JPS5787146A - Electrical connecting structure for indication electrode and integrated circuit element - Google Patents

Electrical connecting structure for indication electrode and integrated circuit element

Info

Publication number
JPS5787146A
JPS5787146A JP16371180A JP16371180A JPS5787146A JP S5787146 A JPS5787146 A JP S5787146A JP 16371180 A JP16371180 A JP 16371180A JP 16371180 A JP16371180 A JP 16371180A JP S5787146 A JPS5787146 A JP S5787146A
Authority
JP
Japan
Prior art keywords
substrate
electrode
indication
end section
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16371180A
Other languages
Japanese (ja)
Inventor
Kazuo Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16371180A priority Critical patent/JPS5787146A/en
Publication of JPS5787146A publication Critical patent/JPS5787146A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE:To obtain a tight electrical connection, to give a vibration-resisting property and a high reliability for the subject connecting structure by a method wherein the output terminal, which will be led out to the surface of an IC mounted substrate, is opposed to the indication electrode end section to be provided on the electrode substrate, and both of them are fixed by performing pressure welding through the intermediary of anisotropic conductive rubber. CONSTITUTION:In the pannel indication device such as a light emitting element and the like, for example, a number of indication electrodes 21 and electrom end sections 21a are arragned. On the other hand, a glass substrate 6, for example, whereon a driving- circuit-formed IC is mounted and fixed, an output terminal 51 of the circuit is led out and arranged at the position corresponding to the electrode end section 21a. The terminal 51 and the end section 21 are arranged facing each other through the intermediary of anisotropic conductive rubber, the circuit substrate 6 and the electrode substrate 11 are adhered using the adhesive agent 8 such as heat-curing resin and the like, for eample, and then the above are electrically connected. Through these procedures, the electrical connection having a satisfactory connected condition and an excellent vibration- resisting property can be performed.
JP16371180A 1980-11-19 1980-11-19 Electrical connecting structure for indication electrode and integrated circuit element Pending JPS5787146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16371180A JPS5787146A (en) 1980-11-19 1980-11-19 Electrical connecting structure for indication electrode and integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16371180A JPS5787146A (en) 1980-11-19 1980-11-19 Electrical connecting structure for indication electrode and integrated circuit element

Publications (1)

Publication Number Publication Date
JPS5787146A true JPS5787146A (en) 1982-05-31

Family

ID=15779176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16371180A Pending JPS5787146A (en) 1980-11-19 1980-11-19 Electrical connecting structure for indication electrode and integrated circuit element

Country Status (1)

Country Link
JP (1) JPS5787146A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593283A (en) * 1982-06-29 1984-01-09 Yokogawa Hokushin Electric Corp X-ray detector
JPH0766286A (en) * 1991-07-01 1995-03-10 At & T Corp Method for connecting electrically integrated circuit with substrate, and integrated circuit assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593283A (en) * 1982-06-29 1984-01-09 Yokogawa Hokushin Electric Corp X-ray detector
JPH0766286A (en) * 1991-07-01 1995-03-10 At & T Corp Method for connecting electrically integrated circuit with substrate, and integrated circuit assembly

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