CN105449119B - 发光装置及其制造方法 - Google Patents
发光装置及其制造方法 Download PDFInfo
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- CN105449119B CN105449119B CN201610008810.0A CN201610008810A CN105449119B CN 105449119 B CN105449119 B CN 105449119B CN 201610008810 A CN201610008810 A CN 201610008810A CN 105449119 B CN105449119 B CN 105449119B
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Classifications
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
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- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
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- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H10K50/00—Organic light-emitting devices
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-204972 | 2009-09-04 | ||
| JP2009204972 | 2009-09-04 | ||
| CN201080040387.3A CN102498570B (zh) | 2009-09-04 | 2010-08-06 | 发光装置及其制造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080040387.3A Division CN102498570B (zh) | 2009-09-04 | 2010-08-06 | 发光装置及其制造方法 |
Publications (2)
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| CN105449119A CN105449119A (zh) | 2016-03-30 |
| CN105449119B true CN105449119B (zh) | 2018-03-23 |
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| CN201610008810.0A Active CN105449119B (zh) | 2009-09-04 | 2010-08-06 | 发光装置及其制造方法 |
| CN201080040387.3A Expired - Fee Related CN102498570B (zh) | 2009-09-04 | 2010-08-06 | 发光装置及其制造方法 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201080040387.3A Expired - Fee Related CN102498570B (zh) | 2009-09-04 | 2010-08-06 | 发光装置及其制造方法 |
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| JP (11) | JP5292372B2 (enExample) |
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| CN (2) | CN105449119B (enExample) |
| TW (7) | TWI562246B (enExample) |
| WO (1) | WO2011027661A1 (enExample) |
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| KR101592013B1 (ko) * | 2008-10-13 | 2016-02-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2011027701A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| WO2011027676A1 (en) | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101988341B1 (ko) | 2009-09-04 | 2019-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
| KR101801956B1 (ko) * | 2009-09-16 | 2017-11-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 이의 제조 방법 |
| CN102576737B (zh) | 2009-10-09 | 2015-10-21 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| WO2011043164A1 (en) | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| WO2011052366A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Voltage regulator circuit |
| KR101299255B1 (ko) * | 2009-11-06 | 2013-08-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102598279B (zh) * | 2009-11-06 | 2015-10-07 | 株式会社半导体能源研究所 | 半导体装置 |
| KR102317763B1 (ko) | 2009-11-06 | 2021-10-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| KR102008769B1 (ko) | 2009-11-27 | 2019-08-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
| CN102648525B (zh) | 2009-12-04 | 2016-05-04 | 株式会社半导体能源研究所 | 显示装置 |
| TWI525377B (zh) | 2010-01-24 | 2016-03-11 | 半導體能源研究所股份有限公司 | 顯示裝置 |
| KR101928897B1 (ko) | 2010-08-27 | 2018-12-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치, 반도체 장치 |
| JP2012163651A (ja) * | 2011-02-04 | 2012-08-30 | Sony Corp | 有機el表示装置及び電子機器 |
| TWI654762B (zh) * | 2011-05-05 | 2019-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| FR2975213B1 (fr) | 2011-05-10 | 2013-05-10 | Trixell Sas | Dispositif d'adressage de lignes d'un circuit de commande pour matrice active de detection |
| JP4982620B1 (ja) * | 2011-07-29 | 2012-07-25 | 富士フイルム株式会社 | 電界効果型トランジスタの製造方法、並びに、電界効果型トランジスタ、表示装置、イメージセンサ及びx線センサ |
| JP6099336B2 (ja) | 2011-09-14 | 2017-03-22 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP5832399B2 (ja) | 2011-09-16 | 2015-12-16 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP2013093565A (ja) * | 2011-10-07 | 2013-05-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| WO2013073619A1 (ja) * | 2011-11-18 | 2013-05-23 | シャープ株式会社 | 半導体装置、表示装置、ならびに半導体装置の製造方法 |
| KR101339000B1 (ko) * | 2011-12-14 | 2013-12-09 | 엘지디스플레이 주식회사 | 유기전계발광 표시소자 및 그 제조방법 |
| US9419146B2 (en) | 2012-01-26 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101451403B1 (ko) | 2012-06-26 | 2014-10-23 | 엘지디스플레이 주식회사 | 금속 산화물 반도체를 포함하는 박막 트랜지스터 기판 및 그 제조 방법 |
| KR102078213B1 (ko) | 2012-07-20 | 2020-02-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| JP2014045175A (ja) | 2012-08-02 | 2014-03-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| WO2014054530A1 (ja) * | 2012-10-04 | 2014-04-10 | 東レ株式会社 | 導電パターンの製造方法 |
| KR20140088810A (ko) * | 2013-01-03 | 2014-07-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| CN103151368A (zh) * | 2013-02-05 | 2013-06-12 | 京东方科技集团股份有限公司 | 一种阵列基板及oled显示装置 |
| CN103309108B (zh) * | 2013-05-30 | 2016-02-10 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| JP6125017B2 (ja) * | 2013-08-07 | 2017-05-10 | シャープ株式会社 | X線イメージセンサー用基板 |
| JP6426402B2 (ja) * | 2013-08-30 | 2018-11-21 | 株式会社半導体エネルギー研究所 | 表示装置 |
| KR102294507B1 (ko) * | 2013-09-06 | 2021-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6570825B2 (ja) | 2013-12-12 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 電子機器 |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9887291B2 (en) * | 2014-03-19 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, or the display module |
| JP6722980B2 (ja) | 2014-05-09 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 表示装置および発光装置、並びに電子機器 |
| US9705004B2 (en) * | 2014-08-01 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10043847B2 (en) * | 2014-08-26 | 2018-08-07 | Gingy Technology Inc. | Image capturing module and electrical apparatus |
| KR102295221B1 (ko) * | 2014-12-26 | 2021-09-01 | 삼성디스플레이 주식회사 | 게이트 구동회로 및 이를 포함하는 표시장치 |
| CN104701350B (zh) * | 2015-03-03 | 2017-03-01 | 京东方科技集团股份有限公司 | 电极及其制作方法、阵列基板及其制作方法 |
| JP2017010000A (ja) | 2015-04-13 | 2017-01-12 | 株式会社半導体エネルギー研究所 | 表示装置 |
| CN113419386A (zh) | 2015-04-13 | 2021-09-21 | 株式会社半导体能源研究所 | 显示面板、数据处理器及显示面板的制造方法 |
| US9666655B2 (en) | 2015-05-05 | 2017-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR102402759B1 (ko) * | 2015-05-29 | 2022-05-31 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 및 이의 제조 방법 |
| US11189736B2 (en) * | 2015-07-24 | 2021-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN105138163B (zh) * | 2015-07-30 | 2018-01-12 | 京东方科技集团股份有限公司 | 一种有机电致发光触控显示面板、其制备方法及显示装置 |
| JP2017096998A (ja) * | 2015-11-18 | 2017-06-01 | 株式会社ジャパンディスプレイ | 表示装置 |
| SG10201701689UA (en) | 2016-03-18 | 2017-10-30 | Semiconductor Energy Lab | Semiconductor device, semiconductor wafer, and electronic device |
| JP6725335B2 (ja) * | 2016-06-20 | 2020-07-15 | 株式会社ジャパンディスプレイ | 半導体装置 |
| KR102620013B1 (ko) * | 2016-07-01 | 2024-01-02 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조방법 |
| US10403204B2 (en) | 2016-07-12 | 2019-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device, display module, electronic device, and method for driving display device |
| CN107622224A (zh) * | 2016-07-17 | 2018-01-23 | 金佶科技股份有限公司 | 指纹识别模块以及指纹识别方法 |
| CN110036433A (zh) * | 2016-09-27 | 2019-07-19 | 伊努鲁有限公司 | 电子器件的无损集成 |
| JP2018106101A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社ジャパンディスプレイ | 表示装置 |
| CN107369716B (zh) * | 2017-07-17 | 2021-02-12 | 京东方科技集团股份有限公司 | 薄膜晶体管及制作方法、显示装置 |
