JP5732142B2 - トレンチを介した選択的ゲルマニウムpコンタクトメタライゼーション - Google Patents
トレンチを介した選択的ゲルマニウムpコンタクトメタライゼーション Download PDFInfo
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- JP5732142B2 JP5732142B2 JP2013546135A JP2013546135A JP5732142B2 JP 5732142 B2 JP5732142 B2 JP 5732142B2 JP 2013546135 A JP2013546135 A JP 2013546135A JP 2013546135 A JP2013546135 A JP 2013546135A JP 5732142 B2 JP5732142 B2 JP 5732142B2
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- boron
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- germanium
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims description 173
- 229910052732 germanium Inorganic materials 0.000 title claims description 172
- 238000001465 metallisation Methods 0.000 title description 3
- 239000010410 layer Substances 0.000 claims description 163
- 238000000034 method Methods 0.000 claims description 78
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 77
- 229910052796 boron Inorganic materials 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 239000000872 buffer Substances 0.000 claims description 51
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 44
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- 238000004891 communication Methods 0.000 claims description 23
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 19
- 125000006850 spacer group Chemical group 0.000 claims description 17
- SCCCLDWUZODEKG-UHFFFAOYSA-N germanide Chemical compound [GeH3-] SCCCLDWUZODEKG-UHFFFAOYSA-N 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 29
- 238000000151 deposition Methods 0.000 description 28
- 239000000463 material Substances 0.000 description 25
- 230000008569 process Effects 0.000 description 20
- 230000008021 deposition Effects 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000011247 coating layer Substances 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 8
- 229910021332 silicide Inorganic materials 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000011065 in-situ storage Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000171 gas-source molecular beam epitaxy Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 2
- 229910021334 nickel silicide Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000001289 rapid thermal chemical vapour deposition Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XWCMFHPRATWWFO-UHFFFAOYSA-N [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] Chemical compound [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] XWCMFHPRATWWFO-UHFFFAOYSA-N 0.000 description 1
- ILCYGSITMBHYNK-UHFFFAOYSA-N [Si]=O.[Hf] Chemical compound [Si]=O.[Hf] ILCYGSITMBHYNK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005280 amorphization Methods 0.000 description 1
- RBFDCQDDCJFGIK-UHFFFAOYSA-N arsenic germanium Chemical compound [Ge].[As] RBFDCQDDCJFGIK-UHFFFAOYSA-N 0.000 description 1
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- OKZIUSOJQLYFSE-UHFFFAOYSA-N difluoroboron Chemical compound F[B]F OKZIUSOJQLYFSE-UHFFFAOYSA-N 0.000 description 1
- VXGHASBVNMHGDI-UHFFFAOYSA-N digermane Chemical compound [Ge][Ge] VXGHASBVNMHGDI-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229940104869 fluorosilicate Drugs 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- 229910000078 germane Inorganic materials 0.000 description 1
- TXFYZJQDQJUDED-UHFFFAOYSA-N germanium nickel Chemical compound [Ni].[Ge] TXFYZJQDQJUDED-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 1
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- KJXBRHIPHIVJCS-UHFFFAOYSA-N oxo(oxoalumanyloxy)lanthanum Chemical compound O=[Al]O[La]=O KJXBRHIPHIVJCS-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- CZXRMHUWVGPWRM-UHFFFAOYSA-N strontium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Sr+2].[Ba+2] CZXRMHUWVGPWRM-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising silicides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
本願は、2010年12月21日に出願された米国出願第12/975,278号の一部継続出願である。
上記したように、トランジスタの駆動電流の増加は、デバイス抵抗を低減することにより実現可能である。接触抵抗は、デバイス全体の抵抗の一部である。標準的なトランジスタのコンタクト積層体は、例えば、シリコン又はSiGeのソース/ドレイン層、ニッケルシリサイド層、窒化チタン接着層、及び、タングステンのコンタクト/パッドを含む。このような構成において、シリコン又はSiGeの価電子帯を金属のピニングレベルにすることによって、接触抵抗を有効に制限できる。一般的に、ニッケル(又は、チタン、コバルト又はプラチナのようなその他の好適なシリサイド)のような当産業で標準的に使用されるシリサイドを用いると、価電子帯のずれは約0.5eVとなる。そこで、本発明の一実施形態では、価電子帯のずれの値及び接触抵抗を大幅に低減させるべく、中間ボロンドープゲルマニウム層が、ソース/ドレイン金属とコンタクト金属との間に設けられる。
図1Aには、本発明の一実施形態に係る基板102上に形成されたMOSデバイス100Aが示されており、ソース/ドレイン層とコンタクト金属との間にボロンドープゲルマニウム層が形成されている。より詳細には、ボロンドープゲルマニウム層117がソース層110とコンタクト金属125との間に設けられており、ボロンドープゲルマニウム層119が、ドレイン層112とコンタクト金属127との間に設けられている。ソース領域110及びドレイン領域112は、様々な周知の技術を使用して形成することができる。この実施形態では、例えば、基板をエッチングした後に、シリコン又はシリコンゲルマニウム材料を(例えば、原子百分率で10%から70%の範囲のゲルマニウム濃度で)エピタキシャル堆積させることにより、ソース領域110及びドレイン領域112を形成する。
周知のように、FinFETは、半導体材料の薄いストリップ(通常、フィンと称される)の周囲に形成されるトランジスタである。トランジスタは、ゲート、ゲート絶縁体、ソース領域及びドレイン領域を含む標準的な電界効果トランジスタ(FET)ノードを含む。デバイスの導電チャネルは、ゲート絶縁体の下でフィンの外側に設けられる。具体的には、電流が、フィンの両側の側壁(基板表面に垂直な面)及びフィンの上面(基板表面と平行な面)に沿って電流が流れる。このような構造の導電チャネルは基本的に、フィンの3つの異なる外側の平面的な領域に沿って存在することから、このようなFinFET設計は、トライゲート(tri-gate)FinFETとも称される。その他の種類のFinFET構成も利用可能であり、例えば、導電チャネルが主に、フィンの2つの側壁に沿ってのみ存在する(フィンの上面には存在しない)いわゆるダブルゲートFinFETが利用可能である。
図8には、本発明の一実施形態に係るコンピュータシステム1000が示されている。図に示すように、コンピュータデバイス1000は、マザーボード1002を備える。マザーボード1002は、これに限定されないが、物理的に及び電気的にマザーボード1002に接続される又は組み込まれるプロセッサ1004及び少なくとも1つの通信チップ1006を含む複数の構成要素を備えてもよい。マザーボード1002は、例えば、任意のプリント回路基板であってもよく、例えば、メインボード又はメインボードに搭載されるドータボード又はデバイス1000の唯一のボードであってもよい。用途に応じて、コンピュータデバイス1000は、物理的に及び電気的にマザーボード1002に接続されていても接続されていなくてもよい1以上の構成要素を含む。その他の構成要素としては、これに限定されないが、例えば、揮発性メモリ(例えば、DRAM)、不揮発性メモリ(例えば、ROM)、グラフィックスプロセッサ、デジタル信号プロセッサ、暗号プロセッサ、チップセット、アンテナ、ディスプレイ、タッチスクリーンディスプレイ、タッチスクリーンコントローラ、バッテリ、オーディオコーデック、ビデオコーデック、電源アンプ、全地球測位システム(GPS)、コンパス、加速度計、ジャイロスコープ、スピーカ、カメラ、大容量記憶装置(ハードディスクドライブ、コンパクトディスク(CD)、デジタル多用途ディスク(DVD)等)が含まれる。コンピュータデバイス1000に含まれる任意の構成要素が、上記した1以上のトランジスタ構造を含んでもよい。ある実施形態では、複数の機能を1以上のチップに組み込むことができる(例えば、通信チップ1006は、プロセッサ1004の一部分であってもよいし、プロセッサに組み込まれてもよい)。
Claims (22)
- チャネル領域を有する基板と、
前記チャネル領域の上方に設けられたゲート電極と、
前記ゲート電極と前記チャネル領域との間に設けられたゲート誘電体層と、
前記チャネル領域に隣接して前記基板に設けられたp型ソース/ドレイン領域及びn型ソース/ドレイン領域と、
前記p型ソース/ドレイン領域の少なくとも一部分上に、原子百分率で90%を超える濃度のゲルマニウムと1E20cm−3を超える濃度のボロンを含有するボロンドープゲルマニウム層と、
前記ボロンドープゲルマニウム層上に設けられた金属−ゲルマニウム化物ソース/ドレインコンタクトと、
前記p型ソース/ドレイン領域と前記ボロンドープゲルマニウム層との間に設けられた段階的に濃度が変化するバッファとを備え、
前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から1E20cm −3 を超える高濃度まで段階的に変化するボロン濃度を有する
トランジスタデバイス。 - 前記トランジスタデバイスは、平面型トランジスタ及びFinFETトランジスタのうちの一つである請求項1に記載のトランジスタデバイス。
- 前記ボロンドープゲルマニウム層は、前記トランジスタデバイスのp型ソース/ドレイン領域の上にのみ設けられる請求項1又は2に記載のトランジスタデバイス。
- 層間誘電体を更に備える請求項1から3の何れか一項に記載のトランジスタデバイス。
- 前記基板と前記p型ソース/ドレイン領域との間に設けられた段階的に濃度が変化するバッファを備える請求項1から4の何れか一項に記載のトランジスタデバイス。
- 前記p型ソース/ドレイン領域と前記ボロンドープゲルマニウム層との間に設けられた前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から原子百分率で95%を超える高濃度まで段階的に変化するゲルマニウム濃度を有する請求項1から5の何れか一項に記載のトランジスタデバイス。
- 前記高濃度は、純粋なゲルマニウムを表す濃度である請求項6に記載のトランジスタデバイス。
- 前記ボロンドープゲルマニウム層は、ゲルマニウム及びボロンのうち少なくとも一つが段階的に変化する濃度を有する請求項1から7の何れか一項に記載のトランジスタデバイス。
- 前記p型ソース/ドレイン領域及び前記n型ソース/ドレイン領域は、前記基板に適合するベースレベル濃度から原子百分率で50%を超える高濃度まで段階的に変化するゲルマニウム濃度を有するシリコンゲルマニウムを有し、
前記ボロンドープゲルマニウム層は、原子百分率で95%を超えるゲルマニウム濃度を有する請求項1から8の何れか一項に記載のトランジスタデバイス。 - 前記p型ソース/ドレイン領域は、前記基板に適合するベースレベル濃度から1E20cm−3を超える高濃度まで段階的に変化するボロン濃度を有するボロンドープシリコンゲルマニウムを有する請求項1から9の何れか一項に記載のトランジスタデバイス。
- 前記p型ソース/ドレイン領域及び前記n型ソース/ドレイン領域は、シリコン又はシリコンゲルマニウムを有し、
前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から原子百分率で50%を超える高濃度まで段階的に変化するゲルマニウム濃度、及び、前記p型ソース/ドレイン領域に適合するベースレベル濃度から1E20cm−3を超える高濃度まで段階的に変化するボロン濃度を有する請求項1から4の何れか一項に記載のトランジスタデバイス。 - 前記ボロンドープゲルマニウム層は、原子百分率で98%を超えるゲルマニウム濃度、及び、2E20cm−3を超えるボロン濃度を有する請求項1から11の何れか一項に記載のトランジスタデバイス。
- 1以上の集積回路を有するプリント回路基板を備え、
前記1以上の集積回路のうちの少なくとも1つは、請求項1から12の何れか一項に記載のトランジスタデバイスを1以上含む電子デバイス。 - 前記1以上の集積回路は、
通信チップ及びプロセッサの少なくとも一つを含み、
前記通信チップ及びプロセッサの少なくとも一つは、前記トランジスタデバイスを1以上有する請求項13に記載の電子デバイス。 - 前記電子デバイスは、コンピュータデバイスである請求項13又は14に記載の電子デバイス。
- チャネル領域を有する基板と、
前記チャネル領域の上方に設けられたゲート電極と、
前記ゲート電極と前記チャネル領域との間に設けられたゲート誘電体層と、
前記ゲート電極の両側に設けられたスペーサと、
前記チャネル領域に隣接して前記基板に設けられ、前記ゲート誘電体層及び/又は対応する前記スペーサの下に延在する先端領域をそれぞれ有するp型ソース/ドレイン領域及びn型ソース/ドレイン領域と、
前記p型ソース/ドレイン領域の少なくとも一部分上に設けられ、原子百分率で95%を超える濃度のゲルマニウムと2E20cm−3を超える濃度のボロンを含有するボロンドープゲルマニウム層と、
前記ボロンドープゲルマニウム層上に設けられた金属−ゲルマニウム化物ソース/ドレインコンタクトと、
前記p型ソース/ドレイン領域と前記ボロンドープゲルマニウム層との間に設けられた段階的に濃度が変化するバッファとを備え、
前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から1E20cm −3 を超える高濃度まで段階的に変化するボロン濃度を有し、
平面型トランジスタ及びFinFETトランジスタのうちの1つであるトランジスタデバイス。 - 前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から原子百分率で95%を超える高濃度まで段階的に変化するゲルマニウム濃度、及び、前記p型ソース/ドレイン領域に適合するベースレベル濃度から2E20cm−3を超える高濃度まで段階的に変化するボロン濃度を有する請求項16に記載のトランジスタデバイス。
- 前記ボロンドープゲルマニウム層は、ゲルマニウム及びボロンのうち少なくとも一つが段階的に変化する濃度を有する請求項16に記載のトランジスタデバイス。
- 前記p型ソース/ドレイン領域及び前記n型ソース/ドレイン領域は、前記基板に適合するベースレベル濃度から原子百分率で50%を超える高濃度まで段階的に変化するゲルマニウム濃度を有するシリコンゲルマニウムを有し、
前記ボロンドープゲルマニウム層は、原子百分率で98%を超えるゲルマニウム濃度を有する請求項16に記載のトランジスタデバイス。 - 前記p型ソース/ドレイン領域は、前記基板に適合するベースレベル濃度から2E20cm−3を超える高濃度まで段階的に変化するボロン濃度を有する請求項19に記載のトランジスタデバイス。
- 前記p型ソース/ドレイン領域及び前記n型ソース/ドレイン領域は、一定のゲルマニウム濃度を有するシリコンゲルマニウムを有し、
前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から原子百分率で50%を超える高濃度まで段階的に変化するゲルマニウム濃度、及び、前記p型ソース/ドレイン領域に適合するベースレベル濃度から2E20cm−3を超える高濃度まで段階的に変化するボロン濃度を有し、
前記バッファは100オングストローム未満の厚みを有する請求項16に記載のトランジスタデバイス。 - トランジスタデバイスを形成する方法であって、
チャネル領域を有する基板を設ける段階と、
前記チャネル領域の上方にゲート電極を設ける段階と、
前記チャネル領域に隣接してp型ソース/ドレイン領域及びn型ソース/ドレイン領域を前記基板に設ける段階と、
前記p型ソース/ドレイン領域の少なくとも一部分上にボロンドープゲルマニウム層を設ける段階と、
前記ボロンドープゲルマニウム層上に、金属−ゲルマニウム化物ソース/ドレインコンタクトを設ける段階と、
前記p型ソース/ドレイン領域と前記ボロンドープゲルマニウム層との間に、段階的に濃度が変化するバッファを設ける段階とを備え、
前記バッファは、前記p型ソース/ドレイン領域に適合するベースレベル濃度から1E20cm −3 を超える高濃度まで段階的に変化するボロン濃度を有し、
前記ゲート電極と前記チャネル領域との間にゲート誘電体層が設けられ、
前記ボロンドープゲルマニウム層は、原子百分率で90%を超える濃度のゲルマニウムと1E20cm−3を超える濃度のボロンを含有する方法。
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