilize injection molding method to form hollow case.
As the thermosetting resin that can be used for making hollow case of the present invention, can phenolic resins, urea resin, melmac, diallyl phthalate ester resin, epoxy resin, polyurethane resin, polyimide resin and unsaturated polyester resin etc. be shown example, preferably use phenolic resins, epoxy resin.
Again, as can be used for thermoplastic resin of the present invention, can polystyrene resin, acrylic resin, polycarbonate resin, mylar, polyamide, polyacetal resin, polyphenylene oxide resin, fluororesin, polyphenylene sulfide, polysulfone resin, polyarylate, polyetherimide resin, polyethersulfone resin, polyether ketone resin, liquid-crystalline polymer, polyamide-imide resin, polyimide resin etc. be shown example, preferably use mylar, polyamide, polyphenylene sulfide, liquid-crystalline polymer.These resins can use separately and also can be used as blend polymer and use multiple simultaneously.Liquid-crystalline polymer, because flowability, thermal endurance, rigidity are good, preferably use among the present invention.
Summary situation about above-mentioned resin, be recorded in " macromolecule voluminous dictionary " (on September 20th, 6 is put down in the distribution of the kind Co., Ltd. of ball) with and on the document quoted etc.
When forming the hollow case of using among the present invention, can use the resin combination that in resin, adds suitable filler.The filler that uses for improving intensity or rigidity, thermal endurance, improves dimensional accuracy, reduces purposes such as coefficient of linear expansion, can suitably select.As the filler that can use with such purpose, but illustration glass fibre (milled glass fiber, short glass fiber etc.), bead, hollow glass ball, glass powder, mica, talcum, clay, silicon dioxide, aluminium oxide, potassium titanate, wollastonite, calcium carbonate, magnesium carbonate, sulfuric acid soda, calcium sulfate, barium sulfate, calcium sulfite, aluminium hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicates, silica sand, silica, quartzy, titanium oxide, zinc oxide, iron oxide, graphite, molybdenum, asbestos, alumina silicate fibre, alumina fibre, gypsum fiber, carbon fibre, carbon black, white carbon, diatomite, bentonite, sericite, white sand (sirasu), inorganic fillers such as graphite, potassium titanate crystal whisker, alumina whisker, aluminium borate whisker, silicon carbide whisker, metal whiskers such as silicon nitride crystal whisker or non-metallic whisker class etc.In addition, the preferred use has shaded effect and prevents carbon black in the effect of the diffraction of light of cassette interior etc.
(comparative example 1)
To on copper alloy, be embedded in the metal pattern by gold-plated lead frame, obtain to be inserted with the resin system hollow case (wide 50mm * depth 10mm * high 4mm, thick 2mm) of conductor terminal by injection moulding liquid-crystalline polymer [ス ミ カ ス-バ-E6008B (Sumitomo Chemical (strain) system)].With the resin system hollow case that obtains in grade 1, after cleaning with ultra-pure water in 000 the cleaning shop, be immersed in the ultrasonic waves for cleaning (38kHz) of carrying out in the ultra-pure water of 500ml 20 seconds, measured the quantity of the break flour that exists in the water that takes out after the resin system hollow case.The mensuration of break flour quantity is used particle collector CLS-700 (PMS society system) in the liquid.The result who measures is present in about 1, the 030/ml of the break flour of size more than 2 microns in the water after the ultrasonic waves for cleaning.
(embodiment 1)
After the silicone resin that uses injector to smear UV cured property on the resin system hollow case inner surface that obtains forms constituent [(strain) ス リ-ボ Application De system TB3161], utilize the about 3000mJ/cm of mercury vapor lamp irradiation in comparative example 1 2Ultraviolet ray (365nm) make resin-shaped become constituent sclerosis.To the resin system hollow case and comparative example 1 the same mensuration of carrying out the break flour number that obtains.The result who measures is present in the about 180/ml of the break flour of size more than 2 microns in the water after the ultrasonic waves for cleaning, has confirmed to suppress greatly by utilizing the sub-inner surface of resin coating hamper from the come off effect of break flour of box inner surface.In addition, the UV of above-mentioned TB3161 sclerosis weight rate is 99.93%.
(comparative example 2)
To the resin system hollow case that obtains in the comparative example 1, after the above-mentioned silicone resin that transparent panel detent position on box uses injector to smear UV cured property forms constituent [(strain) ス リ-ボ Application De system TB3161], utilize mercury vapor lamp to shine about 3000mJ/cm after utilizing above the transparent panel sealing box of glass 2Ultraviolet ray (365nm) make resin-shaped become constituent sclerosis, sealed hollow box.The hollow case that obtains is used helium leak test machine HELEN A-250M-LD[ア ネ Le バ テ Network ニ Network ス (strain) system] estimate bubble-tight result, detected the leakage of helium.
(embodiment 2)
To utilizing hardening resin to cover the resin system hollow case of the box inner surface that obtains among the embodiment 1, utilize the top hollow case of transparent panel sealing with comparative example 2 the same acquisitions.Estimate bubble-tight result to the hollow case that obtains and comparative example 2 are the same, almost do not detect the leakage of helium, thereby confirmed to improve the bubble-tight effect of box by the boundary that utilizes hardening resin to cover the resin part/metallic conductor terminal part of box inner surface.
(embodiment 3)
With the resin system hollow case of the band conductor terminal made among the embodiment 1 in the cleaning shop of grade 1,000 with the ultra-pure water cleaning after, be immersed in the ultrasonic waves for cleaning (38kHz) of carrying out in the ultra-pure water of 500ml 20 seconds, cleaning-drying resin system hollow case.After utilizing bonding agent linear transducer to be fixed on the inner surface of this resin system box, utilize closing line distribution between linear transducer and conductor terminal.
On the inner surface of the intact resin system hollow case of distribution, the aforementioned silicone resin-shaped of using injector to smear UV cured property becomes constituent [(strain) ス リ-ボ Application De system TB3161], and after smearing same silicone resin formation constituent between transparent panel and the peristome, utilize the about 3000mJ/cm of mercury vapor lamp irradiation 2Ultraviolet ray (365nm) make resin-shaped become constituent sclerosis, obtain solid camera head.It is smudgy not have discovery to have on transparent panel when observing the resin system hollow case that obtains.
Describe at least a portion of covering resin system box inner surface and the hardening resin 32 of conductor terminal in the box and resin boundary portion partly below in detail.
The manufacture method of solid camera head 10 of the present invention comprises in the following order: it is integrally formed by the resin system base plate 22 of essentially rectangular and the roughly vertical resin system sidewall 24 that is located on its periphery to be shaped, and plug conductor terminal 40, and the operation of the resin system hollow case 20 that can be sealed by transparent panel 26 of peristome; The operation of cementation solid-state imager 12 on the inner bottom surface of box; Utilize closing line 42 to be electrically connected the operation of the electrode and the metallic conductor terminal 40 of solid-state imager 12; Thereby and become constituent to form the operation that hardening resin 32 utilizes at least a portion of inner surface of hardening resin 32 covering resin system boxes and the conductor terminal in the box 40 and the boundary portion of resin part by give resin-shaped at the inner surface of hollow case 20.When wherein resin-shaped becomes 25 ℃ of the viscosity of constituent 10, below the 000mPasec.
At this, the viscosity that resin-shaped becomes constituent is for being that benchmark is measured with the described single cylinder rotational viscometer method of JIS K7233.When becoming the viscosity of constituent, resin-shaped surpasses 10, during 000mPasec, because the resin-shaped that supplies in the box 20 becomes the illiquidity of constituent, so there is the tendency that can not in box 20, diffuse into film in the short time.
In addition, after hollow case 20 forms, preferably cleaning, dried, hollow box 20 before fixed solid imaging apparatus 12.This cleaning can be used well-known cleaning methods such as ultrasonic waves for cleaning, jet cleaning, spraying cleaning.
The resin-shaped of hollow case inner surface lining usefulness becomes constituent, and the viscosity in the time of 25 ℃ is 10, below the 000mPasec, and preferably 10~10,000mPasec, more preferably 10~5,000mPasec.At this, above-mentioned viscosity is to be that benchmark is measured the value obtained with the described single cylinder rotational viscometer method of JIS K7233.
When presclerotic resin-shaped becomes the viscosity of constituent high, utilize injector (liquid precise quantitative spraying device) etc. to give the operation reduction that resin-shaped becomes constituent at resin system box inner surface, owing to sneak into bubble, thereby or the resin-shaped that covers the box inner surface sclerosis that becomes the thickness of constituent to thicken to utilize ultraviolet irradiation may be insufficient.
Again, become the viscosity or the adjusted volume shrinkage of constituent in order to regulate resin-shaped, or regulate the duro-meter A hardness of hardening resin, can suitably use the hardening composition of simple function simultaneously and become multi-functional hardening composition.
For by the transparent panel closed peristome, can use the hardening resin of above-mentioned hollow case inner surface lining usefulness.On the hardening resin of the hardening resin of transparent panel sealing usefulness, hollow case inner surface lining usefulness, can use, also can use different respectively hardening resins with a kind of material.
The hardening resin that the present invention uses preferably has the set hardness of pushing.
The hardening resin 32 of hollow case inner surface lining usefulness, the duro-meter hardness (Shore hardness) of preferred JIS K7215 defined is below 80 in type A (also being called " duro-meter A hardness "), be more preferably 1~50, being more preferably is 1~30.When duro-meter hardness during in above-mentioned scope, because hardening resin has the hardness of appropriateness, so hardening resin 32 can not peeled off from resin system box inwall and produce break flour, can not cause the bubble-tight decline in the box, so do not worry causing that the cut-out that connects conductor terminal 40 and the closing line 42 of imaging apparatus 12 etc. is preferred yet yet.
The also preferred duro-meter A hardness of the employed hardening resin of being used by the transparent panel closed peristome of adhesive linkage (bonding agent RE) more preferably 1~50, is more preferably at 1~30 below 80.When bonding agent RE has an above-mentioned duro-meter hardness, because bonding agent has the hardness of appropriateness, so can prevent the generation because of the warpage of the solid camera head behind the different covering transparent panels 26 that produce of resin system box 20 and the coefficient of linear expansion of transparent panel 26, so it is preferred to prevent to influence the shooting performance of imaging apparatus.
Cubical contraction is a benchmark with the method for appendix 3 defineds of JIS K6901:1999, utilizes the processing of the resin that hardens under the room temperature, measures resin-shaped and becomes the density of the hardening thing after constituent and the sclerosis thereof and utilize following formula to calculate cubical contraction according to these values.
Cubical contraction=((D2-D1)/D2) * 100
At this, D1 represents that presclerotic resin-shaped becomes the density of constituent, and D2 represents the density of the hardening thing that hardens.The UV sclerous reaction is made as using the mercury vapor lamp of dominant wavelength 365nm, shine about 3,000mJ/cm 2Above ultraviolet ray and the hardening resin that obtains measures under 23 ± 0.1 ℃.
For becoming constituent being higher than the resin-shaped of hardening under the temperature of room temperature, also can utilize the method for above-mentioned appendix 3 defineds to measure cubical contraction.Concrete measurement operation is as the criterion with the operation to epoxy resin or unsaturated polyester resin regulation.
The resin-shaped that the present invention uses become constituent along with the cubical contraction of sclerosis below 5%, preferably below 4%.
Cubical contraction is not worried to damage along with the formation of hardening resin line and is engaged when above-mentioned scope, and the hardening resin that generates can not peel off from the box inner surface, so so can to stablize the air-tightness that keeps hollow case preferred.
Can utilize the sealing hollow case openends such as bonding agent of thermosetting or photo-hardening.Also can be by the transparent panel irradiation ultraviolet radiation box inner surface that hardens simultaneously lining with and the resin-shaped of transparent panel sealing usefulness become constituent.After also the lining of thermosetting box inner surface became constituent with resin-shaped, the resin-shaped of photo-hardening transparent panel sealing usefulness became constituent.
(embodiment A)
To on copper alloy, be embedded in the metal pattern by gold-plated lead frame, obtain to be inserted with the resin system hollow case (wide 50mm * depth 10mm * high 4mm, thick 2mm) of conductor terminal by injection moulding liquid-crystalline polymer [ス ミ カ ス-バ-E6008B (Sumitomo Chemical (strain) system)].
The resin system hollow case of above-mentioned band conductor terminal after cleaning with ultra-pure water in the cleaning shop of grade 1,000, is immersed in the ultrasonic waves for cleaning (38kHz) of carrying out in the ultra-pure water of 500ml 20 seconds, cleaning-drying resin system hollow case.After utilizing bonding agent linear transducer to be cemented on the inner surface of this resin system box, utilize closing line distribution between linear transducer and conductor terminal.
On the inner surface of the intact resin system hollow case of distribution, use injector supply with the silicone resin formation constituent of UV cured property [(strain) ス リ-ボ Application De system TB3080, the viscosity under 23 ℃ is 500mPasec, cubical contraction is 2.7%.], and between transparent panel 26 and peristome, give same silicone resin formation constituent (bonding agent RE) also membranaceously.The resin-shaped of utilizing injector to supply on the box inner surface becomes constituent roughly even very thin spreading out on the box inner surface.Utilize the about 3000mJ/cm of mercury vapor lamp irradiation 2Ultraviolet ray (365nm) make resin-shaped become constituent sclerosis, obtain solid camera head.
Resin test film after the above-mentioned TB3080 sclerosis, duro-meter A hardness is A10.
Do not see after UV cured that hardening resin peels off from the box inner surface yet.
(Comparative examples A)
Use (strain) ス リ-ボ Application De system TB3164 (viscosity 50 except replacing in embodiment A, using (strain) ス リ-ボ Application De system TB3080,000mPasec, cubical contraction 0.39%, the duro-meter A hardness after the sclerosis is A30) implement outward just the samely.The resin-shaped of utilizing injector to supply with becomes constituent (hardening resin 32) evenly not spread out on the box inner surface, and easy residual bubble between box inner surface and the hardening resin constituent.
(comparative example B)
Use (strain) ス リ-ボ Application De system TB3026 (viscosity 19 except replacing in embodiment A, using (strain) ス リ-ボ Application De system TB3080,000mPasec, cubical contraction 7.5%, the duro-meter D hardness after the sclerosis is D85) implement outward just the samely.The resin-shaped of utilizing injector to supply with becomes constituent (hardening resin 32) evenly not spread out on the box inner surface, and confirms to utilize the resin of irradiation ultraviolet radiation sclerosis to peel off from box inner surface part.
The following describes transparent panel is attached to bonding agent RE on the box.
The manufacture method of solid camera head of the present invention, comprise following operation: it is integrally formed by the resin system sidewall 24 on the resin system base plate 22 of essentially rectangular and the roughly vertical periphery that is located at base plate 22 to be shaped, and plug metallic conductor terminal 40, and has the operation of the resin system hollow case 20 of peristome; The operation of cementation solid-state imager 12 on the inner bottom surface of hollow case 20; Be electrically connected the operation of the electrode and the metallic conductor terminal 40 of solid-state imager 12; And give bonding agent RE to the peristome of hollow case, make bonding agent RE sclerosis and the operation of closed peristome after utilizing transparent panel 26 closed peristomes.The viscosity of this bonding agent RE is 10, and more than the 000mPasec, the duro-meter hardness of the bonding agent RE after the sclerosis is below 80 in the A level.
