KR920005297A - 반도체집적회로 장치 - Google Patents
반도체집적회로 장치 Download PDFInfo
- Publication number
- KR920005297A KR920005297A KR1019910013547A KR910013547A KR920005297A KR 920005297 A KR920005297 A KR 920005297A KR 1019910013547 A KR1019910013547 A KR 1019910013547A KR 910013547 A KR910013547 A KR 910013547A KR 920005297 A KR920005297 A KR 920005297A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- region
- well region
- conductive well
- misfet
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 18
- 239000000758 substrate Substances 0.000 claims 11
- 230000000295 complement effect Effects 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 I인 ASIC의 주요부 단면도.
제2도는 제1도의 ASIC및 그것을 내장하는 패키지의 사시도,
제3도는 제1도의 ASIC의 칩배치도.
Claims (7)
- 제1도전형의 반도체기판 주면의 제1영역에 배치되며, 제2도전형 채널의 MISFET를 갖는 버퍼회로에 제1전원이 공급되고, 상기 반도체기판 주면의 제1영역과 다른 제2영역에 배치되며, 상보형 MISFET를 갖는 내부회로에 상기 제1전원에 대해서 적어도 상기 반도체기판 위에서 독립이며, 또한 전위가 같은 제2전원이 공급되는 반도체집적회로장치에 있어서, 상기 버퍼회로의 MISFET를 상기 반도체기판의 주면부에 형성한 제1도전형웰영역의 주면에 구성하고, 이 제1도전형웰영역, 상기 반도체기판 각각의 사이에 양자 사이를 전기적으로 분리하는 분리영역을 구성한 반도체집적회로장치.
- 특허청구의 범위 제1항에 있어서, 상기 분리영역은 상기 제1도전형웰영역의 주위를 덮는 제2도전형 반도체 영역으로 구성되고, 이 제2도전형반도체영역은 상기 내부회로에 공급되는 제2전원이 상기 제1도전형웰영역, 상기 반도체기판 각각에 대해서 역바이어스로 되는 전원이 공급되는 반도체집적회로장치.
- 특허청구의 범위 제2항에 있어서, 상기 버퍼회로는 상기 제2도전형채널의 MISFET및 제1도전형채널의 MISFET를 갖는 상보형 MISFET로 구성되는 반도체집적회로장치.
- 특허청구의 범위 제3항에 있어서, 상기 버퍼회로의 상보형 MISFET의 제2도전형 채널의 MISFET는 상기 제1도전형웰영역의 주면에 구성되며, 제1도전형 채널의 MISFET는 제2도전형웰영역의 주면에 구성되고, 상기 분리영역은 상기 제1도전형웰영역, 상기 반도체기판 각각의 사이에만 구성되는 반도체집적회로장치.
- 특허청구의 범위 제4항에 있어서, 상기 버퍼회로이 제2도전형 채널의 MISFET가 형성된 제1도전형웰영역, 상기 반도체기판 각각이 사이에만 상기 분리영역이 구성되고, 상기 내부회로의 상보형 MISFET의 제2도전형 채널의 MISFET, 상기 반도체기판 각각의 사이에는 상기 분리영역이 구성되지 않는 반도체집적회로장치.
- 특허청구의 범위 제1항에 있어서, 상기 버퍼회로는 반도체기판 주면의 제1영역에 여러개 배치되고, 이 여러개 배치된 버퍼회로중 인접하는 버퍼회로 각각의 분리영역은 일체로 구성되는 반도체집적회로장치.
- 특허청구의 범위 제1항에 있어서, 상기 버퍼회로는 반도체기판 주면의 제1영역에 여러개 배치되고, 이 여러개 배치된 버퍼회로 각각의 제1도전형 웰영역, 또는 제1도전형 웰영역 및 제2도전형 웰영역은 서로 분리되고, 또는 상기 여러개 배치된 버퍼회로중 소정수마다의 버퍼회로의 제1도전형 웰영역, 또는 제1도전형 웰영역 및 제2도전형 웰영역 사이는 서로 분리되고, 이 서로 분리된 제1도전형 웰영역,또는 제1도전형 웰영역 및 제2도전형 웰영역에는 상기 제1전원이 독립적으로 공급되는 반도체집적회로장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02220337A JP3074003B2 (ja) | 1990-08-21 | 1990-08-21 | 半導体集積回路装置 |
JP2-220337 | 1990-08-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920005297A true KR920005297A (ko) | 1992-03-28 |
KR100223352B1 KR100223352B1 (ko) | 1999-10-15 |
Family
ID=16749569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910013547A KR100223352B1 (ko) | 1990-08-21 | 1991-08-06 | 반도체 집적 회로 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5311048A (ko) |
JP (1) | JP3074003B2 (ko) |
KR (1) | KR100223352B1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2766920B2 (ja) * | 1992-01-07 | 1998-06-18 | 三菱電機株式会社 | Icパッケージ及びその実装方法 |
JP3254865B2 (ja) * | 1993-12-17 | 2002-02-12 | ソニー株式会社 | カメラ装置 |
US5796148A (en) * | 1996-05-31 | 1998-08-18 | Analog Devices, Inc. | Integrated circuits |
JPH1041475A (ja) * | 1996-07-23 | 1998-02-13 | Mitsubishi Electric Corp | 半導体集積回路装置及びその製造方法 |
JPH10189749A (ja) * | 1996-12-27 | 1998-07-21 | Toshiba Corp | 半導体集積回路装置、半導体集積回路装置の多電源供給方法、半導体集積回路装置の多電源供給プログラムを記録した機械読み取り可能な記録媒体 |
US6683336B1 (en) | 1996-12-27 | 2004-01-27 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit, supply method for supplying multiple supply voltages in semiconductor integrated circuit, and record medium for storing program of supply method for supplying multiple supply voltages in semiconductor integrated circuit |
US6838320B2 (en) * | 2000-08-02 | 2005-01-04 | Renesas Technology Corp. | Method for manufacturing a semiconductor integrated circuit device |
US6025616A (en) * | 1997-06-25 | 2000-02-15 | Honeywell Inc. | Power distribution system for semiconductor die |
JP4014708B2 (ja) * | 1997-08-21 | 2007-11-28 | 株式会社ルネサステクノロジ | 半導体集積回路装置の設計方法 |
US20020149112A1 (en) * | 1999-07-08 | 2002-10-17 | Houston Theodore W. | Selectively increased interlevel capacitance |
EP1071130A3 (en) * | 1999-07-14 | 2005-09-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device interconnection structure comprising additional capacitors |
WO2001028062A1 (en) * | 1999-10-08 | 2001-04-19 | Packard Bioscience Company | Electrical device shock hazard protection system |
US7170115B2 (en) * | 2000-10-17 | 2007-01-30 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit device and method of producing the same |
DE10300687A1 (de) * | 2003-01-10 | 2004-07-22 | Infineon Technologies Ag | Integrierte Halbleiterschaltung insbesondere Halbleiterspeicherschaltung und Herstellungsverfahren dafür |
JP4318511B2 (ja) * | 2003-08-26 | 2009-08-26 | 三洋電機株式会社 | 昇圧回路 |
WO2008155085A1 (de) * | 2007-06-18 | 2008-12-24 | Microgan Gmbh | Elektrische schaltung mit vertikaler kontaktierung |
GB2466313A (en) | 2008-12-22 | 2010-06-23 | Cambridge Silicon Radio Ltd | Radio Frequency CMOS Transistor |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3971001A (en) * | 1974-06-10 | 1976-07-20 | Sperry Rand Corporation | Reprogrammable read only variable threshold transistor memory with isolated addressing buffer |
JPS6298762A (ja) * | 1985-10-25 | 1987-05-08 | Nec Corp | 集積回路 |
JPS63179544A (ja) * | 1987-01-20 | 1988-07-23 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置 |
JPS6418239A (en) * | 1987-07-13 | 1989-01-23 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
JPS6442165A (en) * | 1987-08-07 | 1989-02-14 | Fujitsu Ltd | Coms semiconductor ic device |
JPH022155A (ja) * | 1988-06-13 | 1990-01-08 | Mitsubishi Electric Corp | 半導体集積回路 |
JPH0286166A (ja) * | 1988-09-22 | 1990-03-27 | Seiko Epson Corp | 多敷居値ゲートアレイ装置 |
-
1990
- 1990-08-21 JP JP02220337A patent/JP3074003B2/ja not_active Expired - Lifetime
-
1991
- 1991-07-31 US US07/738,133 patent/US5311048A/en not_active Expired - Lifetime
- 1991-08-06 KR KR1019910013547A patent/KR100223352B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH04102370A (ja) | 1992-04-03 |
KR100223352B1 (ko) | 1999-10-15 |
JP3074003B2 (ja) | 2000-08-07 |
US5311048A (en) | 1994-05-10 |
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