| JP6905421B2 (ja) * | 2017-08-28 | 2021-07-21 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP6957310B2 (ja) * | 2017-10-24 | 2021-11-02 | 東京エレクトロン株式会社 | 半導体装置およびcmosトランジスタ |
| CN108171179A (zh) * | 2017-12-30 | 2018-06-15 | 深圳信炜科技有限公司 | 感光电路、感光装置及电子设备 |
| CN108224148B (zh) * | 2018-01-04 | 2023-04-18 | 京东方科技集团股份有限公司 | 一种oled照明面板及其驱动方法,照明装置 |
| CN108215513B (zh) * | 2018-02-05 | 2019-06-21 | 杭州旗捷科技有限公司 | 可变阈值的反馈电路、耗材芯片、耗材 |
| TWI662353B (zh) * | 2018-07-13 | 2019-06-11 | 松翰科技股份有限公司 | 光學影像感測模組 |
| CN115509041A (zh) * | 2018-11-26 | 2022-12-23 | 群创光电股份有限公司 | 电子装置 |
| US12035061B2 (en) * | 2019-01-29 | 2024-07-09 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
| US11005495B1 (en) * | 2019-04-11 | 2021-05-11 | Senseeker Engineering, Inc. | Charge transfer circuit for compact modulators |
| WO2020229911A1 (ja) | 2019-05-10 | 2020-11-19 | 株式会社半導体エネルギー研究所 | 表示装置および電子機器 |
| KR20210004795A (ko) * | 2019-07-04 | 2021-01-13 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
| KR102814989B1 (ko) * | 2019-07-19 | 2025-05-30 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN114175261A (zh) * | 2019-07-25 | 2022-03-11 | 日亚化学工业株式会社 | 图像显示装置的制造方法以及图像显示装置 |
| CN111244289B (zh) * | 2020-01-15 | 2022-09-30 | 重庆文理学院 | 一种ZnO薄膜为界面层的有机光伏器件的制备方法 |
| KR102356658B1 (ko) | 2020-03-31 | 2022-01-26 | 포항공과대학교 산학협력단 | 3차원 회로 프린팅이 가능한 연신성 전극회로, 그를 이용한 스트레인 센서 및 그의 제조방법 |
| JP2021192406A (ja) * | 2020-06-05 | 2021-12-16 | シャープ株式会社 | アクティブマトリクス基板およびその製造方法 |
| CN112530978B (zh) * | 2020-12-01 | 2024-02-13 | 京东方科技集团股份有限公司 | 开关器件结构及其制备方法、薄膜晶体管膜层、显示面板 |
| KR20220080801A (ko) * | 2020-12-07 | 2022-06-15 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조 방법 |
| US12402496B2 (en) | 2020-12-24 | 2025-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US11699391B2 (en) | 2021-05-13 | 2023-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display apparatus, and electronic device |
| US12074221B2 (en) * | 2021-07-26 | 2024-08-27 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate and manufacturing method thereof, display panel |
| CN116613136A (zh) * | 2022-02-09 | 2023-08-18 | 群创光电股份有限公司 | 电子装置 |
| JP2024122413A (ja) * | 2023-02-28 | 2024-09-09 | キオクシア株式会社 | 支持基板、支持基板の製造方法、及び半導体記憶装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770247A (zh) * | 2004-09-21 | 2006-05-10 | 卡西欧计算机株式会社 | 驱动电路及显示装置 |
| CN1914552A (zh) * | 2004-01-26 | 2007-02-14 | 株式会社半导体能源研究所 | 电器、半导体装置及其制造方法 |
Family Cites Families (273)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| US4615102A (en) | 1984-05-01 | 1986-10-07 | Fujitsu Limited | Method of producing enhancement mode and depletion mode FETs |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63301565A (ja) | 1987-05-30 | 1988-12-08 | Matsushita Electric Ind Co Ltd | 薄膜集積回路 |
| JPH02156676A (ja) | 1988-12-09 | 1990-06-15 | Fuji Xerox Co Ltd | 薄膜半導体装置 |
| JP2585118B2 (ja) | 1990-02-06 | 1997-02-26 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| EP0445535B1 (en) | 1990-02-06 | 1995-02-01 | Sel Semiconductor Energy Laboratory Co., Ltd. | Method of forming an oxide film |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JP2572003B2 (ja) | 1992-03-30 | 1997-01-16 | 三星電子株式会社 | 三次元マルチチャンネル構造を有する薄膜トランジスタの製造方法 |
| US6624477B1 (en) | 1992-10-09 | 2003-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US5576556A (en) | 1993-08-20 | 1996-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Thin film semiconductor device with gate metal oxide and sidewall spacer |
| TW232751B (en) | 1992-10-09 | 1994-10-21 | Semiconductor Energy Res Co Ltd | Semiconductor device and method for forming the same |
| JPH06202156A (ja) * | 1992-12-28 | 1994-07-22 | Sharp Corp | ドライバーモノリシック駆動素子 |
| JP3479375B2 (ja) * | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| EP0820644B1 (en) | 1995-08-03 | 2005-08-24 | Koninklijke Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| GB9520888D0 (en) | 1995-10-12 | 1995-12-13 | Philips Electronics Nv | Electronic devices comprising thin-film circuitry |
| US5847410A (en) | 1995-11-24 | 1998-12-08 | Semiconductor Energy Laboratory Co. | Semiconductor electro-optical device |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP3264364B2 (ja) * | 1997-01-21 | 2002-03-11 | シャープ株式会社 | 液晶表示装置の製造方法 |
| JPH10290012A (ja) | 1997-04-14 | 1998-10-27 | Nec Corp | アクティブマトリクス型液晶表示装置およびその製造方法 |
| JP2001051292A (ja) | 1998-06-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体表示装置 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| EP0979751B1 (de) * | 1998-08-12 | 2005-11-09 | C. Rob. Hammerstein GmbH & Co.KG | Sitzträgergestell eines Fahrzeugsitzes mit einem linken und einem rechten vorderen Stellarm |
| JP2000111948A (ja) | 1998-10-05 | 2000-04-21 | Sony Corp | 電気光学装置の製造方法及び電気光学装置用の駆動基板の製造方法 |
| US6492190B2 (en) | 1998-10-05 | 2002-12-10 | Sony Corporation | Method of producing electrooptical device and method of producing driving substrate for driving electrooptical device |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP3107075B2 (ja) | 1998-12-14 | 2000-11-06 | 日本電気株式会社 | 液晶表示装置 |
| EP1049167A3 (en) | 1999-04-30 | 2007-10-24 | Sel Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4115654B2 (ja) | 1999-04-30 | 2008-07-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4552239B2 (ja) * | 1999-05-12 | 2010-09-29 | ソニー株式会社 | 表示用薄膜半導体素子及び表示装置 |
| TWI232595B (en) | 1999-06-04 | 2005-05-11 | Semiconductor Energy Lab | Electroluminescence display device and electronic device |
| JP4730994B2 (ja) | 1999-06-04 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 電気光学装置及びその作製方法並びに電子装置 |
| JP2001053283A (ja) | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| JP2001284592A (ja) | 2000-03-29 | 2001-10-12 | Sony Corp | 薄膜半導体装置及びその駆動方法 |
| US7633471B2 (en) | 2000-05-12 | 2009-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric appliance |
| US6828587B2 (en) | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| US6549071B1 (en) | 2000-09-12 | 2003-04-15 | Silicon Laboratories, Inc. | Power amplifier circuitry and method using an inductance coupled to power amplifier switching devices |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP3716755B2 (ja) | 2001-04-05 | 2005-11-16 | 株式会社日立製作所 | アクティブマトリクス型表示装置 |
| JP2003029293A (ja) | 2001-07-13 | 2003-01-29 | Minolta Co Ltd | 積層型表示装置及びその製造方法 |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP4798907B2 (ja) * | 2001-09-26 | 2011-10-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| WO2003040441A1 (fr) | 2001-11-05 | 2003-05-15 | Japan Science And Technology Agency | Film mince monocristallin homologue a super-reseau naturel, procede de preparation et dispositif dans lequel est utilise ledit film mince monocristallin |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| JP2003271075A (ja) * | 2002-03-13 | 2003-09-25 | Toshiba Corp | 表示装置 |
| CN1445821A (zh) | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
| JP4069648B2 (ja) | 2002-03-15 | 2008-04-02 | カシオ計算機株式会社 | 半導体装置および表示駆動装置 |
| JP2003273361A (ja) * | 2002-03-15 | 2003-09-26 | Sharp Corp | 半導体装置およびその製造方法 |
| JP2003280034A (ja) | 2002-03-20 | 2003-10-02 | Sharp Corp | Tft基板およびそれを用いる液晶表示装置 |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| JP2003309266A (ja) | 2002-04-17 | 2003-10-31 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ素子の製造方法 |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| JP4723787B2 (ja) * | 2002-07-09 | 2011-07-13 | シャープ株式会社 | 電界効果型トランジスタ、その製造方法及び画像表示装置 |
| JP4651922B2 (ja) | 2002-08-09 | 2011-03-16 | 株式会社半導体エネルギー研究所 | El表示装置 |
