KR930005518A - 열전도성 인터페이스 재료와 그 이용 방법 - Google Patents

열전도성 인터페이스 재료와 그 이용 방법 Download PDF

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KR930005518A
KR930005518A KR1019920014622A KR920014622A KR930005518A KR 930005518 A KR930005518 A KR 930005518A KR 1019920014622 A KR1019920014622 A KR 1019920014622A KR 920014622 A KR920014622 A KR 920014622A KR 930005518 A KR930005518 A KR 930005518A
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heat
air
conductive material
thermally conductive
holes
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리버티 제임스
존스 피터
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챨스 에이치. 엘러즈
초머릭스, 인코포레이티드
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Publication of KR930005518A publication Critical patent/KR930005518A/ko

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457Parallel ribs and/or grooves
    • Y10T428/24579Parallel ribs and/or grooves with particulate matter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848Three or more layers

Abstract

내용 없음.

Description

열전도성 인터페이스 재료와 그 이용 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 열전도재의 바람직한 제1실시예의 사시도,
제4도는 븐 발명의 열전도재의 바랍직한 다른 실시예의 사시도,
제5도는 바람직한 조립체 형성방법을 보여주는 단면도.

Claims (36)

  1. 방열수단, 열에너지를 발생시키는 전자부품, 및 상기 방열수단과 전자부품 사이에 삽입되어 전자부품에서 방열수단으로 열을 전달하는 수단을 포함하고, 적어도 상기 열전달수단에는 그 열전달수단과 전자부품 사이의 공기를 제거하는 수단이 있는 전기 조립체.
  2. 제1항에 있어서, 상기 방열수단은 히트 싱크나 히트 스프레더중에서 선택되고, 상기 열전달수단은 열전도성 중합체이며, 상기 공기제거수단은 관통구멍, 요철면 또는 홈중에서 선택되는 전기 조립체.
  3. 제1항에 있어서, 상기 열전달수단과 상기 방열수단에 공기제거수단이 있는 전기 조립체.
  4. 제3항에 있어서, 상기 공기제거수단이 일련의 대응 관통구멍들인 전기 조립체.
  5. 제1항에 있어서, 상기 공기제거수단이 상기 열전달수단의 표면에 형성된 일련의 요철면인 전기 조립체.
  6. 제1항에 있어서, 상기 방열수단에는 그 방열수단과 상기 열전달수단 사이의 공기를 제거하는 수단이 있는 전기 조립체.
  7. 열전도재의 제1면에 장착된 전기부품과 열전도재의 제2면에 장착된 히트 싱크를 포함하고, 상기 제2면은 상기 제1면의 반대쪽에 있으며, 열전도재의 상기 표면들중 적어도 하나에는 인접 기판의 표면으로부터 공기를 제거하는 요철면이 있는 열전도성 조립체.
  8. 제7항에 있어서, 상기 제2면이 요철면인 열전도성 조립체.
  9. 제7항에 있어서, 상기 열전도재의 제2면에 인접한 상기 히트 싱크의 표면에는 그 표면과 열전도재 사이에서 공기를 제거하는 요철면이 형성된 열전도성 조립체.
  10. 전자부품과, 상기 전자부품의 한쪽면에 제1면이 장착되고 히트 싱크에 제2면이 장착되는 열전도재를 포함하고, 상기 열전도재에는 상기 제1면으로부터 상기 제2면까지 일련의 관통구멍들이 뚫려있으며, 상기 히트 싱크에는 상기 열전도재의 관통구멍의 배열에 대응하는 형태로 배열된 일련의 관통구명들이 뚫려있는 전기조렵체.
  11. 상기 전자부품이 집적회로소자나 반도체중에서 선택되는 전기 조립체.
  12. 제1면을 갖는 방열수단, 상기 방열수단의 제1면에 장착된 열전달수단, 및 상기 옅전달수단의 제2면에 장착된 방열수단을 포함하고, 적어도 상기 방열수단에는 그 방열수단의 상기 제1면과 상기 열전달수단의 제1면 사이로부터 공기를 제거하는 수단이 있는 전기 조립체.
  13. 제12항에 있어서, 상기 공기제거수단이 관통구멍, 채널, 홈 또는 요철면중에서 선택되는 전기 조립체.
  14. 제12항에 있어서, 상기 열전달수단에 공기제거수단이 있는 전기 조립체.
  15. 제14항에 있어서, 상기 공기제거수단이 관통구멍들이나 요철면중에서 선택되는 전기 조립체.
  16. 제14항에 있어서, 상기 공기제거수단에 상기 방열수단이 있고, 상기 열전달 수단이 일련의 대응 관통구멍들인 전기 조립체.
  17. 열전도재의 제1노출면을 히트 싱크의 노출면에 접합하는 단계: 열전도재의 제2노출면을 열원의 노출면에 접합하여 조립체를 형성하는 단계;및 열전도재와 열원과 히트 싱크 사이의 공기를 제거하기에 충분한 압력을 상기 조립체에 인가하는 단계:를 포함하는, 열원을 히트 싱크에 조립하는 방법.
  18. 제17항에 있어서, 상기 압력을 부압이나 정압중에서 선택하고, 상기 열원은 전자부품이며, 상기 열전도재는 충전된 중합체 고착제이고, 상기 히트 싱크를 금속 히트 싱크, 복합 히트 싱크 또는 히트스프레더중에서 선택하는 방법.
  19. 제17항에 있어서, 상기 열전도재에는 요철면, 채널 또는 관통구멍증에서 선택된 공기제거기구가 있는 방법.
  20. 제17항에 있어서, 상기 히트 싱크에는 요철면, 채널 또는 관통구멍들중에서 선택된 공기제거기구가 있는 방법.
  21. 제18항에 있어서, 상기 열전도재는 하나 또는 그 이상의 열전도재로 채워진 감압 아크릴 고착제인 방법.
  22. 열전달수단의 제1면을 방열수단에 장착하는 단계;상기 열전달수단의 제2면을 방열수단에 장착하여 조립체를 형성하는 단계;및 상기 조립체에서 공기를 제거하도록 그 조립체에 압력을 인가하는 단계;를 포함하고, 적어도 상기 열전달수단의 제2면에는 압력을 받았을 때 그 열전달수단과 상기 발열수단 사이로부터 공기를 제거하는 수단이 있는, 열전도성 전기 조립체의 조립방법.
  23. 중합체 고착재와 열전도성 충전재의 혼합물을 포함하고, 요철면이나 관통구멍들중에서 선택된 공기 제거기구를 갖는 열전도재.
  24. 아크릴 수지, 실리콘 고무, 플루오로실리콘 고무 및 폴리우레탄중에서 선택된 중합체 고착제와 열전도성 충전제의 혼합물로 형성된 형성안정판을 포함하고, 적어도 한면에는 압력을 받았을 때 공기를 제거하는 공기제거 기구가 형성된 열전도재.
  25. 중합체 고착제와 열전도성 충전재로 형성된 형상안정판을 포함하고, 상기 형상안정판에는 제1면으로부터 제2면까지 일련의 관통구멍들이 뚫러있는 열전도재.
  26. 발열수단을 장착하는 표면과 상기 발열수단에서 대기중으로 열을 발산시키는 하나 또는 그 이상의 수단을 포함하고, 상기 표면에는 상기 방열수단과 그 표면 사이로부터 공기를 제거하는 수단이 있는 방열수단.
  27. 평면과 그 평면으로부티 뻗어나와 대기중으로 열을 분산시키는 하나 또는 그 이상의 아암들을 갖는 히트싱크를 포함하고, 상기 평면의 표면에는 일련의 공기 제거용 홈들이 파져있는 방열 기구.
  28. 적어도 하나의 평면을 포함하고, 상기 평면에는 그 평면과 인접한 기반 사이의 공기를 제거하도록 요철면, 채널 또는 관통구멍들중에서 선택된 공기제거기구가 있는 방열 기구.
  29. 감압 접착제중에서 선택된 중합체 고착제와, 그 고착제 전체에 분산된 하나 이상의 열전도성 충전재를 포함하는 열전도재.
  30. 제29항에 있어서, 상기 고착제가 감압 아크릴 수지이고, 상기 하나 이상의 열전도성 충전재는 산화알루미늄, 질화붕소 또는 이들의 혼합물중에서 선택되는 열전도재.
  31. 제28항에 있어서, 상기 중합체 고착제의 중간에 위치한 지지층을 더 포함하는 옅전도재.
  32. 열전도성 감압 접착제로 된 제1층, 상기 제1층 위에 놓이는 지지층, 및 상기 지지층위에 놓이는 열전도성 감압 접착제로 된 제2층을 포함하는 열전도성 인터페이스.
  33. 제32항에 있어서, 상기 열전도성 감압 접착제는 아크릴 수지나 실리콘 고무중에서 선택된 감압 고착제와 하나 이상의 열전도성 충전제로 형성되는 인터페이스.
  34. 제32항에 있어서, 요철면, 채널, 홈 또는 관통구멍들중에서 선택된 공기제거기구를 더 포함하고, 상기 공기제거기구는 적어도 상기 제1층의 노출면에 형성되는 인터페이스.
  35. 제34항에 있어서, 상기 공기제거기구가 상기 제1층의 노출면과 상기 제2층의 노출면에 형성되는 인터페이스
  36. 제34항에 있어서, 상기 공기제거기구는 상기 제1층의 노출면으로부터 상기 지지층과 제2층을 통해 상기 제2층의 노출면까지 뚫려있는 일련의 관통구멍들인 인터페이스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920014622A 1991-08-13 1992-08-12 열전도성 인터페이스 재료와 그 이용 방법 KR930005518A (ko)

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US7/744,568 1991-08-13
US07/744,568 US5213868A (en) 1991-08-13 1991-08-13 Thermally conductive interface materials and methods of using the same

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US (2) US5213868A (ko)
EP (1) EP0528606A3 (ko)
JP (1) JPH05198709A (ko)
KR (1) KR930005518A (ko)
CA (1) CA2073950A1 (ko)
TW (1) TW246715B (ko)

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KR100821382B1 (ko) * 2005-01-21 2008-04-10 엘지전자 주식회사 플라즈마 표시 장치
US8850786B2 (en) 2009-06-05 2014-10-07 INVISTA North America S.à.r.l. Systems and methods for intermittently colored yarn

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KR100603085B1 (ko) * 2004-06-03 2006-07-20 엘에스전선 주식회사 감광성 폴리(에테르-티오에테르)계 공중합 고분자를포함하는 접착제 조성물 및 이를 이용한 접착시트
KR100821382B1 (ko) * 2005-01-21 2008-04-10 엘지전자 주식회사 플라즈마 표시 장치
US8850786B2 (en) 2009-06-05 2014-10-07 INVISTA North America S.à.r.l. Systems and methods for intermittently colored yarn

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EP0528606A3 (en) 1993-07-28
US5298791A (en) 1994-03-29
EP0528606A2 (en) 1993-02-24
TW246715B (ko) 1995-05-01
JPH05198709A (ja) 1993-08-06
US5213868A (en) 1993-05-25
CA2073950A1 (en) 1993-02-14

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