KR910015034A - 반도체장치의 수지봉지장치 - Google Patents

반도체장치의 수지봉지장치 Download PDF

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Publication number
KR910015034A
KR910015034A KR1019910000103A KR910000103A KR910015034A KR 910015034 A KR910015034 A KR 910015034A KR 1019910000103 A KR1019910000103 A KR 1019910000103A KR 910000103 A KR910000103 A KR 910000103A KR 910015034 A KR910015034 A KR 910015034A
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KR
South Korea
Prior art keywords
cavity
elastic means
resin encapsulation
retainer
inserts
Prior art date
Application number
KR1019910000103A
Other languages
English (en)
Other versions
KR940002440B1 (ko
Inventor
야스쓰구 쓰쓰미
스에요시 다나카
Original Assignee
시키모리야
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시키모리야, 미쓰비시덴키 가부시키가이샤 filed Critical 시키모리야
Publication of KR910015034A publication Critical patent/KR910015034A/ko
Application granted granted Critical
Publication of KR940002440B1 publication Critical patent/KR940002440B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

반도체장치의 수지봉지장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 관한 반도체장치의 수지봉지(樹脂封止) 장치의 밑형(下型)을 나타내는 단면도, 제2도 및 제3도는 각각 다른 실시예를 나타내는 단면도.

Claims (4)

  1. 정반과, 상기 정반 위에 고정되고, 상기 정반과의 사이에 공간부를 갖는 캐버티리테이너와, 각각 표면이 노출되도록 상기 캐버티리테이너에 매설되고 상기 표면에 캐버티가 형성된 복수의 캐버티인서트와, 각각 상기 캐버티인서트 및 상기 캐버티리테이너를 관통해서 한 쪽 끝이 상기 캐버티리테이너의 공간부 내에 돌출함과 동시에 반대 쪽 끝이 상기 캐버티인서트의 캐버티 내에 돌출할 수 있도록 이동동작이 가능하게 설치된 복수의 이젝터핀과, 상기 캐버티리테이너의 공간부내에 위치하고 상기 복수의 이젝터핀의 한 쪽 끝이 고정되는 이젝터플레이트와, 각각 상기 이젝터플레이트를 관통해서 상기 정반 위에 상기 복수의 캐버티인서트를 탄성지지하는 제1의 탄성수단을 갖춘 것을 특징으로 하는 반도체장치의 수지봉지장치.
  2. 제1항에 있어서, 상기 복수의 캐버티인서트는, 서로 독립적으로 상기 제1의 탄성수단에 의해 지지되는 반도체장치의 수지봉지장치.
  3. 제1항에 있어서, 상기 복수의 캐버티인서트에 인접하도록 상기 캐버티리테이너에 매설되고 그 표면에 러너 및 상기 복수의 캐버티인서트의 캐버티에 각각 접속되는 복수의 게이트가 형성된 러너인서트와, 상기 복수의 캐버티인서트와 상기 러너인서트를 연결함과 동시에 상기 제1의 탄성수단에 의해 지지되는 연결플레이트를 갖춘 반도체장치의 수지봉지장치.
  4. 제3항에 있어서, 상기 이젝터플레이트를 관통하고, 또 상기 연결플레이트를 사이에 두고 상기 러너인서터를 상기 정반 위에 탄성지지함과 동시에 상기 제1의 탄성수단보다 짧은 제2의 탄성수단을 갖춘 반도체장치의 수지봉지장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000103A 1990-01-23 1991-01-07 반도체장치의 수지봉지장치 KR940002440B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011931A JP2635193B2 (ja) 1990-01-23 1990-01-23 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置
JP2-11931 1990-01-23
JP???2-11931 1990-01-23

Publications (2)

Publication Number Publication Date
KR910015034A true KR910015034A (ko) 1991-08-31
KR940002440B1 KR940002440B1 (ko) 1994-03-24

Family

ID=11791423

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000103A KR940002440B1 (ko) 1990-01-23 1991-01-07 반도체장치의 수지봉지장치

Country Status (3)

Country Link
US (1) US5074779A (ko)
JP (1) JP2635193B2 (ko)
KR (1) KR940002440B1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2290048B (en) * 1990-06-29 1996-05-29 Seikosha Kk Injection molding machines
JP2603748B2 (ja) 1990-07-24 1997-04-23 三菱電機株式会社 半導体樹脂封止装置及び半導体樹脂封止方法
US5217728A (en) * 1991-06-21 1993-06-08 Amp Incorporated High density mold
US5439371A (en) * 1992-10-07 1995-08-08 Sumitomo Heavy Industries, Ltd. Locally pressurizing injection molding machine
JPH06124971A (ja) * 1992-10-14 1994-05-06 Nec Corp 樹脂封止金型
US5429492A (en) * 1992-12-23 1995-07-04 Taniyama; Yoshihiko Plastic molding apparatus
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US6206682B1 (en) * 1998-10-05 2001-03-27 Itt Manufacturing Enterprises, Inc. Molding accelerated stripper-ejector system
JP2002043343A (ja) * 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
US6838319B1 (en) * 2000-08-31 2005-01-04 Micron Technology, Inc. Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
JP3394516B2 (ja) * 2000-10-06 2003-04-07 エヌイーシーセミコンダクターズ九州株式会社 樹脂封止金型
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US6617680B2 (en) * 2001-08-22 2003-09-09 Siliconware Precision Industries Co., Ltd. Chip carrier, semiconductor package and fabricating method thereof
SG103364A1 (en) * 2002-10-11 2004-04-29 Tung Jung Chen Mold article ejecting device used for an injection molding apparatus
KR101087031B1 (ko) * 2010-10-19 2011-11-28 신한다이아몬드공업 주식회사 봉지재 성형장치 및 방법
US9512863B2 (en) * 2012-04-26 2016-12-06 California Institute Of Technology Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment
JP6985187B2 (ja) * 2018-03-15 2021-12-22 トヨタ自動車株式会社 樹脂体の金型
JP7102238B2 (ja) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645492A (en) * 1969-12-30 1972-02-29 Stefan T Edlis Ejection actuator for plastic injection mold
DE3243991C2 (de) * 1982-11-27 1985-01-10 Karl 7298 Loßburg Hehl Formschließeinheit mit einer Auswerfer-Antriebsvorrichtung
US4687434A (en) * 1983-04-06 1987-08-18 Phillips Plastics Corporation Apparatus for molding two-piece plastic fastener
JPS6265214A (ja) * 1985-09-18 1987-03-24 Tohoku Metal Ind Ltd 磁気ヘツド用コアのギヤツプ部接合方法
JPH036410Y2 (ko) * 1985-10-16 1991-02-19
JP2609849B2 (ja) * 1986-07-31 1997-05-14 トーワ株式会社 多品種少量生産に適した半導体封止用のマルチプランジヤー型樹脂モールド装置
ATE66860T1 (de) * 1987-10-31 1991-09-15 Schoettli Ag Heisskanal-spritzwerkzeug zur herstellung von einmal-spritzenzylindern und dgl.
US4874308A (en) * 1988-04-04 1989-10-17 Atlas Gary N Vacuum assisted transfer mold and vent pin

Also Published As

Publication number Publication date
JPH03217032A (ja) 1991-09-24
US5074779A (en) 1991-12-24
JP2635193B2 (ja) 1997-07-30
KR940002440B1 (ko) 1994-03-24

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