JPS59146963U - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS59146963U
JPS59146963U JP1983041106U JP4110683U JPS59146963U JP S59146963 U JPS59146963 U JP S59146963U JP 1983041106 U JP1983041106 U JP 1983041106U JP 4110683 U JP4110683 U JP 4110683U JP S59146963 U JPS59146963 U JP S59146963U
Authority
JP
Japan
Prior art keywords
lead frame
microns
abstract
several
rough surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983041106U
Other languages
English (en)
Inventor
土岐　荘太郎
野口　文信
武夫 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Inc filed Critical Toppan Inc
Priority to JP1983041106U priority Critical patent/JPS59146963U/ja
Publication of JPS59146963U publication Critical patent/JPS59146963U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、本考案のリードフレームの一実施例を示す部
分拡大斜視図である。 １・・・・・・リードフレーム、２・・・・・・粗面（
アイランド部）、３・・・・・・インナーリード、４・
・間貴金属めっき部。

Claims (1)

    【実用新案登録請求の範囲】
  1. アイランド部分が数μ〜数１００μの凹凸深度を有する
    粗面でありインナーリード先端部にのみ貴金属めっきを
    施してなるリードフレーム。
JP1983041106U 1983-03-22 1983-03-22 リ−ドフレ−ム Pending JPS59146963U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983041106U JPS59146963U (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983041106U JPS59146963U (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム

Publications (1)

Publication Number Publication Date
JPS59146963U true JPS59146963U (ja) 1984-10-01

Family

ID=30171704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983041106U Pending JPS59146963U (ja) 1983-03-22 1983-03-22 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59146963U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110034U (ja) * 1987-01-09 1988-07-15
JPS63249341A (ja) * 1987-04-06 1988-10-17 Tomoegawa Paper Co Ltd 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029415U (ja) * 1973-07-10 1975-04-03
JPS5625391B2 (ja) * 1973-01-26 1981-06-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625391B2 (ja) * 1973-01-26 1981-06-11
JPS5029415U (ja) * 1973-07-10 1975-04-03

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110034U (ja) * 1987-01-09 1988-07-15
JPS63249341A (ja) * 1987-04-06 1988-10-17 Tomoegawa Paper Co Ltd 半導体装置

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