GB1265007A - - Google Patents
Info
- Publication number
- GB1265007A GB1265007A GB1265007DA GB1265007A GB 1265007 A GB1265007 A GB 1265007A GB 1265007D A GB1265007D A GB 1265007DA GB 1265007 A GB1265007 A GB 1265007A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- heat sink
- titania
- alumina
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1,265,007. Semi-conductor devices. ASSOCIATED ENG. Ltd. 18 Nov., 1969 [9 Dec., 1968], No. 58456/68. Heading H1K. An assembly comprises a semi-conductor device 1, a heat sink 2, and a plasma or flame sprayed layer 3 of an electrically insulating and thermally conducting material provided between adjacent surfaces of the device and heat sink. The layer 3, which may be formed on the heat sink or the device, may be of alumina, titania, magnesia, chromium nitride, aluminium nitride or a mixture of alumina and titania. A metal layer 4, e.g. of copper, may also be provided, by plasma spraying, on the layer 3, and the device may be soldered to it. Alternatively the layer 4 may be an epoxy resin which is secured to 3 by melting, and finally cured in contact with the device. In a further alternative the layer 4 may be dispensed with, and the device may be in contact with the layer 3.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5845668 | 1968-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1265007A true GB1265007A (en) | 1972-03-01 |
Family
ID=10481665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1265007D Expired GB1265007A (en) | 1968-12-09 | 1968-12-09 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1265007A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2141859A (en) * | 1983-06-20 | 1985-01-03 | Adco Ind Components | A display device |
GB2219133A (en) * | 1988-05-26 | 1989-11-29 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
GB2222721A (en) * | 1988-08-23 | 1990-03-14 | Nobuo Mikoshiba | Cooling semiconductor devices |
EP0843508A2 (en) * | 1996-11-15 | 1998-05-20 | Honeywell Inc. | Coating circuits to dissipate heat |
EP0771023A3 (en) * | 1995-10-27 | 1999-03-24 | Honeywell Inc. | Method of applying a protective coating on a semiconductor integrated circuit |
EP2245913A1 (en) * | 2008-01-22 | 2010-11-03 | Valtion Teknillinen Tutkimuskeskus | Method for arranging cooling for a component and a cooling element |
EP2273181B1 (en) * | 2009-07-07 | 2014-05-07 | Siteco Beleuchtungstechnik GmbH | Indoor or outdoor luminaire |
DE102019201292A1 (en) * | 2019-02-01 | 2020-08-06 | Zf Friedrichshafen Ag | Power electronics arrangement for a vehicle, in particular an electric and / or hybrid vehicle, and method for producing such a power electronics arrangement |
-
1968
- 1968-12-09 GB GB1265007D patent/GB1265007A/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2141859A (en) * | 1983-06-20 | 1985-01-03 | Adco Ind Components | A display device |
GB2219133A (en) * | 1988-05-26 | 1989-11-29 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
GB2219133B (en) * | 1988-05-26 | 1991-11-20 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
GB2222721A (en) * | 1988-08-23 | 1990-03-14 | Nobuo Mikoshiba | Cooling semiconductor devices |
GB2222721B (en) * | 1988-08-23 | 1993-07-28 | Nobuo Mikoshiba | Cooling semiconductor devices |
EP0771023A3 (en) * | 1995-10-27 | 1999-03-24 | Honeywell Inc. | Method of applying a protective coating on a semiconductor integrated circuit |
EP0843508A2 (en) * | 1996-11-15 | 1998-05-20 | Honeywell Inc. | Coating circuits to dissipate heat |
EP0843508A3 (en) * | 1996-11-15 | 2000-04-19 | Honeywell Inc. | Coating circuits to dissipate heat |
EP2245913A1 (en) * | 2008-01-22 | 2010-11-03 | Valtion Teknillinen Tutkimuskeskus | Method for arranging cooling for a component and a cooling element |
EP2245913A4 (en) * | 2008-01-22 | 2011-01-26 | Valtion Teknillinen | Method for arranging cooling for a component and a cooling element |
EP2273181B1 (en) * | 2009-07-07 | 2014-05-07 | Siteco Beleuchtungstechnik GmbH | Indoor or outdoor luminaire |
DE102019201292A1 (en) * | 2019-02-01 | 2020-08-06 | Zf Friedrichshafen Ag | Power electronics arrangement for a vehicle, in particular an electric and / or hybrid vehicle, and method for producing such a power electronics arrangement |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CSNS | Application of which complete specification have been accepted and published, but patent is not sealed |