GB1265007A - - Google Patents

Info

Publication number
GB1265007A
GB1265007A GB1265007DA GB1265007A GB 1265007 A GB1265007 A GB 1265007A GB 1265007D A GB1265007D A GB 1265007DA GB 1265007 A GB1265007 A GB 1265007A
Authority
GB
United Kingdom
Prior art keywords
layer
heat sink
titania
alumina
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1265007A publication Critical patent/GB1265007A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1,265,007. Semi-conductor devices. ASSOCIATED ENG. Ltd. 18 Nov., 1969 [9 Dec., 1968], No. 58456/68. Heading H1K. An assembly comprises a semi-conductor device 1, a heat sink 2, and a plasma or flame sprayed layer 3 of an electrically insulating and thermally conducting material provided between adjacent surfaces of the device and heat sink. The layer 3, which may be formed on the heat sink or the device, may be of alumina, titania, magnesia, chromium nitride, aluminium nitride or a mixture of alumina and titania. A metal layer 4, e.g. of copper, may also be provided, by plasma spraying, on the layer 3, and the device may be soldered to it. Alternatively the layer 4 may be an epoxy resin which is secured to 3 by melting, and finally cured in contact with the device. In a further alternative the layer 4 may be dispensed with, and the device may be in contact with the layer 3.
GB1265007D 1968-12-09 1968-12-09 Expired GB1265007A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5845668 1968-12-09

Publications (1)

Publication Number Publication Date
GB1265007A true GB1265007A (en) 1972-03-01

Family

ID=10481665

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1265007D Expired GB1265007A (en) 1968-12-09 1968-12-09

Country Status (1)

Country Link
GB (1) GB1265007A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141859A (en) * 1983-06-20 1985-01-03 Adco Ind Components A display device
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2222721A (en) * 1988-08-23 1990-03-14 Nobuo Mikoshiba Cooling semiconductor devices
EP0843508A2 (en) * 1996-11-15 1998-05-20 Honeywell Inc. Coating circuits to dissipate heat
EP0771023A3 (en) * 1995-10-27 1999-03-24 Honeywell Inc. Method of applying a protective coating on a semiconductor integrated circuit
EP2245913A1 (en) * 2008-01-22 2010-11-03 Valtion Teknillinen Tutkimuskeskus Method for arranging cooling for a component and a cooling element
EP2273181B1 (en) * 2009-07-07 2014-05-07 Siteco Beleuchtungstechnik GmbH Indoor or outdoor luminaire
DE102019201292A1 (en) * 2019-02-01 2020-08-06 Zf Friedrichshafen Ag Power electronics arrangement for a vehicle, in particular an electric and / or hybrid vehicle, and method for producing such a power electronics arrangement

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141859A (en) * 1983-06-20 1985-01-03 Adco Ind Components A display device
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2219133B (en) * 1988-05-26 1991-11-20 Bergquist Company The Thermally conductive mounting for a semiconductor component
GB2222721A (en) * 1988-08-23 1990-03-14 Nobuo Mikoshiba Cooling semiconductor devices
GB2222721B (en) * 1988-08-23 1993-07-28 Nobuo Mikoshiba Cooling semiconductor devices
EP0771023A3 (en) * 1995-10-27 1999-03-24 Honeywell Inc. Method of applying a protective coating on a semiconductor integrated circuit
EP0843508A2 (en) * 1996-11-15 1998-05-20 Honeywell Inc. Coating circuits to dissipate heat
EP0843508A3 (en) * 1996-11-15 2000-04-19 Honeywell Inc. Coating circuits to dissipate heat
EP2245913A1 (en) * 2008-01-22 2010-11-03 Valtion Teknillinen Tutkimuskeskus Method for arranging cooling for a component and a cooling element
EP2245913A4 (en) * 2008-01-22 2011-01-26 Valtion Teknillinen Method for arranging cooling for a component and a cooling element
EP2273181B1 (en) * 2009-07-07 2014-05-07 Siteco Beleuchtungstechnik GmbH Indoor or outdoor luminaire
DE102019201292A1 (en) * 2019-02-01 2020-08-06 Zf Friedrichshafen Ag Power electronics arrangement for a vehicle, in particular an electric and / or hybrid vehicle, and method for producing such a power electronics arrangement

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed