ITFI970023A0 - Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti - Google Patents

Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Info

Publication number
ITFI970023A0
ITFI970023A0 ITFI970023A ITFI970023A ITFI970023A0 IT FI970023 A0 ITFI970023 A0 IT FI970023A0 IT FI970023 A ITFI970023 A IT FI970023A IT FI970023 A ITFI970023 A IT FI970023A IT FI970023 A0 ITFI970023 A0 IT FI970023A0
Authority
IT
Italy
Prior art keywords
printed circuits
creation
procedure
printed
circuits
Prior art date
Application number
ITFI970023A
Other languages
English (en)
Inventor
Antonio Canova
Original Assignee
Magnetek Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnetek Spa filed Critical Magnetek Spa
Publication of ITFI970023A0 publication Critical patent/ITFI970023A0/it
Priority to IT97FI000023A priority Critical patent/IT1291779B1/it
Priority to PCT/IT1998/000026 priority patent/WO1998036625A1/en
Priority to EP98905612A priority patent/EP0974249B1/en
Priority to ES98905612T priority patent/ES2170477T3/es
Priority to DK98905612T priority patent/DK0974249T3/da
Priority to DE69803664T priority patent/DE69803664T2/de
Publication of ITFI970023A1 publication Critical patent/ITFI970023A1/it
Application granted granted Critical
Publication of IT1291779B1 publication Critical patent/IT1291779B1/it
Priority to US09/374,971 priority patent/US6401332B1/en
Priority to US10/043,002 priority patent/US6858806B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Burglar Alarm Systems (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
IT97FI000023A 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti IT1291779B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
DK98905612T DK0974249T3 (da) 1997-02-17 1998-02-16 Fremgangsmåde til fremstilling af trykte kredsløb og således fremstillede trykte kredsløb
EP98905612A EP0974249B1 (en) 1997-02-17 1998-02-16 Process for producing printed circuits and printed circuits thus obtained
ES98905612T ES2170477T3 (es) 1997-02-17 1998-02-16 Procedimiento para fabricar circuitos impresos y circuitos impresos obtenidos con el mismo.
PCT/IT1998/000026 WO1998036625A1 (en) 1997-02-17 1998-02-16 Process for producing printed circuits and printed circuits thus obtained
DE69803664T DE69803664T2 (de) 1997-02-17 1998-02-16 Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten
US09/374,971 US6401332B1 (en) 1997-02-17 1999-08-16 Processing printed circuits and printed circuits thus obtained
US10/043,002 US6858806B2 (en) 1997-02-17 2002-01-09 Process for producing printed circuits and printed circuits thus obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Publications (3)

Publication Number Publication Date
ITFI970023A0 true ITFI970023A0 (it) 1997-02-17
ITFI970023A1 ITFI970023A1 (it) 1998-08-17
IT1291779B1 IT1291779B1 (it) 1999-01-21

Family

ID=11351938

Family Applications (1)

Application Number Title Priority Date Filing Date
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti

Country Status (7)

