CN102509726A - IP (Intellectual Property) module with encryption structures and manufacturing method of IP module - Google Patents
IP (Intellectual Property) module with encryption structures and manufacturing method of IP module Download PDFInfo
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- CN102509726A CN102509726A CN2011103601393A CN201110360139A CN102509726A CN 102509726 A CN102509726 A CN 102509726A CN 2011103601393 A CN2011103601393 A CN 2011103601393A CN 201110360139 A CN201110360139 A CN 201110360139A CN 102509726 A CN102509726 A CN 102509726A
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Abstract
The invention discloses an IP (Intellectual Property) module with encryption structures, which comprises a plurality of encryption structures forming a specific graph. The encryption structures can protect the IP module. A method for manufacturing the IP module comprises the following steps of: providing a semiconductor substrate; forming an encryption material layer on the semiconductor substrate; forming photoresist on the encryption material layer and graphing the photoresist; adopting the graphical photoresist as a mask for etching the encryption material layer; forming the encryption structures in the encryption material layer; and forming the encryption structures into the specific graph. The method is compatible with the traditional semiconductor manufacturing process. The problem that the traditional IP module is easy to imitate is solved.
Description
Technical field
The present invention relates to the manufacturing approach of semiconductor crystal wafer, relate in particular to a kind of IP module and manufacturing approach thereof with cryptographic structure.
Background technology
Along with the develop rapidly of integrated circuit technology, people can be integrated in original board level system on the chip piece, and System on Chip/SoC (system on chip) becomes the main flow development trend of IC design gradually.SOC appears at the performance that has improved whole system to a great extent, and has well solved the speed issue that the intrinsic noise problem of board level system and plate level line time-delay are brought.Its appearance has epoch making significance, is an important milestone of Information Technology Development.
SOC is that the IP (Intellectual Property) with majority is incorporated on the same wafer, basically in design basically; IP that inventionthe semiconductor industry is referred to as; Be meant a kind of specific function that has, through designing, passing through checking, reusable module, can regard the building blocks of difference in functionality one by one as in advance; The IC designer is according to wafer required function and specification; Select existing IP to combine and can accomplish most design work (chip design of 95-99% can be accomplished by the IP module), function that need all wafers is not required is design again voluntarily all, so could quicken the design time-histories of wafer.
The IP module of Chevron Research Company's design is after putting on market; The personnel of non-Chevron Research Company (CRC) just can make the IP module of identical function through reverse engineering; Chevron Research Company (CRC) knows obviously that the IP module that non-Chevron Research Company (CRC) makes is the product of our company, and the IP module that does not but have evidence to prove that non-Chevron Research Company (CRC) makes is the product of Chevron Research Company (CRC) oneself.In sum, there is not identifying information can prove its product in the IP module of Chevron Research Company (CRC).
To the problem that prior art exists, this case designer relies on the industry experience for many years of being engaged in, and the active research improvement is so invented the IP module with cryptographic structure.
Summary of the invention
The present invention be directed in the prior art, do not have the identifying information problem in the IP module, a kind of IP module with cryptographic structure is provided.
The present invention has the IP module of cryptographic structure, comprising: a plurality of cryptographic structure, a plurality of said cryptographic structure are formed special pattern.
Optional, in said IP module with cryptographic structure, said a plurality of cryptographic structure are positioned at same one deck.
Optional, in said IP module with cryptographic structure, said a plurality of cryptographic structure are positioned at different layers.
Optional, in said IP module with cryptographic structure, said cryptographic structure is through hole or contact plunger or metal wire.
Optional, in said IP module with cryptographic structure, said special pattern is made up of a plurality of letters.
Optional, in said IP module with cryptographic structure, said special pattern is made up of a plurality of numerals.
Optional, in said IP module with cryptographic structure, the material of said cryptographic structure is selected from a kind of or combination in metal, polysilicon, the passivation layer.
The present invention also provides the method for making the IP module with cryptographic structure, comprises the steps:
Semiconductor substrate is provided, on said Semiconductor substrate, forms the encrypted material layer;
On said encrypted material layer, form photoresist, and graphical said photoresist;
With patterned said photoresist is the said encrypted material layer of mask etching, in said encrypted material layer, forms a plurality of cryptographic structure, and a plurality of said structures are formed special pattern.
Optional, have in the method for IP module of cryptographic structure in said manufacturing, said encrypted material layer is metal level, polysilicon layer or passivation layer.
Optional, have in the method for IP module of cryptographic structure in said manufacturing, said special pattern is made up of numeral and/or letter.
In sum, the IP module with cryptographic structure of the present invention through in the IP module, increasing the cryptographic structure of special pattern, makes non-Chevron Research Company (CRC) when utilizing reverse engineering to make IP module of the present invention, and the cryptographic structure information in the IP module is also made simultaneously.After non-Chevron Research Company (CRC) puts IP module of the present invention on market; After the personnel of Chevron Research Company (CRC) dissect the IP module of non-Chevron Research Company (CRC) through reverse engineering again; Just can see the cryptographic structure information that Chevron Research Company (CRC) increases in the IP module, thereby assert the product of the IP module of non-Chevron Research Company (CRC) for the design company.Therefore, after in the IP module, increasing cryptographic structure information, the IP module that Chevron Research Company (CRC) can discern the identical function that occurs on the market is the IP module of the design company.
Have in the method for IP module of cryptographic structure in said manufacturing; On said IP module, make said cryptographic structure; Do not need specific technology; Because required material layer can be selected from existing element some or certain several material layer can, and forming cryptographic structure, only need to carry out etching to material layer just passable, all manufacturing process all manufacturing process with existing components and parts are compatible mutually.
Description of drawings
Fig. 1 is the sketch map that the embodiment of the invention has the IP module of cryptographic structure;
Fig. 2 is the sketch map that further embodiment of this invention has the IP module of cryptographic structure;
Fig. 3 is the sketch map that yet another embodiment of the invention has the IP module of cryptographic structure.
Embodiment
By the technology contents, the structural feature that specify the invention, reached purpose and effect, will combine embodiment and conjunction with figs. to specify below.
The present invention has the IP module of cryptographic structure, comprising: a plurality of cryptographic structure, a plurality of said cryptographic structure are formed special pattern.
Fig. 1 is the sketch map that the embodiment of the invention has the IP module of cryptographic structure; With reference to shown in Figure 1, on the IP module, have a plurality of different components structures; Like transistor, lead, memory, through hole or the like, said cryptographic structure can be selected from one or more in said a plurality of different components structure, can be through hole like said cryptographic structure; Through hole is to connect the different conductive layers layer, in Fig. 1, does not have through hole here with 0 representative; With 1 representative through hole is arranged here, do not have the arrangement mode of first device 10 of through hole unrestricted, as the through hole 12 of cryptographic structure; Formed specific figure, said in the present embodiment special pattern is a numeral " 9 ".Certainly, said special pattern is not limited to numeral 9, and it also can be other numeral or figures, like apple shape, pentalpha, M shape, H shape etc.Said special pattern does not have actual implication, just encrypts with the said IP module of opposing, and can know it is the said IP module of which producer of family design or production with crossing said special pattern, perhaps according to said special pattern, can investigate and prosecute imitated producer.
Optional, in said IP module with cryptographic structure, said a plurality of cryptographic structure are positioned at same one deck.As, said cryptographic structure can be transistorized polysilicon gate, constitutes special pattern with a plurality of said polysilicon gate in one deck.
Optional, in said IP module with cryptographic structure, said a plurality of cryptographic structure are positioned at different layers.That is to say that the special pattern that said cryptographic structure is formed can be to be made up of the cryptographic structure that is positioned at different layers, if said cryptographic structure still is a through hole 12, then the through hole 12 of different layers has constituted above-mentioned numeral " 9 " jointly.
Optional, in said IP module with cryptographic structure, said cryptographic structure is through hole or contact plunger or metal wire.
Optional, in said IP module with cryptographic structure, the material of said cryptographic structure is selected from a kind of or combination in metal, polysilicon, the passivation layer.
Fig. 2 is the sketch map that further embodiment of this invention has the IP module of cryptographic structure; In Fig. 2, said special pattern 100 is the T word.
Fig. 3 is the sketch map that yet another embodiment of the invention has the IP module of cryptographic structure; In Fig. 3, said special pattern 100 is: the tee NER that is made up of many metal line 14.
It should be noted that for different IP modules said special pattern is also different, like this, is not easy to find the rule of cryptographic structure.When said cryptographic structure is positioned at top layer, come to light than being easier to, so said cryptographic structure is preferred, is positioned at different layers.
In sum, the IP module with cryptographic structure of the present invention through in intelligence wealth element, increasing special pattern, can play the effect of protection IP module.Even IP module of the present invention imitated by other producers, also is easy to grab infringement; Because the figure that cryptographic structure is formed has stationarity; Do not have randomness, but do not have any implication again, so; Not knowing that said special pattern exists, is infringement producer but made the producer that is full of special pattern IP module.Because said special pattern is made up of some structure of device itself, so, cost do not increased.
The present invention also provides the method for making the IP module with cryptographic structure, comprises the steps:
Semiconductor substrate is provided, on said Semiconductor substrate, forms the encrypted material layer;
On said encrypted material layer, form photoresist, and graphical said photoresist;
With patterned said photoresist is the said encrypted material layer of mask etching, in said encrypted material layer, forms a plurality of cryptographic structure, and a plurality of said structures are formed special pattern.
Optional, have in the method for IP module of cryptographic structure in said manufacturing, said encrypted material layer is metal level, polysilicon layer or passivation layer.
Optional, have in the method for IP module of cryptographic structure in said manufacturing, said special pattern is made up of numeral and/or letter, and said cryptographic structure is through hole or contact plunger or metal wire.
Have in the method for IP module of cryptographic structure in said manufacturing; On said IP module, make said cryptographic structure; Do not need specific technology; Because required material layer can be selected from existing element some or certain several material layer can, and forming cryptographic structure, only need to carry out etching to material layer just passable, all manufacturing process all manufacturing process with existing components and parts are compatible mutually.Manufacturing approach of the present invention is simple and do not increase cost.
In the present invention, said IP module can be the chunk with memory function, the chunk with analog functuion, the chunk with logical operation function or central processing unit chunk.But be not limited to cited functional blocks.
Claims (10)
1. the IP module with cryptographic structure is characterized in that, comprising: a plurality of cryptographic structure, a plurality of said cryptographic structure are formed special pattern.
2. the IP module with cryptographic structure as claimed in claim 1 is characterized in that said a plurality of cryptographic structure are positioned at same one deck.
3. the IP module with cryptographic structure as claimed in claim 1 is characterized in that said a plurality of cryptographic structure are positioned at different layers.
4. the IP module with cryptographic structure as claimed in claim 1 is characterized in that, said cryptographic structure is through hole or contact plunger or metal wire.
5. the IP module with cryptographic structure as claimed in claim 1 is characterized in that said special pattern is made up of a plurality of letters.
6. the IP module with cryptographic structure as claimed in claim 1 is characterized in that said special pattern is made up of a plurality of numerals.
7. the IP module with cryptographic structure as claimed in claim 1 is characterized in that, the material of said cryptographic structure is selected from a kind of or combination in metal, polysilicon, the passivation layer.
8. make the method for IP module, it is characterized in that, comprise the steps: with cryptographic structure
Semiconductor substrate is provided, on said Semiconductor substrate, forms the encrypted material layer;
On said encrypted material layer, form photoresist, and graphical said photoresist;
With patterned said photoresist is the said encrypted material layer of mask etching, in said encrypted material layer, forms a plurality of cryptographic structure, and a plurality of said structures are formed special pattern.
