FR2718600B1 - Device for clamping electrical power components on a chassis. - Google Patents

Device for clamping electrical power components on a chassis.

Info

Publication number
FR2718600B1
FR2718600B1 FR9404220A FR9404220A FR2718600B1 FR 2718600 B1 FR2718600 B1 FR 2718600B1 FR 9404220 A FR9404220 A FR 9404220A FR 9404220 A FR9404220 A FR 9404220A FR 2718600 B1 FR2718600 B1 FR 2718600B1
Authority
FR
France
Prior art keywords
chassis
electrical power
power components
clamping electrical
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9404220A
Other languages
French (fr)
Other versions
FR2718600A1 (en
Inventor
Patrick Panhaleux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9404220A priority Critical patent/FR2718600B1/en
Publication of FR2718600A1 publication Critical patent/FR2718600A1/en
Application granted granted Critical
Publication of FR2718600B1 publication Critical patent/FR2718600B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9404220A 1994-04-11 1994-04-11 Device for clamping electrical power components on a chassis. Expired - Fee Related FR2718600B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9404220A FR2718600B1 (en) 1994-04-11 1994-04-11 Device for clamping electrical power components on a chassis.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9404220A FR2718600B1 (en) 1994-04-11 1994-04-11 Device for clamping electrical power components on a chassis.

Publications (2)

Publication Number Publication Date
FR2718600A1 FR2718600A1 (en) 1995-10-13
FR2718600B1 true FR2718600B1 (en) 1996-06-14

Family

ID=9461925

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9404220A Expired - Fee Related FR2718600B1 (en) 1994-04-11 1994-04-11 Device for clamping electrical power components on a chassis.

Country Status (1)

Country Link
FR (1) FR2718600B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2131623B (en) * 1982-09-27 1985-12-04 Otter Controls Ltd Mounting arrangement and spring retainer clip for electronic thermostat
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
GB2239739A (en) * 1989-11-16 1991-07-10 Motorola Gmbh Electronic circuit assemblies

Also Published As

Publication number Publication date
FR2718600A1 (en) 1995-10-13

Similar Documents

Publication Publication Date Title
FR2701600B1 (en) DEVICE FOR COOLING ELECTRIC POWER COMPONENTS.
FR2721890B1 (en) POWER ASSISTED STEERING CIRCUIT DEVICE
ZA971445B (en) An electronic trip device comprising a power supply device.
FR2759493B1 (en) SEMICONDUCTOR POWER DEVICE
FR2749268B3 (en) BICYCLE EQUIPPED WITH AN ELECTRIC DRIVE DEVICE
PT102037A (en) TERMINAL STAMPING DEVICE
PT102015A (en) METHOD OF CHECKING A TERMINAL STAMPING DEVICE
FR2785585B1 (en) ELECTRICAL ENERGY DEVICE MOUNTED ON AN AXLE
FR2750944B1 (en) POWER ASSISTED STEERING DEVICE
FR2726129B1 (en) POWER CONNECTION DEVICE
FR2718600B1 (en) Device for clamping electrical power components on a chassis.
FR2692081B1 (en) QUICK CONNECTION ELECTRICAL DISTRIBUTION DEVICE.
FR2748888B1 (en) DEVICE WITH SEMICONDUCTOR POWER ELEMENTS
EP0588279A3 (en) Mounting device for electrochemical battery.
DK0579564T3 (en) Mower intended to be connected to a motor vehicle and comprising an improved immersion device.
FR2688657B1 (en) DEVICE FOR SPREADING THE PASTE ON A CREAPIER SUITABLE FOR THIS PURPOSE.
GB9617538D0 (en) Positioning device
FR2723620B1 (en) DEVICE FOR SOLIDARIZING BY LATCHING AN ELEMENT ON ANOTHER.
FR2744287B1 (en) SIDE COMPONENTS IN A SEMICONDUCTOR POWER DEVICE
FR2690640B1 (en) ELECTRIC WELDING DEVICE.
FR2752289B1 (en) COOLING DEVICE, ESPECIALLY ELECTRONIC MODULES
GB2315059B (en) Positioning device
ES1027799Y (en) AUTOMATIC NUT POSITIONING DEVICE.
GB2314906B (en) An engine mounting device
FR2746251B1 (en) COOLING ELEMENT, ESPECIALLY FOR ELECTRONIC POWER COMPONENTS

Legal Events

Date Code Title Description
ST Notification of lapse