KR870003562A - 수지봉지금형(樹脂封止金型) - Google Patents

수지봉지금형(樹脂封止金型) Download PDF

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Publication number
KR870003562A
KR870003562A KR1019860007173A KR860007173A KR870003562A KR 870003562 A KR870003562 A KR 870003562A KR 1019860007173 A KR1019860007173 A KR 1019860007173A KR 860007173 A KR860007173 A KR 860007173A KR 870003562 A KR870003562 A KR 870003562A
Authority
KR
South Korea
Prior art keywords
template
resin rods
resin
rods now
liquid layer
Prior art date
Application number
KR1019860007173A
Other languages
English (en)
Other versions
KR950000512B1 (ko
Inventor
유우이찌 후꾸시마
후지오 고바야시
신이찌로오 다까하시
Original Assignee
오오가 노리오
쏘니 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 쏘니 가부시기가이샤 filed Critical 오오가 노리오
Publication of KR870003562A publication Critical patent/KR870003562A/ko
Application granted granted Critical
Publication of KR950000512B1 publication Critical patent/KR950000512B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

수지봉지금형(樹脂封止金型)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본원 발명 수지봉지금형의 일실시예의 요부를 나타낸 단면도.
제 2 도는 본원 발명의 다른 실시예의 요부를 나타낸 단면도.
* 도면의 주요부분에 대한 부호의 설명
(1),(9) : 캐비티블록 (6),(11) : 형판
(26) : 지지부재 (27) : 액체층

Claims (1)

  1. 수지를 주입하는 형이 형성된 캐비티블록과 이 캐비티블록을 유지하는 형판을 갖는 수지봉지금형에 있어서, 상기 형판과 상기 형판을 지지하는 부재와의 사이에 액체층을 배설하여, 상기 형판을 액체층상의 각 부에서 상하이동을 가능하게 한 것을 특징으로 하는 수지봉지금형.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860007173A 1985-09-05 1986-08-28 수지봉지금형(樹脂封止金型) KR950000512B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60196646A JPS6256111A (ja) 1985-09-05 1985-09-05 樹脂封止金型
JP85-196646 1985-09-05

Publications (2)

Publication Number Publication Date
KR870003562A true KR870003562A (ko) 1987-04-18
KR950000512B1 KR950000512B1 (ko) 1995-01-24

Family

ID=16361234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007173A KR950000512B1 (ko) 1985-09-05 1986-08-28 수지봉지금형(樹脂封止金型)

Country Status (3)

Country Link
US (1) US4779835A (ko)
JP (1) JPS6256111A (ko)
KR (1) KR950000512B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR100687176B1 (ko) * 2005-11-07 2007-02-26 장재준 엠피쓰리 플레이어 보호커버 제조방법 및 이에 의한엠피쓰리 플레이어 보호커버

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GB2198385B (en) * 1986-12-05 1990-02-07 Metal Box Plc Apparatus for injection moulding
US5059379A (en) * 1987-07-20 1991-10-22 Mitsubishi Denki Kabushiki Kaisha Method of resin sealing semiconductor devices
US4915608A (en) * 1987-07-20 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Device for resin sealing semiconductor devices
GB8722668D0 (en) * 1987-09-26 1987-11-04 Games Workshop Ltd Injection moulding process
JPH0783082B2 (ja) * 1989-05-18 1995-09-06 株式会社東芝 半導体装置
US4969811A (en) * 1989-06-07 1990-11-13 C & L Plastics, Inc. Apparatus for making plastic devices
US5061164A (en) * 1991-04-01 1991-10-29 Micron Technology, Inc. Dowel-less mold chase for use in transfer molding
JP2596831Y2 (ja) * 1991-10-23 1999-06-21 品川白煉瓦株式会社 スライドバルブ装置用板状耐火パッキン
JP2545623Y2 (ja) * 1991-10-23 1997-08-25 品川白煉瓦株式会社 溶融金属容器インサートノズル用耐火パッキン材の装着具
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5405255A (en) * 1992-11-24 1995-04-11 Neu Dynamics Corp. Encapsulaton molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
JPH077748Y2 (ja) * 1993-01-29 1995-03-01 義雄 清水 握りずし成形型
US6007316A (en) * 1993-07-22 1999-12-28 Towa Corporation Apparatus for molding resin to seal electronic parts
JPH0820046A (ja) * 1994-07-06 1996-01-23 Sony Corp 樹脂成形用金型
NL9500238A (nl) * 1995-02-09 1996-09-02 Fico Bv Omhulinrichting met compensatie-element.
JPH08300397A (ja) * 1995-05-01 1996-11-19 Motorola Inc 封止材料をモールドキャビティに転送するための装置および方法
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US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
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EP1393881B1 (en) 1999-12-16 2009-03-11 Dai-Ichi Seiko Co. Ltd. Resin sealing method
US6290481B1 (en) * 2000-05-19 2001-09-18 Siliconware Precision Industries Co., Ltd. Flash-free mold structure for integrated circuit package
US6481996B1 (en) * 2000-05-25 2002-11-19 The Tech Group, Inc. Tapered mold runner block
US6838319B1 (en) 2000-08-31 2005-01-04 Micron Technology, Inc. Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US6857865B2 (en) * 2002-06-20 2005-02-22 Ultratera Corporation Mold structure for package fabrication
US7608482B1 (en) * 2006-12-21 2009-10-27 National Semiconductor Corporation Integrated circuit package with molded insulation
US8814557B2 (en) * 2010-03-24 2014-08-26 United Technologies Corporation Die inserts for die casting
JP5735109B2 (ja) 2010-08-13 2015-06-17 グリーン， ツイード オブ デラウェア， インコーポレイテッド 高体積繊維負荷を有する熱可塑性繊維複合材ならびにそれを作製するための方法および装置
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KR100687176B1 (ko) * 2005-11-07 2007-02-26 장재준 엠피쓰리 플레이어 보호커버 제조방법 및 이에 의한엠피쓰리 플레이어 보호커버

Also Published As

Publication number Publication date
KR950000512B1 (ko) 1995-01-24
JPS6256111A (ja) 1987-03-11
US4779835A (en) 1988-10-25

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