Below describe in detail.
The bonding agent RE that uses in the manufacture method of solid camera head of the present invention, viscosity is 10, and more than the 000mPasec, the duro-meter hardness after the sclerosis is below 80 in the A level.At this, it is that benchmark is measured that the viscosity of bonding agent RE is made as with the described single cylinder rotational viscometer method of JIS K7233.Again, to be made as with the described hardness determination of pushing of JIS K7215 be that benchmark is measured to the duro-meter hardness of the bonding agent RE after the sclerosis.
The bonding agent that the present invention uses, the viscosity in the time of 25 ℃ is 10, more than the 000mPasec, preferably 10,000~150,000mPasec is more preferably 30,000~100,000mPasec.At this, above-mentioned viscosity is to be that benchmark is measured the value obtained with the described single cylinder rotational viscometer method of JIS K7233.When the viscosity of bonding agent less than 10, during 000mPasec, warpage or crooked takes place in bond layer attenuation between this hollow case and the transparent panel easily on this hollow case.
Again, the bonding agent RE that the present invention uses, the duro-meter hardness (Shore hardness) after the preferred sclerosis is below 80 in type A (A level) (also being called " duro-meter A hardness "), is more preferably 1~50, being more preferably is 1~30.In this above-mentioned duro-meter hardness is to be that benchmark is measured the value obtained with the described hardness determination of pushing of JIS K7233.The duro-meter hardness of the bonding agent after hardening is when surpassing 80 value, can not prevent generation, make the shooting decreased performance of solid-state imager because of the warpage of the solid camera head behind the different covering peristomes that produce of resin system box and the coefficient of linear expansion of transparent panel.
As the method for giving the peristome of this hollow case, can use well-known method, the method that illustration uses injector bonding agent to be given target site from nozzle with bonding agent RE.
As the bonding agent RE that uses among the present invention, the radioactive ray hardening, humidity-hardening or the thermosetting bonding agent that satisfy above-mentioned viscosity and duro-meter hardness be can use, uv-hardening resin, visible light hardening resin, thermosetting resin and humidity-hardening resin preferably used.
Again, the bonding agent that uses among the present invention, also can have simultaneously ultraviolet ray (tens of~400nm) hardening, visible light (400 surpass~700nm) character of hardening, thermosetting or humidity-hardening.
As the concrete example of these resins, but illustration acrylic resin, epoxy resin, silicone resin, unsaturated polyester resin, phenolic resins, urea melamine resin, polyurethane resin, polyimide resin etc.
Even wherein, as the bonding agent that uses among the present invention, also preferred uv-hardening resin.When bonding agent is uv-hardening resin, can be in that so its sclerosis productivity of chien shih be strong in short-term, and when sclerosis box or the temperature of transparent panel 26 rise little, so be difficult for taking place warpage that the difference because of this hollow case 20 and the coefficient of linear expansion of transparent panel 26 produces or crooked etc. stress.
Uv-hardening resin as mentioned above.
In the present invention in the bonding agent of Shi Yonging, also can be as required, cooperate purposes suitably to add polymerization and begin additives such as agent, crosslinking agent, reaction promoter, and inorganic filler, rubber constituent etc. such as silicon dioxide, but these additives or filler etc. also appropriate combination use.
Again, for the viscosity of regulating bonding agent or the duro-meter A hardness of the bonding agent after regulating sclerosis, can be suitably the hardening one-tenth of simple function be divided into multi-functional hardening composition, also can uses them simultaneously.
The manufacture method of solid camera head of the present invention, comprise following operation: it is integrally formed by the resin system sidewall 24 on the resin system base plate 22 of essentially rectangular and the roughly vertical periphery that is located at base plate 22 to be shaped, and plug conductor terminal 40, and has the operation of the resin system hollow case 20 of peristome; The operation of cementation solid-state imager 12 on the inner bottom surface of hollow case 20; Be electrically connected the operation of the electrode and the metallic conductor terminal 40 of solid-state imager 12; And give bonding agent RE to the peristome of hollow case 20, make bonding agent RE sclerosis and the operation of closed peristome after utilizing transparent panel 26 closed peristomes.Above-mentioned each operation himself is general operation, can use well-known method.
When forming the hollow case of using among the present invention 20, can use the resin combination that in resin, has added suitable filler.
(example I)
To on copper alloy, be embedded in the metal pattern by gold-plated lead frame, obtain to be inserted with the resin system hollow case (wide 50mm * depth 10mm * high 4mm, thick 2mm) of conductor terminal by injection moulding liquid-crystalline polymer [ス ミ カ ス-バ-E6008B (Sumitomo Chemical (strain) system)].
The resin system hollow case of above-mentioned band conductor terminal after cleaning with ultra-pure water in the cleaning shop of grade 1,000, is immersed in the ultrasonic waves for cleaning (38kHz) of carrying out in the ultra-pure water of 500ml 20 seconds, cleaning-drying resin system hollow case.After utilizing bonding agent linear transducer to be cemented on the inner bottom surface of this resin system box, utilize closing line distribution between linear transducer and conductor terminal.
