US6671223B2
(en)
*
|
1996-12-20 |
2003-12-30 |
Westerngeco, L.L.C. |
Control devices for controlling the position of a marine seismic streamer
|
US6878206B2
(en)
*
|
2001-07-16 |
2005-04-12 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US8110489B2
(en)
*
|
2001-07-25 |
2012-02-07 |
Applied Materials, Inc. |
Process for forming cobalt-containing materials
|
US20080268635A1
(en)
*
|
2001-07-25 |
2008-10-30 |
Sang-Ho Yu |
Process for forming cobalt and cobalt silicide materials in copper contact applications
|
US20030029715A1
(en)
*
|
2001-07-25 |
2003-02-13 |
Applied Materials, Inc. |
An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
|
US20090004850A1
(en)
*
|
2001-07-25 |
2009-01-01 |
Seshadri Ganguli |
Process for forming cobalt and cobalt silicide materials in tungsten contact applications
|
US9051641B2
(en)
|
2001-07-25 |
2015-06-09 |
Applied Materials, Inc. |
Cobalt deposition on barrier surfaces
|
JP2005504885A
(ja)
*
|
2001-07-25 |
2005-02-17 |
アプライド マテリアルズ インコーポレイテッド |
新規なスパッタ堆積方法を使用したバリア形成
|
US7085616B2
(en)
*
|
2001-07-27 |
2006-08-01 |
Applied Materials, Inc. |
Atomic layer deposition apparatus
|
US6936906B2
(en)
*
|
2001-09-26 |
2005-08-30 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
US7780785B2
(en)
*
|
2001-10-26 |
2010-08-24 |
Applied Materials, Inc. |
Gas delivery apparatus for atomic layer deposition
|
US6916398B2
(en)
*
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
WO2003065424A2
(en)
|
2002-01-25 |
2003-08-07 |
Applied Materials, Inc. |
Apparatus for cyclical deposition of thin films
|
US6866746B2
(en)
*
|
2002-01-26 |
2005-03-15 |
Applied Materials, Inc. |
Clamshell and small volume chamber with fixed substrate support
|
US6972267B2
(en)
|
2002-03-04 |
2005-12-06 |
Applied Materials, Inc. |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
|
US7601225B2
(en)
*
|
2002-06-17 |
2009-10-13 |
Asm International N.V. |
System for controlling the sublimation of reactants
|
US7186385B2
(en)
*
|
2002-07-17 |
2007-03-06 |
Applied Materials, Inc. |
Apparatus for providing gas to a processing chamber
|
US7300038B2
(en)
*
|
2002-07-23 |
2007-11-27 |
Advanced Technology Materials, Inc. |
Method and apparatus to help promote contact of gas with vaporized material
|
US6921062B2
(en)
*
|
2002-07-23 |
2005-07-26 |
Advanced Technology Materials, Inc. |
Vaporizer delivery ampoule
|
US6915592B2
(en)
*
|
2002-07-29 |
2005-07-12 |
Applied Materials, Inc. |
Method and apparatus for generating gas to a processing chamber
|
JP4585852B2
(ja)
*
|
2002-07-30 |
2010-11-24 |
エーエスエム アメリカ インコーポレイテッド |
基板処理システム、基板処理方法及び昇華装置
|
US20040065255A1
(en)
*
|
2002-10-02 |
2004-04-08 |
Applied Materials, Inc. |
Cyclical layer deposition system
|
US20040069227A1
(en)
*
|
2002-10-09 |
2004-04-15 |
Applied Materials, Inc. |
Processing chamber configured for uniform gas flow
|
US6905737B2
(en)
*
|
2002-10-11 |
2005-06-14 |
Applied Materials, Inc. |
Method of delivering activated species for rapid cyclical deposition
|
EP1420080A3
(en)
*
|
2002-11-14 |
2005-11-09 |
Applied Materials, Inc. |
Apparatus and method for hybrid chemical deposition processes
|
US6868869B2
(en)
*
|
2003-02-19 |
2005-03-22 |
Advanced Technology Materials, Inc. |
Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases
|
US20040177813A1
(en)
|
2003-03-12 |
2004-09-16 |
Applied Materials, Inc. |
Substrate support lift mechanism
|
US7342984B1
(en)
|
2003-04-03 |
2008-03-11 |
Zilog, Inc. |
Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character
|
US7547363B2
(en)
*
|
2003-07-08 |
2009-06-16 |
Tosoh Finechem Corporation |
Solid organometallic compound-filled container and filling method thereof
|
US6909839B2
(en)
*
|
2003-07-23 |
2005-06-21 |
Advanced Technology Materials, Inc. |
Delivery systems for efficient vaporization of precursor source material
|
US7211454B2
(en)
*
|
2003-07-25 |
2007-05-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate
|
US7261118B2
(en)
*
|
2003-08-19 |
2007-08-28 |
Air Products And Chemicals, Inc. |
Method and vessel for the delivery of precursor materials
|
US7494905B2
(en)
*
|
2003-08-21 |
2009-02-24 |
Texas Instruments Incorporated |
Method for preparing a source material including forming a paste for ion implantation
|
US7156380B2
(en)
*
|
2003-09-29 |
2007-01-02 |
Asm International, N.V. |
Safe liquid source containers
|
US20050095859A1
(en)
*
|
2003-11-03 |
2005-05-05 |
Applied Materials, Inc. |
Precursor delivery system with rate control
|
CN1894763B
(zh)
*
|
2003-12-12 |
2010-12-08 |
山米奎普公司 |
用于在离子植入中延长设备正常运行时间的方法及装置
|
US20080073559A1
(en)
*
|
2003-12-12 |
2008-03-27 |
Horsky Thomas N |
Controlling the flow of vapors sublimated from solids
|
US20050252449A1
(en)
*
|
2004-05-12 |
2005-11-17 |
Nguyen Son T |
Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
|
US20060019033A1
(en)
*
|
2004-05-21 |
2006-01-26 |
Applied Materials, Inc. |
Plasma treatment of hafnium-containing materials
|
US8323754B2
(en)
*
|
2004-05-21 |
2012-12-04 |
Applied Materials, Inc. |
Stabilization of high-k dielectric materials
|
US20060153995A1
(en)
*
|
2004-05-21 |
2006-07-13 |
Applied Materials, Inc. |
Method for fabricating a dielectric stack
|
US8119210B2
(en)
*
|
2004-05-21 |
2012-02-21 |
Applied Materials, Inc. |
Formation of a silicon oxynitride layer on a high-k dielectric material
|
US7741621B2
(en)
*
|
2004-07-14 |
2010-06-22 |
City University Of Hong Kong |
Apparatus and method for focused electric field enhanced plasma-based ion implantation
|
US7819981B2
(en)
*
|
2004-10-26 |
2010-10-26 |
Advanced Technology Materials, Inc. |
Methods for cleaning ion implanter components
|
US7638002B2
(en)
*
|
2004-11-29 |
2009-12-29 |
Tokyo Electron Limited |
Multi-tray film precursor evaporation system and thin film deposition system incorporating same
|
US7484315B2
(en)
*
|
2004-11-29 |
2009-02-03 |
Tokyo Electron Limited |
Replaceable precursor tray for use in a multi-tray solid precursor delivery system
|
US7488512B2
(en)
*
|
2004-11-29 |
2009-02-10 |
Tokyo Electron Limited |
Method for preparing solid precursor tray for use in solid precursor evaporation system
|
US7708835B2
(en)
*
|
2004-11-29 |
2010-05-04 |
Tokyo Electron Limited |
Film precursor tray for use in a film precursor evaporation system and method of using
|
US20060185597A1
(en)
|
2004-11-29 |
2006-08-24 |
Kenji Suzuki |
Film precursor evaporation system and method of using
|
FR2878453B1
(fr)
*
|
2004-11-30 |
2007-03-16 |
Centre Nat Rech Scient Cnrse |
Dispositif de fourniture de vapeurs d'un precurseur solide a un appareil de traitement
|
CN101495190B
(zh)
*
|
2005-03-16 |
2013-05-01 |
高级技术材料公司 |
用于从固体源递送试剂的系统
|
US8197898B2
(en)
|
2005-03-29 |
2012-06-12 |
Tokyo Electron Limited |
Method and system for depositing a layer from light-induced vaporization of a solid precursor
|
US7651570B2
(en)
*
|
2005-03-31 |
2010-01-26 |
Tokyo Electron Limited |
Solid precursor vaporization system for use in chemical vapor deposition
|
US7485338B2
(en)
|
2005-03-31 |
2009-02-03 |
Tokyo Electron Limited |
Method for precursor delivery
|
US7132128B2
(en)
|
2005-03-31 |
2006-11-07 |
Tokyo Electron Limited |
Method and system for depositing material on a substrate using a solid precursor
|
US7566477B2
(en)
|
2005-03-31 |
2009-07-28 |
Tokyo Electron Limited |
Method for saturating a carrier gas with precursor vapor
|
US7345184B2
(en)
|
2005-03-31 |
2008-03-18 |
Tokyo Electron Limited |
Method and system for refurbishing a metal carbonyl precursor
|
DE102005030862B4
(de)
*
|
2005-07-01 |
2009-12-24 |
Sintec Keramik Gmbh |
Erstbenetzungshilfsmaterial für einen Verdampferkörper, seine Verwendung zum Herrichten der Verdampferfläche eines Verdampferkörpers und ein elektrisch beheizbarer keramischer Verdampferkörper
|
US20070020890A1
(en)
*
|
2005-07-19 |
2007-01-25 |
Applied Materials, Inc. |
Method and apparatus for semiconductor processing
|
US20070049043A1
(en)
*
|
2005-08-23 |
2007-03-01 |
Applied Materials, Inc. |
Nitrogen profile engineering in HI-K nitridation for device performance enhancement and reliability improvement
|
US7402534B2
(en)
*
|
2005-08-26 |
2008-07-22 |
Applied Materials, Inc. |
Pretreatment processes within a batch ALD reactor
|
SG165321A1
(en)
|
2005-08-30 |
2010-10-28 |
Advanced Tech Materials |
Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
|
US20070065578A1
(en)
*
|
2005-09-21 |
2007-03-22 |
Applied Materials, Inc. |
Treatment processes for a batch ALD reactor
|
US7459395B2
(en)
|
2005-09-28 |
2008-12-02 |
Tokyo Electron Limited |
Method for purifying a metal carbonyl precursor
|
US7464917B2
(en)
*
|
2005-10-07 |
2008-12-16 |
Appiled Materials, Inc. |
Ampoule splash guard apparatus
|
KR101019293B1
(ko)
|
2005-11-04 |
2011-03-07 |
어플라이드 머티어리얼스, 인코포레이티드 |
플라즈마-강화 원자층 증착 장치 및 방법
|
GB2432371B
(en)
*
|
2005-11-17 |
2011-06-15 |
Epichem Ltd |
Improved bubbler for the transportation of substances by a carrier gas
|
JP4960720B2
(ja)
*
|
2006-02-10 |
2012-06-27 |
東京エレクトロン株式会社 |
膜前駆体蒸発システムにおいて使用される膜前駆体のトレーおよびその使用方法
|
US7432195B2
(en)
*
|
2006-03-29 |
2008-10-07 |
Tokyo Electron Limited |
Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features
|
US7297719B2
(en)
|
2006-03-29 |
2007-11-20 |
Tokyo Electron Limited |
Method and integrated system for purifying and delivering a metal carbonyl precursor
|
US8951478B2
(en)
*
|
2006-03-30 |
2015-02-10 |
Applied Materials, Inc. |
Ampoule with a thermally conductive coating
|
US7562672B2
(en)
*
|
2006-03-30 |
2009-07-21 |
Applied Materials, Inc. |
Chemical delivery apparatus for CVD or ALD
|
US7967911B2
(en)
*
|
2006-04-11 |
2011-06-28 |
Applied Materials, Inc. |
Apparatus and methods for chemical vapor deposition
|
JP2010503977A
(ja)
*
|
2006-04-26 |
2010-02-04 |
アドバンスト テクノロジー マテリアルズ,インコーポレイテッド |
半導体処理システムの洗浄方法
|
US20070252299A1
(en)
*
|
2006-04-27 |
2007-11-01 |
Applied Materials, Inc. |
Synchronization of precursor pulsing and wafer rotation
|
US7798096B2
(en)
*
|
2006-05-05 |
2010-09-21 |
Applied Materials, Inc. |
Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
|
US20070259111A1
(en)
*
|
2006-05-05 |
2007-11-08 |
Singh Kaushal K |
Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film
|
WO2007142700A1
(en)
*
|
2006-06-02 |
2007-12-13 |
Advanced Technology Materials, Inc. |
Copper (i) amidinates and guanidinates for forming copper thin films
|
US7601648B2
(en)
|
2006-07-31 |
2009-10-13 |
Applied Materials, Inc. |
Method for fabricating an integrated gate dielectric layer for field effect transistors
|
US20080241805A1
(en)
*
|
2006-08-31 |
2008-10-02 |
Q-Track Corporation |
System and method for simulated dosimetry using a real time locating system
|
US7473634B2
(en)
*
|
2006-09-28 |
2009-01-06 |
Tokyo Electron Limited |
Method for integrated substrate processing in copper metallization
|
JP5073751B2
(ja)
|
2006-10-10 |
2012-11-14 |
エーエスエム アメリカ インコーポレイテッド |
前駆体送出システム
|
US8986456B2
(en)
*
|
2006-10-10 |
2015-03-24 |
Asm America, Inc. |
Precursor delivery system
|
US9109287B2
(en)
*
|
2006-10-19 |
2015-08-18 |
Air Products And Chemicals, Inc. |
Solid source container with inlet plenum
|
US7775508B2
(en)
*
|
2006-10-31 |
2010-08-17 |
Applied Materials, Inc. |
Ampoule for liquid draw and vapor draw with a continuous level sensor
|
JP5575483B2
(ja)
*
|
2006-11-22 |
2014-08-20 |
ソイテック |
Iii−v族半導体材料の大量製造装置
|
WO2008130448A2
(en)
*
|
2006-11-22 |
2008-10-30 |
S.O.I.Tec Silicon On Insulator Technologies |
Temperature-controlled purge gate valve for chemical vapor deposition chamber
|
US9481943B2
(en)
|
2006-11-22 |
2016-11-01 |
Soitec |
Gallium trichloride injection scheme
|
US20090223441A1
(en)
*
|
2006-11-22 |
2009-09-10 |
Chantal Arena |
High volume delivery system for gallium trichloride
|
WO2008064077A2
(en)
|
2006-11-22 |
2008-05-29 |
S.O.I.Tec Silicon On Insulator Technologies |
Methods for high volume manufacture of group iii-v semiconductor materials
|
WO2008127425A2
(en)
*
|
2006-11-22 |
2008-10-23 |
S.O.I.Tec Silicon On Insulator Technologies |
Abatement of reaction gases from gallium nitride deposition
|
KR101330156B1
(ko)
|
2006-11-22 |
2013-12-20 |
소이텍 |
삼염화 갈륨 주입 구조
|
US9481944B2
(en)
|
2006-11-22 |
2016-11-01 |
Soitec |
Gas injectors including a funnel- or wedge-shaped channel for chemical vapor deposition (CVD) systems and CVD systems with the same
|
US20080141937A1
(en)
*
|
2006-12-19 |
2008-06-19 |
Tokyo Electron Limited |
Method and system for controlling a vapor delivery system
|
US8524931B2
(en)
*
|
2007-01-17 |
2013-09-03 |
Advanced Technology Materials, Inc. |
Precursor compositions for ALD/CVD of group II ruthenate thin films
|
US7955649B2
(en)
*
|
2007-01-17 |
2011-06-07 |
Visichem Technology, Ltd. |
Forming thin films using a resealable vial carrier of amphiphilic molecules
|
US7833353B2
(en)
*
|
2007-01-24 |
2010-11-16 |
Asm Japan K.K. |
Liquid material vaporization apparatus for semiconductor processing apparatus
|
US8821637B2
(en)
*
|
2007-01-29 |
2014-09-02 |
Applied Materials, Inc. |
Temperature controlled lid assembly for tungsten nitride deposition
|
US7846256B2
(en)
*
|
2007-02-23 |
2010-12-07 |
Tokyo Electron Limited |
Ampule tray for and method of precursor surface area
|
WO2009039382A1
(en)
*
|
2007-09-21 |
2009-03-26 |
Semequip. Inc. |
Method for extending equipment uptime in ion implantation
|
US20130249125A1
(en)
*
|
2007-11-13 |
2013-09-26 |
James J. McKinley |
Variable concentration dynamic headspace vapor source generator
|
US8899556B2
(en)
*
|
2007-11-15 |
2014-12-02 |
Lawrence Livermore National Security, Llc. |
Systems and methods for generation of hydrogen peroxide vapor
|
US9034105B2
(en)
*
|
2008-01-10 |
2015-05-19 |
American Air Liquide, Inc. |
Solid precursor sublimator
|
JP2011512015A
(ja)
|
2008-02-11 |
2011-04-14 |
アドバンスド テクノロジー マテリアルズ,インコーポレイテッド |
半導体処理システムにおけるイオン源の洗浄
|
US20090214777A1
(en)
*
|
2008-02-22 |
2009-08-27 |
Demetrius Sarigiannis |
Multiple ampoule delivery systems
|
US8137468B2
(en)
*
|
2008-03-17 |
2012-03-20 |
Applied Materials, Inc. |
Heated valve manifold for ampoule
|
US8343583B2
(en)
|
2008-07-10 |
2013-01-01 |
Asm International N.V. |
Method for vaporizing non-gaseous precursor in a fluidized bed
|
US8146896B2
(en)
*
|
2008-10-31 |
2012-04-03 |
Applied Materials, Inc. |
Chemical precursor ampoule for vapor deposition processes
|
US10378106B2
(en)
|
2008-11-14 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of forming insulation film by modified PEALD
|
US8012876B2
(en)
*
|
2008-12-02 |
2011-09-06 |
Asm International N.V. |
Delivery of vapor precursor from solid source
|
US8663735B2
(en)
*
|
2009-02-13 |
2014-03-04 |
Advanced Technology Materials, Inc. |
In situ generation of RuO4 for ALD of Ru and Ru related materials
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
US8491720B2
(en)
*
|
2009-04-10 |
2013-07-23 |
Applied Materials, Inc. |
HVPE precursor source hardware
|
US8883270B2
(en)
*
|
2009-08-14 |
2014-11-11 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen—oxygen species
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
US8877655B2
(en)
|
2010-05-07 |
2014-11-04 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
US9117773B2
(en)
*
|
2009-08-26 |
2015-08-25 |
Asm America, Inc. |
High concentration water pulses for atomic layer deposition
|
US8598022B2
(en)
|
2009-10-27 |
2013-12-03 |
Advanced Technology Materials, Inc. |
Isotopically-enriched boron-containing compounds, and methods of making and using same
|
JP5898624B2
(ja)
|
2009-11-02 |
2016-04-06 |
シグマ−アルドリッチ・カンパニー、エルエルシー |
蒸発器
|
US8555809B2
(en)
*
|
2010-01-14 |
2013-10-15 |
Rohm And Haas Electronic Materials, Llc |
Method for constant concentration evaporation and a device using the same
|
US8758515B2
(en)
|
2010-08-09 |
2014-06-24 |
Rohm And Haas Electronic Materials Llc |
Delivery device and method of use thereof
|
US8133806B1
(en)
|
2010-09-30 |
2012-03-13 |
S.O.I.Tec Silicon On Insulator Technologies |
Systems and methods for forming semiconductor materials by atomic layer deposition
|
US8486192B2
(en)
|
2010-09-30 |
2013-07-16 |
Soitec |
Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
|
US8776821B2
(en)
|
2011-05-24 |
2014-07-15 |
Rohm And Haas Electronic Materials Llc |
Vapor delivery device, methods of manufacture and methods of use thereof
|
US8997775B2
(en)
|
2011-05-24 |
2015-04-07 |
Rohm And Haas Electronic Materials Llc |
Vapor delivery device, methods of manufacture and methods of use thereof
|
US9312155B2
(en)
|
2011-06-06 |
2016-04-12 |
Asm Japan K.K. |
High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
|
JP2012255193A
(ja)
*
|
2011-06-09 |
2012-12-27 |
Air Liquide Japan Ltd |
固体材料ガスの供給装置および供給方法
|
US9793148B2
(en)
|
2011-06-22 |
2017-10-17 |
Asm Japan K.K. |
Method for positioning wafers in multiple wafer transport
|
US10364496B2
(en)
|
2011-06-27 |
2019-07-30 |
Asm Ip Holding B.V. |
Dual section module having shared and unshared mass flow controllers
|
US10854498B2
(en)
|
2011-07-15 |
2020-12-01 |
Asm Ip Holding B.V. |
Wafer-supporting device and method for producing same
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
JP2013028854A
(ja)
*
|
2011-07-29 |
2013-02-07 |
Air Liquide Japan Ltd |
固体材料ガスの供給装置および供給方法
|
US8724974B2
(en)
*
|
2011-09-30 |
2014-05-13 |
Fujikin Incorporated |
Vaporizer
|
JP5913888B2
(ja)
|
2011-09-30 |
2016-04-27 |
国立大学法人東北大学 |
気化器
|
US9341296B2
(en)
|
2011-10-27 |
2016-05-17 |
Asm America, Inc. |
Heater jacket for a fluid line
|
US9096931B2
(en)
|
2011-10-27 |
2015-08-04 |
Asm America, Inc |
Deposition valve assembly and method of heating the same
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
US9005539B2
(en)
|
2011-11-23 |
2015-04-14 |
Asm Ip Holding B.V. |
Chamber sealing member
|
US9167625B2
(en)
|
2011-11-23 |
2015-10-20 |
Asm Ip Holding B.V. |
Radiation shielding for a substrate holder
|
US9238865B2
(en)
|
2012-02-06 |
2016-01-19 |
Asm Ip Holding B.V. |
Multiple vapor sources for vapor deposition
|
WO2013126323A1
(en)
*
|
2012-02-23 |
2013-08-29 |
Applied Materials, Inc. |
Method and apparatus for precursor delivery
|
US9202727B2
(en)
|
2012-03-02 |
2015-12-01 |
ASM IP Holding |
Susceptor heater shim
|
US8946830B2
(en)
|
2012-04-04 |
2015-02-03 |
Asm Ip Holdings B.V. |
Metal oxide protective layer for a semiconductor device
|
US9029253B2
(en)
|
2012-05-02 |
2015-05-12 |
Asm Ip Holding B.V. |
Phase-stabilized thin films, structures and devices including the thin films, and methods of forming same
|
US8728832B2
(en)
|
2012-05-07 |
2014-05-20 |
Asm Ip Holdings B.V. |
Semiconductor device dielectric interface layer
|
US9598766B2
(en)
|
2012-05-27 |
2017-03-21 |
Air Products And Chemicals, Inc. |
Vessel with filter
|
CN109972119A
(zh)
|
2012-05-31 |
2019-07-05 |
恩特格里斯公司 |
基于源试剂的用于批量沉积的高物质通量流体的输送
|
US8933375B2
(en)
|
2012-06-27 |
2015-01-13 |
Asm Ip Holding B.V. |
Susceptor heater and method of heating a substrate
|
US9243325B2
(en)
|
2012-07-18 |
2016-01-26 |
Rohm And Haas Electronic Materials Llc |
Vapor delivery device, methods of manufacture and methods of use thereof
|
US9558931B2
(en)
|
2012-07-27 |
2017-01-31 |
Asm Ip Holding B.V. |
System and method for gas-phase sulfur passivation of a semiconductor surface
|
US9117866B2
(en)
|
2012-07-31 |
2015-08-25 |
Asm Ip Holding B.V. |
Apparatus and method for calculating a wafer position in a processing chamber under process conditions
|
US9169975B2
(en)
|
2012-08-28 |
2015-10-27 |
Asm Ip Holding B.V. |
Systems and methods for mass flow controller verification
|
US9659799B2
(en)
|
2012-08-28 |
2017-05-23 |
Asm Ip Holding B.V. |
Systems and methods for dynamic semiconductor process scheduling
|
US9021985B2
(en)
|
2012-09-12 |
2015-05-05 |
Asm Ip Holdings B.V. |
Process gas management for an inductively-coupled plasma deposition reactor
|
US9324811B2
(en)
|
2012-09-26 |
2016-04-26 |
Asm Ip Holding B.V. |
Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
|
FR2996628B1
(fr)
*
|
2012-10-04 |
2014-12-26 |
Commissariat Energie Atomique |
Reservoir de stockage d'hydrogene a hydrures metalliques de fabrication simplifiee et dispositif de stockage comportant au moins un tel reservoir
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
JP5837869B2
(ja)
*
|
2012-12-06 |
2015-12-24 |
株式会社フジキン |
原料気化供給装置
|
US20140174955A1
(en)
*
|
2012-12-21 |
2014-06-26 |
Qualcomm Mems Technologies, Inc. |
High flow xef2 canister
|
US9640416B2
(en)
|
2012-12-26 |
2017-05-02 |
Asm Ip Holding B.V. |
Single-and dual-chamber module-attachable wafer-handling chamber
|
JP6078335B2
(ja)
*
|
2012-12-27 |
2017-02-08 |
株式会社日立国際電気 |
基板処理装置、半導体装置の製造方法、気化システム、気化器およびプログラム
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
US8894870B2
(en)
|
2013-02-01 |
2014-11-25 |
Asm Ip Holding B.V. |
Multi-step method and apparatus for etching compounds containing a metal
|
US9484191B2
(en)
|
2013-03-08 |
2016-11-01 |
Asm Ip Holding B.V. |
Pulsed remote plasma method and system
|
US9589770B2
(en)
|
2013-03-08 |
2017-03-07 |
Asm Ip Holding B.V. |
Method and systems for in-situ formation of intermediate reactive species
|
KR102024830B1
(ko)
*
|
2013-05-09 |
2019-09-25 |
(주)지오엘리먼트 |
기화기
|
US8993054B2
(en)
|
2013-07-12 |
2015-03-31 |
Asm Ip Holding B.V. |
Method and system to reduce outgassing in a reaction chamber
|
US9018111B2
(en)
|
2013-07-22 |
2015-04-28 |
Asm Ip Holding B.V. |
Semiconductor reaction chamber with plasma capabilities
|
US9793115B2
(en)
|
2013-08-14 |
2017-10-17 |
Asm Ip Holding B.V. |
Structures and devices including germanium-tin films and methods of forming same
|
US9396934B2
(en)
|
2013-08-14 |
2016-07-19 |
Asm Ip Holding B.V. |
Methods of forming films including germanium tin and structures and devices including the films
|
WO2015029457A1
(en)
*
|
2013-09-02 |
2015-03-05 |
L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude |
Method for producing pyromellitic dianhydride, pyromellitic dianhydride produced by the method, and apparatus therefor
|
JP6111171B2
(ja)
*
|
2013-09-02 |
2017-04-05 |
東京エレクトロン株式会社 |
成膜方法及び成膜装置
|
US9240412B2
(en)
|
2013-09-27 |
2016-01-19 |
Asm Ip Holding B.V. |
Semiconductor structure and device and methods of forming same using selective epitaxial process
|
US9556516B2
(en)
|
2013-10-09 |
2017-01-31 |
ASM IP Holding B.V |
Method for forming Ti-containing film by PEALD using TDMAT or TDEAT
|
US9605343B2
(en)
|
2013-11-13 |
2017-03-28 |
Asm Ip Holding B.V. |
Method for forming conformal carbon films, structures conformal carbon film, and system of forming same
|
US9334566B2
(en)
|
2013-11-25 |
2016-05-10 |
Lam Research Corporation |
Multi-tray ballast vapor draw systems
|
US10179947B2
(en)
|
2013-11-26 |
2019-01-15 |
Asm Ip Holding B.V. |
Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition
|
US9343315B2
(en)
*
|
2013-11-27 |
2016-05-17 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method for fabricating semiconductor structure, and solid precursor delivery system
|
US9957612B2
(en)
|
2014-01-17 |
2018-05-01 |
Ceres Technologies, Inc. |
Delivery device, methods of manufacture thereof and articles comprising the same
|
US10683571B2
(en)
|
2014-02-25 |
2020-06-16 |
Asm Ip Holding B.V. |
Gas supply manifold and method of supplying gases to chamber using same
|
US10167557B2
(en)
|
2014-03-18 |
2019-01-01 |
Asm Ip Holding B.V. |
Gas distribution system, reactor including the system, and methods of using the same
|
US9447498B2
(en)
|
2014-03-18 |
2016-09-20 |
Asm Ip Holding B.V. |
Method for performing uniform processing in gas system-sharing multiple reaction chambers
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
KR102387359B1
(ko)
*
|
2014-04-18 |
2022-04-14 |
어플라이드 머티어리얼스, 인코포레이티드 |
자동-리필 앰풀 및 사용 방법들
|
WO2015164029A1
(en)
*
|
2014-04-21 |
2015-10-29 |
Entegris, Inc. |
Solid vaporizer
|
US9404587B2
(en)
|
2014-04-24 |
2016-08-02 |
ASM IP Holding B.V |
Lockout tagout for semiconductor vacuum valve
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
US9543180B2
(en)
|
2014-08-01 |
2017-01-10 |
Asm Ip Holding B.V. |
Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
|
US9970108B2
(en)
*
|
2014-08-01 |
2018-05-15 |
Lam Research Corporation |
Systems and methods for vapor delivery in a substrate processing system
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
US11072860B2
(en)
|
2014-08-22 |
2021-07-27 |
Lam Research Corporation |
Fill on demand ampoule refill
|
US20160052651A1
(en)
*
|
2014-08-22 |
2016-02-25 |
Lam Research Corporation |
Fill on demand ampoule
|
US10094018B2
(en)
|
2014-10-16 |
2018-10-09 |
Lam Research Corporation |
Dynamic precursor dosing for atomic layer deposition
|
US11970772B2
(en)
|
2014-08-22 |
2024-04-30 |
Lam Research Corporation |
Dynamic precursor dosing for atomic layer deposition
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
US9657845B2
(en)
|
2014-10-07 |
2017-05-23 |
Asm Ip Holding B.V. |
Variable conductance gas distribution apparatus and method
|
KR102300403B1
(ko)
|
2014-11-19 |
2021-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
KR102263121B1
(ko)
|
2014-12-22 |
2021-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 및 그 제조 방법
|
US9982341B2
(en)
*
|
2015-01-30 |
2018-05-29 |
Lam Research Corporation |
Modular vaporizer
|
US9478415B2
(en)
|
2015-02-13 |
2016-10-25 |
Asm Ip Holding B.V. |
Method for forming film having low resistance and shallow junction depth
|
US10529542B2
(en)
|
2015-03-11 |
2020-01-07 |
Asm Ip Holdings B.V. |
Cross-flow reactor and method
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
JP6301867B2
(ja)
*
|
2015-03-31 |
2018-03-28 |
東芝メモリ株式会社 |
気化システム
|
WO2016175259A1
(ja)
*
|
2015-04-30 |
2016-11-03 |
芝浦メカトロニクス株式会社 |
錠剤印刷装置および錠剤印刷方法
|
KR102299892B1
(ko)
*
|
2015-05-07 |
2021-09-10 |
(주)지오엘리먼트 |
모세관 현상을 이용한 고효율 기화기
|
KR102269079B1
(ko)
*
|
2015-05-08 |
2021-06-25 |
(주)지오엘리먼트 |
충진이 용이하고 기화 효율이 향상된 기화기
|
KR101725959B1
(ko)
|
2015-05-08 |
2017-04-21 |
(주)지오엘리먼트 |
충진이 용이하고 기화 효율이 향상된 기화기
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
US10600673B2
(en)
|
2015-07-07 |
2020-03-24 |
Asm Ip Holding B.V. |
Magnetic susceptor to baseplate seal
|
US10043661B2
(en)
|
2015-07-13 |
2018-08-07 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
US9899291B2
(en)
|
2015-07-13 |
2018-02-20 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
US20170023235A1
(en)
*
|
2015-07-21 |
2017-01-26 |
Apple Inc. |
Sublimator/vaporizer
|
US10083836B2
(en)
|
2015-07-24 |
2018-09-25 |
Asm Ip Holding B.V. |
Formation of boron-doped titanium metal films with high work function
|
US10087525B2
(en)
|
2015-08-04 |
2018-10-02 |
Asm Ip Holding B.V. |
Variable gap hard stop design
|
US9647114B2
(en)
|
2015-08-14 |
2017-05-09 |
Asm Ip Holding B.V. |
Methods of forming highly p-type doped germanium tin films and structures and devices including the films
|
MY190445A
(en)
|
2015-08-21 |
2022-04-21 |
Flisom Ag |
Homogeneous linear evaporation source
|
TWI624554B
(zh)
*
|
2015-08-21 |
2018-05-21 |
弗里松股份有限公司 |
蒸發源
|
US9711345B2
(en)
|
2015-08-25 |
2017-07-18 |
Asm Ip Holding B.V. |
Method for forming aluminum nitride-based film by PEALD
|
US9960072B2
(en)
|
2015-09-29 |
2018-05-01 |
Asm Ip Holding B.V. |
Variable adjustment for precise matching of multiple chamber cavity housings
|
US9909214B2
(en)
|
2015-10-15 |
2018-03-06 |
Asm Ip Holding B.V. |
Method for depositing dielectric film in trenches by PEALD
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
US10322384B2
(en)
|
2015-11-09 |
2019-06-18 |
Asm Ip Holding B.V. |
Counter flow mixer for process chamber
|
US9455138B1
(en)
|
2015-11-10 |
2016-09-27 |
Asm Ip Holding B.V. |
Method for forming dielectric film in trenches by PEALD using H-containing gas
|
US9905420B2
(en)
|
2015-12-01 |
2018-02-27 |
Asm Ip Holding B.V. |
Methods of forming silicon germanium tin films and structures and devices including the films
|
US9607837B1
(en)
|
2015-12-21 |
2017-03-28 |
Asm Ip Holding B.V. |
Method for forming silicon oxide cap layer for solid state diffusion process
|
US9627221B1
(en)
|
2015-12-28 |
2017-04-18 |
Asm Ip Holding B.V. |
Continuous process incorporating atomic layer etching
|
US9735024B2
(en)
|
2015-12-28 |
2017-08-15 |
Asm Ip Holding B.V. |
Method of atomic layer etching using functional group-containing fluorocarbon
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10468251B2
(en)
|
2016-02-19 |
2019-11-05 |
Asm Ip Holding B.V. |
Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
|
US9754779B1
(en)
|
2016-02-19 |
2017-09-05 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10501866B2
(en)
|
2016-03-09 |
2019-12-10 |
Asm Ip Holding B.V. |
Gas distribution apparatus for improved film uniformity in an epitaxial system
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
US9892913B2
(en)
|
2016-03-24 |
2018-02-13 |
Asm Ip Holding B.V. |
Radial and thickness control via biased multi-port injection settings
|
JP6946340B2
(ja)
*
|
2016-04-19 |
2021-10-06 |
インテグリス・インコーポレーテッド |
不正開放防止化学薬品パッケージ
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10087522B2
(en)
|
2016-04-21 |
2018-10-02 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
US10032628B2
(en)
|
2016-05-02 |
2018-07-24 |
Asm Ip Holding B.V. |
Source/drain performance through conformal solid state doping
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
KR102592471B1
(ko)
|
2016-05-17 |
2023-10-20 |
에이에스엠 아이피 홀딩 비.브이. |
금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US10388509B2
(en)
|
2016-06-28 |
2019-08-20 |
Asm Ip Holding B.V. |
Formation of epitaxial layers via dislocation filtering
|
US9928983B2
(en)
*
|
2016-06-30 |
2018-03-27 |
Varian Semiconductor Equipment Associates, Inc. |
Vaporizer for ion source
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US9793135B1
(en)
|
2016-07-14 |
2017-10-17 |
ASM IP Holding B.V |
Method of cyclic dry etching using etchant film
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
KR102354490B1
(ko)
|
2016-07-27 |
2022-01-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
US10177025B2
(en)
|
2016-07-28 |
2019-01-08 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
US10395919B2
(en)
|
2016-07-28 |
2019-08-27 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US10090316B2
(en)
|
2016-09-01 |
2018-10-02 |
Asm Ip Holding B.V. |
3D stacked multilayer semiconductor memory using doped select transistor channel
|
US10876205B2
(en)
|
2016-09-30 |
2020-12-29 |
Asm Ip Holding B.V. |
Reactant vaporizer and related systems and methods
|
US11926894B2
(en)
|
2016-09-30 |
2024-03-12 |
Asm Ip Holding B.V. |
Reactant vaporizer and related systems and methods
|
US10410943B2
(en)
|
2016-10-13 |
2019-09-10 |
Asm Ip Holding B.V. |
Method for passivating a surface of a semiconductor and related systems
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10643904B2
(en)
|
2016-11-01 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for forming a semiconductor device and related semiconductor device structures
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10435790B2
(en)
|
2016-11-01 |
2019-10-08 |
Asm Ip Holding B.V. |
Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
|
US10134757B2
(en)
|
2016-11-07 |
2018-11-20 |
Asm Ip Holding B.V. |
Method of processing a substrate and a device manufactured by using the method
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
US10340135B2
(en)
|
2016-11-28 |
2019-07-02 |
Asm Ip Holding B.V. |
Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
|
KR20180068582A
(ko)
|
2016-12-14 |
2018-06-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US9916980B1
(en)
|
2016-12-15 |
2018-03-13 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10655221B2
(en)
|
2017-02-09 |
2020-05-19 |
Asm Ip Holding B.V. |
Method for depositing oxide film by thermal ALD and PEALD
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
US10283353B2
(en)
|
2017-03-29 |
2019-05-07 |
Asm Ip Holding B.V. |
Method of reforming insulating film deposited on substrate with recess pattern
|
US10103040B1
(en)
|
2017-03-31 |
2018-10-16 |
Asm Ip Holding B.V. |
Apparatus and method for manufacturing a semiconductor device
|
USD830981S1
(en)
|
2017-04-07 |
2018-10-16 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate processing apparatus
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10446393B2
(en)
|
2017-05-08 |
2019-10-15 |
Asm Ip Holding B.V. |
Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
US11946131B2
(en)
*
|
2017-05-26 |
2024-04-02 |
Universal Display Corporation |
Sublimation cell with time stability of output vapor pressure
|
US10504742B2
(en)
|
2017-05-31 |
2019-12-10 |
Asm Ip Holding B.V. |
Method of atomic layer etching using hydrogen plasma
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
US10676370B2
(en)
*
|
2017-06-05 |
2020-06-09 |
Axcelis Technologies, Inc. |
Hydrogen co-gas when using aluminum iodide as an ion source material
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
JP6324609B1
(ja)
*
|
2017-06-21 |
2018-05-16 |
日本エア・リキード株式会社 |
固体材料容器およびその固体材料容器に固体材料が充填されている固体材料製品
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
US10312055B2
(en)
|
2017-07-26 |
2019-06-04 |
Asm Ip Holding B.V. |
Method of depositing film by PEALD using negative bias
|
US10605530B2
(en)
|
2017-07-26 |
2020-03-31 |
Asm Ip Holding B.V. |
Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
US11104993B2
(en)
*
|
2017-07-28 |
2021-08-31 |
Entegris, Inc. |
Modular tray ampoule
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US10249524B2
(en)
|
2017-08-09 |
2019-04-02 |
Asm Ip Holding B.V. |
Cassette holder assembly for a substrate cassette and holding member for use in such assembly
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
KR102344996B1
(ko)
*
|
2017-08-18 |
2021-12-30 |
삼성전자주식회사 |
전구체 공급 유닛, 기판 처리 장치 및 그를 이용한 반도체 소자의 제조방법
|
US10597773B2
(en)
*
|
2017-08-22 |
2020-03-24 |
Praxair Technology, Inc. |
Antimony-containing materials for ion implantation
|
US10236177B1
(en)
|
2017-08-22 |
2019-03-19 |
ASM IP Holding B.V.. |
Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
|
USD900036S1
(en)
|
2017-08-24 |
2020-10-27 |
Asm Ip Holding B.V. |
Heater electrical connector and adapter
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10607895B2
(en)
|
2017-09-18 |
2020-03-31 |
Asm Ip Holdings B.V. |
Method for forming a semiconductor device structure comprising a gate fill metal
|
WO2019058969A1
(ja)
*
|
2017-09-21 |
2019-03-28 |
株式会社Kokusai Electric |
貯留容器、気化器、基板処理装置および半導体装置の製造方法
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
US10895347B2
(en)
*
|
2017-10-20 |
2021-01-19 |
Entegris, Inc. |
Heat transfer to ampoule trays
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
KR102443047B1
(ko)
|
2017-11-16 |
2022-09-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 방법 및 그에 의해 제조된 장치
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
CN111316417B
(zh)
|
2017-11-27 |
2023-12-22 |
阿斯莫Ip控股公司 |
与批式炉偕同使用的用于储存晶圆匣的储存装置
|
JP7206265B2
(ja)
|
2017-11-27 |
2023-01-17 |
エーエスエム アイピー ホールディング ビー.ブイ. |
クリーン・ミニエンバイロメントを備える装置
|
US10290508B1
(en)
|
2017-12-05 |
2019-05-14 |
Asm Ip Holding B.V. |
Method for forming vertical spacers for spacer-defined patterning
|
JP6895372B2
(ja)
*
|
2017-12-12 |
2021-06-30 |
東京エレクトロン株式会社 |
原料容器
|
US20190186003A1
(en)
*
|
2017-12-14 |
2019-06-20 |
Entegris, Inc. |
Ampoule vaporizer and vessel
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
CN111630203A
(zh)
|
2018-01-19 |
2020-09-04 |
Asm Ip私人控股有限公司 |
通过等离子体辅助沉积来沉积间隙填充层的方法
|
TWI799494B
(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Asm 智慧財產控股公司 |
沈積方法
|
USD903477S1
(en)
|
2018-01-24 |
2020-12-01 |
Asm Ip Holdings B.V. |
Metal clamp
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
US10535516B2
(en)
|
2018-02-01 |
2020-01-14 |
Asm Ip Holdings B.V. |
Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
US10832913B2
(en)
*
|
2018-02-14 |
2020-11-10 |
Taiwan Semiconductor Manufacturing Company Ltd. |
Method and apparatus for forming semiconductor structure
|
CN116732497A
(zh)
|
2018-02-14 |
2023-09-12 |
Asm Ip私人控股有限公司 |
通过循环沉积工艺在衬底上沉积含钌膜的方法
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
US10658181B2
(en)
|
2018-02-20 |
2020-05-19 |
Asm Ip Holding B.V. |
Method of spacer-defined direct patterning in semiconductor fabrication
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
US10510536B2
(en)
|
2018-03-29 |
2019-12-17 |
Asm Ip Holding B.V. |
Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
US12025484B2
(en)
|
2018-05-08 |
2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
KR102709511B1
(ko)
|
2018-05-08 |
2024-09-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조
|
TW202349473A
(zh)
|
2018-05-11 |
2023-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構
|
EP3841388A4
(en)
|
2018-05-23 |
2022-07-27 |
Senseer Ltd |
DEVICE, SYSTEM AND METHOD FOR MONITORING THE OPERATION OF A PROJECTILE LAUNCHER
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
TWI840362B
(zh)
|
2018-06-04 |
2024-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
水氣降低的晶圓處置腔室
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
TW202405221A
(zh)
|
2018-06-27 |
2024-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於形成含金屬材料及包含含金屬材料的膜及結構之循環沉積方法
|
JP2021529254A
(ja)
|
2018-06-27 |
2021-10-28 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
金属含有材料ならびに金属含有材料を含む膜および構造体を形成するための周期的堆積方法
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
KR102686758B1
(ko)
|
2018-06-29 |
2024-07-18 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
US10483099B1
(en)
|
2018-07-26 |
2019-11-19 |
Asm Ip Holding B.V. |
Method for forming thermally stable organosilicon polymer film
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
KR20200020608A
(ko)
|
2018-08-16 |
2020-02-26 |
에이에스엠 아이피 홀딩 비.브이. |
고체 소스 승화기
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
CN112703271A
(zh)
*
|
2018-09-03 |
2021-04-23 |
应用材料公司 |
用于薄膜沉积的直接液体注射系统
|
KR102576431B1
(ko)
*
|
2018-09-10 |
2023-09-08 |
삼성디스플레이 주식회사 |
유기물 제조장치 및 이를 이용한 제조방법
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
CN110970344B
(zh)
|
2018-10-01 |
2024-10-25 |
Asmip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
US10847365B2
(en)
|
2018-10-11 |
2020-11-24 |
Asm Ip Holding B.V. |
Method of forming conformal silicon carbide film by cyclic CVD
|
US10811256B2
(en)
|
2018-10-16 |
2020-10-20 |
Asm Ip Holding B.V. |
Method for etching a carbon-containing feature
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
US10381219B1
(en)
|
2018-10-25 |
2019-08-13 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(ko)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
US10559458B1
(en)
|
2018-11-26 |
2020-02-11 |
Asm Ip Holding B.V. |
Method of forming oxynitride film
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
JP7504584B2
(ja)
|
2018-12-14 |
2024-06-24 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
TW202405220A
(zh)
|
2019-01-17 |
2024-02-01 |
荷蘭商Asm Ip 私人控股有限公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
JP7240881B2
(ja)
*
|
2019-01-18 |
2023-03-16 |
Jx金属株式会社 |
塩化金属の昇華容器
|
TWI756590B
(zh)
|
2019-01-22 |
2022-03-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理裝置
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
TW202044325A
(zh)
|
2019-02-20 |
2020-12-01 |
荷蘭商Asm Ip私人控股有限公司 |
填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備
|
US11482533B2
(en)
|
2019-02-20 |
2022-10-25 |
Asm Ip Holding B.V. |
Apparatus and methods for plug fill deposition in 3-D NAND applications
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
TWI845607B
(zh)
|
2019-02-20 |
2024-06-21 |
荷蘭商Asm Ip私人控股有限公司 |
用來填充形成於基材表面內之凹部的循環沉積方法及設備
|
TWI842826B
(zh)
|
2019-02-22 |
2024-05-21 |
荷蘭商Asm Ip私人控股有限公司 |
基材處理設備及處理基材之方法
|
KR20200108248A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
SiOCN 층을 포함한 구조체 및 이의 형성 방법
|
KR20200108243A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
KR20200108242A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
US11492701B2
(en)
*
|
2019-03-19 |
2022-11-08 |
Asm Ip Holding B.V. |
Reactor manifolds
|
JP2020167398A
(ja)
|
2019-03-28 |
2020-10-08 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ドアオープナーおよびドアオープナーが提供される基材処理装置
|
KR20200116855A
(ko)
|
2019-04-01 |
2020-10-13 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자를 제조하는 방법
|
US11447864B2
(en)
|
2019-04-19 |
2022-09-20 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
KR20200125453A
(ko)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
기상 반응기 시스템 및 이를 사용하는 방법
|
KR102709637B1
(ko)
*
|
2019-04-26 |
2024-09-26 |
엔테그리스, 아이엔씨. |
기화 용기 및 방법
|
KR20200130121A
(ko)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
딥 튜브가 있는 화학물질 공급원 용기
|
KR20200130118A
(ko)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
비정질 탄소 중합체 막을 개질하는 방법
|
KR20200130652A
(ko)
|
2019-05-10 |
2020-11-19 |
에이에스엠 아이피 홀딩 비.브이. |
표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
|
JP2020188255A
(ja)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
JP2020188254A
(ja)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
CN113853449B
(zh)
*
|
2019-05-31 |
2023-10-10 |
应用材料公司 |
用于在基板上形成膜的方法及系统
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
KR20200141003A
(ko)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
가스 감지기를 포함하는 기상 반응기 시스템
|
KR20200143254A
(ko)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
KR20210005515A
(ko)
|
2019-07-03 |
2021-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
|
US11788190B2
(en)
|
2019-07-05 |
2023-10-17 |
Asm Ip Holding B.V. |
Liquid vaporizer
|
JP7499079B2
(ja)
|
2019-07-09 |
2024-06-13 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同軸導波管を用いたプラズマ装置、基板処理方法
|
CN112216646A
(zh)
|
2019-07-10 |
2021-01-12 |
Asm Ip私人控股有限公司 |
基板支撑组件及包括其的基板处理装置
|
KR20210010307A
(ko)
|
2019-07-16 |
2021-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
KR20210010820A
(ko)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 게르마늄 구조를 형성하는 방법
|
KR20210010816A
(ko)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
라디칼 보조 점화 플라즈마 시스템 및 방법
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
KR20210010817A
(ko)
|
2019-07-19 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법
|
TWI839544B
(zh)
|
2019-07-19 |
2024-04-21 |
荷蘭商Asm Ip私人控股有限公司 |
形成形貌受控的非晶碳聚合物膜之方法
|
CN112309843A
(zh)
|
2019-07-29 |
2021-02-02 |
Asm Ip私人控股有限公司 |
实现高掺杂剂掺入的选择性沉积方法
|
CN112309900A
(zh)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
基板处理设备
|
CN112309899A
(zh)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
基板处理设备
|
US11587815B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11587814B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11227782B2
(en)
|
2019-07-31 |
2022-01-18 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
CN112323048B
(zh)
|
2019-08-05 |
2024-02-09 |
Asm Ip私人控股有限公司 |
用于化学源容器的液位传感器
|
USD965524S1
(en)
|
2019-08-19 |
2022-10-04 |
Asm Ip Holding B.V. |
Susceptor support
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
Asm Ip Holding B.V. |
Susceptor shaft
|
JP2021031769A
(ja)
|
2019-08-21 |
2021-03-01 |
エーエスエム アイピー ホールディング ビー.ブイ. |
成膜原料混合ガス生成装置及び成膜装置
|
USD930782S1
(en)
|
2019-08-22 |
2021-09-14 |
Asm Ip Holding B.V. |
Gas distributor
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
Exhaust duct
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
KR20210024423A
(ko)
|
2019-08-22 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
홀을 구비한 구조체를 형성하기 위한 방법
|
USD940837S1
(en)
|
2019-08-22 |
2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
KR20210024420A
(ko)
|
2019-08-23 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
|
KR20210029090A
(ko)
|
2019-09-04 |
2021-03-15 |
에이에스엠 아이피 홀딩 비.브이. |
희생 캡핑 층을 이용한 선택적 증착 방법
|
KR20210029663A
(ko)
|
2019-09-05 |
2021-03-16 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11624113B2
(en)
|
2019-09-13 |
2023-04-11 |
Asm Ip Holding B.V. |
Heating zone separation for reactant evaporation system
|
US11946136B2
(en)
|
2019-09-20 |
2024-04-02 |
Asm Ip Holding B.V. |
Semiconductor processing device
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
Substrate processing method
|
CN112593212B
(zh)
|
2019-10-02 |
2023-12-22 |
Asm Ip私人控股有限公司 |
通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
|
KR20210042810A
(ko)
|
2019-10-08 |
2021-04-20 |
에이에스엠 아이피 홀딩 비.브이. |
활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
|
TWI846953B
(zh)
|
2019-10-08 |
2024-07-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理裝置
|
KR20210043460A
(ko)
|
2019-10-10 |
2021-04-21 |
에이에스엠 아이피 홀딩 비.브이. |
포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
|
US12009241B2
(en)
|
2019-10-14 |
2024-06-11 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly with detector to detect cassette
|
TWI834919B
(zh)
|
2019-10-16 |
2024-03-11 |
荷蘭商Asm Ip私人控股有限公司 |
氧化矽之拓撲選擇性膜形成之方法
|
US11637014B2
(en)
|
2019-10-17 |
2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
KR20210047808A
(ko)
|
2019-10-21 |
2021-04-30 |
에이에스엠 아이피 홀딩 비.브이. |
막을 선택적으로 에칭하기 위한 장치 및 방법
|
KR20210048408A
(ko)
|
2019-10-22 |
2021-05-03 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 증착 반응기 매니폴드
|
US20210123134A1
(en)
*
|
2019-10-24 |
2021-04-29 |
Entegris, Inc. |
Sublimation ampoule with level sensing
|
KR20210050453A
(ko)
|
2019-10-25 |
2021-05-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
KR20210054983A
(ko)
|
2019-11-05 |
2021-05-14 |
에이에스엠 아이피 홀딩 비.브이. |
도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
|
US11501968B2
(en)
|
2019-11-15 |
2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
KR20210062561A
(ko)
|
2019-11-20 |
2021-05-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
|
US11450529B2
(en)
|
2019-11-26 |
2022-09-20 |
Asm Ip Holding B.V. |
Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
|
CN112951697A
(zh)
|
2019-11-26 |
2021-06-11 |
Asm Ip私人控股有限公司 |
基板处理设备
|
CN112885692A
(zh)
|
2019-11-29 |
2021-06-01 |
Asm Ip私人控股有限公司 |
基板处理设备
|
CN112885693A
(zh)
|
2019-11-29 |
2021-06-01 |
Asm Ip私人控股有限公司 |
基板处理设备
|
JP7527928B2
(ja)
|
2019-12-02 |
2024-08-05 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板処理装置、基板処理方法
|
KR20210070898A
(ko)
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
JP2023505780A
(ja)
*
|
2019-12-11 |
2023-02-13 |
ラム リサーチ コーポレーション |
液体前駆体気化器
|
KR20210078405A
(ko)
|
2019-12-17 |
2021-06-28 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 나이트라이드 층을 형성하는 방법 및 바나듐 나이트라이드 층을 포함하는 구조
|
US11527403B2
(en)
|
2019-12-19 |
2022-12-13 |
Asm Ip Holding B.V. |
Methods for filling a gap feature on a substrate surface and related semiconductor structures
|
JP2021109175A
(ja)
|
2020-01-06 |
2021-08-02 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ガス供給アセンブリ、その構成要素、およびこれを含む反応器システム
|
JP2021111783A
(ja)
|
2020-01-06 |
2021-08-02 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
チャネル付きリフトピン
|
US11993847B2
(en)
|
2020-01-08 |
2024-05-28 |
Asm Ip Holding B.V. |
Injector
|
KR20210093163A
(ko)
|
2020-01-16 |
2021-07-27 |
에이에스엠 아이피 홀딩 비.브이. |
고 종횡비 피처를 형성하는 방법
|
KR102675856B1
(ko)
|
2020-01-20 |
2024-06-17 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법 및 박막 표면 개질 방법
|
KR102586352B1
(ko)
*
|
2020-01-28 |
2023-10-11 |
가부시키가이샤 아루박 |
증착원, 증착장치
|
TW202130846A
(zh)
|
2020-02-03 |
2021-08-16 |
荷蘭商Asm Ip私人控股有限公司 |
形成包括釩或銦層的結構之方法
|
TW202146882A
(zh)
|
2020-02-04 |
2021-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統
|
US11776846B2
(en)
|
2020-02-07 |
2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
US11781243B2
(en)
|
2020-02-17 |
2023-10-10 |
Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
TW202203344A
(zh)
|
2020-02-28 |
2022-01-16 |
荷蘭商Asm Ip控股公司 |
專用於零件清潔的系統
|
KR20210116249A
(ko)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법
|
KR20210116240A
(ko)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
조절성 접합부를 갖는 기판 핸들링 장치
|
KR20210117157A
(ko)
|
2020-03-12 |
2021-09-28 |
에이에스엠 아이피 홀딩 비.브이. |
타겟 토폴로지 프로파일을 갖는 층 구조를 제조하기 위한 방법
|
KR20210124042A
(ko)
|
2020-04-02 |
2021-10-14 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법
|
TW202146689A
(zh)
|
2020-04-03 |
2021-12-16 |
荷蘭商Asm Ip控股公司 |
阻障層形成方法及半導體裝置的製造方法
|
TW202145344A
(zh)
|
2020-04-08 |
2021-12-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於選擇性蝕刻氧化矽膜之設備及方法
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
KR20210128343A
(ko)
|
2020-04-15 |
2021-10-26 |
에이에스엠 아이피 홀딩 비.브이. |
크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
|
US11996289B2
(en)
|
2020-04-16 |
2024-05-28 |
Asm Ip Holding B.V. |
Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
|
KR20210132605A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리
|
JP2021172884A
(ja)
|
2020-04-24 |
2021-11-01 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体
|
KR20210132600A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
|
KR20210134226A
(ko)
|
2020-04-29 |
2021-11-09 |
에이에스엠 아이피 홀딩 비.브이. |
고체 소스 전구체 용기
|
KR20210134869A
(ko)
|
2020-05-01 |
2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Foup 핸들러를 이용한 foup의 빠른 교환
|
TW202147543A
(zh)
|
2020-05-04 |
2021-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
半導體處理系統
|
KR20210141379A
(ko)
|
2020-05-13 |
2021-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 레이저 정렬 고정구
|
TW202146699A
(zh)
|
2020-05-15 |
2021-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統
|
TW202147383A
(zh)
|
2020-05-19 |
2021-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
基材處理設備
|
KR20210145078A
(ko)
|
2020-05-21 |
2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
|
TW202200837A
(zh)
|
2020-05-22 |
2022-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於在基材上形成薄膜之反應系統
|
JP7478028B2
(ja)
*
|
2020-05-27 |
2024-05-02 |
大陽日酸株式会社 |
固体材料供給装置
|
TW202201602A
(zh)
|
2020-05-29 |
2022-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理方法
|
TW202212620A
(zh)
|
2020-06-02 |
2022-04-01 |
荷蘭商Asm Ip私人控股有限公司 |
處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法
|
TW202218133A
(zh)
|
2020-06-24 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
形成含矽層之方法
|
TW202217953A
(zh)
|
2020-06-30 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理方法
|
TW202202649A
(zh)
|
2020-07-08 |
2022-01-16 |
荷蘭商Asm Ip私人控股有限公司 |
基板處理方法
|
TW202219628A
(zh)
|
2020-07-17 |
2022-05-16 |
荷蘭商Asm Ip私人控股有限公司 |
用於光微影之結構與方法
|
TW202204662A
(zh)
|
2020-07-20 |
2022-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於沉積鉬層之方法及系統
|
CN112097114A
(zh)
*
|
2020-08-07 |
2020-12-18 |
安徽亚格盛电子新材料有限公司 |
一种精确制备液态mo源和氢气混合气的装置
|
US12040177B2
(en)
|
2020-08-18 |
2024-07-16 |
Asm Ip Holding B.V. |
Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
US11725280B2
(en)
|
2020-08-26 |
2023-08-15 |
Asm Ip Holding B.V. |
Method for forming metal silicon oxide and metal silicon oxynitride layers
|
TW202229601A
(zh)
|
2020-08-27 |
2022-08-01 |
荷蘭商Asm Ip私人控股有限公司 |
形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
US12009224B2
(en)
|
2020-09-29 |
2024-06-11 |
Asm Ip Holding B.V. |
Apparatus and method for etching metal nitrides
|
KR20220045900A
(ko)
|
2020-10-06 |
2022-04-13 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치
|
CN114293174A
(zh)
|
2020-10-07 |
2022-04-08 |
Asm Ip私人控股有限公司 |
气体供应单元和包括气体供应单元的衬底处理设备
|
TW202229613A
(zh)
|
2020-10-14 |
2022-08-01 |
荷蘭商Asm Ip私人控股有限公司 |
於階梯式結構上沉積材料的方法
|
TW202217037A
(zh)
|
2020-10-22 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
沉積釩金屬的方法、結構、裝置及沉積總成
|
TW202223136A
(zh)
|
2020-10-28 |
2022-06-16 |
荷蘭商Asm Ip私人控股有限公司 |
用於在基板上形成層之方法、及半導體處理系統
|
US11834740B2
(en)
*
|
2020-11-10 |
2023-12-05 |
Applied Materials, Inc. |
Apparatus, system, and method for generating gas for use in a process chamber
|
TW202235649A
(zh)
|
2020-11-24 |
2022-09-16 |
荷蘭商Asm Ip私人控股有限公司 |
填充間隙之方法與相關之系統及裝置
|
KR20220076343A
(ko)
|
2020-11-30 |
2022-06-08 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터
|
US11578406B2
(en)
*
|
2020-12-08 |
2023-02-14 |
Applied Materials, Inc. |
Ampoule for a semiconductor manufacturing precursor
|
US11946137B2
(en)
|
2020-12-16 |
2024-04-02 |
Asm Ip Holding B.V. |
Runout and wobble measurement fixtures
|
TW202231903A
(zh)
|
2020-12-22 |
2022-08-16 |
荷蘭商Asm Ip私人控股有限公司 |
過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成
|
TW202242184A
(zh)
|
2020-12-22 |
2022-11-01 |
荷蘭商Asm Ip私人控股有限公司 |
前驅物膠囊、前驅物容器、氣相沉積總成、及將固態前驅物裝載至前驅物容器中之方法
|
TW202226899A
(zh)
|
2020-12-22 |
2022-07-01 |
荷蘭商Asm Ip私人控股有限公司 |
具匹配器的電漿處理裝置
|
CN218596506U
(zh)
*
|
2021-02-26 |
2023-03-10 |
恩特格里斯公司 |
用于可汽化固体源材料的汽化器容器
|
EP4056730B1
(en)
|
2021-03-10 |
2024-07-17 |
SK Inc. |
Container for feeding a precursor material
|
USD1023959S1
(en)
|
2021-05-11 |
2024-04-23 |
Asm Ip Holding B.V. |
Electrode for substrate processing apparatus
|
USD980813S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas flow control plate for substrate processing apparatus
|
USD981973S1
(en)
|
2021-05-11 |
2023-03-28 |
Asm Ip Holding B.V. |
Reactor wall for substrate processing apparatus
|
USD980814S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas distributor for substrate processing apparatus
|
US11584990B2
(en)
|
2021-07-02 |
2023-02-21 |
Applied Materials, Inc. |
Bottom fed sublimation bed for high saturation efficiency in semiconductor applications
|
CN115896744A
(zh)
*
|
2021-08-17 |
2023-04-04 |
北京北方华创微电子装备有限公司 |
半导体工艺设备
|
USD990441S1
(en)
|
2021-09-07 |
2023-06-27 |
Asm Ip Holding B.V. |
Gas flow control plate
|
CN113897593B
(zh)
*
|
2021-09-13 |
2023-08-11 |
浙江陶特容器科技股份有限公司 |
一种固态前驱体源存储升华器
|
JP7045743B1
(ja)
*
|
2021-10-11 |
2022-04-01 |
株式会社リンテック |
気化器
|
CN114318300B
(zh)
*
|
2021-12-30 |
2024-05-10 |
拓荆科技股份有限公司 |
一种半导体加工设备及其反应腔室、工艺管路穿腔模块
|
WO2024051920A1
(en)
|
2022-09-06 |
2024-03-14 |
Sk Inc. |
Container for feeding a precursor material
|
KR20240074503A
(ko)
|
2022-11-21 |
2024-05-28 |
(주)지오엘리먼트 |
세정 장치를 구비한 기화 시스템 및 이를 세정하는 세정 방법
|
KR20240074489A
(ko)
|
2022-11-21 |
2024-05-28 |
(주)지오엘리먼트 |
세정 장치를 구비한 기화 시스템 및 이를 세정하는 세정 방법
|
KR20240092507A
(ko)
|
2022-12-14 |
2024-06-24 |
(주)지오엘리먼트 |
버퍼 캐니스터를 구비한 전구체 공급 시스템
|