| US7081704B2 (en) | 2002-08-09 | 2006-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR100870522B1 (ko) | 2002-09-17 | 2008-11-26 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| US6788567B2 (en) | 2002-12-02 | 2004-09-07 | Rohm Co., Ltd. | Data holding device and data holding method |
| JP4251874B2 (ja) | 2003-01-21 | 2009-04-08 | 三洋電機株式会社 | エレクトロルミネッセンス表示装置 |
| JP2004247533A (ja) * | 2003-02-14 | 2004-09-02 | Casio Comput Co Ltd | アクティブマトリックスパネル |
| JP4314843B2 (ja) | 2003-03-05 | 2009-08-19 | カシオ計算機株式会社 | 画像読取装置及び個人認証システム |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JP2004281087A (ja) * | 2003-03-12 | 2004-10-07 | Nippon Hoso Kyokai <Nhk> | 有機elデバイスおよび有機elディスプレイ |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| KR20050000129A (ko) * | 2003-06-23 | 2005-01-03 | 삼성전자주식회사 | 액정 표시 장치 |
| US8552933B2 (en) | 2003-06-30 | 2013-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and driving method of the same |
| JP4675584B2 (ja) | 2003-06-30 | 2011-04-27 | 株式会社半導体エネルギー研究所 | 発光装置の駆動方法 |
| TWI368774B (en) | 2003-07-14 | 2012-07-21 | Semiconductor Energy Lab | Light-emitting device |
| JP4906106B2 (ja) * | 2003-07-14 | 2012-03-28 | 株式会社半導体エネルギー研究所 | 発光装置 |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| JP2005054862A (ja) * | 2003-08-01 | 2005-03-03 | Smc Corp | アクチュエータ |
| KR20050029426A (ko) * | 2003-09-22 | 2005-03-28 | 삼성에스디아이 주식회사 | 칼라필터층 또는 색변환층을 갖는 풀칼라 유기전계발광소자 |
| US7230374B2 (en) | 2003-09-22 | 2007-06-12 | Samsung Sdi Co., Ltd. | Full color organic light-emitting device having color modulation layer |
| US20050093435A1 (en) | 2003-09-22 | 2005-05-05 | Suh Min-Chul | Full color organic light-emtting device having color modulation layer |
| US20080081105A1 (en) | 2003-09-22 | 2008-04-03 | Samsung Sdi Co., Ltd. | Method of fabricating full color organic light-emtting device having color modulation layer using liti method |
| JP4683898B2 (ja) * | 2003-10-21 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4877866B2 (ja) | 2003-10-28 | 2012-02-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7439086B2 (en) | 2003-11-14 | 2008-10-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing liquid crystal display device |
| JP4831954B2 (ja) | 2003-11-14 | 2011-12-07 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US7859187B2 (en) | 2003-11-14 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for fabricating the same |
| KR101019045B1 (ko) | 2003-11-25 | 2011-03-04 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 그 제조방법 |
| KR20110091797A (ko) | 2003-11-28 | 2011-08-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
| KR101090245B1 (ko) * | 2003-12-10 | 2011-12-06 | 삼성전자주식회사 | 박막 트랜지스터 표시판 |
| WO2005071478A1 (en) | 2004-01-26 | 2005-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Electric appliance, semiconductor device, and method for manufacturing the same |
| US7691685B2 (en) | 2004-01-26 | 2010-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| CN1998087B (zh) | 2004-03-12 | 2014-12-31 | 独立行政法人科学技术振兴机构 | 非晶形氧化物和薄膜晶体管 |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7642642B2 (en) * | 2004-03-23 | 2010-01-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Microcap wafer bonding apparatus |
| JP4628004B2 (ja) * | 2004-03-26 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| US7129634B2 (en) * | 2004-04-07 | 2006-10-31 | Eastman Kodak Company | Color OLED with added color gamut pixels |
| US8581805B2 (en) * | 2004-05-21 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device and driving method thereof |
| JP5089027B2 (ja) | 2004-05-28 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7491590B2 (en) | 2004-05-28 | 2009-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor in display device |
| KR101098343B1 (ko) * | 2004-06-03 | 2011-12-26 | 삼성전자주식회사 | 전계발광표시장치, 색필터 패널 및 이의 제조 방법 |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP4286738B2 (ja) | 2004-07-14 | 2009-07-01 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型電界効果半導体装置の作製方法 |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| KR101217659B1 (ko) | 2004-09-03 | 2013-01-02 | 스탠리 일렉트릭 컴퍼니, 리미티드 | El소자 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US8350466B2 (en) * | 2004-09-17 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| CA2585190A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7868326B2 (en) | 2004-11-10 | 2011-01-11 | Canon Kabushiki Kaisha | Field effect transistor |
| KR20070085879A (ko) | 2004-11-10 | 2007-08-27 | 캐논 가부시끼가이샤 | 발광 장치 |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| US8003449B2 (en) | 2004-11-26 | 2011-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device having a reverse staggered thin film transistor |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| JP2006202156A (ja) * | 2005-01-21 | 2006-08-03 | Seiko Epson Corp | メモリーカードコネクタ |
| TWI472037B (zh) | 2005-01-28 | 2015-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US7888702B2 (en) | 2005-04-15 | 2011-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the display device |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| KR20060125066A (ko) | 2005-06-01 | 2006-12-06 | 삼성전자주식회사 | 개구율이 향상된 어레이 기판 및 이의 제조방법 |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| TWI282249B (en) | 2005-07-05 | 2007-06-01 | Univision Technology Inc | Color OLED device and fabrication method thereof |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| KR100729043B1 (ko) | 2005-09-14 | 2007-06-14 | 삼성에스디아이 주식회사 | 투명 박막 트랜지스터 및 그의 제조방법 |
| JP5006598B2 (ja) | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | 電界効果型トランジスタ |
| EP1998373A3 (en) | 2005-09-29 | 2012-10-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| JP5129473B2 (ja) | 2005-11-15 | 2013-01-30 | 富士フイルム株式会社 | 放射線検出器 |
| US7745798B2 (en) | 2005-11-15 | 2010-06-29 | Fujifilm Corporation | Dual-phosphor flat panel radiation detector |
| WO2007058329A1 (en) | 2005-11-15 | 2007-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP5250929B2 (ja) | 2005-11-30 | 2013-07-31 | 凸版印刷株式会社 | トランジスタおよびその製造方法 |
| EP1793266B1 (en) * | 2005-12-05 | 2017-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Transflective Liquid Crystal Display with a Horizontal Electric Field Configuration |
| KR100732849B1 (ko) | 2005-12-21 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기 발광 표시장치 |
| KR100771607B1 (ko) | 2005-12-21 | 2007-10-31 | 엘지전자 주식회사 | 유기 el 디스플레이 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) * | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP5110803B2 (ja) | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| KR101230316B1 (ko) * | 2006-03-21 | 2013-02-06 | 삼성디스플레이 주식회사 | 표시장치와 그 제조방법 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| JP2007286150A (ja) | 2006-04-13 | 2007-11-01 | Idemitsu Kosan Co Ltd | 電気光学装置、並びに、電流制御用tft基板及びその製造方法 |
| JP2007293073A (ja) * | 2006-04-26 | 2007-11-08 | Epson Imaging Devices Corp | 電気光学装置の製造方法、電気光学装置および電子機器 |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| JP2006293385A (ja) * | 2006-05-24 | 2006-10-26 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| JP4494369B2 (ja) * | 2006-05-24 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| KR20070114533A (ko) | 2006-05-29 | 2007-12-04 | 삼성전자주식회사 | 반투과 표시 장치 및 그 제조 방법 |
| EP2025004A1 (en) * | 2006-06-02 | 2009-02-18 | Kochi Industrial Promotion Center | Semiconductor device including an oxide semiconductor thin film layer of zinc oxide and manufacturing method thereof |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| KR101217555B1 (ko) | 2006-06-28 | 2013-01-02 | 삼성전자주식회사 | 접합 전계 효과 박막 트랜지스터 |
