KR870003562A - 수지봉지금형(樹脂封止金型) - Google Patents
수지봉지금형(樹脂封止金型) Download PDFInfo
- Publication number
- KR870003562A KR870003562A KR1019860007173A KR860007173A KR870003562A KR 870003562 A KR870003562 A KR 870003562A KR 1019860007173 A KR1019860007173 A KR 1019860007173A KR 860007173 A KR860007173 A KR 860007173A KR 870003562 A KR870003562 A KR 870003562A
- Authority
- KR
- South Korea
- Prior art keywords
- template
- resin rods
- resin
- rods now
- liquid layer
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims 4
- 229920005989 resin Polymers 0.000 title claims 4
- 239000007788 liquid Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
- B29C45/1744—Mould support platens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본원 발명 수지봉지금형의 일실시예의 요부를 나타낸 단면도.
제 2 도는 본원 발명의 다른 실시예의 요부를 나타낸 단면도.
* 도면의 주요부분에 대한 부호의 설명
(1),(9) : 캐비티블록 (6),(11) : 형판
(26) : 지지부재 (27) : 액체층
Claims (1)
- 수지를 주입하는 형이 형성된 캐비티블록과 이 캐비티블록을 유지하는 형판을 갖는 수지봉지금형에 있어서, 상기 형판과 상기 형판을 지지하는 부재와의 사이에 액체층을 배설하여, 상기 형판을 액체층상의 각 부에서 상하이동을 가능하게 한 것을 특징으로 하는 수지봉지금형.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60196646A JPS6256111A (ja) | 1985-09-05 | 1985-09-05 | 樹脂封止金型 |
JP85-196646 | 1985-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870003562A true KR870003562A (ko) | 1987-04-18 |
KR950000512B1 KR950000512B1 (ko) | 1995-01-24 |
Family
ID=16361234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860007173A KR950000512B1 (ko) | 1985-09-05 | 1986-08-28 | 수지봉지금형(樹脂封止金型) |
Country Status (3)
Country | Link |
---|---|
US (1) | US4779835A (ko) |
JP (1) | JPS6256111A (ko) |
KR (1) | KR950000512B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687176B1 (ko) * | 2005-11-07 | 2007-02-26 | 장재준 | 엠피쓰리 플레이어 보호커버 제조방법 및 이에 의한엠피쓰리 플레이어 보호커버 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2198385B (en) * | 1986-12-05 | 1990-02-07 | Metal Box Plc | Apparatus for injection moulding |
US4915608A (en) * | 1987-07-20 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Device for resin sealing semiconductor devices |
US5059379A (en) * | 1987-07-20 | 1991-10-22 | Mitsubishi Denki Kabushiki Kaisha | Method of resin sealing semiconductor devices |
GB8722668D0 (en) * | 1987-09-26 | 1987-11-04 | Games Workshop Ltd | Injection moulding process |
JPH0783082B2 (ja) * | 1989-05-18 | 1995-09-06 | 株式会社東芝 | 半導体装置 |
US4969811A (en) * | 1989-06-07 | 1990-11-13 | C & L Plastics, Inc. | Apparatus for making plastic devices |
US5061164A (en) * | 1991-04-01 | 1991-10-29 | Micron Technology, Inc. | Dowel-less mold chase for use in transfer molding |
JP2596831Y2 (ja) * | 1991-10-23 | 1999-06-21 | 品川白煉瓦株式会社 | スライドバルブ装置用板状耐火パッキン |
JP2545623Y2 (ja) * | 1991-10-23 | 1997-08-25 | 品川白煉瓦株式会社 | 溶融金属容器インサートノズル用耐火パッキン材の装着具 |
US5405255A (en) * | 1992-11-24 | 1995-04-11 | Neu Dynamics Corp. | Encapsulaton molding equipment |
US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
JPH077748Y2 (ja) * | 1993-01-29 | 1995-03-01 | 義雄 清水 | 握りずし成形型 |
US6007316A (en) * | 1993-07-22 | 1999-12-28 | Towa Corporation | Apparatus for molding resin to seal electronic parts |
JPH0820046A (ja) * | 1994-07-06 | 1996-01-23 | Sony Corp | 樹脂成形用金型 |
NL9500238A (nl) * | 1995-02-09 | 1996-09-02 | Fico Bv | Omhulinrichting met compensatie-element. |
JPH08300397A (ja) * | 1995-05-01 | 1996-11-19 | Motorola Inc | 封止材料をモールドキャビティに転送するための装置および方法 |
NL1005283C2 (nl) * | 1997-02-14 | 1998-08-18 | 3P Licensing Bv | Matrijssamenstel met verende afsteuning. |
US6001672A (en) | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
NL1011392C2 (nl) * | 1999-02-25 | 2000-08-28 | 3P Licensing Bv | Inrichting voor het omhullen van elektronische componenten en daarvoor bestemde matrijs. |
