GB1091561A - Electrical assemblies - Google Patents

Electrical assemblies

Info

Publication number
GB1091561A
GB1091561A GB617363A GB617363A GB1091561A GB 1091561 A GB1091561 A GB 1091561A GB 617363 A GB617363 A GB 617363A GB 617363 A GB617363 A GB 617363A GB 1091561 A GB1091561 A GB 1091561A
Authority
GB
United Kingdom
Prior art keywords
aluminium member
semi
conductor
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB617363A
Inventor
John Duncan Mccoll
Anthony Johnson
Frederick William Mathews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Co Ltd
Original Assignee
English Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Co Ltd filed Critical English Electric Co Ltd
Priority to GB617363A priority Critical patent/GB1091561A/en
Publication of GB1091561A publication Critical patent/GB1091561A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,091,561. Semi-conductor devices. ENGLISH ELECTRIC CO. Ltd. May 13, 1964 [Feb. 15, 1963], No. 6173/63. Heading H1K. A heat sink for a semi-conductor device such as a silicon power diode comprises an aluminium member having a thin layer of solderable metal metallurgically bonded to one surface thereof, the device being soldered to this layer in good thermal and electrical contact therewith. The metal may be copper, silver or gold and may be pressure welded to the aluminium member or deposited thereon by spraying or electrolysis. Cooling fins may be provided on the aluminium member except in the region of the device.
GB617363A 1963-02-15 1963-02-15 Electrical assemblies Expired GB1091561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB617363A GB1091561A (en) 1963-02-15 1963-02-15 Electrical assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB617363A GB1091561A (en) 1963-02-15 1963-02-15 Electrical assemblies

Publications (1)

Publication Number Publication Date
GB1091561A true GB1091561A (en) 1967-11-22

Family

ID=9809753

Family Applications (1)

Application Number Title Priority Date Filing Date
GB617363A Expired GB1091561A (en) 1963-02-15 1963-02-15 Electrical assemblies

Country Status (1)

Country Link
GB (1) GB1091561A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2117972A (en) * 1982-04-02 1983-10-19 Mitsubishi Electric Corp Device for cooling semiconductor elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2117972A (en) * 1982-04-02 1983-10-19 Mitsubishi Electric Corp Device for cooling semiconductor elements

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