| KR101257811B1 (ko) | 2006-06-30 | 2013-04-29 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이 기판과 그 제조방법 |
| US20080029656A1 (en) * | 2006-07-20 | 2008-02-07 | John Feehan | Guide for cords, cables and wires |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP5216276B2 (ja) * | 2006-08-30 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7651896B2 (en) | 2006-08-30 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4748456B2 (ja) * | 2006-09-26 | 2011-08-17 | カシオ計算機株式会社 | 画素駆動回路及び画像表示装置 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| KR20080028571A (ko) | 2006-09-27 | 2008-04-01 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR100790761B1 (ko) | 2006-09-29 | 2008-01-03 | 한국전자통신연구원 | 인버터 |
| JP5468196B2 (ja) | 2006-09-29 | 2014-04-09 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置及び液晶表示装置 |
| TWI850180B (zh) | 2006-09-29 | 2024-07-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| KR20080045886A (ko) * | 2006-11-21 | 2008-05-26 | 삼성전자주식회사 | 유기막 증착용 마스크 및 그 제조방법, 이를 포함하는유기전계 발광표시장치의 제조방법 |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR20080054597A (ko) | 2006-12-13 | 2008-06-18 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR20080055058A (ko) * | 2006-12-14 | 2008-06-19 | 삼성전자주식회사 | 표시 기판 및 그 제조 방법 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| TWI396464B (zh) | 2007-01-22 | 2013-05-11 | Innolux Corp | 有機電致發光顯示裝置及其製作方法 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR101410926B1 (ko) | 2007-02-16 | 2014-06-24 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| JP5196870B2 (ja) | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
| US8436349B2 (en) | 2007-02-20 | 2013-05-07 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
| WO2008105347A1 (en) | 2007-02-20 | 2008-09-04 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
| JP2008203761A (ja) * | 2007-02-22 | 2008-09-04 | Hitachi Displays Ltd | 表示装置 |
| KR100858088B1 (ko) | 2007-02-28 | 2008-09-10 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| JP5121254B2 (ja) | 2007-02-28 | 2013-01-16 | キヤノン株式会社 | 薄膜トランジスタおよび表示装置 |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| JP2008276212A (ja) | 2007-04-05 | 2008-11-13 | Fujifilm Corp | 有機電界発光表示装置 |
| JP5197058B2 (ja) | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
| WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| JP5294651B2 (ja) | 2007-05-18 | 2013-09-18 | キヤノン株式会社 | インバータの作製方法及びインバータ |
| KR101345376B1 (ko) * | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| KR101092483B1 (ko) * | 2007-05-31 | 2011-12-13 | 캐논 가부시끼가이샤 | 산화물 반도체를 사용한 박막트랜지스터의 제조 방법 |
| US8017422B2 (en) | 2007-06-19 | 2011-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming pattern, method for manufacturing light emitting device, and light emitting device |
| JP2009010052A (ja) | 2007-06-26 | 2009-01-15 | Kobe Steel Ltd | 表示装置の製造方法 |
| US8354674B2 (en) | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| US7897971B2 (en) | 2007-07-26 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101399608B1 (ko) | 2007-07-27 | 2014-05-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작방법 |
| JP5331407B2 (ja) | 2007-08-17 | 2013-10-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2009049223A (ja) * | 2007-08-21 | 2009-03-05 | Seiko Epson Corp | 発光装置 |
| KR101484297B1 (ko) | 2007-08-31 | 2015-01-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 표시장치의 제작방법 |
| JP5395384B2 (ja) | 2007-09-07 | 2014-01-22 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| KR101432110B1 (ko) * | 2007-09-11 | 2014-08-21 | 삼성디스플레이 주식회사 | 유기 발광 장치 및 그 제조 방법 |
| JP5354999B2 (ja) | 2007-09-26 | 2013-11-27 | キヤノン株式会社 | 電界効果型トランジスタの製造方法 |
| JP4759598B2 (ja) | 2007-09-28 | 2011-08-31 | キヤノン株式会社 | 薄膜トランジスタ、その製造方法及びそれを用いた表示装置 |
| JP2009103732A (ja) * | 2007-10-19 | 2009-05-14 | Sony Corp | 表示装置およびその製造方法 |
| JP2009099887A (ja) * | 2007-10-19 | 2009-05-07 | Hitachi Displays Ltd | 表示装置 |
| JP2009109883A (ja) * | 2007-10-31 | 2009-05-21 | Canon Inc | 電場発光表示装置 |
| JP5377940B2 (ja) | 2007-12-03 | 2013-12-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5215158B2 (ja) | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
| KR101412761B1 (ko) | 2008-01-18 | 2014-07-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| JP5540517B2 (ja) | 2008-02-22 | 2014-07-02 | 凸版印刷株式会社 | 画像表示装置 |
| KR20090105261A (ko) * | 2008-04-02 | 2009-10-07 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP2009265271A (ja) | 2008-04-23 | 2009-11-12 | Nippon Shokubai Co Ltd | 電気光学表示装置 |
| US9041202B2 (en) | 2008-05-16 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
| KR101499235B1 (ko) * | 2008-06-23 | 2015-03-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| TWI875442B (zh) | 2008-07-31 | 2025-03-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| TW201009954A (en) * | 2008-08-19 | 2010-03-01 | Chunghwa Picture Tubes Ltd | Thin film transistor, pixel structure and fabrication methods thereof |
| KR101489652B1 (ko) * | 2008-09-02 | 2015-02-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20100030865A (ko) * | 2008-09-11 | 2010-03-19 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| CN103928476A (zh) | 2008-10-03 | 2014-07-16 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
| KR101659925B1 (ko) | 2008-10-03 | 2016-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN102509736B (zh) | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
| KR101579487B1 (ko) * | 2008-10-28 | 2015-12-23 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR101631454B1 (ko) | 2008-10-31 | 2016-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 논리회로 |
| KR101432764B1 (ko) | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| KR101671544B1 (ko) | 2008-11-21 | 2016-11-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 표시 장치 및 전자 기기 |
| TWI402982B (zh) * | 2009-03-02 | 2013-07-21 | Innolux Corp | 影像顯示系統及其製造方法 |
| KR101739154B1 (ko) | 2009-07-17 | 2017-05-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| WO2011007677A1 (en) | 2009-07-17 | 2011-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101929726B1 (ko) | 2009-07-18 | 2018-12-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR101782176B1 (ko) | 2009-07-18 | 2017-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR102181301B1 (ko) | 2009-07-18 | 2020-11-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치 제조 방법 |
| WO2011010542A1 (en) | 2009-07-23 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101988341B1 (ko) * | 2009-09-04 | 2019-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
| KR102000932B1 (ko) * | 2012-12-18 | 2019-07-26 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| US9012900B2 (en) * | 2012-12-26 | 2015-04-21 | Lg Display Co., Ltd. | Organic light emitting diode display device and method of fabricating the same |
| KR102139355B1 (ko) * | 2013-12-31 | 2020-07-29 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
| KR102471668B1 (ko) * | 2014-11-10 | 2022-11-29 | 엘지디스플레이 주식회사 | 유기발광 다이오드 표시장치 및 그 제조방법 |
| KR102802821B1 (ko) * | 2016-11-25 | 2025-04-30 | 엘지디스플레이 주식회사 | 표시장치 |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914552A (zh) * | 2004-01-26 | 2007-02-14 | 株式会社半导体能源研究所 | 电器、半导体装置及其制造方法 |
| CN1770247A (zh) * | 2004-09-21 | 2006-05-10 | 卡西欧计算机株式会社 | 驱动电路及显示装置 |
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