FR2718600B1 - Device for clamping electrical power components on a chassis. - Google Patents
Device for clamping electrical power components on a chassis.Info
- Publication number
- FR2718600B1 FR2718600B1 FR9404220A FR9404220A FR2718600B1 FR 2718600 B1 FR2718600 B1 FR 2718600B1 FR 9404220 A FR9404220 A FR 9404220A FR 9404220 A FR9404220 A FR 9404220A FR 2718600 B1 FR2718600 B1 FR 2718600B1
- Authority
- FR
- France
- Prior art keywords
- chassis
- electrical power
- power components
- clamping electrical
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9404220A FR2718600B1 (en) | 1994-04-11 | 1994-04-11 | Device for clamping electrical power components on a chassis. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9404220A FR2718600B1 (en) | 1994-04-11 | 1994-04-11 | Device for clamping electrical power components on a chassis. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2718600A1 FR2718600A1 (en) | 1995-10-13 |
FR2718600B1 true FR2718600B1 (en) | 1996-06-14 |
Family
ID=9461925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9404220A Expired - Fee Related FR2718600B1 (en) | 1994-04-11 | 1994-04-11 | Device for clamping electrical power components on a chassis. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2718600B1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2131623B (en) * | 1982-09-27 | 1985-12-04 | Otter Controls Ltd | Mounting arrangement and spring retainer clip for electronic thermostat |
CA1307355C (en) * | 1988-05-26 | 1992-09-08 | David C. Degree | Soft-faced semiconductor component backing |
GB2239739A (en) * | 1989-11-16 | 1991-07-10 | Motorola Gmbh | Electronic circuit assemblies |
-
1994
- 1994-04-11 FR FR9404220A patent/FR2718600B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2718600A1 (en) | 1995-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2701600B1 (en) | DEVICE FOR COOLING ELECTRIC POWER COMPONENTS. | |
FR2721890B1 (en) | POWER ASSISTED STEERING CIRCUIT DEVICE | |
ZA971445B (en) | An electronic trip device comprising a power supply device. | |
FR2759493B1 (en) | SEMICONDUCTOR POWER DEVICE | |
FR2749268B3 (en) | BICYCLE EQUIPPED WITH AN ELECTRIC DRIVE DEVICE | |
PT102037A (en) | TERMINAL STAMPING DEVICE | |
PT102015A (en) | METHOD OF CHECKING A TERMINAL STAMPING DEVICE | |
FR2785585B1 (en) | ELECTRICAL ENERGY DEVICE MOUNTED ON AN AXLE | |
FR2750944B1 (en) | POWER ASSISTED STEERING DEVICE | |
FR2726129B1 (en) | POWER CONNECTION DEVICE | |
FR2718600B1 (en) | Device for clamping electrical power components on a chassis. | |
FR2692081B1 (en) | QUICK CONNECTION ELECTRICAL DISTRIBUTION DEVICE. | |
FR2748888B1 (en) | DEVICE WITH SEMICONDUCTOR POWER ELEMENTS | |
EP0588279A3 (en) | Mounting device for electrochemical battery. | |
DK0579564T3 (en) | Mower intended to be connected to a motor vehicle and comprising an improved immersion device. | |
FR2688657B1 (en) | DEVICE FOR SPREADING THE PASTE ON A CREAPIER SUITABLE FOR THIS PURPOSE. | |
GB9617538D0 (en) | Positioning device | |
FR2723620B1 (en) | DEVICE FOR SOLIDARIZING BY LATCHING AN ELEMENT ON ANOTHER. | |
FR2744287B1 (en) | SIDE COMPONENTS IN A SEMICONDUCTOR POWER DEVICE | |
FR2690640B1 (en) | ELECTRIC WELDING DEVICE. | |
FR2752289B1 (en) | COOLING DEVICE, ESPECIALLY ELECTRONIC MODULES | |
GB2315059B (en) | Positioning device | |
ES1027799Y (en) | AUTOMATIC NUT POSITIONING DEVICE. | |
GB2314906B (en) | An engine mounting device | |
FR2746251B1 (en) | COOLING ELEMENT, ESPECIALLY FOR ELECTRONIC POWER COMPONENTS |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |