JP5034206B2 - 導電性接着剤 - Google Patents
導電性接着剤 Download PDFInfo
- Publication number
- JP5034206B2 JP5034206B2 JP2005289883A JP2005289883A JP5034206B2 JP 5034206 B2 JP5034206 B2 JP 5034206B2 JP 2005289883 A JP2005289883 A JP 2005289883A JP 2005289883 A JP2005289883 A JP 2005289883A JP 5034206 B2 JP5034206 B2 JP 5034206B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- copper
- core material
- coating film
- conductive filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
Description
32b…被覆膜、32c…粒子。
Claims (2)
- 熱硬化性の樹脂(31)中に導電性フィラー(32)が混合されてなる導電性接着剤に
おいて、
前記導電性フィラー(32)は、銅系金属からなる芯材(32a)と、前記芯材(32
a)の表面を被覆する銀からなる被覆膜(32b)と、前記被覆膜(32b)の表面に設
けられた銀からなる粒子(32c)とを備え、熱によって前記導電性フィラー(32)の
表面に、銅銀合金層を形成するものであり、
前記導電性フィラー(32)における銅と銀との総重量を100としたとき、銅の重量比率は50以下であることを特徴とする導電性接着剤。 - 前記粒子(32c)の径は、1nm〜100nmであることを特徴とする請求項1に記載の導電性接着剤。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289883A JP5034206B2 (ja) | 2005-10-03 | 2005-10-03 | 導電性接着剤 |
US11/500,307 US7357883B2 (en) | 2005-10-03 | 2006-08-08 | Conductive adhesive, method of producing the same, and bonding method |
KR1020060083728A KR100765502B1 (ko) | 2005-10-03 | 2006-08-31 | 도전성 접착제, 도전성 접착제의 제조방법 및 본딩방법 |
DE102006045750A DE102006045750B4 (de) | 2005-10-03 | 2006-09-27 | Leitendes Klebemittel, dessen Verwendung und Verfahren zu dessen Herstellung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289883A JP5034206B2 (ja) | 2005-10-03 | 2005-10-03 | 導電性接着剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007099851A JP2007099851A (ja) | 2007-04-19 |
JP5034206B2 true JP5034206B2 (ja) | 2012-09-26 |
Family
ID=37887221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005289883A Expired - Fee Related JP5034206B2 (ja) | 2005-10-03 | 2005-10-03 | 導電性接着剤 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7357883B2 (ja) |
JP (1) | JP5034206B2 (ja) |
KR (1) | KR100765502B1 (ja) |
DE (1) | DE102006045750B4 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
DE102006056361B4 (de) * | 2006-11-29 | 2012-08-16 | Infineon Technologies Ag | Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren |
JP2008218643A (ja) * | 2007-03-02 | 2008-09-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP5837735B2 (ja) * | 2009-08-20 | 2015-12-24 | 三菱マテリアル株式会社 | 導電性インク組成物及び該組成物を用いて形成された太陽電池モジュール |
JP6665514B2 (ja) | 2015-01-28 | 2020-03-13 | 三菱マテリアル株式会社 | 銀被覆粒子の製造方法 |
JP6636306B2 (ja) * | 2015-11-27 | 2020-01-29 | 日東電工株式会社 | 接着シート、ダイシングテープ一体型接着シート、及び、半導体装置の製造方法 |
JP2017147163A (ja) * | 2016-02-19 | 2017-08-24 | 三菱マテリアル株式会社 | 導電性ペースト及びこれを用いて形成された導電性膜 |
Family Cites Families (37)
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---|---|---|---|---|
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
US4652465A (en) * | 1984-05-14 | 1987-03-24 | Nissan Chemical Industries Ltd. | Process for the production of a silver coated copper powder and conductive coating composition |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JP2504057B2 (ja) | 1987-06-02 | 1996-06-05 | 日立化成工業株式会社 | 導電性粒子 |
JPS6466281A (en) * | 1987-09-08 | 1989-03-13 | Showa Denko Kk | Adhesive composition |
JPH04115407A (ja) * | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
JP2970720B2 (ja) * | 1992-10-23 | 1999-11-02 | 富士通株式会社 | マイクロカプセル型導電性接着剤及びその製造方法 |
JPH06240464A (ja) * | 1993-02-19 | 1994-08-30 | Showa Denko Kk | 銀被覆銅粉およびこれを用いた導電性組成物 |
AU6696494A (en) * | 1993-11-03 | 1995-05-23 | W.L. Gore & Associates, Inc. | Electrically conductive adhesives |
TW340132B (en) | 1994-10-20 | 1998-09-11 | Ibm | Structure for use as an electrical interconnection means and process for preparing the same |
KR100290993B1 (ko) * | 1995-06-13 | 2001-08-07 | 이사오 우치가사키 | 반도체장치,반도체탑재용배선기판및반도체장치의제조방법 |
EP0851515A3 (en) * | 1996-12-27 | 2004-10-27 | Canon Kabushiki Kaisha | Powdery material, electrode member, method for manufacturing same and secondary cell |
US6444305B2 (en) * | 1997-08-29 | 2002-09-03 | 3M Innovative Properties Company | Contact printable adhesive composition and methods of making thereof |
US6013203A (en) * | 1998-08-19 | 2000-01-11 | Enthone-Omi, Inc. | Coatings for EMI/RFI shielding |
JP2000192000A (ja) | 1998-12-28 | 2000-07-11 | Asahi Chem Ind Co Ltd | 導電性接着剤 |
JP2000303042A (ja) | 1999-04-20 | 2000-10-31 | Senju Metal Ind Co Ltd | 導電ペーストおよび導電ペースト用フィラーの製造方法 |
JP2001043729A (ja) | 1999-07-28 | 2001-02-16 | Matsushita Electric Ind Co Ltd | 導電性粒子及びその製造方法、導電性接着剤、半導体装置の実装体、半導体パッケージの実装体、並びに、電子部品の実装体 |
EP1219693B1 (en) * | 2000-02-29 | 2006-05-03 | Matsushita Electric Industrial Co., Ltd. | Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
JP2001297627A (ja) * | 2000-04-12 | 2001-10-26 | Hitachi Chem Co Ltd | 導電材 |
JP2001298049A (ja) * | 2000-04-13 | 2001-10-26 | Asahi Kasei Corp | 接続用複合金属粒子およびペースト、接続基板 |
US20050182161A1 (en) * | 2000-12-15 | 2005-08-18 | Rajesh Khattar | Irregular shaped copper particles and methods of use |
US6884833B2 (en) * | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
JP4815719B2 (ja) | 2001-08-27 | 2011-11-16 | 東洋紡績株式会社 | 導電ペーストおよびプリント配線板 |
JP2003147316A (ja) | 2001-11-16 | 2003-05-21 | Hitachi Chem Co Ltd | 接着用樹脂ペースト組成物及びこれを用いた半導体装置 |
KR100484449B1 (ko) * | 2002-02-25 | 2005-04-22 | 한국과학기술원 | 고출력 모듈 접속용 저 전기 저항/고 임계전류밀도 이방성전도성 접착제조성물 |
JP4389148B2 (ja) * | 2002-05-17 | 2009-12-24 | 日立化成工業株式会社 | 導電ペースト |
JP4235887B2 (ja) * | 2002-06-07 | 2009-03-11 | 日立化成工業株式会社 | 導電ペースト |
JP4238671B2 (ja) * | 2003-05-23 | 2009-03-18 | 株式会社デンソー | 電子部品の実装構造 |
JP2004356053A (ja) * | 2003-05-30 | 2004-12-16 | Matsushita Electric Ind Co Ltd | 導電性ペーストおよびそれを用いた配線板 |
JP4273399B2 (ja) * | 2003-07-08 | 2009-06-03 | 日立化成工業株式会社 | 導電ペースト及びその製造方法 |
DE102004032903B4 (de) * | 2003-07-08 | 2006-06-29 | Hitachi Chemical Co., Ltd. | Leitfähiges Pulver und Verfahren zur Herstellung desselben |
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JP4197151B2 (ja) * | 2003-11-27 | 2008-12-17 | 三井金属鉱業株式会社 | 二層コート銅粉及びその二層コート銅粉の製造方法並びにその二層コート銅粉を用いた導電性ペースト |
US7078095B2 (en) * | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
JP4134134B2 (ja) * | 2004-12-30 | 2008-08-13 | パナゼム カンパニー リミテッド | 導電性ペイント組成物およびこれを適用した電磁波遮蔽用導電膜 |
KR100619390B1 (ko) * | 2005-01-31 | 2006-09-06 | 나믹스 코포레이션 | 도전성 접착제 및 그것을 이용한 회로 |
-
2005
- 2005-10-03 JP JP2005289883A patent/JP5034206B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-08 US US11/500,307 patent/US7357883B2/en not_active Expired - Fee Related
- 2006-08-31 KR KR1020060083728A patent/KR100765502B1/ko not_active IP Right Cessation
- 2006-09-27 DE DE102006045750A patent/DE102006045750B4/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102006045750A1 (de) | 2007-04-12 |
DE102006045750B4 (de) | 2012-06-14 |
US20070075299A1 (en) | 2007-04-05 |
KR100765502B1 (ko) | 2007-10-10 |
JP2007099851A (ja) | 2007-04-19 |
US7357883B2 (en) | 2008-04-15 |
KR20070037674A (ko) | 2007-04-06 |
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