KR910001917A - 반도체장치 - Google Patents

반도체장치 Download PDF

Info

Publication number
KR910001917A
KR910001917A KR1019890009304A KR890009304A KR910001917A KR 910001917 A KR910001917 A KR 910001917A KR 1019890009304 A KR1019890009304 A KR 1019890009304A KR 890009304 A KR890009304 A KR 890009304A KR 910001917 A KR910001917 A KR 910001917A
Authority
KR
South Korea
Prior art keywords
semiconductor device
protective film
hole
inner periphery
semiconductor chip
Prior art date
Application number
KR1019890009304A
Other languages
English (en)
Inventor
츠토무 나카자와
게이지 이치카와
쥰이치 오노
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910001917A publication Critical patent/KR910001917A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 따른 보호막을 적층시킨 반도체칩을 나타낸 평면도.
제2도는 제1도의 Ⅱ부 확대도.
제3도는 제1도에 상당하는 본 발명의 다른 실시예를 나타낸 도면.

Claims (1)

  1. 반도체칩(1)의 전체 표면에 응력완화용 보호막(2)이 적층됨과 더불어, 반도체칩(1)의 표면에서 본딩패드부(3)의 상부에 위치되는 상기 보호막(2)에 구멍트인부(4)가 형성된 반도체장치에 있어서, 상기 보호막(2)상에 형성된 구멍트인부(4)의 내주변의 모서리부(5)가 둔각(鈍角)내지 원호형상으로 형성되거나 상기 내주변이 원형상으로 형성된 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890009304A 1988-06-30 1989-06-30 반도체장치 KR910001917A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63163560A JPH0212950A (ja) 1988-06-30 1988-06-30 半導体装置
JP63-163560 1988-06-30

Publications (1)

Publication Number Publication Date
KR910001917A true KR910001917A (ko) 1991-01-31

Family

ID=15776222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890009304A KR910001917A (ko) 1988-06-30 1989-06-30 반도체장치

Country Status (3)

Country Link
EP (1) EP0349001A3 (ko)
JP (1) JPH0212950A (ko)
KR (1) KR910001917A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170430A (en) * 1991-01-04 1992-12-08 Schuh Peter O Voice-switched handset receive amplifier
US5287003A (en) * 1991-02-26 1994-02-15 U.S. Philips Corporation Resin-encapsulated semiconductor device having a passivation reinforcement hard polyimide film
US5366589A (en) * 1993-11-16 1994-11-22 Motorola, Inc. Bonding pad with circular exposed area and method thereof
EP0758080B1 (de) * 1995-08-09 1998-09-30 Siemens Aktiengesellschaft Mikromechanisches Bauelement mit perforierter, spannungsfreier Membran
JP2005273790A (ja) 2004-03-25 2005-10-06 Miki Pulley Co Ltd 撓み軸継手
JP5855361B2 (ja) 2011-05-31 2016-02-09 三菱電機株式会社 半導体装置
CN102280432A (zh) * 2011-08-08 2011-12-14 无锡红光微电子有限公司 Qfn封装框架结构
CN104681527A (zh) * 2013-12-03 2015-06-03 上海北京大学微电子研究院 Qfn封装框架结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190336A (en) * 1981-05-20 1982-11-22 Nec Corp Semiconductor integrated circuit
DE3327960A1 (de) * 1983-08-03 1985-02-14 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung in einem isolierstoffgehaeuse
EP0275588B1 (en) * 1986-12-19 1993-11-10 Koninklijke Philips Electronics N.V. Method of fabricating a semiconductor device with reduced packaging stress

Also Published As

Publication number Publication date
JPH0212950A (ja) 1990-01-17
EP0349001A2 (en) 1990-01-03
EP0349001A3 (en) 1990-08-01

Similar Documents

Publication Publication Date Title
KR890012380A (ko) 전자 소자 패키지 및 제조방법
KR920017291A (ko) 반도체 압력센서
KR900001568A (ko) 반도체장치용 테이핑부품
KR850000803A (ko) 반도체 장치
KR910001917A (ko) 반도체장치
KR900007087A (ko) Ic 패키지용 콘테이너 및 그 수송방법
DE69013646D1 (de) Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.
KR920010792A (ko) 반도체 장치
ES2112369T3 (es) Colchon y metodo de fabricacion.
KR900003875A (ko) 카세트 릴
KR920017094A (ko) 하드디스크 장치
KR920010803A (ko) 와이어본딩방식 반도체장치
KR930017125A (ko) 더미 패턴(dymmy pattern)을 갖는 반도체칩
KR910017608A (ko) 수지밀봉형 반도체장치
KR900004040A (ko) 반도체 집적회로 디바이스
KR870004502A (ko) 반도체 장치
KR910010686A (ko) 수지밀봉형 반도체장치
KR920013689A (ko) 반도체 장치의 리이드 프레임
KR940001365A (ko) 탭 패키지
KR880009364A (ko) 카세트 리일
KR940001370A (ko) 반도체 장치
KR920016985A (ko) 반도체 카드 패키지 장치
KR930018699A (ko) 반도체 장치
KR860002865A (ko) 열발산장치가 일체로 부착된 집적회로 패키지
KR950010046A (ko) 하이브리드 아이시(Hybrid IC)구조

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
SUBM Submission of document of abandonment before or after decision of registration