After the intact resin system hollow case drying of distribution, use injector to give UV cured property bonding agent fluid sealant 5088[ヘ Application ケ Le ジ ャ パ Application (strain) system at its peristome, viscosity in the time of 25 ℃: 65,000mPasec], after utilizing transparent panel to seal this peristome, utilize the about 3000mJ/cm of mercury vapor lamp irradiation 2Ultraviolet ray (365nm) make adhesive hardens, obtain solid camera head.
Resin test film after above-mentioned fluid sealant 5088 sclerosis, duro-meter A hardness is 30.
On the solid camera head that obtains, be that the maximum amount of warpage of benchmark is 20 μ m with the straight line at vertical two ends of linking this box base plate.
(Comparative Example I)
Except in example I, using uv-hardening resin XE17-303[GE Toshiba's silicone (strain) system, viscosity in the time of 25 ℃: 4,000mPasec, the duro-meter A hardness after the sclerosis: 17] as beyond the bonding agent, made solid camera head with embodiment 1 just the samely.
The maximum amount of warpage of the solid camera head that obtains is 55 μ m.
(Comparative Example I I)
Except in example I, using uv-hardening resin XE17-303[ケ ミ テ ッ Network (strain) system, viscosity in the time of 25 ℃: 600mPasec, duro-meter D hardness after the sclerosis: 80] as beyond the bonding agent, made solid camera head with embodiment 1 just the samely.In addition, duro-meter D hardness is the same with duro-meter A hardness, and utilizing with the described hardness determination of pushing of JIS K7215 is that the mensuration of benchmark obtains.
The maximum amount of warpage of the solid camera head that obtains is 102 μ m, and has seen in the part of the bonding plane of transparent panel and resin system box peristome and to have peeled off.
Below, the concrete structure of the solid camera head that has above-mentioned solid shooting element collection box is described.
Fig. 4 is the detailed exploded perspective view that has the solid camera head of solid shooting element collection box.
As mentioned above, solid shooting element collection box 20 has solid-state imager 12 and will be configured in inner taking in and use recess DP, and the size that has vertical X is the resinous box main body (hollow box) 100 more than 3 times of the size of Width, with from taking in a plurality of conductor terminals 40 that extend to the outside via the sidewall parallel with vertical X of box main body 100 24 with the inside of recess DP.
This solid camera head has solid shooting element collection box 20, is located at the solid-state imager of taking in among the recess DP 12, and the transparent panel 26 with the opening of recess DP is taken in sealing.Vertical and the horizontal aspect ratio of box main body is higher, more than 3.When adopting liquid-crystalline polymer as the material of the high box main body 100 of aspect ratio, the high molecular state of orientation that can obtain to align in the vertical, thermal endurance, strength characteristics, low bulk are good.And, as mentioned above, preferably in resin, comprise the filler that inorganic material constitutes.That is,, can further improve rigidity by contain the filler that inorganic material constitutes at resin.Combination by liquid-crystalline polymer and inorganic material filler can constitute the box with high rigidity.Filler is made of a plurality of fibrous bodies or spicule, and the aspect ratio of each fibrous body or spicule is more than 5.
And the aspect ratio of solid-state imager 12 also is more than 3.Solid-state imager 12 is one dimension CCD (linear transducers).Because the high solid-state imager 12 easy deflections of aspect ratio are so the present invention is effective especially under the situation of using this solid-state imager 12.In addition, solid-state imager 12 also can be only vertical both ends by island 30 be fixed on the island 30.
On vertical both ends of solid shooting element collection box 20, be respectively equipped with rib 105.Rib 105 is integrally formed with sidewall 24, and from vertical two ends of box main body 100, X is outwards outstanding along the longitudinal.The XY cross section of rib 105 constitutes roughly U font with the both ends of box main body 100.Rib 105 suppresses perpendicular to warpage on the direction of sidewall 24 or deflection.The part of lead frame is exposed in the space of rib 105 inboards.
It is depth direction, a plurality of recesses (thinner wall section, groove) 104 of extending of X along the longitudinal that the sidewall 24 of box main body 100 has Width Y.So, resin flow is even during ester moulding, and can carry out lightweight.
Fig. 5 is the stereogram of solid shooting element collection box central portion that has the island 30 of (otch) 132 that have slit.
On box main body 100, along vertical X of the base plate 22 of box main body 100, be provided with a pair of resinous rib 103 integratedly with base plate 22.By a pair of rib 103, be formed with groove LGR betwixt.Box main body 100 is the little box main bodies of aspect ratio that are easy to generate strain, and, no matter whether constitute by resin, in this device,, can suppress perpendicular to warpage or deflection on vertical directions X of box main body 100 owing to have the rib 103 that on vertical X, extends.Rib 103 preferably has a plurality of, considers from the viewpoint that improves rigidity, and rib 103 is preferably placed on the extended line of short transverse Z of sidewall 24.
Solid shooting element collection box 20 is located on the bottom surface of recess DP, has the island 30 of wanting fixed solid imaging apparatus 12, with island 30 mutually continuously, to the island compressed part 34 of extension along the sidewall longitudinally 24 of box main body 100 in.Because island compressed part 34 is extended to the inside of sidewall 24, so can limit island 30, therefore, can suppress the warpage on island 30 and the warpage of solid-state imager 12 with respect to the moving of box main body 100, can suppress the deterioration of its characteristic.And, can also dispel the heat to the outside via island compressed part 34.
Island 30 has the slit (otch) 132 that extends towards the other end from an end of Width on the position except its both ends.Because stress concentrates near the slit 132 the island part easily, this island part deflection, and absorb and expand and shrink, so can suppress the deflection of solid-state imager 12.
And solid shooting element collection box 20 has at least one pair of island compressed part 34, and it is mutually continuous with island 30, to extending in the sidewall longitudinally 24 of box main body 100.A pair of island compressed part 34 is vertically being separated on the X, and slit 132 is located near the middle position J between a pair of island compressed part 34.The position of island compressed part 34 is limited to along the island position of center line of the island compressed part 34 of 30 Width.When with the distance between a pair of island compressed part 34 as X 0, will be from the position of an island compressed part 34 to the distance of middle position J as X 1The time, the distance X from another island compressed part 34 to middle position J 2Equal X 0/ 2.
As mentioned above, though owing to there is a pair of island compressed part 34,30 warpage is suppressed to the island, owing to the fixed-site of a pair of island compressed part 34 on sidewall 24, so stress add easily island 30 betwixt middle position J near.Since near this middle position J, be provided with slit 132, thus stress absorbed in this position, this island part deflection, and absorb expansion and contraction, so can suppress the deflection of solid-state imager 12.
Slit 132 has the 1st slit 132A and the 2nd slit 132B, one end of the 1st slit 132A Width of 30 from the island extends to the other end, the 2nd slit 132B extends to an end from the other end of the Width on island, and the 1st slit 132A and the 2nd slit 132B dispose across middle position J.
In this case, since the locational island 30 of formation of the 1st slit 132A around vertically reverse towards with the locational island 30 of the formation of the 2nd slit 132B around reverse longitudinally towards opposite, so can offset island 30 around reversing longitudinally, the both ends that can suppress island 30 are around reversing longitudinally.And, because the 1st slit 132A and the 2nd slit 132B have 1 point-symmetric tendency of P on the island 30 between the 1st slit 132A and the 2nd slit 132B, so under island 30 had produced longitudinally the situation of thermal expansion, the Width on island 30 was restricted with respect to the mobile of center line longitudinally on island 30.
The deep D of slit 132 is made of curved surface.The Z axle that this curved surface part comprises with the thickness direction that is parallel to island 30 is the barrel surface at center.In this case, because stress can relax the stress raisers on the deep D when concentrating on the island 30 on the formation position of slit 132, so the durability on island 30 is good.And, owing to constitute the deep of slit, produce flash when being shaped so can also reduce by curved surface.
Be filled with softer hardening resin 32 in the inside of slit 132, the island 30 easy deflections on the formation position of slit 132, and can absorb expansion and contraction.Hardening resin 32 is coated on the inner surface portion of box main body 100, and is coated on the boundary portion of inner surface of conductor terminal 40 and box main body 100.The duro-meter hardness of hardening resin 32 and RE is below 80 in the A level
And box main body 100 has a pair of jut (jetty portion) 101 with Width two end in contact on island 30.Jut 101 is 30 longitudinal extension along the island.A pair of jut 101 can suppress the moving of Width on island 30.Box main body 100 has along the island a pair of groove SGR of 30 longitudinal extension, and the side of each jut 101 constitutes the side of each groove SGR.That is, on the inner bottom surface near the side on island 30, box, suppress it and vertically be equipped with groove (groove) SGR, in addition, jut 101 is not located on the formation position of slit 132, island 30 easy deformation on the formation position of slit 132.
And the sensitive surface of solid-state imager 12 exposes, and sufficient bright light is incided be subjected on the first face.The 1st hardening resin 32 is stopped by the side in jut 101 outsides, is not present on the sensitive surface.Therefore, according to this solid camera head, can carry out correct shooting.
The recess DP of transparent panel 26 (with reference to Fig. 4) enclosure main body 100, but between box main body 100 and transparent panel 26, add the 2nd hardening resin RE.That is, on the junction surface between box main body 100 and the transparent panel 26, there is hardening resin RE.The 2nd hardening resin RE can bonding transparent panel 26 and box main body 100.
And the 1st hardening resin 32 and the 2nd hardening resin RE are continuous.Because the 1st hardening resin 32 and the 2nd hardening resin RE can apply in same operation, so simple in structure.In addition, the connecting portion (with reference to Fig. 1) of the 1st hardening resin 32 lining closing lines 42 and conductor terminal 40 can prevent this connecting portion deterioration.
Fig. 6 is the stereogram of solid shooting element collection box central portion that has the island of separation.
A pair of island 30,30 box main body 100 vertically on separate.That is,, on the box main body position 100A between both sides' the island 30,30, be not fixed with island 100 because separate on island 30,30, thus the easy deflection of this box main body position 100A, and absorbable expansion and contraction, can suppress the fixedly deflection of imaging apparatus 12.
Fig. 7 is the figure that is used to illustrate the manufacture method of solid shooting element collection box.
Under the situation of the injection moulding that carries out above-mentioned solid shooting element collection box, resin RE is flowed between the 1st metal pattern M1 and the 2nd metal pattern M2 of the die cavity that has above-mentioned box formation between the subtend face.The 1st metal pattern M1 and the 2nd metal pattern M2 constitute the box metal mould for formation.Between the 1st metal pattern M1 and the 2nd metal pattern M2, be inserted with lead frame.
The 2nd metal pattern M2 has the upwardly extending taper resin entrance hole M21 in Z side, and has the contact path M22 that extends at directions X from the front end of resin entrance hole M21.The leading section of contact path 22 constitutes gate part, and resin RE1 is imported in the die cavity from here, and resin flows in the die cavity along directions X.Therefore, be under the situation of liquid-crystalline polymer at resin RE1, high molecular being oriented on the directions X that constitutes it alignd.
After filling at resin, solidifying, by connecting a plurality of push rod EP of the 1st metal pattern M1, the resin that solidifies when the direction pushing of the 2nd metal pattern M2, is finished solid shooting element collection box.That is, method of the present invention comprises resin is injected the operation that the mould cavity part of metal pattern M1, M2 is cured.Afterwards, with solid-state imager 12 cementations, be connected on the island 30, be electrically connected solid-state imager 12 and conductor terminal 40 by the line closing line, last, with the upper opening of transparent panel 26 sealing boxes, finish above-mentioned solid camera head.
As mentioned above, the manufacture method of above-mentioned solid camera head is provided with in the following order:
(I) shaping is integrally formed by the resin system base plate 22 of essentially rectangular and the roughly vertical resin system sidewall 24 that is located on base plate 22 peripheries, and plug metallic conductor terminal 40, and the operation of the thermoplastic resin system hollow case 20 that can be sealed by transparent panel 26 of peristome; (II) operation of cementation solid-state imager 12 on the inner bottom surface of box 20; (III) utilize closing line to be electrically connected the operation of electrode and this metallic conductor terminal 40 of this solid-state imager 12; (IV) operation of sealing the box peristomes by transparent panel 26.
And, have any one operation of from following operation, selecting:
(i) form constituent A and make its sclerosis form hardening resin A (32) by give hardening resin at this box inner surface, thereby utilize at least a portion that hardening resin covers the box inner surface with and/or box in the operation of this conductor terminal 40 and the boundary portion of box inner surface, and (ii) give hardening resin constituent B (RE) at the position that contacts with this transparent panel 26 of the peristome of box, and after utilizing these peristomes of transparent panel 26 sealing, utilize hardening resin B after the hardening resin constituent B sclerosis to shut the operation of peristome.
Hardening resin forms the viscosity of constituent A below 5000mPasec.It is that the cubical contraction of following hardening resin to form the sclerosis of constituent A forms constituent A at the hardening resin below 5% that this hardening resin forms constituent A, when above-mentioned hardening resin formed irradiation ultraviolet radiation on the constituent A, formation hardening resin A, the weight of hardening resin A was at more than 99.8% of weight of presclerotic hardening resin formation constituent A, below 100%.
In addition, above-mentioned operation (i) is, the hardening resin of giving UV cured property on the hollow case inner surface forms constituent A, make resin-shaped become constituent A to become hardening resin A by transparent panel 26 irradiation ultraviolet radiations of shutting, thereby utilize hardening resin 32 to cover the operation of the boundary portion of at least a portion of hollow case inner surface and this metallic conductor terminal 40 in the box and resin part.
And as mentioned above, hardening resin forms the viscosity of constituent B preferably more than 10000mPasec.
Hardening resin forms the preferably UV cured property of constituent B, above-mentioned operation (ii) is, on hollow case with transparent panel 26 between give UV cured property resin-shaped become constituent B (RE), thereby make this resin-shaped become constituent B to become the operation that hardening resin seals this box by these transparent panel 26 irradiation ultraviolet radiations.

Claims (18)

1, a kind of solid camera head, have by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on its periphery integrally formed, and plug the metallic conductor terminal, the thermoplastic resin system hollow case that peristome is sealed by transparent panel, the inner bottom surface of this hollow case is provided with the metallic island, cementation has solid-state imager on this island, it is characterized in that:
(a) inner surface portion of above-mentioned hollow case,
(b) the boundary portion of above-mentioned metallic conductor terminal and above-mentioned hollow case inner surface and
(c) junction surface of above-mentioned hollow case and above-mentioned transparent panel
Certain 1 position on, the configuration hardening resin forms the hardening resin after the constituent sclerosis, the duro-meter hardness of aforementioned hardening resin is below 80 in the A level.
2, solid camera head as claimed in claim 1 is characterized in that: aforementioned hardening resin comprises at least a kind that selects from epoxy resin, unsaturated polyester resin, phenolic resins, urea-Melamine resin sheet, polyurethane resin, silicone resin, polyimide resin and acrylic resin group.
