KR890700693A - 클러스터 비임을 사용하는 에너지 인텐시브 표면 반응 - Google Patents

클러스터 비임을 사용하는 에너지 인텐시브 표면 반응

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KR890700693A
KR890700693A KR1019880701310A KR880701310A KR890700693A KR 890700693 A KR890700693 A KR 890700693A KR 1019880701310 A KR1019880701310 A KR 1019880701310A KR 880701310 A KR880701310 A KR 880701310A KR 890700693 A KR890700693 A KR 890700693A
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clusters
reactant
species
reaction
cluster
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KR1019880701310A
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KR910001773B1 (ko
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월프강 크나우어
존 엘. 바르텔트
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에이.더블유.카람벨라스
휴우즈 에어크라프트 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221—Ion beam deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources
    • H01J2237/0812—Ionized cluster beam [ICB] sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/961—Ion beam source and generation

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

내용 없음.

Description

클러스터 비임을 사용하는 에너지 인텐시브 표면 반응
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 단일 클러스터 비임 제조용 클러스터 비임 데포지션 장치의 개략적인 설명도이고,

Claims (19)

  1. 각 클러스터 당 2 내지 10,000개의 반응물 종을 함유하는 단위들을 함유하는 휘발성 반응물 종의 클러스터들을 형성하는 단계, 클러스터들을 이온화하는 단계, 클러스터들을 표면을 향해 가속시키는 단계, 및 표면상에 클러스터들을 충돌시킴으로써, 클러스터들이 붕해되어 표면에서의 화학반응에 반웅물과 에너지를 제공하는 단계로 이루어지는, 외부로부터 에너지는 얻는 표면에서의 화학반응의 완성 방법.
  2. 제1항에 있어서, 각 단위가 하나의 원자임을 특징으로 하는 방법.
  3. 제1항에 있어서, 각 단위가 분자임을 특징으로 하는 방법.
  4. 제1항에 있어서, 모든 반응물 종들이 클러스터들의 단위 중에 함유됨을 특징으로 하는 방법.
  5. 제l항에 있어서, 적어도 1종의 반응물은 클러스터들의 단위 중에 함유되고, 적어도 1종의 다른 반응물은 표면상에 존재하는 것을 특징으로 하는 방법.
  6. 제1항에 있어서, 적어도 1종의 반응물은 클러스터들의 단위 중에 함유되고, 적어도 1종의 다른 반응물은 다른 외부원으로부터 표면에 공급되는 것을 특징으로 하는 방법.
  7. 제1항에 있어서, 표면이 반도체 재료로 된 것임을 특징으로 하는 방법.
  8. 제1항에 있어서, 클러스터들이 단속적(斷續的)으로 표면에 충돌함을 특징으로 하는 방법.
  9. 클러스터 당 2 내지 l0,000개의 휘발성 반응물 에칭액 종으로 원 단위들을 함유하는 클러스터들을 형성하는 단계, 클러스터들을 이온화하는 단계, 클러스터들을 표면을 향해 가속시키는 단계, 및 클러스터들을 표면에 충돌시킴으로써, 클러스터들이 붕해되어 표면에서의 에칭 반응에 에칭액 종과 에너지를 제공하는 단계로 이루어지는 표면 에칭 방법.
  10. 제9항에 있어서, 각 단위가 가스 분자임을 특징으로 하는 방법.
  11. 제9항에 있어서, 에칭액 종이 할로겐을 함유 하는 분자임을 특징으로 하는 방법.
  12. 제9항의 방법에 의해 제조된 에칭된 표면.
  13. 클러스터 당 제1휘발성 반응물 종을 함유하는 단위 2 내지 약 10,000개를 함유하는 제1클러스터들을 형성하는 단계, 제1클러스터들을 이온화하는 단계, 제1클러스터들을 표면을 향해 가속시키는 단계, 제1클러스터들을 표면에 충돌시킴으로써, 제1클러스터들이 붕해되어 표면에서의 화학반응에 제1반응들과 에너지를 제공하는 단계, 클러스터 당 제2반응물 종을 함유하는 단위 2 내지 약 10,000개를 함유하는 제2클러스터들을 형성하는 단계, 제2클러스터들을 이온화하는 단계, 제2클러스터들을 표면을 향해 가속시키는 단계, 및 제2클러스터들을 표면에 충돌시킴으로써, 제2클러스터들이 붕해되어 표면에서의 화학반응에 제2반응물과 에너지를 제공하는 단계로 이루어지는, 외부로부터 에너지를 얻는 표면에서의 화학 반응의 완성 방법.
  14. 제13항에 있어서, 제1클러스터들의 충돌 단계 및 제2클러스터들의 충돌 단계가 실질적으로 동시에 일어나는 것을 특징으로 하는 방법.
  15. 각 클러스터당 피막으로 데포지션될 휘발성 반응물 종으로된 단위 2 내지 약 10,000개를 함유하는 클러스터들을 형성하는 단계, 클러스터들을 이온화하는 단계. 클러스터들을 표면을 향해 가속시키는 단계, 및 클러스터들을 표면에 충돌시킴으로써, 클러스터들이 붕해되어 표면에서의 대포지션 반응에 반응물 종과 에너지를 제공하는 단계로 이루어지고, 이 화학 반응의 결과로서 생성된 피막이 클러스터로서 제공된 종들을 포함 하는 것을 특징으로 하는, 표면상에 반응 피막을 제조하는 방법.
  16. 제15항에 있어서, 화학 반응이 클러스터 단위들의 분해 반응인 것을 특징으로 하는 방법.
  17. 제15항에 있어서, 화학 반응이 클러스터중의 반응물 중과 표면상의 다른 종과의 반응인 것을 특징으로 하는 방법.
  18. 제15항에 있어서, 화학 반응이 클러스터 중의 반응물 종과 다른 외부원으로부터 표면에 제공된 다른 종과의 반응인 것을 특징으로 하는 방법.
  19. 표면상에 제15항의 방법에 의해 제조된 반응 피막을 갖는 표면.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880701310A 1987-02-20 1987-11-19 클러스터 비임을 사용하는 에너지 집중 표면 반응 KR910001773B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US017,380 1987-02-20
US07/017,380 US4740267A (en) 1987-02-20 1987-02-20 Energy intensive surface reactions using a cluster beam
US0L7380 1987-02-20
PCT/US1987/003043 WO1988006194A1 (en) 1987-02-20 1987-11-19 Energy intensive surface reactions using a cluster beam

Publications (2)

Publication Number Publication Date
KR890700693A true KR890700693A (ko) 1989-04-26
KR910001773B1 KR910001773B1 (ko) 1991-03-23

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ID=21782265

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KR1019880701310A KR910001773B1 (ko) 1987-02-20 1987-11-19 클러스터 비임을 사용하는 에너지 집중 표면 반응

Country Status (7)

Country Link
US (1) US4740267A (ko)
EP (1) EP0417067B1 (ko)
JP (1) JPH01502203A (ko)
KR (1) KR910001773B1 (ko)
DE (1) DE3789814T2 (ko)
HK (1) HK107394A (ko)
WO (1) WO1988006194A1 (ko)

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US4740267A (en) 1988-04-26
WO1988006194A1 (en) 1988-08-25
JPH0548301B2 (ko) 1993-07-21
HK107394A (en) 1994-10-14
EP0417067B1 (en) 1994-05-11
DE3789814T2 (de) 1994-08-25
EP0417067A1 (en) 1991-03-20
KR910001773B1 (ko) 1991-03-23
DE3789814D1 (de) 1994-06-16
JPH01502203A (ja) 1989-08-03

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