KR920007083A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR920007083A
KR920007083A KR1019910015953A KR910015953A KR920007083A KR 920007083 A KR920007083 A KR 920007083A KR 1019910015953 A KR1019910015953 A KR 1019910015953A KR 910015953 A KR910015953 A KR 910015953A KR 920007083 A KR920007083 A KR 920007083A
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KR
South Korea
Prior art keywords
semiconductor device
identification
section
convex portion
identification information
Prior art date
Application number
KR1019910015953A
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English (en)
Other versions
KR950014606B1 (ko
Inventor
가즈히코 하시모토
마사타카 마츠이
쇼이치 아쇼
Original Assignee
아오이 죠이치
가부시기가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시기가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR920007083A publication Critical patent/KR920007083A/ko
Application granted granted Critical
Publication of KR950014606B1 publication Critical patent/KR950014606B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Radiation (AREA)

Abstract

내용 없음

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1의 실시예에 관한 반도체 장치를 도시하는 평면도,
제2도는 상기 제1도의 X-X선에 따르는 단면도,
제3도는 복수의 반도체 정치부가 형성되는 실리콘 웨이퍼를 도시하는 평면도.

Claims (5)

  1. 복수의 반도체장치부(B1-B46)가 동시에 형성된 반도체 장치에 있어서 각각의 반도체 장치부에는 다른 반도체 장치부터 식별할 수 있는 식별부(11,21,23)가 형성되는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 식별부는 그 반도체 장치부에 특유의 오목부 또는 볼록부로 구성되는 것을 특징으로 하는 반도체 장치.
  3. 제2항에 있어서, 상기 오목부 또는 볼록부가 다른 반도체 장치부로부터 식별하기 위한 식별정보인 것을 특징으로 하는 반도체 장치.
  4. 제2항에 있어서, 상기 오목부 또는 볼록부는 그 반도체 장치부를 형성하는 반도체 장치의 정보 및 그 반도체 장치의 위치 정보를 포함하는 것을 특징으로 하는 반도체 장치.
  5. 복수의 반도체장치부(B1-B46)가 동시에 형성된 반도체 장치에 있어서, 각각의 반도체 장치부에 다른 반도체 장치로부터 식별하는 식별정보가 등록되는 등록부(25)와 제어신호(ø)의 입력에 따라서 상기 등록부로부터 상기 식별정보를 독출하는 독출수단(24)을 설치한 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910015953A 1990-09-14 1991-09-13 반도체 장치 KR950014606B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2242464A JPH07123101B2 (ja) 1990-09-14 1990-09-14 半導体装置
JP02-242464 1990-09-14

Publications (2)

Publication Number Publication Date
KR920007083A true KR920007083A (ko) 1992-04-28
KR950014606B1 KR950014606B1 (ko) 1995-12-11

Family

ID=17089476

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910015953A KR950014606B1 (ko) 1990-09-14 1991-09-13 반도체 장치

Country Status (3)

Country Link
US (1) US5294812A (ko)
JP (1) JPH07123101B2 (ko)
KR (1) KR950014606B1 (ko)

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Also Published As

Publication number Publication date
JPH04123417A (ja) 1992-04-23
US5294812A (en) 1994-03-15
JPH07123101B2 (ja) 1995-12-25
KR950014606B1 (ko) 1995-12-11

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