JP5292372B2 - 発光装置の作製方法 - Google Patents
発光装置の作製方法 Download PDFInfo
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- JP5292372B2 JP5292372B2 JP2010196573A JP2010196573A JP5292372B2 JP 5292372 B2 JP5292372 B2 JP 5292372B2 JP 2010196573 A JP2010196573 A JP 2010196573A JP 2010196573 A JP2010196573 A JP 2010196573A JP 5292372 B2 JP5292372 B2 JP 5292372B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/402—Amorphous materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010196573A JP5292372B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009204972 | 2009-09-04 | ||
| JP2009204972 | 2009-09-04 | ||
| JP2010196573A JP5292372B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013121444A Division JP5635648B2 (ja) | 2009-09-04 | 2013-06-10 | 発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011077512A JP2011077512A (ja) | 2011-04-14 |
| JP2011077512A5 JP2011077512A5 (ja) | 2012-09-20 |
| JP5292372B2 true JP5292372B2 (ja) | 2013-09-18 |
Family
ID=43649203
Family Applications (11)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010196573A Active JP5292372B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置の作製方法 |
| JP2013121444A Active JP5635648B2 (ja) | 2009-09-04 | 2013-06-10 | 発光装置 |
| JP2013231160A Active JP5478768B2 (ja) | 2009-09-04 | 2013-11-07 | 半導体装置 |
| JP2014211592A Active JP5933886B2 (ja) | 2009-09-04 | 2014-10-16 | 半導体装置 |
| JP2016092845A Active JP6243962B2 (ja) | 2009-09-04 | 2016-05-03 | 半導体装置 |
| JP2017217472A Active JP6518310B2 (ja) | 2009-09-04 | 2017-11-10 | 半導体装置 |
| JP2019080000A Active JP6619900B2 (ja) | 2009-09-04 | 2019-04-19 | 半導体装置 |
| JP2019206666A Active JP6905029B2 (ja) | 2009-09-04 | 2019-11-15 | 半導体装置 |
| JP2021104659A Active JP7201749B2 (ja) | 2009-09-04 | 2021-06-24 | 半導体装置 |
| JP2022205119A Withdrawn JP2023033317A (ja) | 2009-09-04 | 2022-12-22 | 発光装置 |
| JP2024212206A Pending JP2025028105A (ja) | 2009-09-04 | 2024-12-05 | 表示装置 |
Family Applications After (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013121444A Active JP5635648B2 (ja) | 2009-09-04 | 2013-06-10 | 発光装置 |
| JP2013231160A Active JP5478768B2 (ja) | 2009-09-04 | 2013-11-07 | 半導体装置 |
| JP2014211592A Active JP5933886B2 (ja) | 2009-09-04 | 2014-10-16 | 半導体装置 |
| JP2016092845A Active JP6243962B2 (ja) | 2009-09-04 | 2016-05-03 | 半導体装置 |
| JP2017217472A Active JP6518310B2 (ja) | 2009-09-04 | 2017-11-10 | 半導体装置 |
| JP2019080000A Active JP6619900B2 (ja) | 2009-09-04 | 2019-04-19 | 半導体装置 |
| JP2019206666A Active JP6905029B2 (ja) | 2009-09-04 | 2019-11-15 | 半導体装置 |
| JP2021104659A Active JP7201749B2 (ja) | 2009-09-04 | 2021-06-24 | 半導体装置 |
| JP2022205119A Withdrawn JP2023033317A (ja) | 2009-09-04 | 2022-12-22 | 発光装置 |
| JP2024212206A Pending JP2025028105A (ja) | 2009-09-04 | 2024-12-05 | 表示装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (8) | US8502225B2 (enExample) |
| JP (11) | JP5292372B2 (enExample) |
| KR (10) | KR101988341B1 (enExample) |
| CN (2) | CN105449119B (enExample) |
| TW (7) | TWI562246B (enExample) |
| WO (1) | WO2011027661A1 (enExample) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101592013B1 (ko) * | 2008-10-13 | 2016-02-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2011027701A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| WO2011027676A1 (en) | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101988341B1 (ko) | 2009-09-04 | 2019-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
| KR101801956B1 (ko) * | 2009-09-16 | 2017-11-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 이의 제조 방법 |
| CN102576737B (zh) | 2009-10-09 | 2015-10-21 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| WO2011043164A1 (en) | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| WO2011052366A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Voltage regulator circuit |
| KR101299255B1 (ko) * | 2009-11-06 | 2013-08-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102598279B (zh) * | 2009-11-06 | 2015-10-07 | 株式会社半导体能源研究所 | 半导体装置 |
| KR102317763B1 (ko) | 2009-11-06 | 2021-10-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| KR102008769B1 (ko) | 2009-11-27 | 2019-08-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
| CN102648525B (zh) | 2009-12-04 | 2016-05-04 | 株式会社半导体能源研究所 | 显示装置 |
| TWI525377B (zh) | 2010-01-24 | 2016-03-11 | 半導體能源研究所股份有限公司 | 顯示裝置 |
| KR101928897B1 (ko) | 2010-08-27 | 2018-12-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치, 반도체 장치 |
| JP2012163651A (ja) * | 2011-02-04 | 2012-08-30 | Sony Corp | 有機el表示装置及び電子機器 |
| TWI654762B (zh) * | 2011-05-05 | 2019-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| FR2975213B1 (fr) | 2011-05-10 | 2013-05-10 | Trixell Sas | Dispositif d'adressage de lignes d'un circuit de commande pour matrice active de detection |
| JP4982620B1 (ja) * | 2011-07-29 | 2012-07-25 | 富士フイルム株式会社 | 電界効果型トランジスタの製造方法、並びに、電界効果型トランジスタ、表示装置、イメージセンサ及びx線センサ |
| JP6099336B2 (ja) | 2011-09-14 | 2017-03-22 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP5832399B2 (ja) | 2011-09-16 | 2015-12-16 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP2013093565A (ja) * | 2011-10-07 | 2013-05-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| WO2013073619A1 (ja) * | 2011-11-18 | 2013-05-23 | シャープ株式会社 | 半導体装置、表示装置、ならびに半導体装置の製造方法 |
| KR101339000B1 (ko) * | 2011-12-14 | 2013-12-09 | 엘지디스플레이 주식회사 | 유기전계발광 표시소자 및 그 제조방법 |
| US9419146B2 (en) | 2012-01-26 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101451403B1 (ko) | 2012-06-26 | 2014-10-23 | 엘지디스플레이 주식회사 | 금속 산화물 반도체를 포함하는 박막 트랜지스터 기판 및 그 제조 방법 |
| KR102078213B1 (ko) | 2012-07-20 | 2020-02-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| JP2014045175A (ja) | 2012-08-02 | 2014-03-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| WO2014054530A1 (ja) * | 2012-10-04 | 2014-04-10 | 東レ株式会社 | 導電パターンの製造方法 |
| KR20140088810A (ko) * | 2013-01-03 | 2014-07-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| CN103151368A (zh) * | 2013-02-05 | 2013-06-12 | 京东方科技集团股份有限公司 | 一种阵列基板及oled显示装置 |
| CN103309108B (zh) * | 2013-05-30 | 2016-02-10 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| JP6125017B2 (ja) * | 2013-08-07 | 2017-05-10 | シャープ株式会社 | X線イメージセンサー用基板 |
| JP6426402B2 (ja) * | 2013-08-30 | 2018-11-21 | 株式会社半導体エネルギー研究所 | 表示装置 |
| KR102294507B1 (ko) * | 2013-09-06 | 2021-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6570825B2 (ja) | 2013-12-12 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 電子機器 |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9887291B2 (en) * | 2014-03-19 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, or the display module |
| JP6722980B2 (ja) | 2014-05-09 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 表示装置および発光装置、並びに電子機器 |
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