IL150784A0 - Personalized hardware - Google Patents

Personalized hardware

Info

Publication number
IL150784A0
IL150784A0 IL15078400A IL15078400A IL150784A0 IL 150784 A0 IL150784 A0 IL 150784A0 IL 15078400 A IL15078400 A IL 15078400A IL 15078400 A IL15078400 A IL 15078400A IL 150784 A0 IL150784 A0 IL 150784A0
Authority
IL
Israel
Prior art keywords
personalized hardware
personalized
hardware
Prior art date
Application number
IL15078400A
Original Assignee
Zavitan Semiconductors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zavitan Semiconductors Inc filed Critical Zavitan Semiconductors Inc
Publication of IL150784A0 publication Critical patent/IL150784A0/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
IL15078400A 2000-01-20 2000-12-18 Personalized hardware IL150784A0 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17708700P 2000-01-20 2000-01-20
US18975600P 2000-03-16 2000-03-16
US19120800P 2000-03-22 2000-03-22
US23745800P 2000-10-02 2000-10-02
PCT/GB2000/004869 WO2001054194A1 (en) 2000-01-20 2000-12-18 Personalized hardware

Publications (1)

Publication Number Publication Date
IL150784A0 true IL150784A0 (en) 2003-02-12

Family

ID=27497219

Family Applications (2)

Application Number Title Priority Date Filing Date
IL15078400A IL150784A0 (en) 2000-01-20 2000-12-18 Personalized hardware
IL150784A IL150784A (en) 2000-01-20 2002-07-17 Personalized hardware

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL150784A IL150784A (en) 2000-01-20 2002-07-17 Personalized hardware

Country Status (7)

Country Link
EP (1) EP1249042A1 (en)
JP (1) JP2003520451A (en)
KR (2) KR100859825B1 (en)
CN (1) CN100375097C (en)
AU (1) AU2001223813A1 (en)
IL (2) IL150784A0 (en)
WO (1) WO2001054194A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162307A1 (en) * 2001-12-19 2003-07-03 Philips Intellectual Property Production of mask-programmed ROMs, using a mask containing several systems, whereby encryption using the mask is carried out so that the produced systems have different keys
DE10319976A1 (en) * 2003-05-05 2004-12-09 Infineon Technologies Ag Semiconductor chip especially a memory chip has an individualized electrical lead structure independent of the chip function
CN1922727B (en) * 2004-02-20 2011-12-21 株式会社半导体能源研究所 Manufacturing method of semiconductor device, integrated circuit card, ic tag, rfid, transponder, bill, negotiable securities, passport, electronic apparatus, bag, and clothing
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
JP5400279B2 (en) 2007-06-07 2014-01-29 スパンション エルエルシー Semiconductor device, manufacturing method thereof, and semiconductor manufacturing apparatus
JP5761947B2 (en) * 2010-09-02 2015-08-12 キヤノン株式会社 Semiconductor integrated circuit device
CN102509726A (en) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 IP (Intellectual Property) module with encryption structures and manufacturing method of IP module
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
US11133206B2 (en) 2019-04-15 2021-09-28 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
TWI714419B (en) * 2020-01-06 2020-12-21 力晶積成電子製造股份有限公司 Semiconductor stack structure with concealed identifier
DE102022110501A1 (en) 2022-04-29 2023-11-02 Infineon Technologies Ag IDENTIFICATION CODES ON SEMICONDUCTOR CHIPS

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPH01293616A (en) * 1988-05-23 1989-11-27 Nec Corp Manufacture of semiconductor integrated circuit
JPH0247825A (en) 1988-08-10 1990-02-16 Mitsubishi Electric Corp Charged beam picturing data preparing method
KR920702046A (en) * 1989-10-13 1992-08-12 원본미기재 Tape auto bonding
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography
DE69032740T2 (en) * 1989-12-20 1999-06-02 Koninklijke Philips Electronics N.V., Eindhoven Information coding method for chip identification using step litographic methods
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
JPH07123101B2 (en) * 1990-09-14 1995-12-25 株式会社東芝 Semiconductor device
JP2913817B2 (en) * 1990-10-30 1999-06-28 日本電気株式会社 Method for manufacturing semiconductor memory

Also Published As

Publication number Publication date
IL150784A (en) 2007-05-15
KR20020086474A (en) 2002-11-18
AU2001223813A1 (en) 2001-07-31
EP1249042A1 (en) 2002-10-16
JP2003520451A (en) 2003-07-02
WO2001054194A1 (en) 2001-07-26
KR100859829B1 (en) 2008-09-23
CN100375097C (en) 2008-03-12
CN1425197A (en) 2003-06-18
KR20080033547A (en) 2008-04-16
KR100859825B1 (en) 2008-09-23

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Legal Events

Date Code Title Description
FF Patent granted
MM9K Patent not in force due to non-payment of renewal fees