ATE139580T1 - Gasversorgungsvorrichtung und ihre verwendung für eine filmabscheidungsanlage - Google Patents

Gasversorgungsvorrichtung und ihre verwendung für eine filmabscheidungsanlage

Info

Publication number
ATE139580T1
ATE139580T1 AT90310507T AT90310507T ATE139580T1 AT E139580 T1 ATE139580 T1 AT E139580T1 AT 90310507 T AT90310507 T AT 90310507T AT 90310507 T AT90310507 T AT 90310507T AT E139580 T1 ATE139580 T1 AT E139580T1
Authority
AT
Austria
Prior art keywords
gas
supply device
gas supply
film deposition
starting
Prior art date
Application number
AT90310507T
Other languages
English (en)
Inventor
Nobuo Mikoshiba
Kazuo Tsubouchi
Kazuya Masu
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1250025A external-priority patent/JPH03112892A/ja
Priority claimed from JP1250027A external-priority patent/JP2776913B2/ja
Priority claimed from JP1250026A external-priority patent/JP2773918B2/ja
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE139580T1 publication Critical patent/ATE139580T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4485Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C23C16/20Deposition of aluminium only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C23C16/4482Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Air Bags (AREA)
  • Manufacturing And Processing Devices For Dough (AREA)
AT90310507T 1989-09-26 1990-09-25 Gasversorgungsvorrichtung und ihre verwendung für eine filmabscheidungsanlage ATE139580T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1250025A JPH03112892A (ja) 1989-09-26 1989-09-26 ガス供給装置
JP1250027A JP2776913B2 (ja) 1989-09-26 1989-09-26 ガス供給装置
JP1250026A JP2773918B2 (ja) 1989-09-26 1989-09-26 ガス供給装置

Publications (1)

Publication Number Publication Date
ATE139580T1 true ATE139580T1 (de) 1996-07-15

Family

ID=27333893

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90310507T ATE139580T1 (de) 1989-09-26 1990-09-25 Gasversorgungsvorrichtung und ihre verwendung für eine filmabscheidungsanlage

Country Status (8)

Country Link
US (3) US5476547A (de)
EP (1) EP0420596B1 (de)
KR (1) KR940005276B1 (de)
AT (1) ATE139580T1 (de)
DE (1) DE69027496T2 (de)
MY (1) MY107421A (de)
PT (1) PT95432B (de)
SG (1) SG45405A1 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5456945A (en) * 1988-12-27 1995-10-10 Symetrix Corporation Method and apparatus for material deposition
SG45405A1 (en) * 1989-09-26 1998-01-16 Canon Kk Gas feeding device and deposition film forming apparatus employing the same
EP0548990B1 (de) * 1991-12-26 1997-03-12 Canon Kabushiki Kaisha Herstellungsverfahren einer niedergeschlagenen Schicht mittels CVD, unter Verwendung von flüssigem Rohstoff und dazu geeignete Vorrichtung
JP3222518B2 (ja) * 1991-12-26 2001-10-29 キヤノン株式会社 液体原料気化装置および薄膜形成装置
FR2695944B1 (fr) * 1992-09-24 1994-11-18 Onera (Off Nat Aerospatiale) Appareil de dépôt chimique en phase vapeur activé par un plasma micro-ondes.
JPH06196419A (ja) * 1992-12-24 1994-07-15 Canon Inc 化学気相堆積装置及びそれによる半導体装置の製造方法
CA2158434A1 (en) * 1993-03-18 1994-09-29 Peter S. Kirlin Apparatus and method for delivering reagents in vapor form to a cvd reactor
AU6910096A (en) * 1995-09-01 1997-03-27 Encapsulation Technology, Llc Method and apparatus for encapsulating particulates
US5674574A (en) * 1996-05-20 1997-10-07 Micron Technology, Inc. Vapor delivery system for solid precursors and method regarding same
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
US6280793B1 (en) 1996-11-20 2001-08-28 Micron Technology, Inc. Electrostatic method and apparatus for vaporizing precursors and system for using same
US6074487A (en) * 1997-02-13 2000-06-13 Shimadzu Corporation Unit for vaporizing liquid materials
US5820678A (en) * 1997-05-30 1998-10-13 The Regents Of The University Of California Solid source MOCVD system
TW460943B (en) * 1997-06-11 2001-10-21 Applied Materials Inc Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions
JPH11312649A (ja) * 1998-04-30 1999-11-09 Nippon Asm Kk Cvd装置
US6271131B1 (en) 1998-08-26 2001-08-07 Micron Technology, Inc. Methods for forming rhodium-containing layers such as platinum-rhodium barrier layers
US6239028B1 (en) * 1998-09-03 2001-05-29 Micron Technology, Inc. Methods for forming iridium-containing films on substrates
GB9929279D0 (en) * 1999-12-11 2000-02-02 Epichem Ltd An improved method of and apparatus for the delivery of precursors in the vapour phase to a plurality of epitaxial reactor sites
EP1329540A3 (de) * 2000-07-03 2003-11-05 Epichem Limited Vorrichtung zur Zuführung von Gas-Vorläufern zu mehreren Epitaxiereaktoren
US6660631B1 (en) * 2000-08-31 2003-12-09 Micron Technology, Inc. Devices containing platinum-iridium films and methods of preparing such films and devices
US6613656B2 (en) * 2001-02-13 2003-09-02 Micron Technology, Inc. Sequential pulse deposition
US6561498B2 (en) * 2001-04-09 2003-05-13 Lorex Industries, Inc. Bubbler for use in vapor generation systems
JP4104300B2 (ja) * 2001-06-25 2008-06-18 三洋電機株式会社 複数機器制御システム
US20070032046A1 (en) * 2001-07-06 2007-02-08 Dmitriev Vladimir A Method for simultaneously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US6921062B2 (en) 2002-07-23 2005-07-26 Advanced Technology Materials, Inc. Vaporizer delivery ampoule
US7300038B2 (en) * 2002-07-23 2007-11-27 Advanced Technology Materials, Inc. Method and apparatus to help promote contact of gas with vaporized material
US6797337B2 (en) * 2002-08-19 2004-09-28 Micron Technology, Inc. Method for delivering precursors
US6868869B2 (en) * 2003-02-19 2005-03-22 Advanced Technology Materials, Inc. Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases
JP4714422B2 (ja) * 2003-04-05 2011-06-29 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. ゲルマニウムを含有するフィルムを堆積させる方法、及び蒸気送達装置
JP4689969B2 (ja) * 2003-04-05 2011-06-01 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. Iva族およびvia族化合物の調製
JP4954448B2 (ja) * 2003-04-05 2012-06-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 有機金属化合物
US20040237889A1 (en) * 2003-05-28 2004-12-02 Winbond Electronics Corporation Chemical gas deposition process and dry etching process and apparatus of same
US6909839B2 (en) * 2003-07-23 2005-06-21 Advanced Technology Materials, Inc. Delivery systems for efficient vaporization of precursor source material
US20050051087A1 (en) * 2003-09-08 2005-03-10 Taiwan Semiconductor Manufacturing Co., Ltd., Primer tank with nozzle assembly
DE10345824A1 (de) * 2003-09-30 2005-05-04 Infineon Technologies Ag Anordnung zur Abscheidung von atomaren Schichten auf Substraten
CA2566944C (en) * 2004-05-20 2016-10-11 Nam Hung Tran Bubbler for constant vapor delivery of a solid chemical
JP4845385B2 (ja) * 2004-08-13 2011-12-28 東京エレクトロン株式会社 成膜装置
US7722720B2 (en) 2004-12-08 2010-05-25 Rohm And Haas Electronic Materials Llc Delivery device
KR101299791B1 (ko) * 2005-03-16 2013-08-23 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 시약의 고체 소스로부터 시약을 운반하기 위한 시스템
GB2432371B (en) 2005-11-17 2011-06-15 Epichem Ltd Improved bubbler for the transportation of substances by a carrier gas
US8603250B2 (en) * 2006-06-27 2013-12-10 First Solar, Inc. System and method for deposition of a material on a substrate
US20080241805A1 (en) 2006-08-31 2008-10-02 Q-Track Corporation System and method for simulated dosimetry using a real time locating system
US8708320B2 (en) 2006-12-15 2014-04-29 Air Products And Chemicals, Inc. Splashguard and inlet diffuser for high vacuum, high flow bubbler vessel
TWI398541B (zh) 2007-06-05 2013-06-11 羅門哈斯電子材料有限公司 有機金屬化合物
US8142847B2 (en) 2007-07-13 2012-03-27 Rohm And Haas Electronic Materials Llc Precursor compositions and methods
US7659414B2 (en) 2007-07-20 2010-02-09 Rohm And Haas Company Method of preparing organometallic compounds
JP5104151B2 (ja) * 2007-09-18 2012-12-19 東京エレクトロン株式会社 気化装置、成膜装置、成膜方法及び記憶媒体
US7712249B1 (en) * 2007-11-16 2010-05-11 Monster Mosquito Systems, Llc Ultrasonic humidifier for repelling insects
US8296993B2 (en) * 2007-11-16 2012-10-30 Monster Mosquito Systems, Llc Ultrasonic humidifier for repelling insects
US8348248B2 (en) * 2009-03-11 2013-01-08 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Bubbling supply system for stable precursor supply
US8944420B2 (en) 2009-03-19 2015-02-03 Air Products And Chemicals, Inc. Splashguard for high flow vacuum bubbler vessel
US8162296B2 (en) 2009-03-19 2012-04-24 Air Products And Chemicals, Inc. Splashguard for high flow vacuum bubbler vessel
JP5690498B2 (ja) 2009-03-27 2015-03-25 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 基体上に膜を堆積する方法および気化前駆体化合物を送達する装置
EP2339048B1 (de) 2009-09-14 2016-12-07 Rohm and Haas Electronic Materials, L.L.C. Verfahren zum Abscheiden von organometallischen Verbindungen
EP2496733B1 (de) 2009-11-02 2021-08-04 Sigma-Aldrich Co. LLC Methode zum verdampfen
KR20200124780A (ko) 2012-05-31 2020-11-03 엔테그리스, 아이엔씨. 배취식 침착을 위한 고 물질 플럭스를 갖는 유체의 소스 시약-기반 수송
DE102013209673B3 (de) * 2013-05-24 2014-05-22 Heraeus Quarzglas Gmbh & Co. Kg Verfahren und Verdampfer zur Herstellung von synthetischem Quarzglas
US9957612B2 (en) 2014-01-17 2018-05-01 Ceres Technologies, Inc. Delivery device, methods of manufacture thereof and articles comprising the same
KR101878465B1 (ko) * 2016-07-12 2018-07-13 기초과학연구원 단결정 금속포일, 및 이의 제조방법
CN113166936A (zh) * 2018-12-11 2021-07-23 应用材料公司 安瓿飞溅缓解
EP4257250A1 (de) * 2022-04-06 2023-10-11 Molecular Plasma Group S.A. Verbesserter zerstäuber für ein plasmabeschichtungsgerät

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE283874C (de) *
US3016233A (en) * 1959-11-06 1962-01-09 Van D Olmstead Ultrasonic fuel and air mixer
NL299691A (de) * 1962-10-26
FR2110622A5 (de) * 1970-10-23 1972-06-02 Commissariat Energie Atomique
US4076617A (en) * 1971-04-22 1978-02-28 Tii Corporation Sonic cavitation and ozonation of waste material
US3967549A (en) * 1973-05-11 1976-07-06 Electroprint, Inc. Ink supply system for an ink mist printer
US4011157A (en) * 1976-01-30 1977-03-08 International Business Machines Corporation Ultrasonic removal of solid impurities from recirculating ink
US4134514A (en) * 1976-12-02 1979-01-16 J C Schumacher Co. Liquid source material container and method of use for semiconductor device manufacturing
US4529427A (en) * 1977-05-19 1985-07-16 At&T Bell Laboratories Method for making low-loss optical waveguides on an industrial scale
JPS5535855A (en) * 1978-09-04 1980-03-13 Matsushita Electric Ind Co Ltd Liquid fuel combusting apparatus
EP0058571A1 (de) * 1981-02-18 1982-08-25 National Research Development Corporation Verfahren und Vorrichtung zum Zuführen einer kontrollierten Menge eines Reaktanten bei einem Dampfphasen-Abscheidungsverfahren
US4436674A (en) * 1981-07-30 1984-03-13 J.C. Schumacher Co. Vapor mass flow control system
US4506815A (en) * 1982-12-09 1985-03-26 Thiokol Corporation Bubbler cylinder and dip tube device
US4517220A (en) * 1983-08-15 1985-05-14 Motorola, Inc. Deposition and diffusion source control means and method
JPS60131973A (ja) * 1983-12-19 1985-07-13 Matsushita Electric Ind Co Ltd 有機金属の気化方法
JPS60131968A (ja) * 1983-12-19 1985-07-13 Nec Corp 気相成長装置
US4842893A (en) * 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US5097800A (en) * 1983-12-19 1992-03-24 Spectrum Control, Inc. High speed apparatus for forming capacitors
JPS60154627A (ja) * 1984-01-25 1985-08-14 Hitachi Ltd 半導体装置の製造装置
AU563417B2 (en) * 1984-02-07 1987-07-09 Nippon Telegraph & Telephone Public Corporation Optical fibre manufacture
JPS6124227A (ja) * 1984-07-13 1986-02-01 Toshiba Corp 気相成長装置
JPS61187229A (ja) * 1985-02-14 1986-08-20 Sumitomo Electric Ind Ltd 気相成長による半導体製造装置
US4919304A (en) * 1985-08-01 1990-04-24 American Cyanamid Company Bubbler cylinder device
JPS6233769A (ja) * 1985-08-02 1987-02-13 Sumitomo Electric Ind Ltd 液体原料のバブリング装置
JPS6283400A (ja) * 1985-10-02 1987-04-16 Toyo Sutoufuaa Chem:Kk 有機金属気相成長用シリンダ−の改良法
JPS62207870A (ja) * 1986-03-10 1987-09-12 Mitsubishi Electric Corp 化学気相成長装置
JPS62229822A (ja) * 1986-03-31 1987-10-08 Toshiba Corp 砒化ガリウム層の気相成長方法
JPS62273714A (ja) * 1986-05-21 1987-11-27 Clarion Co Ltd 有機金属ガス供給方法および装置
US4761269A (en) * 1986-06-12 1988-08-02 Crystal Specialties, Inc. Apparatus for depositing material on a substrate
EP0270656B1 (de) * 1986-06-23 1993-06-02 SPECTRUM CONTROL, INC. (a Pennsylvania corporation) Bedampfen von flüssigen monomeren
US4954371A (en) * 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JPH0791649B2 (ja) * 1986-07-11 1995-10-04 日本鋼管株式会社 化学気相蒸着処理設備における処理用ガス供給装置
JP2559030B2 (ja) * 1986-07-25 1996-11-27 日本電信電話株式会社 金属薄膜の製造方法
JPH069191B2 (ja) * 1986-10-24 1994-02-02 住友電気工業株式会社 気相成長法による半導体製造装置
DE3705482A1 (de) * 1987-02-20 1988-09-01 Hoechst Ag Verfahren und anordnung zur oberflaechenvorbehandlung von kunststoff mittels einer elektrischen koronaentladung
JPS63210001A (ja) * 1987-02-26 1988-08-31 Mitsubishi Kasei Corp 球状圧電性セラミツクス粒子の製造法
DE3708967A1 (de) * 1987-03-19 1988-10-06 Merck Patent Gmbh Vorrichtung zur erzeugung eines gasgemisches nach dem saettigungsverfahren
JPS63314826A (ja) * 1987-06-17 1988-12-22 Sanyo Electric Co Ltd 気相成長装置
US5034372A (en) * 1987-12-07 1991-07-23 Mitsubishi Denki Kabushiki Kaisha Plasma based method for production of superconductive oxide layers
GB2213837B (en) * 1987-12-22 1992-03-11 Philips Electronic Associated Electronic device manufacture with deposition of material
GB8802942D0 (en) * 1988-02-09 1988-03-09 Aron Vecht & Co Ltd Methods & apparatus for depositing thin films
JPH01252776A (ja) * 1988-03-31 1989-10-09 Sony Corp 気相成長アルミニウム膜形成方法
DE3827628A1 (de) * 1988-08-16 1990-03-15 Hoechst Ag Verfahren und vorrichtung zur oberflaechenvorbehandlung eines formkoerpers aus kunststoff mittels einer elektrischen koronaentladung
US4911101A (en) * 1988-07-20 1990-03-27 General Electric Company Metal organic molecular beam epitaxy (MOMBE) apparatus
DE3827629A1 (de) * 1988-08-16 1990-03-15 Hoechst Ag Verfahren und vorrichtung zur oberflaechenvorbehandlung von ein- oder mehrschichtigem formmaterial mittels einer elektrischen koronaentladung
JP2570839B2 (ja) * 1988-12-22 1997-01-16 日本電気株式会社 A▲l▼ーCu合金薄膜形成方法
JPH02185026A (ja) * 1989-01-11 1990-07-19 Nec Corp Al薄膜の選択的形成方法
US4904419A (en) * 1989-03-14 1990-02-27 Reynolds Warren D Process and apparatus for vapor transfer of very high purity liquids at high dilution
SG45405A1 (en) * 1989-09-26 1998-01-16 Canon Kk Gas feeding device and deposition film forming apparatus employing the same
JPH03122117A (ja) * 1989-10-05 1991-05-24 Mitsubishi Rayon Co Ltd 防振材用樹脂
JPH0439922A (ja) * 1990-06-05 1992-02-10 Fujitsu Ltd 気相成長用蒸発器

Also Published As

Publication number Publication date
US5779804A (en) 1998-07-14
DE69027496D1 (de) 1996-07-25
DE69027496T2 (de) 1996-10-31
EP0420596B1 (de) 1996-06-19
US5755885A (en) 1998-05-26
SG45405A1 (en) 1998-01-16
MY107421A (en) 1995-12-30
PT95432B (pt) 1998-06-30
EP0420596A1 (de) 1991-04-03
US5476547A (en) 1995-12-19
PT95432A (pt) 1994-01-31
KR910007072A (ko) 1991-04-30
KR940005276B1 (ko) 1994-06-15

Similar Documents

Publication Publication Date Title
ATE139580T1 (de) Gasversorgungsvorrichtung und ihre verwendung für eine filmabscheidungsanlage
TW352457B (en) Chemical vapor phase growth apparatus (3)
PT77245A (en) Dispositif and process of chemical vapour deposition
ATE119215T1 (de) Chemische abscheidemethoden unter verwendung überkritischer lösungen.
DE3071057D1 (en) Process for reaction of epoxides with organic compounds having an active hydrogen
ZA801509B (en) Process for producing hydrogen from synthesis gas containing c.o.s.
JPS51138704A (en) Method and apparatus for producing synthetic fuel from solid waste
FI900252A (fi) Foerfarande och anordning foer framstaellning av heterogena katalysatorer.
ATE17111T1 (de) Verfahren zur durchfuehrung von chemischen reaktionen unter beteiligung von atomarem wasserstoff.
NO934505L (no) Fremgangsmåte for fremstilling av en organisk væske
ES466902A1 (es) Un metodo para formar una pelicula de fosforo-nitrogeno-oxi-geno.
EP0009685A3 (en) Process for the preparation of 2-vinylpyridine from acetylene and acrylonitrile and 2-vinylpyridine prepared by this process; organo-cobalt compounds
JPS55164072A (en) Coating
ES8402881A1 (es) Procedimiento para la fabricacion de una capa selectivamente absorvente para colectores solares.
JPS5321123A (en) Production of methylbenzenes
TH27024A (th) ระบบตัวเร่งปฏิกิริยาของพอลิเอธิลีนที่ง่ายขึ้น
TW328614B (en) Chemical gas phase growing device (4)
EP0079592A3 (de) Stabilisierung von Katalysatoren
NO873569D0 (no) Katalysatorsystem og fremgangsmaate for fremstilling av alkoholer fra olefiner og syntesegasser.
JPS57140650A (en) Catalyst for decomposing ozone
TH27024EX (th) ระบบตัวเร่งปฏิกิริยาของพอลิเอธิลีนที่ง่ายขึ้น
JPS52133086A (en) Gasphase growth
JPS52114270A (en) Vapor growing apparatus
JPS6481314A (en) Formation of doping silicon thin film
JPS5215594A (en) Process for preparing an optical active polymer

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties