CN109801900A - 一种电力用逆变电路装置 - Google Patents
一种电力用逆变电路装置 Download PDFInfo
- Publication number
- CN109801900A CN109801900A CN201910036878.3A CN201910036878A CN109801900A CN 109801900 A CN109801900 A CN 109801900A CN 201910036878 A CN201910036878 A CN 201910036878A CN 109801900 A CN109801900 A CN 109801900A
- Authority
- CN
- China
- Prior art keywords
- hole
- chip
- electric power
- inverter circuit
- power inverter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Inverter Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910036878.3A CN109801900B (zh) | 2019-01-15 | 2019-01-15 | 一种电力用逆变电路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910036878.3A CN109801900B (zh) | 2019-01-15 | 2019-01-15 | 一种电力用逆变电路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109801900A true CN109801900A (zh) | 2019-05-24 |
CN109801900B CN109801900B (zh) | 2021-10-29 |
Family
ID=66559357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910036878.3A Expired - Fee Related CN109801900B (zh) | 2019-01-15 | 2019-01-15 | 一种电力用逆变电路装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109801900B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112910285A (zh) * | 2021-01-05 | 2021-06-04 | 山东傲天环保科技有限公司 | 一种逆变器电力系统及其制造方法 |
US11587861B2 (en) * | 2020-03-30 | 2023-02-21 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399259A (zh) * | 2007-09-27 | 2009-04-01 | 三洋电机株式会社 | 电路装置及其制造方法 |
CN103430307A (zh) * | 2012-02-13 | 2013-12-04 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
CN103633044A (zh) * | 2012-08-24 | 2014-03-12 | 三菱电机株式会社 | 半导体装置 |
CN105794094A (zh) * | 2013-12-04 | 2016-07-20 | 三菱电机株式会社 | 半导体装置 |
CN106487252A (zh) * | 2015-08-28 | 2017-03-08 | 三菱电机株式会社 | 半导体装置、智能功率模块及电力转换装置 |
CN108538825A (zh) * | 2017-03-02 | 2018-09-14 | 三菱电机株式会社 | 功率模块 |
-
2019
- 2019-01-15 CN CN201910036878.3A patent/CN109801900B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399259A (zh) * | 2007-09-27 | 2009-04-01 | 三洋电机株式会社 | 电路装置及其制造方法 |
CN103430307A (zh) * | 2012-02-13 | 2013-12-04 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
CN103633044A (zh) * | 2012-08-24 | 2014-03-12 | 三菱电机株式会社 | 半导体装置 |
CN105794094A (zh) * | 2013-12-04 | 2016-07-20 | 三菱电机株式会社 | 半导体装置 |
CN106487252A (zh) * | 2015-08-28 | 2017-03-08 | 三菱电机株式会社 | 半导体装置、智能功率模块及电力转换装置 |
CN108538825A (zh) * | 2017-03-02 | 2018-09-14 | 三菱电机株式会社 | 功率模块 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11587861B2 (en) * | 2020-03-30 | 2023-02-21 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN112910285A (zh) * | 2021-01-05 | 2021-06-04 | 山东傲天环保科技有限公司 | 一种逆变器电力系统及其制造方法 |
CN112910285B (zh) * | 2021-01-05 | 2022-06-14 | 深圳市富鑫产业科技有限公司 | 一种逆变器电力系统及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109801900B (zh) | 2021-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211012 Address after: 226600 energy saving and environmental protection science and Technology Industrial Park, Hai'an City, Nantong City, Jiangsu Province (No. 19, Dianhu Avenue) Applicant after: Jiangsu shuangju Intelligent Equipment Manufacturing Co.,Ltd. Address before: 226600 industrial concentration zone, Baidian Town, Hai'an City, Nantong City, Jiangsu Province Applicant before: HAI'AN GAOTONG AUTOMATION TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211029 Termination date: 20220115 |