3, solid camera head as claimed in claim 1 is characterized in that: on above-mentioned metallic island along the jetty portion that vertically is provided with of above-mentioned solid-state imager.
4, solid camera head as claimed in claim 1 is characterized in that: the side near above-mentioned metallic island on the inner bottom surface of above-mentioned box, vertically is equipped with groove along it.
5, solid camera head as claimed in claim 1 is characterized in that: aforementioned hardening resin constituent comprises uv-hardening resin.
6, a kind of manufacture method of solid-state imager is provided with in the following order:
(I) be shaped integrally formedly, and plug the metallic conductor terminal by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on this base plate periphery, and the operation of the thermoplastic resin system hollow case that can be sealed by transparent panel of peristome;
(II) operation of cementation solid-state imager on the inner bottom surface of this box;
(III) utilize closing line to be electrically connected the operation of electrode and this metallic conductor terminal of this solid-state imager;
(IV) seal the operation of this box peristome by transparent panel;
It is characterized in that having some operations of from following operation, selecting:
(i) form constituent A and make its sclerosis form hardening resin A by give hardening resin at this box inner surface, thereby utilize at least a portion that hardening resin covers this box inner surface with and/or this box in this conductor terminal and the operation of the boundary portion of this box inner surface, and
(ii) give hardening resin constituent B at the position that contacts with this transparent panel of the peristome of this box, above-mentioned hardening resin forms the viscosity of constituent B more than 10000mPasec, and after utilizing transparent panel to seal this peristome, utilize hardening resin B after this hardening resin constituent B sclerosis to shut the operation of this peristome.
7, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: above-mentioned hardening resin forms the viscosity of constituent A below 5000mPasec.
8, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: follow above-mentioned hardening resin to form the cubical contraction of sclerosis of constituent A below 5%.
9, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: it is UV cured property that above-mentioned hardening resin forms constituent A.
10, the manufacture method of solid camera head as claimed in claim 9, it is characterized in that: when above-mentioned hardening resin formed irradiation ultraviolet radiation on the constituent A, formation hardening resin A, the weight of this hardening resin A was at more than 99.8% of weight of presclerotic hardening resin formation constituent A, below 100%.
11, the manufacture method of solid camera head as claimed in claim 9, it is characterized in that: above-mentioned operation (i) is, the hardening resin of giving UV cured property on above-mentioned hollow case inner surface forms constituent A, make this resin-shaped become constituent A to become hardening resin A by the transparent panel irradiation ultraviolet radiation of shutting, thus utilize at least a portion that hardening resin covers this hollow case inner surface with and/or this box in this metallic conductor terminal and the operation of the boundary portion of resin part.
12, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: it is UV cured property that this hardening resin forms constituent B.
13, the manufacture method of solid camera head as claimed in claim 12, it is characterized in that: above-mentioned operation (ii) is, on above-mentioned hollow case with transparent panel between give UV cured property resin-shaped become constituent B, thereby make this resin-shaped become constituent B to become the operation that hardening resin seals this box by this transparent panel irradiation ultraviolet radiation.
14, a kind of solid camera head that utilizes the described manufacture method of claim 6 to make.
15, a kind of solid camera head is characterized in that: have:
Resinous box main body with recess;
Be located at the island on the bottom surface of above-mentioned recess;
Be fixed on the solid-state imager on the above-mentioned island;
Sidewall via above-mentioned box main body in the above-mentioned recess extends to outside conductor terminal;
The closing line that connects above-mentioned solid-state imager and above-mentioned conductor terminal;
With above-mentioned to the Width two ends contact, along above-mentioned arrive vertically more than a pair of jut;
With contacted the 1st hardening resin of each outer lateral side of above-mentioned jut.
16, solid camera head as claimed in claim 15 is characterized in that: have:
Seal the transparent panel of the recess of above-mentioned box main body;
Be installed at the 2nd hardening resin between above-mentioned box main body and the above-mentioned transparent panel.
17, solid camera head as claimed in claim 16 is characterized in that: above-mentioned the 1st hardening resin and above-mentioned the 2nd hardening resin are continuous.
18, solid camera head as claimed in claim 15 is characterized in that: the be covered connecting portion of above-mentioned closing line and above-mentioned conductor terminal of above-mentioned the 1st hardening resin.
CN200610071648A 2005-03-25 2006-03-27 Solid camera head and manufacture method thereof Expired - Fee Related CN100576553C (en)

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JP2005087443 2005-03-25
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102176549A (en) * 2010-12-30 2011-09-07 蔡彭博 Transparent security box of cable intermediate head

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Publication number Priority date Publication date Assignee Title
TW200820386A (en) * 2006-07-21 2008-05-01 Sumitomo Chemical Co Case for housing solid-state imaging element, manufacturing method thereof, and solid-state imaging device
JP5684491B2 (en) 2010-04-27 2015-03-11 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Semiconductor device and manufacturing method thereof
JP2012079914A (en) * 2010-10-01 2012-04-19 Mitsubishi Electric Corp Power module and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102176549A (en) * 2010-12-30 2011-09-07 蔡彭博 Transparent security box of cable intermediate head

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