WO2001043942A1 (fr) * | 1999-12-16 | 2001-06-21 | Dai-Ichi Seiko Co., Ltd. | Moule d'obturation par resine et procede d'obturation par resine |
US6290481B1 (en) * | 2000-05-19 | 2001-09-18 | Siliconware Precision Industries Co., Ltd. | Flash-free mold structure for integrated circuit package |
US6481996B1 (en) * | 2000-05-25 | 2002-11-19 | The Tech Group, Inc. | Tapered mold runner block |
US6838319B1 (en) * | 2000-08-31 | 2005-01-04 | Micron Technology, Inc. | Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically |
JP4549521B2 (ja) * | 2000-12-14 | 2010-09-22 | フィーサ株式会社 | インサート成形方法及び金型 |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
US6444501B1 (en) | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
US6857865B2 (en) * | 2002-06-20 | 2005-02-22 | Ultratera Corporation | Mold structure for package fabrication |
US7608482B1 (en) * | 2006-12-21 | 2009-10-27 | National Semiconductor Corporation | Integrated circuit package with molded insulation |
US8814557B2 (en) * | 2010-03-24 | 2014-08-26 | United Technologies Corporation | Die inserts for die casting |
ES2897736T3 (es) | 2010-08-13 | 2022-03-02 | Greene Tweed Inc | Composite de fibras termoplásticas con carga de elevado volumen de fibras y procedimiento de fabricación del mismo |
US10201094B2 (en) | 2014-05-20 | 2019-02-05 | Medtronic, Inc. | Systems for encapsulating a hybrid assembly of electronic components and associated methods |
DE102015112527B4 (de) * | 2015-07-30 | 2018-11-29 | Lapmaster Wolters Gmbh | Vorrichtung und Verfahren zum Eingießen eines ringförmigen Kunststoffrahmens in eine Ausnehmung einer Läuferscheibe einer Doppelseitenbearbeitungsmaschine |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US133229A (en) * | 1872-11-19 | hyatt | ||
US1750424A (en) * | 1927-11-04 | 1930-03-11 | American Rubber Products Corp | Molding apparatus |
US2342772A (en) * | 1939-01-09 | 1944-02-29 | Sk Wellman Co | Stripping apparatus |
US2612666A (en) * | 1946-03-05 | 1952-10-07 | Doehler Jarvis Corp | Die casting apparatus |
US2708288A (en) * | 1950-05-26 | 1955-05-17 | Frank W Fuller | Method and apparatus for molding plastic |
US2871513A (en) * | 1954-03-03 | 1959-02-03 | Us Rubber Co | Molding press |
US3431601A (en) * | 1966-12-05 | 1969-03-11 | Willis L Lipscomb | Modular die |
US3746488A (en) * | 1971-12-13 | 1973-07-17 | Garlock Inc | Apparatus for removably holding mold cavity sections to mold plates |
US3972668A (en) * | 1975-02-19 | 1976-08-03 | Hercules Incorporated | Pressless injection molding apparatus |
JPS6012203B2 (ja) * | 1980-03-31 | 1985-03-30 | 興國ゴム工業株式会社 | フラツシユレス金型装置 |
US4416604A (en) * | 1981-06-01 | 1983-11-22 | Associated Enterprises, Inc. | Universal molding system and method |
US4504208A (en) * | 1982-07-14 | 1985-03-12 | Kabushiki Kaisha Kobe Seiko Sho | Mold clamping device for injection molding machine |
US4575328A (en) * | 1984-03-06 | 1986-03-11 | Asm Fico Tooling, B.V. | Automatic continuously cycleable molding apparatus |
US4586886A (en) * | 1985-04-18 | 1986-05-06 | Plastek Industries, Inc. | Insert transfer device and method |
-
1985
- 1985-09-05 JP JP60196646A patent/JPS6256111A/ja active Pending
-
1986
- 1986-08-28 KR KR1019860007173A patent/KR950000512B1/ko not_active IP Right Cessation
- 1986-09-04 US US06/903,562 patent/US4779835A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687176B1 (ko) * | 2005-11-07 | 2007-02-26 | 장재준 | 엠피쓰리 플레이어 보호커버 제조방법 및 이에 의한엠피쓰리 플레이어 보호커버 |
Also Published As
Publication number | Publication date |
---|---|
KR950000512B1 (ko) | 1995-01-24 |
JPS6256111A (ja) | 1987-03-11 |
US4779835A (en) | 1988-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19970325 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |