KR920003566A - 반도체 발광장치 - Google Patents

반도체 발광장치 Download PDF

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Publication number
KR920003566A
KR920003566A KR1019910012007A KR910012007A KR920003566A KR 920003566 A KR920003566 A KR 920003566A KR 1019910012007 A KR1019910012007 A KR 1019910012007A KR 910012007 A KR910012007 A KR 910012007A KR 920003566 A KR920003566 A KR 920003566A
Authority
KR
South Korea
Prior art keywords
light emitting
semiconductor light
resin
emitting device
optical
Prior art date
Application number
KR1019910012007A
Other languages
English (en)
Other versions
KR950000112B1 (ko
Inventor
와기 하세가와
가시 구보다
고난 이시이
이찌 나가이세
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR920003566A publication Critical patent/KR920003566A/ko
Application granted granted Critical
Publication of KR950000112B1 publication Critical patent/KR950000112B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

내용 없음

Description

반도체 발광장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 제1실시예의 개략의 구조를 표시하는 측면도.

Claims (1)

  1. 반도체 발광소자와 그 반도체발광소자로부터 출사되는 출사광이 통하도록 미리정하여진 위치관계에서 배치된 적어도 1개의 광학부품과를 상기 출사광이 투과할 수 있는 수지로 이루어지는 수지부내에 고정하고 상기 출사광이 통하는 상기 광학부품의 최종의 것의 축사측의 표면을 상기 수지부로 부터 노출시켜 있으며, 상기 출사광의 상기 반도체소자 및 광학 부품간의 전광로가 상기 수지부내에 위치하도록 수지부를 설치하고 있는 것을 특징으로 하는 반도체 발광장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910012007A 1990-07-16 1991-07-15 반도체 발광장치 KR950000112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-189917 1990-07-16
JP2189917A JP2792722B2 (ja) 1990-07-16 1990-07-16 半導体発光装置

Publications (2)

Publication Number Publication Date
KR920003566A true KR920003566A (ko) 1992-02-29
KR950000112B1 KR950000112B1 (ko) 1995-01-09

Family

ID=16249375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012007A KR950000112B1 (ko) 1990-07-16 1991-07-15 반도체 발광장치

Country Status (5)

Country Link
US (1) US5105237A (ko)
EP (1) EP0466975B1 (ko)
JP (1) JP2792722B2 (ko)
KR (1) KR950000112B1 (ko)
DE (1) DE69001548T2 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5488623A (en) * 1990-11-07 1996-01-30 Fuji Electric Co., Ltd. Mold-type semiconductor laser device with reduced light-emitting point displacement during operation
US5444726A (en) * 1990-11-07 1995-08-22 Fuji Electric Co., Ltd. Semiconductor laser device
TW253996B (ko) * 1992-04-07 1995-08-11 Fuji Electric Co Ltd
US5367530A (en) * 1992-05-29 1994-11-22 Sanyo Electric Co., Ltd. Semiconductor laser apparatus
JP2565279B2 (ja) * 1992-09-25 1996-12-18 日本電気株式会社 光結合構造
ATE150593T1 (de) * 1992-10-14 1997-04-15 Ibm Gekapselte, lichtemittierende diode und kapselungsverfahren
US5414293A (en) * 1992-10-14 1995-05-09 International Business Machines Corporation Encapsulated light emitting diodes
US5516727A (en) * 1993-04-19 1996-05-14 International Business Machines Corporation Method for encapsulating light emitting diodes
JPH09307144A (ja) * 1996-05-14 1997-11-28 Matsushita Electric Ind Co Ltd 発光素子及びその製造方法
DE19714170C1 (de) * 1997-03-21 1998-07-30 Siemens Ag Elektrooptisches Modul
JP2001021775A (ja) 1999-07-09 2001-01-26 Sumitomo Electric Ind Ltd 光学装置
US6999237B2 (en) * 2001-09-12 2006-02-14 Lightmaster Systems, Inc. Method and apparatus for configuration and assembly of a video projection light management system
US20030151832A1 (en) * 2002-01-14 2003-08-14 Arthur Berman Method and apparatus for enclosing optical assemblies
EP1425618B1 (de) * 2001-09-14 2006-12-13 Finisar Corporation Sende- und/oder empfangsanordnung zur optischen signalübertragung
WO2003083543A1 (fr) 2002-04-01 2003-10-09 Ibiden Co., Ltd. Substrat support de puce a circuit integre, procede de fabrication de substrat support de puce a circuit integre, dispositif de communication optique et procede de fabrication de dispositif de communication optique
EP1688770B1 (en) * 2003-11-27 2012-11-14 Ibiden Co., Ltd. Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board
JP2008032522A (ja) * 2006-07-28 2008-02-14 Nitta Ind Corp 光ファイバを用いた触覚センサ
WO2016164035A1 (en) 2015-04-10 2016-10-13 Hewlett Packard Enterprise Development Lp Overmolded filters

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE226431C (ko) *
JPS5333436A (en) * 1976-09-09 1978-03-29 Toshiba Corp Alloy for high frequency induction heating vessel
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
JPS54127691A (en) * 1978-03-28 1979-10-03 Toshiba Corp Semiconductor light emission device
JPS5545236U (ko) * 1978-09-16 1980-03-25
DE2913262C2 (de) * 1979-04-03 1982-04-29 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Elektro-optische Verbindungsvorrichtung
JPS566038U (ko) * 1979-06-25 1981-01-20
DE3016103A1 (de) * 1980-04-25 1981-10-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung transparenter geissharze
JPS5850572A (ja) * 1981-09-22 1983-03-25 株式会社東芝 デイスプレイ装置の製造方法
EP0114258A1 (en) * 1982-11-30 1984-08-01 Kabushiki Kaisha Toshiba Resin encapsulation type photo-semiconductor devices
JPH084155B2 (ja) * 1986-06-25 1996-01-17 松下電器産業株式会社 光コネクタモジユ−ル
JPS6314489A (ja) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp 半導体レ−ザ装置
JPS6333877A (ja) * 1986-07-29 1988-02-13 Omron Tateisi Electronics Co 光半導体装置
JP2504533B2 (ja) * 1988-09-02 1996-06-05 同和鉱業株式会社 Ｌｅｄ発光装置並びに該装置に用いる発光ブロックの製造方法

Also Published As

Publication number Publication date
US5105237A (en) 1992-04-14
EP0466975B1 (en) 1993-05-05
DE69001548T2 (de) 1993-09-09
KR950000112B1 (ko) 1995-01-09
JPH0474483A (ja) 1992-03-09
JP2792722B2 (ja) 1998-09-03
DE69001548D1 (de) 1993-06-09
EP0466975A1 (en) 1992-01-22

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