KR900012740A - 수지봉지장치(樹脂封止裝置) - Google Patents

수지봉지장치(樹脂封止裝置) Download PDF

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Publication number
KR900012740A
KR900012740A KR1019890016887A KR890016887A KR900012740A KR 900012740 A KR900012740 A KR 900012740A KR 1019890016887 A KR1019890016887 A KR 1019890016887A KR 890016887 A KR890016887 A KR 890016887A KR 900012740 A KR900012740 A KR 900012740A
Authority
KR
South Korea
Prior art keywords
encapsulation device
chase
resin encapsulation
resin
type
Prior art date
Application number
KR1019890016887A
Other languages
English (en)
Other versions
KR920002388B1 (ko
Inventor
야스쓰구 쓰쓰미
스에요시 다나카
유다카 모리타
Original Assignee
시끼모리야
미쓰비시전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시끼모리야, 미쓰비시전기 주식회사 filed Critical 시끼모리야
Publication of KR900012740A publication Critical patent/KR900012740A/ko
Application granted granted Critical
Publication of KR920002388B1 publication Critical patent/KR920002388B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/36—Moulds having means for locating or centering cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/80—Measuring, controlling or regulating of relative position of mould parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

수지봉지장치(樹脂封止裝置)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 따른 수지봉지장치를 나타내는 평면도, 측면도, 입면도.
제7도는 본 발명이 별도의 실시예에 따른 수지봉지장치를 나타내는 측면도.
제10도, 종래의 수지봉지장치를 나타내는 평면도, 측면도.

Claims (1)

  1. 수지가 주입되는 캐버티를 갖는 체이스블로과, 이 체이스블록을 지지하는 지지부를 갖춘 윗형과 밑형으로 이루어지고, 이 윗형과 밑형의 양 체이스블록을 조합시켜 상기 수지를 성형하는 것에 있어서, 상기 양 체이스블록간의 자리잡기를 행하는자리잡기 부재를 상기 양 체이스블록에 부착시킴과 아울러, 상기 케이스 블록을 상기 지지부에 이동이 가능하게 설치한 것을 특징으로 하는 수지봉지장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890016887A 1989-02-03 1989-11-21 수지봉지장치(樹脂封止裝置) KR920002388B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP26133 1989-02-03
JP1-26133 1989-02-03
JP1026133A JPH0694135B2 (ja) 1989-02-03 1989-02-03 樹脂封止装置

Publications (2)

Publication Number Publication Date
KR900012740A true KR900012740A (ko) 1990-09-01
KR920002388B1 KR920002388B1 (ko) 1992-03-23

Family

ID=12185057

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890016887A KR920002388B1 (ko) 1989-02-03 1989-11-21 수지봉지장치(樹脂封止裝置)

Country Status (3)

Country Link
US (1) US5108278A (ko)
JP (1) JPH0694135B2 (ko)
KR (1) KR920002388B1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281121A (en) * 1989-02-03 1994-01-25 Mitsubishi Denki Kabushiki Kaisha Resin sealing apparatus
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
US5061164A (en) * 1991-04-01 1991-10-29 Micron Technology, Inc. Dowel-less mold chase for use in transfer molding
US5333369A (en) * 1992-03-05 1994-08-02 Nissei Plastic Industrial Co., Ltd. Method and apparatus for positioning dies
JP2846773B2 (ja) * 1992-09-01 1999-01-13 三菱電機株式会社 半導体装置の樹脂封止装置及び樹脂封止方法
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
JP2685405B2 (ja) * 1993-02-12 1997-12-03 株式会社東芝 半導体樹脂封止装置
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
EP0742586A3 (en) * 1995-05-02 1998-03-11 Texas Instruments Incorporated Improvements in or relating to integrated circuits
US6896505B2 (en) * 2002-06-27 2005-05-24 Modular Molding International, Inc. System for removably mounting modules in an injection molding press
JP3786946B1 (ja) 2005-01-24 2006-06-21 株式会社三井ハイテック 永久磁石の樹脂封止方法
CN102170201B (zh) * 2006-01-11 2012-11-28 株式会社三井高科技 将永磁体树脂密封到叠片转子铁芯中的方法
JP2016037005A (ja) * 2014-08-08 2016-03-22 富士ゼロックス株式会社 金型及び成形品の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596993A (en) * 1949-01-13 1952-05-20 United Shoe Machinery Corp Method and mold for covering of eyelets by plastic injection
US3596317A (en) * 1969-08-15 1971-08-03 Donald C Nicholson Apparatus for making plastic-embedded specimens
US4202522A (en) * 1977-06-16 1980-05-13 Honeywell Inc. Injection molding apparatus for accommodating various sizes of molding die inserts
EP0070320A4 (en) * 1981-01-26 1985-03-06 Dai Ichi Seiko Co Ltd MOLDING AND SEALING APPARATUS.
JPS5866639U (ja) * 1981-10-27 1983-05-06 日本電気株式会社 半導体集積回路用樹脂モ−ルド金型
US4513942A (en) * 1983-05-25 1985-04-30 Bourns, Inc. Plate molding apparatus with interlocking cavity plates
DE3327806C1 (de) * 1983-08-02 1984-06-20 Karl 7298 Loßburg Hehl Formenspannvorrichtung an einer Formschliesseinheit
JPS6058813A (ja) * 1983-09-12 1985-04-05 Hitachi Ltd 成形型
SU1211066A1 (ru) * 1984-01-05 1986-02-15 Научно-Исследовательский,Проектно-Конструкторский И Технологический Кабельный Институт Устройство дл литьевого прессовани резиновых изделий
JPS61135719A (ja) * 1984-12-06 1986-06-23 Mitsubishi Electric Corp 樹脂封止装置における金型の支持方法
JPS6251413A (ja) * 1985-08-30 1987-03-06 Nec Yamagata Ltd トランスファモ−ルドプレス
JPH07105409B2 (ja) * 1987-02-13 1995-11-13 株式会社東芝 半導体装置樹脂封止用金型
US4828479A (en) * 1987-08-25 1989-05-09 Pleasant Ronald E Molding apparatus
US4812114A (en) * 1987-09-30 1989-03-14 Texas Instruments Incorporated New IC molding process
JP2640238B2 (ja) * 1988-02-04 1997-08-13 トーワ株式会社 半導体素子の樹脂封止成形用金型装置
JPH01204708A (ja) * 1988-02-10 1989-08-17 Toyama Nippon Denki Kk モールド成形金型
JPH01208110A (ja) * 1988-02-16 1989-08-22 Kawasaki Yukou Kk Ｓｍｃ等のプレス成形装置

Also Published As

Publication number Publication date
US5108278A (en) 1992-04-28
JPH02206509A (ja) 1990-08-16
JPH0694135B2 (ja) 1994-11-24
KR920002388B1 (ko) 1992-03-23

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