KR940010297A - 태브(tab) 집적회로에 대한 히트싱크 및 커버 - Google Patents

태브(tab) 집적회로에 대한 히트싱크 및 커버 Download PDF

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Publication number
KR940010297A
KR940010297A KR1019930015627A KR930015627A KR940010297A KR 940010297 A KR940010297 A KR 940010297A KR 1019930015627 A KR1019930015627 A KR 1019930015627A KR 930015627 A KR930015627 A KR 930015627A KR 940010297 A KR940010297 A KR 940010297A
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South Korea
Prior art keywords
circuit board
printed circuit
cover
conductive material
integrated circuit
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KR1019930015627A
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English (en)
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KR0156013B1 (ko
Inventor
셀나 에릭
에트하다이 에산
라가사 제임스
Original Assignee
마이클 에이치. 모리스
선 마이크로시스템즈 인코오퍼레이티드
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Publication of KR940010297A publication Critical patent/KR940010297A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

인쇄회로기판상에 장착된 자동테이프 본딩(“TAB”) 집적회로에 대한 히트싱크와 보호 커버를 제공하는 장치는 인쇄회로기판상에 구멍으로 뚫는 다수의 열 바이어를 갖춘 인쇄회로기판으로 구성된다. TAB 지적회로는 열 바이어 위의 인쇄회로기판상에 장착된다. 이때 바이어는 TAB 집적회로에서 발생된 열을 인쇄회로기판의 다른 면에 전달한다. 하트싱크는 열을 방출하기 위해서 기판의 반대면의 열 바이어 위에 놓인다. 히트싱크는 TAB 집적회로위에 놓여진 성형 플라스틱 커버를 걸어 채우는 스프링 클립에 의해서 적절히 유지된다.
이 장치는 쉽게 제조될수 있으며 TAB 집적회로에서 발생된 열을 효율적으로 방출시킨다.

Description

태브(TAB) 집적회로에 대한 히트싱크 및 커버
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 TAB 집적회로에 대한 히트싱크장치의 제1실시예에 제공된 인쇄회로기판을 나타낸다.
제3도는 TAB 집적회로에 대한 히트싱크 장치의 제1실시예에 있어서의 히트 슬러그(slug)를 나타낸다.

Claims (11)

  1. 인쇄회로기판상에 장착된 집적회로에서 발생된 열을 효율적으로 방출하는 장치에 있어서, 제1면과 제2면 및 다수의 에지를 가지며 인쇄회로기판을 통해서 열전도성물질로 이루어진 적어도 하나의 구멍을 갖는 인쇄회로기판; 상기 구멍위의 상기 인쇄회로기판의 제1면상에 장착되고 상기 열 전도성물질에 인접해 있는 집적회로; 상기 열 전도성 물질과 접해있으며 상기 구멍위의 상기 인쇄회로기판의 제3면상에 위치하는 열방출장치; 선반을 가지며 상기 집적회로를 둘러싸는 커버; 및 상기 커버를 상기 인쇄회로기판에 결합하는 스프링 클립으로 구성되며, 상기 집적회로에서 발생된 열을 상기 열 전도성물질을 경유 상기 인쇄회로기판구멍을 통해서 상기 제1면으로 부터 상기 열 방출장치에 의해서 방출되는 상기 제2면까지 전도되는 것을 특징으로 하는 인쇄회로기판상에 장착된 집적회로에서 발생된 열을 효율적으로 방출시키는 장치.
  2. 제1항에 있어서, 상기 인쇄회로기판은 상기 인쇄회로기판의 제1에지상에서 제1노치 및 상기 인쇄회로기판의 제2에지상에서 제2노치를 포함하며, 상기 커버는 상기 커버를 상기 인쇄회로기판과 정렬시키는 상기 커버의 제1 및 제2끝단상에 위치하는 한쌍의 로케이터 핀을 포함하는 것을 특징으로 하는 장치.
  3. 제1항에 있어서, 상기 커버는 적어도 하나의 창을 갖는것을 특징으로 하는 장치.
  4. 제1항에 있어서, 상기 열 전도성 물질은 바이어인 것을 특징으로 하는 장치.
  5. 제4항에 있어서, 열전도성 물질은 구리로 구성되는 것을 특징으로 하는 장치.
  6. 제1항에 있어서, 상기 열전도성 물질은 구멍 내로 부합되는 히트 슬러그로 구성되며 상기 히트 슬러그는 상기 집적회로와 접하는 상기 제1면과 상기 열방출장치와 접하는 상기 제2면에 각각 접하는 것을 특징으로 하는 장치.
  7. 제1항에 있어서, 열 방출장치는 히트싱크로 구성되는 것을 특징으로 하는 장치.
  8. 제7항에 있어서, 열 그리스층이 상기 인쇄회로기판과 상기 히트싱크 사이에 놓여지는 것을 특징으로 하는 장치.
  9. 제2항에 있어서, 상기 인쇄회로기판은 상기 인쇄회로기판의 에지에서 적어도 하나의 노치를 가지며 상기 커버는 상기 노치의 오목부내에 부합하는 적어도 하나의 로케이터 핀을 갖는 것을 특징으로 하는 장치.
  10. 인쇄회로기판내에 바이어를 만드는 단계; 상기 바이어에 인접한 집적회로를 상기 인쇄회로기판에 제1면에 장착하는 단계; 상기 인쇄회로기판의 상기 제1면상의 상기 집적회로위에 커버를 놓아두는 단계; 상기 바이어에 인접한 열 방출장치를 상기 인쇄회로기판의 제2면에 놓아두는 단계; 및 상기 커버를 거는 스프링 클립으로 상기 인쇄회로기판에 상기 열방출장치를 걸어 고정시키는 단계로 구성되는 것을 특징으로 하는 집적회로를 효율적으로 냉각하며 보호하는 집적회로 패키지를 구성하는 방법.
  11. 제10항에 있어서, 상기 열방출장치는 인쇄회로기판을 통해서 상기 히트싱크를 고정시키는 볼트를 사용해서 상기 인쇄회로기판에 장착되는 것을 특징으로 하는 집적회로 패키지를 구성하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930015627A 1992-10-09 1993-08-12 태브 집적회로에 대한 히트싱크 및 커버 KR0156013B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US958,924 1992-10-09
US07/958,924 US5280409A (en) 1992-10-09 1992-10-09 Heat sink and cover for tab integrated circuits

Publications (2)

Publication Number Publication Date
KR940010297A true KR940010297A (ko) 1994-05-24
KR0156013B1 KR0156013B1 (ko) 1998-12-15

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JP (1) JP3336090B2 (ko)
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JP3336090B2 (ja) 2002-10-21
US5280409A (en) 1994-01-18
JPH0823182A (ja) 1996-01-23
KR0156013B1 (ko) 1998-12-15

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