JP2014195112A - 半導体イメージセンサ・モジュール及びその製造方法 - Google Patents
半導体イメージセンサ・モジュール及びその製造方法 Download PDFInfo
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- JP2014195112A JP2014195112A JP2014110598A JP2014110598A JP2014195112A JP 2014195112 A JP2014195112 A JP 2014195112A JP 2014110598 A JP2014110598 A JP 2014110598A JP 2014110598 A JP2014110598 A JP 2014110598A JP 2014195112 A JP2014195112 A JP 2014195112A
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Abstract
【解決手段】本発明の半導体イメージセンサ・モジュールは、光電変換素子とトランジスタで構成する複数の画素が配列されたイメージセンサを備えた第1の半導体チップと、A/D変換器アレイを備えた第2の半導体チップを積層して構成される。好ましくは、さらにメモリ素子アレイを備えた第3の半導体チップを積層して構成される。また、本発明の半導体イメージセンサ・モジュールは、上記イメージセンサを備えた第1の半導体チップと、アナログ型不揮発性メモリアレイを備えた第4の半導体チップを積層して構成される。
【選択図】図1
Description
図54に示すCCDイメージセンサ1は、撮像領域2内に画素となる複数の受光センサ(光電変換素子)3が規則的に例えば2次元マトリックス状に配列されると共に、各受光センサ列に対応して信号電荷を垂直方向へ転送するCCD構造の垂直転送レジスタ4が配置され、さらに各垂直転送レジスタ4に接続されて信号電荷を水平方向へ転送するCCD構造の水平転送レジスタ5が配置され、この水平転送レジスタ5の終段に電荷電圧変化して出力する出力部6が接続されて成る。このCCDイメージセンサ1では、撮像領域2で受光した光を各受光センサ3で信号電荷に変換して蓄積し、この各受光センサ3の信号電荷を読出しゲート部7を介して垂直転送レジスタ4へ読み出して垂直方向へ転送する。また、垂直転送レジスタ4から1ライン毎に水平転送レジスタ5に読み出した信号電荷は、水平方向へ転送して出力部6より電圧信号に変換して撮像信号として出力する。
このCMOSイメージセンサ11では、垂直駆動回路15からの駆動パルスにより画素12の行が選択され、選択され行の画素12の出力が垂直選択線21を通じてカラム部16に送られる。カラム部16ではカラム信号処理回路19が画素12の列に対応して配列されており、1行分の画素12の信号を受けて、その信号にCDS(Correlated Double Sampling:固定パターンノイズ除去の処理)や信号増幅やアナログ/デジタル(AD)変換等の処理が行われる。そして、水平駆動回路17によりカラム信号処理回路19が順番に選択されて、その信号が水平信号線20に導かれ、出力回路18より撮像信号として出力される。
メモリ素子アレイは、メモリ素子アレイ中にパリティチェック用のメモチビットを有する構成とすることができる。メモリ素子アレイは、メモリ素子アレイ中に欠陥救済用のスペアビットを有する構成とすることができる。
フォトダイオードPDは、n+電荷蓄積領域68a及びn型半導体領域68bと、基板の表裏両面に形成した暗電流を抑制するためのアキュミュレーション層となるp+半導体領域69とにより形成される。そして、基板裏面側にパシベーション膜71を介してカラーフィルタ72が形成され、さらにカラーフィルタ72上に各画素に対応したオンチップマイクロレンズ73が形成される。この撮像領域59は、いわゆるフォトダイオードPD・センサ回路領域となる。
メモリ素子としては、例えば、DRAM,SRAMに代表される揮発性メモリ、フローティングゲート型の不揮発性メモリ、MONOS型の不揮発性メモリ等を用いることができる。
図8に簡単な素子の特性評価回路を示す。図9にパルス印加図及び図10に電圧電流図を示す。
このRRAMすなわち抵抗変化型多値メモリ素子は、図7に示すように、シリコン基板172に素子分離領域173が形成され、素子分離領域173で区画された基板172に第1、第2及び第3のソース/ドレイン領域174,175及び176が形成される。第1及び第2のソース/ドレイン領域174及び175と絶縁膜を介して形成されたゲート電極(いわゆるワード線)177とにより第1のMOSトランジスタTr1が形成される。また、第2及び第3のソース/ドレイン領域175及び176と絶縁膜を介して形成されたゲート電極(いわゆるワード線)178とにより第2のMOSトランジスタTr2が形成される。第2のソース/ドレイン領域175には層間絶縁膜を貫通する導電プラグ179を介してセンス線181が接続される。一方、第1及び第3のソース/ドレイン領域174及び176に、それぞれ導電プラグ179を介して抵抗変化型多値メモリ素子182及び183が接続される。抵抗変化型多値メモリ素子182及び183の他端はビット線180が接続される。メモリ素子182及び183は、例えばSrZrO3:Cr系材料を用いることができる。メモリ材料はこの他にPCMO(Pr0.7Ca0.3MnO3)、カルコゲナイドにCu,やAgを添加した材料などが有る。このメモリ材料184の上下にPt電極185,186が形成されてメモリ素子182,183が形成される。1つのメモリ素子と1つのMOSトランジスタで1ビットが構成される。図7ではセンス線を共通とした2ビット分のメモリ素子が構成される。図8に単一のメモリ素子の回路を示す。
メモリ素子に図9のようにパルス電圧を印加する。スイッチング電圧閾値は材料、膜厚によって変わる。図9で閾値電圧を+−0.7Vとする。実際には多くの場合対象でないがここでは"0"書き込み,"1"書き込みの閾値電圧の絶対値は等しいとして説明する。パルス電圧を閾値以上に上げると抵抗値が変化する(4→5、10→11:(図10参照))。実際の読み出し動作は閾値より低い電圧を印加して流れる電流から"0","1"を判定する。多くの場合、"0"の抵抗値と"1"の抵抗値の間の中間抵抗を作り、この抵抗とメモリの抵抗を比較して"0"、"1"を判定する。図11にメモリアレイの結線図を示す。図12で”0”書き込み動作の説明図を示す。"1"(低抵抗)のビットに"0"(高抵抗)を書き込む場合、選択セルのワード線をオンにしビット線に、メモリ素子に閾値電圧以上の電圧が加わるようにパルス電圧を加え"0"書き込みを行う。
この第2の半導体チップ53のパッド82に導電性のマイクロバンプ83を設け、このマイクロバンプ83を介してフェースダウンで、第2の半導体チップ53のパッド82と第1の半導体チップ52の表面側のパッド81とを電気的に接続する。
また、図22の第3実施の形態に係る半導体イメージセンサ・モジュール100も、図25Bの工程でアナログ型の不揮発性メモリアレイを形成した第4の半導体チップ55のパッドにマイクロバンプを設け、フェースダウンで第4の半導体イメージセンサ・モジュール55を第1の半導体チップ52に接続することにより、製造することができる。
この等価回路は、4つの画素の4つの受光部(フォトダイオードPD)210に対応した別々の転送トランジスタ212を備え、これらの転送トランジスタ212を共通のフローティングディフュージョン(FD)部に接続し、それ以降の1つの増幅トランジスタ214、及び、1つのリセットトランジスタ220等を共用するような構成となっている。信号電荷は増幅トランジスタ214を介して、信号出力線へと接続される。増幅トランジスタ214と信号出力線との間には転送トランジスタを設けて、信号出力線への出力をスイッチングすることもできる。
図40に示すように、本実施形態に係るCMOSイメージセンサ310は、光電変換素子を含む単位画素311が行列状(マトリックス状)に多数2次元配置されてなる画素アレイ部312に加えて、行又は単位画素走査回路313、カラム処理部314、参照電圧供給部315、列又は単位画素走査回路316、水平出力線317およびタイミング制御回路318を有する構成となっている。
一方、周辺回路部が形成された信号処理チップ402は、例えばバンプを介してフリップチップでインタポーザ403上に実装されている。
このような構成の半導体イメージセンサ・モジュール400が、インタポーザ403ごと他の実装基板に実装され、例えばワイヤボンディング442などにより電気的に接続されて用いられる。例えば、インタポーザ403上には上記センサチップ(CMOS固体撮像素子)401aと信号処理チップ402を接続して1チップ化した機能を評価する電極PADが形成されている。
Claims (13)
- 複数の画素が規則的に配列され、前記各画素が光電変換素子とトランジスタで構成されたイメージセンサを備えた第1の半導体チップと、
複数のアナログ/デジタル変換器からなるアナログ/デジタル変換器アレイを備えた第2の半導体チップとが積層されて成る
ことを特徴とする半導体イメージセンサ・モジュール。 - 少なくともデコーダとセンスアンプを備えたメモリ素子アレイを備えた第3の半導体チップが、さらに積層されて成る
ことを特徴とする請求の範囲第1項記載の半導体イメージセンサ・モジュール。 - 複数の光電変換素子と複数のメモリ素子が、1つのアナログ/デジタル変換器を共有するように、
前記第1及び第2の半導体チップが前記第3の半導体チップに対して近接して配置されて成る
ことを特徴とする請求の範囲第2項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子が揮発性メモリである
ことを特徴とする請求の範囲第3項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子がフローティングゲート型の不揮発性メモリである
ことを特徴とする請求の範囲第3項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子がMONOS型の不揮発性メモリである
ことを特徴とする請求の範囲第3項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子が多値をとる不揮発性メモリである
ことを特徴とする請求の範囲第3項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子アレイ中にパリティチェック用のメモリビットを有する
ことを特徴とする請求の範囲第2項記載の半導体イメージセンサ・モジュール。 - 前記メモリ素子アレイ中に欠陥救済用のスペアビットを有する
ことを特徴とする請求の範囲第2項記載の半導体イメージセンサ・モジュール。 - 複数の画素が規則的に配列され、前記各画素が光電変換素子とトランジスタで構成されたイメージセンサを備えた第1の半導体チップと、
複数のアナログ型不揮発性メモリからなるアナログ型不揮発性メモリアレイを備えた第4の半導体チップとが積層されて成り、
前記アナログ型不揮発性メモリにより、蓄積電荷量に応じた情報量を記憶させるようにして成る
ことを特徴とする半導体イメージセンサ・モジュール。 - 各画素が光電変換素子とトランジスタで構成された複数の画素を2次元状に規則的に配列したイメージセンサを備えた第1の半導体チップを形成する工程と、
複数のアナログ/デジタル変換器からなるアナログ/デジタル変換器アレイを備えた第2の半導体チップを形成する工程と、
前記第1の半導体チップと前記第2の半導体チップとを積層して前記イメージセンサの画素と前記アナログ/デジタル変換器をフェースダウンでバンプで接合またはLSIチップ面に対して垂直にウェーハを貫通するスルーホールで接続する工程とを有する
ことを特徴とする半導体イメージセンサ・モジュールの製造方法。 - 少なくともデコーダとセンスアンプを備えたメモリ素子アレイを有する第3の半導体チップを形成する工程を有し、
前記第1の半導体チップと前記第2の半導体チップと前記第3の半導体チップとを積層し、前記イメージセンサの画素を前記アナログ/デジタル変換器を通じて前記メモリにウェーハ面に垂直にウェーハを貫通するスルーホールで接続する工程を有する
ことを特徴とする請求の範囲第11項記載の半導体イメージセンサ・モジュールの製造方法。 - 各画素が光電変換素子とトランジスタで構成された複数の画素を2次元状に規則的に配列したイメージセンサを備えた第1の半導体チップを形成する工程と、
複数のアナログ型不揮発性メモリからなるアナログ不揮発性メモリアレイを備えた第4の半導体チップを形成する工程と、
前記第1の半導体チップと前記第4の半導体チップとを積層して前記イメージセンサの画素と前記アナログ型不揮発性メモリを接続する工程とを有する
ことを特徴とする半導体イメージセンサ・モジュールの製造方法。
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US20160255296A1 (en) | 2016-09-01 |
US20100276572A1 (en) | 2010-11-04 |
TW201101476A (en) | 2011-01-01 |
US10594972B2 (en) | 2020-03-17 |
TWI369782B (ja) | 2012-08-01 |
US9955097B2 (en) | 2018-04-24 |
CN101753866A (zh) | 2010-06-23 |
CN101753867A (zh) | 2010-06-23 |
JP2013179313A (ja) | 2013-09-09 |
JPWO2006129762A1 (ja) | 2009-01-08 |
US20170195602A1 (en) | 2017-07-06 |
WO2006129762A1 (ja) | 2006-12-07 |
KR20080019652A (ko) | 2008-03-04 |
US20220124270A1 (en) | 2022-04-21 |
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