Country Link
US (2) US6401332B1 (it)
EP (1) EP0974249B1 (it)
DE (1) DE69803664T2 (it)
DK (1) DK0974249T3 (it)
ES (1) ES2170477T3 (it)
IT (1) IT1291779B1 (it)
WO (1) WO1998036625A1 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITRM20020138U1 (it) * 2002-07-31 2004-02-01 Dmg Spa Pulsantiere di ascensore con pulsanti precablati.
US20050247761A1 (en) * 2004-05-04 2005-11-10 Albanese Patricia M Surface mount attachment of components
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
US8148377B2 (en) 2007-02-11 2012-04-03 Map Pharmaceuticals, Inc. Method of therapeutic administration of DHE to enable rapid relief of migraine while minimizing side effect profile
WO2009121697A1 (de) * 2008-04-01 2009-10-08 Continental Automotive Gmbh Stromführungsbauteil mit einem träger, leiterbahnen und leiterplättchen
DE102011004526B4 (de) 2011-02-22 2021-05-06 Vitesco Technologies GmbH Leiterplatte mit hoher Stromtragfähigkeit und Verfahren zur Herstellung einer solchen Leiterplatte
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
KR102059610B1 (ko) * 2015-12-18 2019-12-26 주식회사 엘지화학 고전도성 방열 패드를 이용한 인쇄회로기판의 방열 시스템
JP6412051B2 (ja) * 2016-04-18 2018-10-24 ファナック株式会社 プリント板の自動組み立ての歩留りを向上する自動組立システム及び自動組立方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
EP0315799B1 (de) 1987-11-10 1992-05-06 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Bestücken von Leiterplatten mit Bauelementen
US4873764A (en) 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
DE3813097A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen auf leiterplatten
DE3813096A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen, insbesondere smd-bauelementen, auf leiterplatten
JPH01303793A (ja) * 1988-05-31 1989-12-07 Pfu Ltd プリント配線板の製造方法及び配線板
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
DE3935930A1 (de) 1989-10-27 1991-05-02 Adalbert Fritsch Bestueckungsgeraet
US5157734A (en) 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
DE69009421T2 (de) 1989-12-20 1994-12-15 Philips Nv Verfahren zum Simultananordnen und Verlöten von SMD-Bauteilen.
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
US5195154A (en) 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
JPH0429338A (ja) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Ｉｃの搭載用回路基板及びその搭載方法
DE4028556C1 (it) * 1990-09-08 1992-04-02 Robert Bosch Gmbh, 7000 Stuttgart, De
AU651881B2 (en) 1991-03-18 1994-08-04 Fujitsu Limited System for producing printed-wiring board unit and its producing method
EP0509582B1 (en) 1991-04-16 1996-09-04 Koninklijke Philips Electronics N.V. SMD-resistor
DE69300850T2 (de) 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
JPH06196851A (ja) * 1992-12-25 1994-07-15 Taiyo Yuden Co Ltd 回路基板に金属部材を取り付けるはんだ付け方法
US5410801A (en) 1993-02-08 1995-05-02 Automated Production Systems Apparatus for manually controlled placement of components on circuit boards
US5323528A (en) 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH0715122A (ja) * 1993-06-23 1995-01-17 Matsushita Electric Ind Co Ltd 接合用フィルム構体および電子部品実装方法
US5349504A (en) 1993-07-12 1994-09-20 Dialight Corporation Multi-level lightpipe design for SMD LEDs
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
FR2712454B3 (fr) * 1993-11-08 1996-03-22 Nicomatic Composant conducteur passif pour montage en surface sur une carte de circuit imprimé.
US5373111A (en) * 1993-11-19 1994-12-13 Delco Electronics Corporation Bond pad having a patterned bonding surface
DE4339551C1 (de) 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
US5974661A (en) 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5578874A (en) * 1994-06-14 1996-11-26 Hughes Aircraft Company Hermetically self-sealing flip chip
DE4433565A1 (de) 1994-09-20 1996-03-21 Blaupunkt Werke Gmbh Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
US5886877A (en) * 1995-10-13 1999-03-23 Meiko Electronics Co., Ltd. Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
US5729896A (en) * 1996-10-31 1998-03-24 International Business Machines Corporation Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
US5896081A (en) 1997-06-10 1999-04-20 Cyntec Company Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6457234B1 (en) * 1999-05-14 2002-10-01 International Business Machines Corporation Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond

Also Published As

Publication number Publication date
ITFI970023A1 (it) 1998-08-17
IT1291779B1 (it) 1999-01-21
US6858806B2 (en) 2005-02-22
US20020056571A1 (en) 2002-05-16
WO1998036625A1 (en) 1998-08-20
EP0974249B1 (en) 2002-01-30
DE69803664T2 (de) 2002-10-24
US6401332B1 (en) 2002-06-11
DE69803664D1 (de) 2002-03-14
DK0974249T3 (da) 2002-05-06
EP0974249A1 (en) 2000-01-26
ES2170477T3 (es) 2002-08-01

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Legal Events

Date Code Title Description
0001 Granted