CN1319138C - 封装的半导体器件的形成方法 - Google Patents

封装的半导体器件的形成方法 Download PDF

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CN1319138C
CN1319138C CNB031023126A CN03102312A CN1319138C CN 1319138 C CN1319138 C CN 1319138C CN B031023126 A CNB031023126 A CN B031023126A CN 03102312 A CN03102312 A CN 03102312A CN 1319138 C CN1319138 C CN 1319138C
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radiator
circuit
circuit wafer
semiconductor device
wafer
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CN1437233A (zh
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马克·A·格博
肖恩·M·奥考内
特伦特·A·汤普森
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NXP USA Inc
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Freescale Semiconductor Inc
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Abstract

一种封装的半导体器件(20)具有第一集成电路片(28)，其上表面具有有源电路。第一电路片(28)安装在第一散热器(22)的凹孔(21)内。在上表面具有电路的第二电路片(36)被附着到第一电路片(28)的上表面上。电路片(28和36)都电连接到安装于第一散热器(22)上的基片(24)。第二散热器(40)安装在第二电路片(36)的上表面上。第二散热器(40)提供用于散发由第二电路片(36)所产生的热量的额外路径。

Description

封装的半导体器件的形成方法
技术领域
本发明一般涉及一种封装的半导体器件，特别涉及形成封装的半导体器件的方法。
背景技术
在封装的集成电路中需要提供一种封装，这使得多个半导体电路片(die)在该封装之内。在一个封装内包含多个电路片具有几个优点。例如，可以减小封装成本以及可以减小在印刷电路板上所需的空间量。在一个封装内实现多个电路片的一种方法是把一个电路片叠加在另一个电路片之上。但是，叠加电路片的方案的一个问题是在该叠层顶部的电路片要通过底部的电路片而散热。为了封装高功率的器件，可以通过底部散发的热量受到限制。因此，需要一种具有改进散热性能的用于叠加电路片的封装半导体器件。
发明内容
本发明涉及一种用于形成半导体器件的方法，包括：
提供具有第一散热器的封装器件、覆盖第一散热器的封装基片、以及延伸通过该封装基片并且进入第一散热器的凹孔；
将第一电路片附着到所述凹孔中的第一散热器上；
将第二电路片附着到第一电路片上；
将第二散热器附着到第二电路片上；
在第一电路片和封装基片之间形成多个线接合连接；以及
封装该线接合连接、第一电路片、第二电路片以及至少一部分的第二散热器。
本发明还涉及一种半导体器件，其特征在于：
具有第一表面和第二表面的半导体电路片，该半导体电路片包括在第一表面中的有源电路；以及
连接到半导体电路片的第一表面的散热器，其中该散热器焊接到覆盖一部分所述半导体电路片第一表面的金属层。
附图说明
本发明通过附图中的例子而示出，但是不限于此，其中相同的参照标号表示相同的元件，其中：
图1-7包括根据本发明的一个实施例而形成的封装器件的连续截面示图。
本领域的普通技术人员应当知道在图中的元件是为了简化和清楚而示出的，并且不一定按照比例来绘制。例如，在图中的一些元件的尺寸可能相对于其它元件而被夸大，以有助于理解本发明的各种实施例。
具体实施方式通常，本发明采用一种用于叠加电路片的封装半导体器件，其通过把散热器附加到顶部电路片上而提高散热性能。附加到顶部电路片的该散热器补充用于支持底部电路片的散热器。底部散热器具有用于支承叠加的电路片的凹孔，以减小该器件的高度。当封装的器件附加到一个印刷电路板(PCB)上时，附加到顶部电路片的散热器与PCB相接触，提供用于发散直接由顶部电路片的工作所产生的热量的直接热路径。通过参照附图可以更好地理解本发明。
图1示出根据本发明一个实施例的一个器件20。封装的器件20包括具有凹孔21的散热器22。在所示的实施例中，散热器22由铜所形成。如果由铜所形成，则散热器22可以镀有其它金属，例如铬银、镍金等等这样的其它金属。在其它实施例中，散热器22可以由任何其它导热材料所形成。一个封装的基片24附加到散热器22上。基片24还具有通常对应于凹孔21的开口。基片24的顶部包括一个或多个线接合指状物30以及一个或多个焊锡球焊盘32。在本发明的一个实施例中，焊盘32由导电材料所形成，并且可以用于把器件20机械连接和电连接到PCB。并且，焊盘32可以被用于安装分立器件，可以用于连接测试用的测试探针，或者可以用于连接导电互联线(例如，焊锡球)。在所示的实施例中，线接合焊盘30通常把电路片电连接到封装基片。但是，在其它实施例中，其它技术可以用于把该电路片连接到基片。并且，基片24包含例如引线(未示出)这样的把线接合焊盘30连接到焊锡球焊盘32的电导体。具有电路的半导体电路片28在凹孔21中对齐，并且使用电路片粘合材料26附着到散热器22上。另外，电路片28可以通过电路片粘合带附着到散热器22上。
图2示出封装器件20的一个实施例，其中第二电路片36通过使用电路片附着材料34而对齐并且附着到电路片28的上表面上。通常，电路片36具有比附着电路片28的表面面积更小的表面面积。
图3示出封装器件20的一个实施例，其中第二散热器40附着到电路片36的上表面。散热器40使用电路片附着材料38而被附着到电路片36的上表面。电路片附着材料38例如可以是环氧树脂或者胶带电路片附着材料中的一种。在另一个实施例中，可以通过把散热器40焊接到电路片36上的一个适当尺寸的金属焊盘(未示出)而把散热器40附着到电路片36上。散热器40可以在晶片分割为独立的电路片之前或之后而焊接到金属焊盘上。
在一个实施例中，散热器40由铜所制成。如果由铜所形成，则散热器40可以电镀有例如铬银、镍金等等其它材料。在其它实施例中，散热器40可以使用例如铝或金这样的另一种导热材料所形成，并且可以通过冲压、铸造、蚀刻或者机械加工而形成。并且，在所示的实施例中，散热器40被形成为具有尖细或台阶形状，由参考标号41所表示的特征或突起，使得散热器40的底部表面的面积大于散热器40的上表面的面积。并且，当从上往下观看时，散热器40可以为圆柱形或矩形。如果圆柱形被用于散热器40，则散热器40可以被示出为通过他们的平坦表面相互连接的两个圆柱，一个圆柱的直径小于另一个圆柱的直径。如果矩形被用于散热器40，则它可以被看作为两个连接或相邻的盒子，其中一个盒子的体积不同于另一个盒子的体积。在其它实施例中，散热器40可以具有不同的形状，并且可以由多个部件所形成。
图4示出器件20的一个实施例，其中电路片28和36通过接合线44和46电连接到接合指状物30。本发明的另一个实施例可以使用多个接合线44和46和接合指状物30。并且，图4中所示的作为一个选项，接合线48把散热器40电连接到电路片36上的一个位置。例如，接合线48可以被用于把散热器40电接地到电路片36。在散热器40中的特征41作为附着可选的接合线的一个常规位置。
图5示出器件20的一个实施例，其中一个封装材料50已经施加在叠层电路片36和28、散热器40以及接合线44、46和48上。请注意，封装材料50可以是用于集成电路的任何类型的适当材料，例如模制塑料或者液体凝聚成团的材料。并且，请注意封装材料50的上表面与散热器40的上表面齐平，并且不覆盖散热器40的上表面。并且，特征41用于把散热器40锁定在电路片36的顶部，并且在器件20重复热循环之后防止散热器40脱离封装材料50。另外，在所示的实施例中，封装材料50基本上填充所有凹孔21。
图6示出器件20的一个实施例，其中多个焊锡球52形成在多个焊锡焊盘32之上。焊锡球52使用淀积焊锡球52的一种常规技术而形成。
图7示出器件20的一个实施例，其中器件20连接PCB54。请注意，在所示的实施例中，器件20被叠加或旋转，以把器件20附着到PCB54上。但是，在另一个实施例中，器件20可以在形成过程中以任何方式而被定位。PCB54包括在位置上对应于焊锡焊盘32的多个接合焊盘。焊锡球52被加热或回流，以提供到焊盘60的电连接，该焊盘还可以具有丝网印刷的焊锡膏等等。并且，焊锡连接56形成在散热器40和PCB54上的相应焊盘60之间。
散热器40提供用于器件20的第二散热路径。在器件20的工作过程中，热量至少部分地从电路片36通过散热器40散发。减小对于由电路片28散发由电路片36所产生的热量的需要，从而允许叠加电路片的半导体器件具有更大的功率消耗。
请注意，在基片24中的线路和通孔(未示出)被用于有选择地把基片24的各个部分相互连接。还请注意，电路片附着材料26、34和38可以是任何类型的适当材料，例如胶带或者非固态胶(例如胶水、环氧树脂)。电路片28和36可以是任何类型的集成电路、半导体器件，或者其它类型的电激活基片。本发明的其它实施例可以具有被封装在封装的半导体器件20中的任何数目的电路片28和36。例如，另一个实施例可以在封装器件20中封装3个电路片。请注意，电路片28和36的尺寸和长宽比可以变化。请注意，电路片28和36位于所示实施例中的散热器22的凹孔21内。但是，在其它实施例中，电路片28和电路片36可以位于没有凹孔21的散热器上。并且，散热器22可以被形成在与凹孔21相对的一侧上，以增加表面面积提高散热效率。
在上述说明书中，已经参照具体实施例描述本发明。但是，本领域的普通技术人员将认识到可以做出各种改变和变化而不脱离在下文的权利要求中给出的本发明的范围。例如，本领域所公知的任何适当的电路片附着处理、线接合处理、焊锡球形成处理以及胶带处理可以被用于封装器件20的形成。相应地，说明书和附图被认为是说明性而非限制性的，并且所有这些改变被包含在本发明的范围内。效果、优点以及对问题的解决方案已经参照特定的实施例进行描述。但是，这些效果、优点、对问题的解决方案以及可以产生任何效果、优点或解决方案的任何因素不被认为是任何权利要求的关键、必要或本质特征或要素。

Claims (2)

1.一种用于形成半导体器件的方法，包括：
提供具有第一散热器的封装器件、覆盖第一散热器的封装基片、以及延伸通过该封装基片并且进入第一散热器的凹孔；
将第一电路片附着到所述凹孔中的第一散热器上；
将第二电路片附着到第一电路片上；
将第二散热器附着到第二电路片上；
在第一电路片和封装基片之间形成多个线接合连接；以及
封装该线接合连接、第一电路片、第二电路片以及至少一部分的第二散热器。
2.根据权利要求1的方法，其中所述基片具有表面，该表面包括多个焊锡球焊盘和所述多个线接合连接。
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