KR890017800A - Dip용 외부장착 방열판 - Google Patents

Dip용 외부장착 방열판 Download PDF

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Publication number
KR890017800A
KR890017800A KR1019880005185A KR880005185A KR890017800A KR 890017800 A KR890017800 A KR 890017800A KR 1019880005185 A KR1019880005185 A KR 1019880005185A KR 880005185 A KR880005185 A KR 880005185A KR 890017800 A KR890017800 A KR 890017800A
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KR
South Korea
Prior art keywords
dip
heat sink
external heat
product marking
marking portion
Prior art date
Application number
KR1019880005185A
Other languages
English (en)
Other versions
KR910002291B1 (ko
Inventor
김동국
Original Assignee
강진구
삼성반도체통신 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 강진구, 삼성반도체통신 주식회사 filed Critical 강진구
Priority to KR1019880005185A priority Critical patent/KR910002291B1/ko
Publication of KR890017800A publication Critical patent/KR890017800A/ko
Application granted granted Critical
Publication of KR910002291B1 publication Critical patent/KR910002291B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음

Description

DIP용 외부장착 방열판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 사시도. 제 2 도는 본 발명의 측면도. 제 3 도는 본 발명의 평면도.

Claims (2)

  1. DIP에 결합사용하는 방열판에 있어서, DIP 윗면의 제품 마킹부를 확인할 수 있도록 DIP (1) 윗면에 형성된 제품 마킹부분(2) 상부의 방열판(3) 부위에 확인공(4)을 형성하여서 됨을 특징으로 하는 확인공을 형성한 DIP용 방열판.
  2. 제 1 항에 있어서, 확인공(4)을 DIP(1) 윗면보다 약간 작은 직사각형으로 형성함을 특징으로 하는 확인공을 형성한 DIP용 방열판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880005185A 1988-05-04 1988-05-04 반도체 장치용 방열판 KR910002291B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019880005185A KR910002291B1 (ko) 1988-05-04 1988-05-04 반도체 장치용 방열판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880005185A KR910002291B1 (ko) 1988-05-04 1988-05-04 반도체 장치용 방열판

Publications (2)

Publication Number Publication Date
KR890017800A true KR890017800A (ko) 1989-12-18
KR910002291B1 KR910002291B1 (ko) 1991-04-11

Family

ID=19274159

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005185A KR910002291B1 (ko) 1988-05-04 1988-05-04 반도체 장치용 방열판

Country Status (1)

Country Link
KR (1) KR910002291B1 (ko)

Also Published As

Publication number Publication date
KR910002291B1 (ko) 1991-04-11

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