9. manufacturing as claimed in claim 8 has the method for the IP module of cryptographic structure, it is characterized in that, said encrypted material layer is metal level, polysilicon layer or passivation layer.
10. manufacturing as claimed in claim 8 has the method for the IP module of cryptographic structure, it is characterized in that, said special pattern is made up of numeral and/or letter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103601393A CN102509726A (en) | 2011-11-14 | 2011-11-14 | IP (Intellectual Property) module with encryption structures and manufacturing method of IP module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011103601393A CN102509726A (en) | 2011-11-14 | 2011-11-14 | IP (Intellectual Property) module with encryption structures and manufacturing method of IP module |
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| CN102509726A true CN102509726A (en) | 2012-06-20 |
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| CN2011103601393A Pending CN102509726A (en) | 2011-11-14 | 2011-11-14 | IP (Intellectual Property) module with encryption structures and manufacturing method of IP module |
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Citations (9)
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| US5350715A (en) * | 1991-11-12 | 1994-09-27 | Samsung Electronics Co., Ltd. | Chip identification scheme |
| CN1397047A (en) * | 2000-01-27 | 2003-02-12 | 罗利克有限公司 | Optical security device |
| CN1425197A (en) * | 2000-01-20 | 2003-06-18 | 扎威腾半导体有限公司 | Personalized hardware |
| CN1451213A (en) * | 1999-09-30 | 2003-10-22 | 美国邮政服务 | Systems and methods for authenticating an electronic message |
| CN1983025A (en) * | 2005-12-14 | 2007-06-20 | 富士通株式会社 | Fabrication method for photomask, fabrication method for device and monitoring method for photomask |
| CN101427530A (en) * | 2006-04-19 | 2009-05-06 | 思科技术公司 | Techniques for integrated routing of call circuit signaling and the internet protocol |
| CN101438405A (en) * | 2006-02-23 | 2009-05-20 | 飞思卡尔半导体公司 | Method and apparatus for indicating directionality in integrated circuit manufacturing |
| CN101572225A (en) * | 2008-04-28 | 2009-11-04 | 精工爱普生株式会社 | Semiconductor device and manufacturing method thereof |
| CN102137151A (en) * | 2010-01-22 | 2011-07-27 | 微软公司 | Remote protocol with multi connection channels |
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2011
- 2011-11-14 CN CN2011103601393A patent/CN102509726A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5350715A (en) * | 1991-11-12 | 1994-09-27 | Samsung Electronics Co., Ltd. | Chip identification scheme |
| CN1451213A (en) * | 1999-09-30 | 2003-10-22 | 美国邮政服务 | Systems and methods for authenticating an electronic message |
| CN1425197A (en) * | 2000-01-20 | 2003-06-18 | 扎威腾半导体有限公司 | Personalized hardware |
| CN1397047A (en) * | 2000-01-27 | 2003-02-12 | 罗利克有限公司 | Optical security device |
| CN1983025A (en) * | 2005-12-14 | 2007-06-20 | 富士通株式会社 | Fabrication method for photomask, fabrication method for device and monitoring method for photomask |
| CN101438405A (en) * | 2006-02-23 | 2009-05-20 | 飞思卡尔半导体公司 | Method and apparatus for indicating directionality in integrated circuit manufacturing |
| CN101427530A (en) * | 2006-04-19 | 2009-05-06 | 思科技术公司 | Techniques for integrated routing of call circuit signaling and the internet protocol |
| CN101572225A (en) * | 2008-04-28 | 2009-11-04 | 精工爱普生株式会社 | Semiconductor device and manufacturing method thereof |
| CN102137151A (en) * | 2010-01-22 | 2011-07-27 | 微软公司 | Remote protocol with multi connection channels |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140430 |
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Effective date of registration: 20140430 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120620 |
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