KR900007087A - Ic 패키지용 콘테이너 및 그 수송방법 - Google Patents

Ic 패키지용 콘테이너 및 그 수송방법 Download PDF

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Publication number
KR900007087A
KR900007087A KR1019890014466A KR890014466A KR900007087A KR 900007087 A KR900007087 A KR 900007087A KR 1019890014466 A KR1019890014466 A KR 1019890014466A KR 890014466 A KR890014466 A KR 890014466A KR 900007087 A KR900007087 A KR 900007087A
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KR
South Korea
Prior art keywords
package
container
embedded
transportation method
package container
Prior art date
Application number
KR1019890014466A
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English (en)
Other versions
KR0169467B1 (ko
Inventor
야스히데 오하시
Original Assignee
야마무라 가쯔미
세이꼬 엡슨 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마무라 가쯔미, 세이꼬 엡슨 가부시끼 가이샤 filed Critical 야마무라 가쯔미
Publication of KR900007087A publication Critical patent/KR900007087A/ko
Application granted granted Critical
Publication of KR0169467B1 publication Critical patent/KR0169467B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

내용 없음

Description

IC 패키지용 콘테이너 및 그 수송방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1A도 내지 제1C도는 본 발명의 실시예를 나타내는 투시도.
제 2 도는 본 발명에 이용된 콘테이너의 주요부분을 나타내는 단면도.
제 3 도는 콘테이너의 몸체와 결합된 뚜껑(lid)을 나타내는 단면도.

Claims (2)

  1. 콘테이너상에 J형 밴드 리드 핀을 갖는 IC 패키지용 콘테이너에 있어서, 상기 콘테이너에 꺼꾸로 내장된 IC 패키지와, 상기 콘테이너 자체 또는 그 인접하게 내장된 다른 IC패키지와 결코 접촉되지 않는 상기 내장된 IC 패키지의 리드를 구비하는 것을 특징으로 하는 IC 패키지용 콘테이너.
  2. IC 패키지 수송 방법에 있어서, 상기 IC 패키지를 콘테이너내에 꺼꾸로 내장시키고, 상기 내장된 IC 패키지의 리드는 콘테이너 그 자체 또는 그와 인접하게 내장된 다른 IC 패키지와 결코 접촉되지 않도록 하는 것을 특징으로 하는 IC 패키지 수송 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890014466A 1988-10-14 1989-10-10 Ic패키지용 콘테이너 및 그 이송 방법 KR0169467B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63-134376 1988-10-14
JP13437688 1988-10-14
JP134376 1988-10-14

Publications (2)

Publication Number Publication Date
KR900007087A true KR900007087A (ko) 1990-05-09
KR0169467B1 KR0169467B1 (ko) 1999-01-15

Family

ID=15126946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890014466A KR0169467B1 (ko) 1988-10-14 1989-10-10 Ic패키지용 콘테이너 및 그 이송 방법

Country Status (2)

Country Link
US (1) US5263583A (ko)
KR (1) KR0169467B1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736345B2 (ja) * 1992-11-11 1995-04-19 山一電機株式会社 リードフリー形ｉｃキャリア
US5421455A (en) * 1994-08-09 1995-06-06 Minnesota Mining And Manufacturing Company Locking clip for IC trays
US5481438A (en) * 1994-09-06 1996-01-02 Shinon Denkisangyo Kabushiki Kaisha Tray for semiconductor devices
JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
KR100362076B1 (ko) * 1997-09-10 2002-11-22 야요이 가부시끼가이샤 테이프형상부품포장체, 부품수납용테이프, 테이프형상커버 및 부품포장장치
US6146924A (en) * 1999-08-06 2000-11-14 Vanguard International Semiconductor Corporation Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process
US6540086B1 (en) * 2000-10-13 2003-04-01 Peak International Ltd. Protective cover tape having a foam layer
JP4116851B2 (ja) * 2002-09-19 2008-07-09 富士通株式会社 電子部品の処理方法及び電子部品用治具
US20060011509A1 (en) * 2004-07-14 2006-01-19 White Robert J Jr Packaging system and method for storing electronic components
US20100018891A1 (en) * 2008-07-24 2010-01-28 Leviton Manufacturing Co., Inc. Package assembly enclosing a plurality of communication connector jacks and method of use
US20150108038A1 (en) * 2013-10-23 2015-04-23 Texas Instruments Incorporated Tape and reel cover tape to improve die sticking issues
US10101176B2 (en) 2014-03-13 2018-10-16 Texas Instruments Incorporated Carrier tape packaging method and apparatus
JP6522653B2 (ja) * 2014-12-11 2019-05-29 株式会社Ｆｕｊｉ 作業機、および収納方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435949A (en) * 1967-10-06 1969-04-01 Signetics Corp Magazine for integrated circuit modules
US4266684A (en) * 1979-03-08 1981-05-12 Maccise Yamil A Jug with sugar bowl, coffee pot and cups
EP0130489B1 (de) * 1983-06-30 1990-09-19 Siemens Aktiengesellschaft Rohrförmiger Behälter zur Aufnahme von Halbleiterbauelementen
US4564880A (en) * 1984-03-14 1986-01-14 Motorola, Inc. Apparatus and method for protecting integrated circuits
US4709297A (en) * 1984-06-29 1987-11-24 Siemens Aktiengesellschaft Guiding device for semiconductor components with DIL casings
DE8433243U1 (de) * 1984-11-13 1986-05-07 Siemens AG, 1000 Berlin und 8000 München Horde für Halb- und Fertigprodukte
US4632246A (en) * 1985-02-21 1986-12-30 Amp Incorporated Package for card edge connectors
NL8501400A (nl) * 1985-05-15 1986-12-01 Philips Nv Houder voor elektronische onderdelen.
NL8503063A (nl) * 1985-11-08 1987-06-01 Philips Nv Bandverpakking voor elektrische en/of elektronische onderdelen.
GB8712338D0 (en) * 1987-05-26 1987-07-01 Yen W H Packaging of electrical components

Also Published As

Publication number Publication date
US5263583A (en) 1993-11-23
KR0169467B1 (ko) 1999-01-15

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