KR910016103A - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR910016103A
KR910016103A KR1019910002123A KR910002123A KR910016103A KR 910016103 A KR910016103 A KR 910016103A KR 1019910002123 A KR1019910002123 A KR 1019910002123A KR 910002123 A KR910002123 A KR 910002123A KR 910016103 A KR910016103 A KR 910016103A
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KR
South Korea
Prior art keywords
semiconductor device
silicon nitride
nitride film
insulating film
interlayer insulating
Prior art date
Application number
KR1019910002123A
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English (en)
Inventor
고지 미야모토
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910016103A publication Critical patent/KR910016103A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Formation Of Insulating Films (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 제 1 실시예에 따른 반도체장치의 구성을 나타낸 단면도.

Claims (12)

  1. 적어도 1층의 실리콘질화막(16,37)으로 이루어진 층간절연막을 전극인출용 접촉개구부(18,39)를 제외한 전체면에 형성하여 이루어진 것을 특징으로 하는 반도체장치.
  2. 제 1 항에 있어서, 상기 실리콘질화막(16,37)이 상기 층간절연막의 최하층에 위치하고 있는 것을 특징으로 하는 반도체장치.
  3. 제 1 항에 있어서, 상기 실리콘질화막(16,37)의 막두께가 100nm이하인 것을 특징으로 하는 반도체장치.
  4. 사이드웰구조를 갖춘 트랜지스터를 적어도 한개 이상 포함하고, 적어도 1층의 실리콘질화막(16,37)으로 이루어진 층간절연막을 전극인출용 접촉개구부(18,39)를 제외한 전체면에 형성하여 이루어진 것을 특징으로 하는 반도체장치.
  5. 제 4 항에 있어서, 상기 실리콘질화막(16,37)이 상기 충절연막의 최하층에 위치하고 있는 것을 특징으로 하는 반도체장치.
  6. 제 4 항에 있어서, 상기 실리콘질화막(16,37)의 막두께가 100nm이하인 것을 특징으로 하는 반도체장치.
  7. 자외선소거형 MOS트랜지스터를 메모리셀로서 갖추고, 적어도 1층의 실리콘질화막(16)으로 이루어진 층간절연막을 전극인출용 접촉개구부(18)를 제외한 전체면에 형성하여 이루어진 것을 특징으로 하는 반도체장치.
  8. 제 7 항에 있어서, 상기 실리콘질화막(16)이 층간절연막의 최하층에 위치하고 있는 것을 특징으로 하는 반도체장치.
  9. 제 7 항에 있어서, 상기 실리콘질화막(16)의 막두께가 100nm이하인 것을 특징으로 하는 반도체장치.
  10. 최종보호막으로서 플라즈마 CVD절연막(42)이 설치되고, 적어도 1층의 실리콘질화막(37)으로 이루어진 층간절연막을 전극인출용 접촉개구부(39)를 제외한 전체면에 형성되어 이루어진 것을 특징으로 하는 반도체장치.
  11. 제 10 항에 있어서, 상기 실리콘질화막(37)이 상기 층간절연막의 최하층에 위치하고 있는 것을 특징으로 하는 반도체장치.
  12. 제 10 항에 있어서, 상기 실리콘질화막(37)의 막두께가 100nm이하인 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910002123A 1990-02-08 1991-02-08 반도체장치 KR910016103A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2027092A JPH03232231A (ja) 1990-02-08 1990-02-08 半導体装置
JP02-027092 1990-02-08

Publications (1)

Publication Number Publication Date
KR910016103A true KR910016103A (ko) 1991-09-30

Family

ID=12211435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910002123A KR910016103A (ko) 1990-02-08 1991-02-08 반도체장치

Country Status (3)

Country Link
EP (1) EP0441392A3 (ko)
JP (1) JPH03232231A (ko)
KR (1) KR910016103A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186675A (ja) * 1990-11-16 1992-07-03 Matsushita Electron Corp 半導体装置
JP3886209B2 (ja) * 1997-06-02 2007-02-28 貞夫 門倉 対向ターゲット式スパッタ装置
JP4340040B2 (ja) * 2002-03-28 2009-10-07 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649570A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor memory and its manufacturing process
JPS61133656A (ja) * 1984-12-03 1986-06-20 Hitachi Ltd 半導体装置およびその製造方法
ATE194882T1 (de) * 1987-03-04 2000-08-15 Advanced Micro Devices Inc Passivationsschicht für integrierte schaltungsstruktur
JPH0687483B2 (ja) * 1988-02-13 1994-11-02 株式会社東芝 半導体装置
US4982250A (en) * 1989-01-04 1991-01-01 Motorola, Inc. Mosture barrier for floating gate transistors

Also Published As

Publication number Publication date
EP0441392A2 (en) 1991-08-14
EP0441392A3 (en) 1991-10-16
JPH03232231A (ja) 1991-10-16

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