GB2131623B - Mounting arrangement and spring retainer clip for electronic thermostat - Google Patents

Mounting arrangement and spring retainer clip for electronic thermostat

Info

Publication number
GB2131623B
GB2131623B GB08325488A GB8325488A GB2131623B GB 2131623 B GB2131623 B GB 2131623B GB 08325488 A GB08325488 A GB 08325488A GB 8325488 A GB8325488 A GB 8325488A GB 2131623 B GB2131623 B GB 2131623B
Authority
GB
United Kingdom
Prior art keywords
mounting arrangement
spring retainer
retainer clip
electronic thermostat
thermostat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08325488A
Other versions
GB8325488D0 (en
GB2131623A (en
Inventor
Arthur Malcolm Blackburn
Richard Antony Phillips
Charles Matthew Grief
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otter Controls Ltd
Original Assignee
Otter Controls Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838319969A external-priority patent/GB8319969D0/en
Application filed by Otter Controls Ltd filed Critical Otter Controls Ltd
Publication of GB8325488D0 publication Critical patent/GB8325488D0/en
Publication of GB2131623A publication Critical patent/GB2131623A/en
Application granted granted Critical
Publication of GB2131623B publication Critical patent/GB2131623B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
    • G05D23/1909—Control of temperature characterised by the use of electric means using an analogue comparing device whose output amplitude can only take two discrete values
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB08325488A 1982-09-27 1983-09-23 Mounting arrangement and spring retainer clip for electronic thermostat Expired GB2131623B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8227499 1982-09-27
GB838319969A GB8319969D0 (en) 1983-07-25 1983-07-25 Spring retainer clip

Publications (3)

Publication Number Publication Date
GB8325488D0 GB8325488D0 (en) 1983-10-26
GB2131623A GB2131623A (en) 1984-06-20
GB2131623B true GB2131623B (en) 1985-12-04

Family

ID=26283953

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08325488A Expired GB2131623B (en) 1982-09-27 1983-09-23 Mounting arrangement and spring retainer clip for electronic thermostat

Country Status (2)

Country Link
FR (1) FR2533795A1 (en)
GB (1) GB2131623B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
FR2597215B1 (en) * 1986-04-14 1990-05-11 Nozick Jacques CONNECTION DEVICE FOR CONNECTING A VERY LOW VOLTAGE CONTROL CIRCUIT TO A POWER SWITCHING MODULE
DE9004903U1 (en) * 1990-04-30 1990-07-05 Ing. Rolf Seifert Electronic Gmbh, 5828 Ennepetal, De
FR2718600B1 (en) * 1994-04-11 1996-06-14 Sagem Device for clamping electrical power components on a chassis.
GB2393333B (en) * 2000-04-18 2004-07-07 Sunonwealth Electr Mach Ind Co Circuit board and heat-dissipating device
US6988871B2 (en) 2002-05-06 2006-01-24 Tyco Electronics Canada Ltd. Heat sink attachment clip
DE102005036966A1 (en) * 2005-08-05 2007-02-22 Robert Seuffer Gmbh & Co. Kg Electrical component arrangement
DE102007050985A1 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Crab

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4222090A (en) * 1977-11-25 1980-09-09 Jaffe Richard A Micromodular electronic package
DE3107067A1 (en) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München CONTROL UNIT IN MODULAR DESIGN

Also Published As

Publication number Publication date
FR2533795A1 (en) 1984-03-30
GB8325488D0 (en) 1983-10-26
GB2131623A (en) 1984-06-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee