JP2006503178A - 蒸発器配送アンプル - Google Patents
蒸発器配送アンプル Download PDFInfo
- Publication number
- JP2006503178A JP2006503178A JP2004523054A JP2004523054A JP2006503178A JP 2006503178 A JP2006503178 A JP 2006503178A JP 2004523054 A JP2004523054 A JP 2004523054A JP 2004523054 A JP2004523054 A JP 2004523054A JP 2006503178 A JP2006503178 A JP 2006503178A
- Authority
- JP
- Japan
- Prior art keywords
- container
- ampoule
- vertically stacked
- delivery system
- carrier gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003708 ampul Substances 0.000 title claims description 100
- 239000012159 carrier gas Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 69
- 239000007787 solid Substances 0.000 claims description 47
- 239000007789 gas Substances 0.000 claims description 40
- 239000002243 precursor Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000004891 communication Methods 0.000 claims description 11
- 238000001704 evaporation Methods 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000011143 downstream manufacturing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 17
- 238000005229 chemical vapour deposition Methods 0.000 description 15
- 238000000859 sublimation Methods 0.000 description 11
- 230000008022 sublimation Effects 0.000 description 11
- 239000000376 reactant Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 for example Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 238000005092 sublimation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UYHCMHBPNSWPMT-UHFFFAOYSA-N C1(=CC=CC=CC1)[Ti] Chemical compound C1(=CC=CC=CC1)[Ti] UYHCMHBPNSWPMT-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XUAZJHGVVIBHFU-UHFFFAOYSA-N [Ti]C1=CC=CC1.C1=CC=CC=CC=C1 Chemical compound [Ti]C1=CC=CC1.C1=CC=CC=CC=C1 XUAZJHGVVIBHFU-UHFFFAOYSA-N 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- FQNHWXHRAUXLFU-UHFFFAOYSA-N carbon monoxide;tungsten Chemical group [W].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] FQNHWXHRAUXLFU-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PDPJQWYGJJBYLF-UHFFFAOYSA-J hafnium tetrachloride Chemical compound Cl[Hf](Cl)(Cl)Cl PDPJQWYGJJBYLF-UHFFFAOYSA-J 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- NLLZTRMHNHVXJJ-UHFFFAOYSA-J titanium tetraiodide Chemical compound I[Ti](I)(I)I NLLZTRMHNHVXJJ-UHFFFAOYSA-J 0.000 description 1
- QJXLIDXWUXDHMK-UHFFFAOYSA-N titanium(2+);diazide Chemical compound [Ti+2].[N-]=[N+]=[N-].[N-]=[N+]=[N-] QJXLIDXWUXDHMK-UHFFFAOYSA-N 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
- C23C16/4483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material using a porous body
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C11/00—Use of gas-solvents or gas-sorbents in vessels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C3/00—Vessels not under pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C3/00—Vessels not under pressure
- F17C3/02—Vessels not under pressure with provision for thermal insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2203/00—Vessel construction, in particular walls or details thereof
- F17C2203/03—Thermal insulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S261/00—Gas and liquid contact apparatus
- Y10S261/65—Vaporizers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
本発明は蒸発器に関し、より詳細には、たとえば、化学気相成長(CVD)法、原子層化学気相成長(ALCVD)法およびイオン注入法において用いられる液体および固体ソース試薬などの液体および固体材料の蒸発のために、拡大した表面積を提供する多数の容器を有する蒸発器配送システムに関する。
化学気相成長法(CVD)は、半導体ウエハ処理において、フィルムおよび被膜の前処理用として広範に用いられてきた。CVDは、たとえば、比較的迅速な処理時間において、非常にコンフォーマルで高質なフィルムを提供するその能力のために、多くの点で好まれている堆積法である。さらに、CVDは、深いコンタクトおよび他の開口部に関してさえも、非常にコンフォーマルなフィルムを提供することを始めとして、不整な形状の基板を被膜するのに有益である。
本発明は、半導体製造用途のために特定の有用性を有する固体および液体ケミカルソースを蒸発させるための蒸発器システムおよび方法に関する。
a)可蒸発ソース材料を保持するための少なくとも1つの容器と、
b)容器に配置された複数の孔付き突出部であって、可蒸発ソース材料が通過するための通路を提供する孔付き突出部と、
c)容器を通過するためのキャリヤガスストリームを導入するキャリヤガス管と、
を備える。
a)アンプル底部と、側壁と、着脱自在の上端部とを含み、内部アンプル室を形成するアンプルと、
b)アンプルに連通して結合したガス入口およびガス出口と、
c)内部アンプル室内に配置された少なくとも1つの容器であって、容器底部および側壁を含み、容器キャビティを形成する容器と、
d)少なくとも容器底部に配置され、容器底部を通して通路を提供する複数の孔付き突出部であって、容器キャビティ内に延伸する孔付き突出部と、
を備える。
a)各容器がソース材料を保持するためのキャビティを有している複数の垂直に積重された容器と、
b)垂直に積重された容器のそれぞれに配置され、各それぞれのキャビティ内に延伸する複数の孔付き突出部であって、近接し垂直に積重された容器間に、キャリヤガスが通過するための通路を形成する孔付き突出部と、
c)複数の垂直に積重された容器と接触し、かつ各垂直に積重された容器のキャビティを通して延伸するキャリヤガス管と、
を備える。
a)アンプル底部およびアンプル側壁を有して、内室を形成するアンプルと、
b)内室を密閉するアンプル上端部と、
c)アンプル上端部に連通して結合したガス入口および出口と、
d)内室内に配置された、複数の垂直に積重され接触している容器であって、各容器が、容器底部および容器側壁を含み、固体前駆体材料を保持するための容器キャビティを形成し、各容器側壁が、アンプル側壁と接触している容器と、
e)各容器底部に配置され、かつ、近接し垂直に積重され接触している容器間に通路を提供する複数の孔付き突出部であって、容器キャビティ内に延伸する孔付き突出部と、
f)内室内に配置され、かつキャリヤガスを垂直に積重され接触している容器の下へ導くために、ガス入口に連通されているキャリヤガス浸漬管と、
g)アンプルを加熱するための手段と、
を備える。
a)蒸発可能ソース材料を自身に含む複数の相互接続され垂直に積重された容器を提供することであって、相互接続され垂直に積重された容器のそれぞれが、複数の通路付き突出部を含むことと、
b)相互接続され垂直に積重された容器を、封止可能アンプル内に配置することと、
c)封止可能アンプル内のソース材料を蒸発させるのに十分な量で、封止可能アンプルに熱を印加することと、
d)蒸発されたソース材料を、封止可能アンプルを通してプロセスチャンバに移動させるために、キャリヤガスを封止可能アンプルに導入することと、
を含む。
本発明は、次の知見に基づいている。すなわち、蒸発器システムで用いられるある一定のソース材料は、典型的な堆積用途に必要とされるフローレートを満たすのに十分な量で適切に蒸発されないということである。場合によっては、必要なフローレートを達成するために、200℃を超える高温を用いて、ソース材料の分解を引き起こす可能性のある昇華速度を増加した。
図1に示すような、本発明のアンプル内に積重された5つの容器を有する容器ユニットを含む本発明の蒸発器をテストし、アンプルから容器への熱伝導性の有効性を判定した。アンプルは、良質なステンレス鋼で製造され、アンプル周囲の回りにぴったり合う形状を有するブロックヒータに接続された。ヒータは、可変AC電圧源でありかつ加熱の程度を制御する可変トランスに接続された。アンプル内に配置された個別容器のいくつか、すなわち、容器1および5が、加熱の均一性およびアンプルから容器への熱移動の有効性を判定するために、温度センサに接続された。アンプルに導入され、かつ約500sccmで容器ユニットを通過するキャリヤガスのソースに、アンプルを接続した。図7に示すように、アンプルに装着されたヒータの温度が上昇するにつれて、容器で検知された内部温度もまた、熱伝導の有効性に応じて上昇した。容器1および5で検知された温度は、アンプルの温度と同等であり、容器の積重を通した加熱の均一性を示した。かくして、個別容器は、前駆体材料を蒸発させるために均一に加熱される追加表面積を提供する。
Claims (32)
- ソース材料の蒸発および配送のための蒸気配送システムであって、
a)アンプル底部と、側壁と、着脱自在の上端部とを含み、内部アンプル室を形成するアンプルと、
b)前記アンプルに連通して結合されたガス入口およびガス出口と、
c)前記内部アンプル室内に配置された少なくとも1つのソース材料容器であって、容器底部および側壁を含み、容器キャビティを形成する容器と、
d)少なくとも前記容器底部に配置され、前記容器底部を通して通路を提供する複数の孔付き突出部であって、前記容器キャビティ内に延伸する孔付き突出部と、
を備えるシステム。 - 前記内室内に配置され、前記容器底部を通って延伸し、かつ前記ガス入口に連通して結合した内部ガス搬送部材をさらに備える、請求項1に記載の蒸気配送システム。
- 前記内部ガス搬送部材は、前記容器底部の中央を通って延伸する、請求項2に記載の蒸気配送システム。
- 前記容器側壁は、容器内に固体前駆体を保持するために十分に高い、請求項2に記載の蒸気配送システム。
- 前記複数の孔付き突出部は、前記容器側壁に配置されている、請求項2に記載の蒸気配送システム。
- 前記容器底部、前記側壁および前記複数の孔付き突出部は、前記アンプルにおける前記内室の表面積と略同等の表面積を有している、請求項1に記載の蒸気配送システム。
- 前記内室に配置された複数の垂直に積重された容器を含む、請求項5に記載の蒸気配送システム。
- 各容器側壁は、上に重なり垂直に近接する容器と接触するのに十分な高さがあり、容器間にガス保持スペースを形成する、請求項7に記載の蒸気配送システム。
- 前記孔付き突出部の高さは、前記容器側壁の高さよりも低い、請求項8に記載の蒸気配送システム。
- 前記内部ガス搬送部材は、前記複数の垂直に積重された容器を通して延伸する、請求項9に記載の蒸気配送システム。
- 前記複数の垂直に積重された容器それぞれの前記容器側壁は、前記アンプル側壁と接触する、請求項10に記載の蒸気配送システム。
- 前記内部ガス搬送部材と、前記複数の垂直に積重された容器それぞれを通して延伸する箇所との間に配置された封止用O−リングをさらに含む、請求項11に記載の蒸気配送システム。
- 前記ガス入口および前記ガス出口は、前記アンプル上端部に配置されている、請求項12に記載の蒸気配送システム。
- 前記ガス入口は、前記アンプル上端部の略中央に配置されている、請求項13に記載の蒸気配送システム。
- 前記内部ガス搬送部材は、キャリヤガス浸漬管である、請求項14に記載の蒸気配送システム。
- 前記キャリヤガス浸漬管は、前記複数の垂直に積重された容器を通って、前記内室の底部に延伸する、請求項15に記載の蒸気配送システム。
- 前記孔付き突出部は、第2の端部よりも小さい直径を備えた第1の端部を有する漏斗形状をしている、請求項15に記載の蒸気配送システム。
- より小さい直径を備えた前記第1の端部が前記容器キャビティ内に延伸し、もって、キャリヤガスを前記ガス出口に導き、キャリヤガスの逆流を低減する、請求項17に記載の蒸気配送システム。
- 前記アンプルおよび前記複数の垂直に積重された容器は、熱伝導材料から構成されている、請求項15に記載の蒸気配送システム。
- 前記アンプルを加熱するための手段をさらに備える、請求項1に記載の蒸気配送システム。
- a)アンプル底部およびアンプル側壁を含み、内室を形成するアンプルと、
b)前記内室を密閉するアンプル上端部と、
c)前記アンプル上端部に連通して結合したガス入口およびガス出口と、
d)前記内室内に配置された、複数の垂直に積重され接触している容器であって、各容器が、容器底部および容器側壁を含み、固体前駆体材料を保持するための容器キャビティを形成し、各容器側壁が、前記アンプル側壁と接触している容器と、
e)各容器底部に配置され、かつ、近接し垂直に積重され接触している容器間に通路を提供する複数の孔付き突出部であって、前記容器キャビティ内に延伸する孔付き突出部と、
f)前記内室内に配置され、かつ、キャリヤガスを前記垂直に積重され接触している容器の下へ導くために前記ガス入口に連通して結合しているキャリヤガス浸漬管と、
g)前記アンプルを加熱するための手段と、
を備える蒸発器。 - a)各容器がソース材料を保持するためのキャビティを有する複数の垂直に積重された容器と、
b)前記垂直に積重された容器のそれぞれに配置され、かつ、各それぞれのキャビティ内に延伸する複数の孔付き突出部であって、近接し垂直に積重された容器間でキャリヤガスが通過するための通路を形成する孔付き突出部と、
c)前記複数の垂直に積重された容器と接触し、かつ、各垂直に積重された容器の前記キャビティを通して延伸するキャリヤガス管と、
を備える蒸発器ユニット。 - 前記垂直に積重された容器のそれぞれが、少なくとも1つの近接する容器と接触している、請求項22に記載の蒸発器ユニット。
- 前記突出部は漏斗形状であり、かつ、前記容器キャビティ内に延伸するにつれて狭くなる、請求項22に記載の蒸発器ユニット。
- 前記ソース材料が、固体前駆体である、請求項22に記載の蒸発器ユニット。
- 前記突出部は、前記固体前駆体を流動化するために、前記固体前駆体を通してキャリヤガスを移動させるための孔を自身に含む側壁を有する、請求項25に記載の蒸発器ユニット。
- a)可蒸発ソース材料を保持するための少なくとも1つの容器と、
b)前記容器に配置された複数の孔付き突出部であって、前記可蒸発ソース材料の通過のための通路を提供する孔付き突出部と、
c)前記容器を通過するための前記キャリヤガスのストリームを導入するキャリヤガス管と、
を備える蒸発器ユニット。 - 蒸発されたソース材料を、下流のプロセスチャンバに配送するための方法であって、
a)可蒸発ソース材料を自身に含む複数の相互接続され垂直に積重された容器を提供することであって、相互接続され垂直に積重された容器のそれぞれが、複数の通路付き突出部を含むことと、
b)前記相互接続され垂直に積重された容器を、封止可能アンプル内に配置することと、
c)前記封止可能アンプル内の前記ソース材料を蒸発させるのに十分な量で、前記封止可能アンプルに熱を印加することと、
d)前記蒸発されたソース材料を、前記封止可能アンプルを通して前記プロセスチャンバに移動させるために、キャリヤガスを前記封止可能アンプルに導入することと、
を含む方法。 - 前記孔付き容器は、複数の孔付き突出部を含み、近接し垂直に積重された容器間で通路を形成する、請求項28に記載の方法。
- 前記垂直に積重された容器が、少なくとも1つの近接する容器と接触している、請求項28に記載の方法。
- 前記ソース材料が、固体前駆体である、請求項28に記載の方法。
- a)アンプル底部およびアンプル側壁を含み、内室を形成するアンプルと、
b)前記内室を密閉するアンプル上端部と、
c)前記アンプル上端部に連通して結合されたガス入口およびガス出口と、
d)前記内室内に配置された、複数の垂直に積重され接触している容器であって、各容器が、容器底部および容器側壁を含み、固体前駆体材料を保持するための容器キャビティを形成し、各容器側壁が、前記アンプル側壁と接触している容器と、
e)各容器底部に配置され、近接し垂直に積重され接触している容器間で通路を提供する複数の孔と、
f)前記内室内に配置され、かつ、キャリヤガスを前記垂直に積重され接触している容器の下へ導くために前記ガス入口に連通して結合されたキャリヤガス浸漬管と、
g)前記アンプルを加熱するための手段と、
を備える蒸発器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/201,518 US6921062B2 (en) | 2002-07-23 | 2002-07-23 | Vaporizer delivery ampoule |
US10/201,518 | 2002-07-23 | ||
PCT/US2003/020825 WO2004010463A2 (en) | 2002-07-23 | 2003-07-01 | Vaporizer delivery ampoule |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009283359A Division JP5538857B2 (ja) | 2002-07-23 | 2009-12-14 | 蒸発器配送アンプル |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006503178A true JP2006503178A (ja) | 2006-01-26 |
JP2006503178A5 JP2006503178A5 (ja) | 2006-08-17 |
JP4843218B2 JP4843218B2 (ja) | 2011-12-21 |
Family
ID=30769655
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004523054A Expired - Lifetime JP4843218B2 (ja) | 2002-07-23 | 2003-07-01 | 蒸発器配送アンプル |
JP2009283359A Expired - Lifetime JP5538857B2 (ja) | 2002-07-23 | 2009-12-14 | 蒸発器配送アンプル |
JP2014013897A Expired - Lifetime JP6230431B2 (ja) | 2002-07-23 | 2014-01-29 | 蒸発器配送アンプル |
JP2015079307A Expired - Lifetime JP6293699B2 (ja) | 2002-07-23 | 2015-04-08 | 蒸発器配送アンプル |
JP2016011999A Expired - Lifetime JP6157025B2 (ja) | 2002-07-23 | 2016-01-26 | 蒸発器配送アンプル及びその利用方法 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009283359A Expired - Lifetime JP5538857B2 (ja) | 2002-07-23 | 2009-12-14 | 蒸発器配送アンプル |
JP2014013897A Expired - Lifetime JP6230431B2 (ja) | 2002-07-23 | 2014-01-29 | 蒸発器配送アンプル |
JP2015079307A Expired - Lifetime JP6293699B2 (ja) | 2002-07-23 | 2015-04-08 | 蒸発器配送アンプル |
JP2016011999A Expired - Lifetime JP6157025B2 (ja) | 2002-07-23 | 2016-01-26 | 蒸発器配送アンプル及びその利用方法 |
Country Status (9)
Country | Link |
---|---|
US (8) | US6921062B2 (ja) |
EP (2) | EP1539336B1 (ja) |
JP (5) | JP4843218B2 (ja) |
KR (4) | KR20080098448A (ja) |
CN (3) | CN101033537A (ja) |
AU (1) | AU2003245757A1 (ja) |
SG (3) | SG179319A1 (ja) |
TW (1) | TWI303461B (ja) |
WO (1) | WO2004010463A2 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007211346A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Electron Ltd | 膜前駆体蒸発システムにおいて使用される膜前駆体のトレーおよびその使用方法 |
JP2010502833A (ja) * | 2006-08-31 | 2010-01-28 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 制御された固体モルフォロジを利用する、固体前駆体に基づいた流体の送出 |
WO2012168924A1 (en) * | 2011-06-09 | 2012-12-13 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Supply apparatus and method of solid material gas |
JP2013028854A (ja) * | 2011-07-29 | 2013-02-07 | Air Liquide Japan Ltd | 固体材料ガスの供給装置および供給方法 |
WO2015029457A1 (en) | 2013-09-02 | 2015-03-05 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for producing pyromellitic dianhydride, pyromellitic dianhydride produced by the method, and apparatus therefor |
JP2016000866A (ja) * | 2004-06-01 | 2016-01-07 | インテグリス・インコーポレーテッド | ガスと蒸発材料との接触を促進するのを助ける方法及び装置 |
US9469898B2 (en) | 2002-07-23 | 2016-10-18 | Entegris, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
JP6324609B1 (ja) * | 2017-06-21 | 2018-05-16 | 日本エア・リキード株式会社 | 固体材料容器およびその固体材料容器に固体材料が充填されている固体材料製品 |
WO2019058969A1 (ja) * | 2017-09-21 | 2019-03-28 | 株式会社Kokusai Electric | 貯留容器、気化器、基板処理装置および半導体装置の製造方法 |
JP2019513646A (ja) * | 2016-04-19 | 2019-05-30 | インテグリス・インコーポレーテッド | 不正開放防止化学薬品パッケージ |
JP2021507104A (ja) * | 2017-12-14 | 2021-02-22 | インテグリス・インコーポレーテッド | 改良型アンプル蒸発装置およびベッセル |
JP2021190487A (ja) * | 2020-05-27 | 2021-12-13 | 大陽日酸株式会社 | 固体材料供給装置 |
JP7045743B1 (ja) | 2021-10-11 | 2022-04-01 | 株式会社リンテック | 気化器 |
Families Citing this family (551)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6671223B2 (en) * | 1996-12-20 | 2003-12-30 | Westerngeco, L.L.C. | Control devices for controlling the position of a marine seismic streamer |
US6878206B2 (en) * | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US20080268635A1 (en) * | 2001-07-25 | 2008-10-30 | Sang-Ho Yu | Process for forming cobalt and cobalt silicide materials in copper contact applications |
US20090004850A1 (en) * | 2001-07-25 | 2009-01-01 | Seshadri Ganguli | Process for forming cobalt and cobalt silicide materials in tungsten contact applications |
US8110489B2 (en) * | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
WO2003030224A2 (en) * | 2001-07-25 | 2003-04-10 | Applied Materials, Inc. | Barrier formation using novel sputter-deposition method |
US20030029715A1 (en) * | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
US9051641B2 (en) * | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US6936906B2 (en) * | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7780785B2 (en) * | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
US6916398B2 (en) * | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
AU2003238853A1 (en) * | 2002-01-25 | 2003-09-02 | Applied Materials, Inc. | Apparatus for cyclical deposition of thin films |
US6866746B2 (en) * | 2002-01-26 | 2005-03-15 | Applied Materials, Inc. | Clamshell and small volume chamber with fixed substrate support |
US6972267B2 (en) | 2002-03-04 | 2005-12-06 | Applied Materials, Inc. | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor |
US7601225B2 (en) * | 2002-06-17 | 2009-10-13 | Asm International N.V. | System for controlling the sublimation of reactants |
US7186385B2 (en) * | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
US6915592B2 (en) * | 2002-07-29 | 2005-07-12 | Applied Materials, Inc. | Method and apparatus for generating gas to a processing chamber |
JP4585852B2 (ja) * | 2002-07-30 | 2010-11-24 | エーエスエム アメリカ インコーポレイテッド | 基板処理システム、基板処理方法及び昇華装置 |
US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
US20040069227A1 (en) * | 2002-10-09 | 2004-04-15 | Applied Materials, Inc. | Processing chamber configured for uniform gas flow |
US6905737B2 (en) * | 2002-10-11 | 2005-06-14 | Applied Materials, Inc. | Method of delivering activated species for rapid cyclical deposition |
EP1420080A3 (en) * | 2002-11-14 | 2005-11-09 | Applied Materials, Inc. | Apparatus and method for hybrid chemical deposition processes |
US6868869B2 (en) * | 2003-02-19 | 2005-03-22 | Advanced Technology Materials, Inc. | Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases |
US20040177813A1 (en) | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
US7342984B1 (en) | 2003-04-03 | 2008-03-11 | Zilog, Inc. | Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character |
US7547363B2 (en) * | 2003-07-08 | 2009-06-16 | Tosoh Finechem Corporation | Solid organometallic compound-filled container and filling method thereof |
US6909839B2 (en) * | 2003-07-23 | 2005-06-21 | Advanced Technology Materials, Inc. | Delivery systems for efficient vaporization of precursor source material |
US7211454B2 (en) * | 2003-07-25 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate |
US7261118B2 (en) * | 2003-08-19 | 2007-08-28 | Air Products And Chemicals, Inc. | Method and vessel for the delivery of precursor materials |
US7494905B2 (en) * | 2003-08-21 | 2009-02-24 | Texas Instruments Incorporated | Method for preparing a source material including forming a paste for ion implantation |
US7156380B2 (en) * | 2003-09-29 | 2007-01-02 | Asm International, N.V. | Safe liquid source containers |
US20050095859A1 (en) * | 2003-11-03 | 2005-05-05 | Applied Materials, Inc. | Precursor delivery system with rate control |
CN1964620B (zh) * | 2003-12-12 | 2010-07-21 | 山米奎普公司 | 对从固体升华的蒸气流的控制 |
US20080073559A1 (en) * | 2003-12-12 | 2008-03-27 | Horsky Thomas N | Controlling the flow of vapors sublimated from solids |
US20050252449A1 (en) * | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
US20060019033A1 (en) * | 2004-05-21 | 2006-01-26 | Applied Materials, Inc. | Plasma treatment of hafnium-containing materials |
US20060153995A1 (en) * | 2004-05-21 | 2006-07-13 | Applied Materials, Inc. | Method for fabricating a dielectric stack |
US8119210B2 (en) * | 2004-05-21 | 2012-02-21 | Applied Materials, Inc. | Formation of a silicon oxynitride layer on a high-k dielectric material |
US8323754B2 (en) * | 2004-05-21 | 2012-12-04 | Applied Materials, Inc. | Stabilization of high-k dielectric materials |
US7741621B2 (en) * | 2004-07-14 | 2010-06-22 | City University Of Hong Kong | Apparatus and method for focused electric field enhanced plasma-based ion implantation |
US7819981B2 (en) * | 2004-10-26 | 2010-10-26 | Advanced Technology Materials, Inc. | Methods for cleaning ion implanter components |
US7638002B2 (en) * | 2004-11-29 | 2009-12-29 | Tokyo Electron Limited | Multi-tray film precursor evaporation system and thin film deposition system incorporating same |
US20060185597A1 (en) * | 2004-11-29 | 2006-08-24 | Kenji Suzuki | Film precursor evaporation system and method of using |
US7488512B2 (en) * | 2004-11-29 | 2009-02-10 | Tokyo Electron Limited | Method for preparing solid precursor tray for use in solid precursor evaporation system |
US7484315B2 (en) * | 2004-11-29 | 2009-02-03 | Tokyo Electron Limited | Replaceable precursor tray for use in a multi-tray solid precursor delivery system |
US7708835B2 (en) * | 2004-11-29 | 2010-05-04 | Tokyo Electron Limited | Film precursor tray for use in a film precursor evaporation system and method of using |
FR2878453B1 (fr) * | 2004-11-30 | 2007-03-16 | Centre Nat Rech Scient Cnrse | Dispositif de fourniture de vapeurs d'un precurseur solide a un appareil de traitement |
EP1866074A4 (en) * | 2005-03-16 | 2017-01-04 | Entegris Inc. | System for delivery of reagents from solid sources thereof |
US8197898B2 (en) | 2005-03-29 | 2012-06-12 | Tokyo Electron Limited | Method and system for depositing a layer from light-induced vaporization of a solid precursor |
US7566477B2 (en) | 2005-03-31 | 2009-07-28 | Tokyo Electron Limited | Method for saturating a carrier gas with precursor vapor |
US7345184B2 (en) | 2005-03-31 | 2008-03-18 | Tokyo Electron Limited | Method and system for refurbishing a metal carbonyl precursor |
US7132128B2 (en) | 2005-03-31 | 2006-11-07 | Tokyo Electron Limited | Method and system for depositing material on a substrate using a solid precursor |
US7651570B2 (en) * | 2005-03-31 | 2010-01-26 | Tokyo Electron Limited | Solid precursor vaporization system for use in chemical vapor deposition |
US7485338B2 (en) | 2005-03-31 | 2009-02-03 | Tokyo Electron Limited | Method for precursor delivery |
DE102005030862B4 (de) * | 2005-07-01 | 2009-12-24 | Sintec Keramik Gmbh | Erstbenetzungshilfsmaterial für einen Verdampferkörper, seine Verwendung zum Herrichten der Verdampferfläche eines Verdampferkörpers und ein elektrisch beheizbarer keramischer Verdampferkörper |
US20070020890A1 (en) * | 2005-07-19 | 2007-01-25 | Applied Materials, Inc. | Method and apparatus for semiconductor processing |
US20070049043A1 (en) * | 2005-08-23 | 2007-03-01 | Applied Materials, Inc. | Nitrogen profile engineering in HI-K nitridation for device performance enhancement and reliability improvement |
US7402534B2 (en) * | 2005-08-26 | 2008-07-22 | Applied Materials, Inc. | Pretreatment processes within a batch ALD reactor |
CN103170447B (zh) | 2005-08-30 | 2015-02-18 | 先进科技材料公司 | 使用替代的氟化含硼前驱体的硼离子注入和用于注入的大氢化硼的形成 |
US20070065578A1 (en) * | 2005-09-21 | 2007-03-22 | Applied Materials, Inc. | Treatment processes for a batch ALD reactor |
US7459395B2 (en) | 2005-09-28 | 2008-12-02 | Tokyo Electron Limited | Method for purifying a metal carbonyl precursor |
US7464917B2 (en) * | 2005-10-07 | 2008-12-16 | Appiled Materials, Inc. | Ampoule splash guard apparatus |
US20070119371A1 (en) | 2005-11-04 | 2007-05-31 | Paul Ma | Apparatus and process for plasma-enhanced atomic layer deposition |
GB2432371B (en) * | 2005-11-17 | 2011-06-15 | Epichem Ltd | Improved bubbler for the transportation of substances by a carrier gas |
US7297719B2 (en) | 2006-03-29 | 2007-11-20 | Tokyo Electron Limited | Method and integrated system for purifying and delivering a metal carbonyl precursor |
US7432195B2 (en) * | 2006-03-29 | 2008-10-07 | Tokyo Electron Limited | Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features |
US8951478B2 (en) * | 2006-03-30 | 2015-02-10 | Applied Materials, Inc. | Ampoule with a thermally conductive coating |
US7562672B2 (en) | 2006-03-30 | 2009-07-21 | Applied Materials, Inc. | Chemical delivery apparatus for CVD or ALD |
US7967911B2 (en) * | 2006-04-11 | 2011-06-28 | Applied Materials, Inc. | Apparatus and methods for chemical vapor deposition |
SG171606A1 (en) * | 2006-04-26 | 2011-06-29 | Advanced Tech Materials | Cleaning of semiconductor processing systems |
US20070252299A1 (en) * | 2006-04-27 | 2007-11-01 | Applied Materials, Inc. | Synchronization of precursor pulsing and wafer rotation |
US7798096B2 (en) * | 2006-05-05 | 2010-09-21 | Applied Materials, Inc. | Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool |
US20070259111A1 (en) * | 2006-05-05 | 2007-11-08 | Singh Kaushal K | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film |
WO2007142700A1 (en) * | 2006-06-02 | 2007-12-13 | Advanced Technology Materials, Inc. | Copper (i) amidinates and guanidinates for forming copper thin films |
US7601648B2 (en) | 2006-07-31 | 2009-10-13 | Applied Materials, Inc. | Method for fabricating an integrated gate dielectric layer for field effect transistors |
US7473634B2 (en) * | 2006-09-28 | 2009-01-06 | Tokyo Electron Limited | Method for integrated substrate processing in copper metallization |
KR101480971B1 (ko) | 2006-10-10 | 2015-01-09 | 에이에스엠 아메리카, 인코포레이티드 | 전구체 전달 시스템 |
US8986456B2 (en) * | 2006-10-10 | 2015-03-24 | Asm America, Inc. | Precursor delivery system |
US9109287B2 (en) * | 2006-10-19 | 2015-08-18 | Air Products And Chemicals, Inc. | Solid source container with inlet plenum |
US7775508B2 (en) * | 2006-10-31 | 2010-08-17 | Applied Materials, Inc. | Ampoule for liquid draw and vapor draw with a continuous level sensor |
JP5244814B2 (ja) * | 2006-11-22 | 2013-07-24 | ソイテック | 化学気相成長チャンバ用の温度制御されたパージゲート弁を使用した方法、アセンブリ及びシステム |
KR101353334B1 (ko) * | 2006-11-22 | 2014-02-18 | 소이텍 | 갈륨 질화물 증착에서의 반응 가스 감소 |
WO2008064077A2 (en) | 2006-11-22 | 2008-05-29 | S.O.I.Tec Silicon On Insulator Technologies | Methods for high volume manufacture of group iii-v semiconductor materials |
KR101330156B1 (ko) | 2006-11-22 | 2013-12-20 | 소이텍 | 삼염화 갈륨 주입 구조 |
US9481944B2 (en) | 2006-11-22 | 2016-11-01 | Soitec | Gas injectors including a funnel- or wedge-shaped channel for chemical vapor deposition (CVD) systems and CVD systems with the same |
EP2066496B1 (en) * | 2006-11-22 | 2013-04-10 | Soitec | Equipment for high volume manufacture of group iii-v semiconductor materials |
US9481943B2 (en) | 2006-11-22 | 2016-11-01 | Soitec | Gallium trichloride injection scheme |
WO2008064080A1 (en) * | 2006-11-22 | 2008-05-29 | S.O.I.Tec Silicon On Insulator Technologies | High volume delivery system for gallium trichloride |
US20080141937A1 (en) * | 2006-12-19 | 2008-06-19 | Tokyo Electron Limited | Method and system for controlling a vapor delivery system |
TW200831694A (en) * | 2007-01-17 | 2008-08-01 | Advanced Tech Materials | Precursor compositions for ALD/CVD of group II ruthenate thin films |
US7955649B2 (en) * | 2007-01-17 | 2011-06-07 | Visichem Technology, Ltd. | Forming thin films using a resealable vial carrier of amphiphilic molecules |
US7833353B2 (en) * | 2007-01-24 | 2010-11-16 | Asm Japan K.K. | Liquid material vaporization apparatus for semiconductor processing apparatus |
US8821637B2 (en) * | 2007-01-29 | 2014-09-02 | Applied Materials, Inc. | Temperature controlled lid assembly for tungsten nitride deposition |
US7846256B2 (en) * | 2007-02-23 | 2010-12-07 | Tokyo Electron Limited | Ampule tray for and method of precursor surface area |
WO2009039382A1 (en) * | 2007-09-21 | 2009-03-26 | Semequip. Inc. | Method for extending equipment uptime in ion implantation |
WO2009064427A2 (en) * | 2007-11-13 | 2009-05-22 | Mckinley James J | Variable concentration dynamic headspace vapor source generator |
US8899556B2 (en) * | 2007-11-15 | 2014-12-02 | Lawrence Livermore National Security, Llc. | Systems and methods for generation of hydrogen peroxide vapor |
US9034105B2 (en) * | 2008-01-10 | 2015-05-19 | American Air Liquide, Inc. | Solid precursor sublimator |
KR20110005683A (ko) | 2008-02-11 | 2011-01-18 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 반도체 가공 시스템에서의 이온 공급원 세정법 |
US20090214777A1 (en) * | 2008-02-22 | 2009-08-27 | Demetrius Sarigiannis | Multiple ampoule delivery systems |
WO2009117440A1 (en) * | 2008-03-17 | 2009-09-24 | Applied Materials, Inc. | Heated valve manifold for ampoule |
US8343583B2 (en) | 2008-07-10 | 2013-01-01 | Asm International N.V. | Method for vaporizing non-gaseous precursor in a fluidized bed |
US8146896B2 (en) * | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Chemical precursor ampoule for vapor deposition processes |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US8012876B2 (en) * | 2008-12-02 | 2011-09-06 | Asm International N.V. | Delivery of vapor precursor from solid source |
US8663735B2 (en) * | 2009-02-13 | 2014-03-04 | Advanced Technology Materials, Inc. | In situ generation of RuO4 for ALD of Ru and Ru related materials |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8491720B2 (en) * | 2009-04-10 | 2013-07-23 | Applied Materials, Inc. | HVPE precursor source hardware |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US8883270B2 (en) * | 2009-08-14 | 2014-11-11 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen—oxygen species |
US8877655B2 (en) | 2010-05-07 | 2014-11-04 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US9117773B2 (en) * | 2009-08-26 | 2015-08-25 | Asm America, Inc. | High concentration water pulses for atomic layer deposition |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
CN102597310B (zh) | 2009-11-02 | 2015-02-04 | 西格玛-奥吉奇有限责任公司 | 固态前体输送组件以及相关方法 |
US8555809B2 (en) * | 2010-01-14 | 2013-10-15 | Rohm And Haas Electronic Materials, Llc | Method for constant concentration evaporation and a device using the same |
US8758515B2 (en) | 2010-08-09 | 2014-06-24 | Rohm And Haas Electronic Materials Llc | Delivery device and method of use thereof |
US8486192B2 (en) | 2010-09-30 | 2013-07-16 | Soitec | Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods |
US8133806B1 (en) | 2010-09-30 | 2012-03-13 | S.O.I.Tec Silicon On Insulator Technologies | Systems and methods for forming semiconductor materials by atomic layer deposition |
US8776821B2 (en) | 2011-05-24 | 2014-07-15 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
US8997775B2 (en) | 2011-05-24 | 2015-04-07 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US9793148B2 (en) | 2011-06-22 | 2017-10-17 | Asm Japan K.K. | Method for positioning wafers in multiple wafer transport |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
JP5913888B2 (ja) * | 2011-09-30 | 2016-04-27 | 国立大学法人東北大学 | 気化器 |
US8724974B2 (en) * | 2011-09-30 | 2014-05-13 | Fujikin Incorporated | Vaporizer |
US9341296B2 (en) | 2011-10-27 | 2016-05-17 | Asm America, Inc. | Heater jacket for a fluid line |
US9096931B2 (en) | 2011-10-27 | 2015-08-04 | Asm America, Inc | Deposition valve assembly and method of heating the same |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US9005539B2 (en) | 2011-11-23 | 2015-04-14 | Asm Ip Holding B.V. | Chamber sealing member |
US9167625B2 (en) | 2011-11-23 | 2015-10-20 | Asm Ip Holding B.V. | Radiation shielding for a substrate holder |
US9238865B2 (en) | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
WO2013126323A1 (en) * | 2012-02-23 | 2013-08-29 | Applied Materials, Inc. | Method and apparatus for precursor delivery |
US9202727B2 (en) | 2012-03-02 | 2015-12-01 | ASM IP Holding | Susceptor heater shim |
US8946830B2 (en) | 2012-04-04 | 2015-02-03 | Asm Ip Holdings B.V. | Metal oxide protective layer for a semiconductor device |
TWI622664B (zh) | 2012-05-02 | 2018-05-01 | Asm智慧財產控股公司 | 相穩定薄膜,包括該薄膜之結構及裝置,及其形成方法 |
US8728832B2 (en) | 2012-05-07 | 2014-05-20 | Asm Ip Holdings B.V. | Semiconductor device dielectric interface layer |
US9598766B2 (en) | 2012-05-27 | 2017-03-21 | Air Products And Chemicals, Inc. | Vessel with filter |
KR20210135341A (ko) | 2012-05-31 | 2021-11-12 | 엔테그리스, 아이엔씨. | 배취식 침착을 위한 고 물질 플럭스를 갖는 유체의 소스 시약-기반 수송 |
US8933375B2 (en) | 2012-06-27 | 2015-01-13 | Asm Ip Holding B.V. | Susceptor heater and method of heating a substrate |
US9243325B2 (en) | 2012-07-18 | 2016-01-26 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
US9558931B2 (en) | 2012-07-27 | 2017-01-31 | Asm Ip Holding B.V. | System and method for gas-phase sulfur passivation of a semiconductor surface |
US9117866B2 (en) | 2012-07-31 | 2015-08-25 | Asm Ip Holding B.V. | Apparatus and method for calculating a wafer position in a processing chamber under process conditions |
US9169975B2 (en) | 2012-08-28 | 2015-10-27 | Asm Ip Holding B.V. | Systems and methods for mass flow controller verification |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
US9021985B2 (en) | 2012-09-12 | 2015-05-05 | Asm Ip Holdings B.V. | Process gas management for an inductively-coupled plasma deposition reactor |
US9324811B2 (en) | 2012-09-26 | 2016-04-26 | Asm Ip Holding B.V. | Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same |
FR2996628B1 (fr) * | 2012-10-04 | 2014-12-26 | Commissariat Energie Atomique | Reservoir de stockage d'hydrogene a hydrures metalliques de fabrication simplifiee et dispositif de stockage comportant au moins un tel reservoir |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
JP5837869B2 (ja) * | 2012-12-06 | 2015-12-24 | 株式会社フジキン | 原料気化供給装置 |
US20140174955A1 (en) * | 2012-12-21 | 2014-06-26 | Qualcomm Mems Technologies, Inc. | High flow xef2 canister |
US9640416B2 (en) | 2012-12-26 | 2017-05-02 | Asm Ip Holding B.V. | Single-and dual-chamber module-attachable wafer-handling chamber |
JP6078335B2 (ja) * | 2012-12-27 | 2017-02-08 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、気化システム、気化器およびプログラム |
US8894870B2 (en) | 2013-02-01 | 2014-11-25 | Asm Ip Holding B.V. | Multi-step method and apparatus for etching compounds containing a metal |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
KR102024830B1 (ko) * | 2013-05-09 | 2019-09-25 | (주)지오엘리먼트 | 기화기 |
US8993054B2 (en) | 2013-07-12 | 2015-03-31 | Asm Ip Holding B.V. | Method and system to reduce outgassing in a reaction chamber |
US9018111B2 (en) | 2013-07-22 | 2015-04-28 | Asm Ip Holding B.V. | Semiconductor reaction chamber with plasma capabilities |
US9396934B2 (en) | 2013-08-14 | 2016-07-19 | Asm Ip Holding B.V. | Methods of forming films including germanium tin and structures and devices including the films |
US9793115B2 (en) | 2013-08-14 | 2017-10-17 | Asm Ip Holding B.V. | Structures and devices including germanium-tin films and methods of forming same |
JP6111171B2 (ja) * | 2013-09-02 | 2017-04-05 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
US9556516B2 (en) | 2013-10-09 | 2017-01-31 | ASM IP Holding B.V | Method for forming Ti-containing film by PEALD using TDMAT or TDEAT |
US9605343B2 (en) | 2013-11-13 | 2017-03-28 | Asm Ip Holding B.V. | Method for forming conformal carbon films, structures conformal carbon film, and system of forming same |
US9334566B2 (en) | 2013-11-25 | 2016-05-10 | Lam Research Corporation | Multi-tray ballast vapor draw systems |
US10179947B2 (en) | 2013-11-26 | 2019-01-15 | Asm Ip Holding B.V. | Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition |
US9343315B2 (en) * | 2013-11-27 | 2016-05-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating semiconductor structure, and solid precursor delivery system |
US9957612B2 (en) | 2014-01-17 | 2018-05-01 | Ceres Technologies, Inc. | Delivery device, methods of manufacture thereof and articles comprising the same |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US9447498B2 (en) | 2014-03-18 | 2016-09-20 | Asm Ip Holding B.V. | Method for performing uniform processing in gas system-sharing multiple reaction chambers |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
KR102387359B1 (ko) * | 2014-04-18 | 2022-04-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 자동-리필 앰풀 및 사용 방법들 |
US10392700B2 (en) * | 2014-04-21 | 2019-08-27 | Entegris, Inc. | Solid vaporizer |
US9404587B2 (en) | 2014-04-24 | 2016-08-02 | ASM IP Holding B.V | Lockout tagout for semiconductor vacuum valve |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9543180B2 (en) | 2014-08-01 | 2017-01-10 | Asm Ip Holding B.V. | Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum |
US9970108B2 (en) * | 2014-08-01 | 2018-05-15 | Lam Research Corporation | Systems and methods for vapor delivery in a substrate processing system |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US11970772B2 (en) | 2014-08-22 | 2024-04-30 | Lam Research Corporation | Dynamic precursor dosing for atomic layer deposition |
US10094018B2 (en) | 2014-10-16 | 2018-10-09 | Lam Research Corporation | Dynamic precursor dosing for atomic layer deposition |
US20160052651A1 (en) * | 2014-08-22 | 2016-02-25 | Lam Research Corporation | Fill on demand ampoule |
US11072860B2 (en) | 2014-08-22 | 2021-07-27 | Lam Research Corporation | Fill on demand ampoule refill |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
KR102300403B1 (ko) | 2014-11-19 | 2021-09-09 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
KR102263121B1 (ko) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 및 그 제조 방법 |
US9982341B2 (en) * | 2015-01-30 | 2018-05-29 | Lam Research Corporation | Modular vaporizer |
US9478415B2 (en) | 2015-02-13 | 2016-10-25 | Asm Ip Holding B.V. | Method for forming film having low resistance and shallow junction depth |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
JP6301867B2 (ja) * | 2015-03-31 | 2018-03-28 | 東芝メモリ株式会社 | 気化システム |
US10857818B2 (en) * | 2015-04-30 | 2020-12-08 | Shibaura Mechatronics Corporation | Tablet printing apparatus and tablet printing method |
KR102299892B1 (ko) * | 2015-05-07 | 2021-09-10 | (주)지오엘리먼트 | 모세관 현상을 이용한 고효율 기화기 |
KR101725959B1 (ko) | 2015-05-08 | 2017-04-21 | (주)지오엘리먼트 | 충진이 용이하고 기화 효율이 향상된 기화기 |
KR102269079B1 (ko) * | 2015-05-08 | 2021-06-25 | (주)지오엘리먼트 | 충진이 용이하고 기화 효율이 향상된 기화기 |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US9899291B2 (en) | 2015-07-13 | 2018-02-20 | Asm Ip Holding B.V. | Method for protecting layer by forming hydrocarbon-based extremely thin film |
US10043661B2 (en) | 2015-07-13 | 2018-08-07 | Asm Ip Holding B.V. | Method for protecting layer by forming hydrocarbon-based extremely thin film |
US20170023235A1 (en) * | 2015-07-21 | 2017-01-26 | Apple Inc. | Sublimator/vaporizer |
US10083836B2 (en) | 2015-07-24 | 2018-09-25 | Asm Ip Holding B.V. | Formation of boron-doped titanium metal films with high work function |
US10087525B2 (en) | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
US9647114B2 (en) | 2015-08-14 | 2017-05-09 | Asm Ip Holding B.V. | Methods of forming highly p-type doped germanium tin films and structures and devices including the films |
TWI624554B (zh) * | 2015-08-21 | 2018-05-21 | 弗里松股份有限公司 | 蒸發源 |
MY190445A (en) | 2015-08-21 | 2022-04-21 | Flisom Ag | Homogeneous linear evaporation source |
US9711345B2 (en) | 2015-08-25 | 2017-07-18 | Asm Ip Holding B.V. | Method for forming aluminum nitride-based film by PEALD |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US9909214B2 (en) | 2015-10-15 | 2018-03-06 | Asm Ip Holding B.V. | Method for depositing dielectric film in trenches by PEALD |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US9455138B1 (en) | 2015-11-10 | 2016-09-27 | Asm Ip Holding B.V. | Method for forming dielectric film in trenches by PEALD using H-containing gas |
US9905420B2 (en) | 2015-12-01 | 2018-02-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium tin films and structures and devices including the films |
US9607837B1 (en) | 2015-12-21 | 2017-03-28 | Asm Ip Holding B.V. | Method for forming silicon oxide cap layer for solid state diffusion process |
US9627221B1 (en) | 2015-12-28 | 2017-04-18 | Asm Ip Holding B.V. | Continuous process incorporating atomic layer etching |
US9735024B2 (en) | 2015-12-28 | 2017-08-15 | Asm Ip Holding B.V. | Method of atomic layer etching using functional group-containing fluorocarbon |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US9754779B1 (en) | 2016-02-19 | 2017-09-05 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10087522B2 (en) | 2016-04-21 | 2018-10-02 | Asm Ip Holding B.V. | Deposition of metal borides |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US9928983B2 (en) * | 2016-06-30 | 2018-03-27 | Varian Semiconductor Equipment Associates, Inc. | Vaporizer for ion source |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US9793135B1 (en) | 2016-07-14 | 2017-10-17 | ASM IP Holding B.V | Method of cyclic dry etching using etchant film |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
KR102354490B1 (ko) | 2016-07-27 | 2022-01-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US10177025B2 (en) | 2016-07-28 | 2019-01-08 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10090316B2 (en) | 2016-09-01 | 2018-10-02 | Asm Ip Holding B.V. | 3D stacked multilayer semiconductor memory using doped select transistor channel |
US11926894B2 (en) | 2016-09-30 | 2024-03-12 | Asm Ip Holding B.V. | Reactant vaporizer and related systems and methods |
US10876205B2 (en) | 2016-09-30 | 2020-12-29 | Asm Ip Holding B.V. | Reactant vaporizer and related systems and methods |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
KR20180068582A (ko) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US9916980B1 (en) | 2016-12-15 | 2018-03-13 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
KR102700194B1 (ko) | 2016-12-19 | 2024-08-28 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US10103040B1 (en) | 2017-03-31 | 2018-10-16 | Asm Ip Holding B.V. | Apparatus and method for manufacturing a semiconductor device |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
KR102457289B1 (ko) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US11946131B2 (en) * | 2017-05-26 | 2024-04-02 | Universal Display Corporation | Sublimation cell with time stability of output vapor pressure |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US10676370B2 (en) | 2017-06-05 | 2020-06-09 | Axcelis Technologies, Inc. | Hydrogen co-gas when using aluminum iodide as an ion source material |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US11104993B2 (en) * | 2017-07-28 | 2021-08-31 | Entegris, Inc. | Modular tray ampoule |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
KR102344996B1 (ko) | 2017-08-18 | 2021-12-30 | 삼성전자주식회사 | 전구체 공급 유닛, 기판 처리 장치 및 그를 이용한 반도체 소자의 제조방법 |
US10236177B1 (en) | 2017-08-22 | 2019-03-19 | ASM IP Holding B.V.. | Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures |
US10597773B2 (en) * | 2017-08-22 | 2020-03-24 | Praxair Technology, Inc. | Antimony-containing materials for ion implantation |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
KR102401446B1 (ko) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (ko) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치 |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10895347B2 (en) * | 2017-10-20 | 2021-01-19 | Entegris, Inc. | Heat transfer to ampoule trays |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
KR102443047B1 (ko) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 방법 및 그에 의해 제조된 장치 |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
WO2019103610A1 (en) | 2017-11-27 | 2019-05-31 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
JP7214724B2 (ja) | 2017-11-27 | 2023-01-30 | エーエスエム アイピー ホールディング ビー.ブイ. | バッチ炉で利用されるウェハカセットを収納するための収納装置 |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
JP6895372B2 (ja) * | 2017-12-12 | 2021-06-30 | 東京エレクトロン株式会社 | 原料容器 |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
TWI799494B (zh) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
CN111630203A (zh) | 2018-01-19 | 2020-09-04 | Asm Ip私人控股有限公司 | 通过等离子体辅助沉积来沉积间隙填充层的方法 |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10832913B2 (en) * | 2018-02-14 | 2020-11-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Method and apparatus for forming semiconductor structure |
JP7124098B2 (ja) | 2018-02-14 | 2022-08-23 | エーエスエム・アイピー・ホールディング・ベー・フェー | 周期的堆積プロセスにより基材上にルテニウム含有膜を堆積させる方法 |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102501472B1 (ko) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
TWI843623B (zh) | 2018-05-08 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構 |
KR20190129718A (ko) | 2018-05-11 | 2019-11-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조 |
US11566861B2 (en) | 2018-05-23 | 2023-01-31 | Senseer Ltd | Device system and method for projectile launcher operation monitoring |
KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
TWI840362B (zh) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 水氣降低的晶圓處置腔室 |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
TW202409324A (zh) | 2018-06-27 | 2024-03-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於形成含金屬材料之循環沉積製程 |
WO2020003000A1 (en) | 2018-06-27 | 2020-01-02 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
KR102686758B1 (ko) | 2018-06-29 | 2024-07-18 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11634812B2 (en) | 2018-08-16 | 2023-04-25 | Asm Ip Holding B.V. | Solid source sublimator |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
CN112703271A (zh) * | 2018-09-03 | 2021-04-23 | 应用材料公司 | 用于薄膜沉积的直接液体注射系统 |
KR102576431B1 (ko) * | 2018-09-10 | 2023-09-08 | 삼성디스플레이 주식회사 | 유기물 제조장치 및 이를 이용한 제조방법 |
KR102707956B1 (ko) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
TWI844567B (zh) | 2018-10-01 | 2024-06-11 | 荷蘭商Asm Ip私人控股有限公司 | 基材保持裝置、含有此裝置之系統及其使用之方法 |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (ko) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
JP7504584B2 (ja) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム |
TWI819180B (zh) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
JP7240881B2 (ja) * | 2019-01-18 | 2023-03-16 | Jx金属株式会社 | 塩化金属の昇華容器 |
KR20200091543A (ko) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
TWI845607B (zh) | 2019-02-20 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | 用來填充形成於基材表面內之凹部的循環沉積方法及設備 |
JP2020136678A (ja) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材表面内に形成された凹部を充填するための方法および装置 |
KR20200102357A (ko) | 2019-02-20 | 2020-08-31 | 에이에스엠 아이피 홀딩 비.브이. | 3-d nand 응용의 플러그 충진체 증착용 장치 및 방법 |
KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
TWI842826B (zh) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
KR20200108243A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
KR20200108242A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
US11492701B2 (en) * | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
KR20200116033A (ko) | 2019-03-28 | 2020-10-08 | 에이에스엠 아이피 홀딩 비.브이. | 도어 개방기 및 이를 구비한 기판 처리 장치 |
KR20200116855A (ko) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
KR20200123380A (ko) | 2019-04-19 | 2020-10-29 | 에이에스엠 아이피 홀딩 비.브이. | 층 형성 방법 및 장치 |
KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
KR102709637B1 (ko) | 2019-04-26 | 2024-09-26 | 엔테그리스, 아이엔씨. | 기화 용기 및 방법 |
KR20200130118A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
KR20200130121A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
KR20200130652A (ko) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
JP2020188255A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
JP2020188254A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
JP7304435B2 (ja) * | 2019-05-31 | 2023-07-06 | アプライド マテリアルズ インコーポレイテッド | 基板上に膜を形成するための方法およびシステム |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141003A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 가스 감지기를 포함하는 기상 반응기 시스템 |
KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (ko) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
JP7499079B2 (ja) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同軸導波管を用いたプラズマ装置、基板処理方法 |
CN112216646A (zh) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
KR20210010307A (ko) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210010820A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
KR20210010816A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 라디칼 보조 점화 플라즈마 시스템 및 방법 |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
TWI839544B (zh) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成形貌受控的非晶碳聚合物膜之方法 |
KR20210010817A (ko) | 2019-07-19 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법 |
CN112309843A (zh) | 2019-07-29 | 2021-02-02 | Asm Ip私人控股有限公司 | 实现高掺杂剂掺入的选择性沉积方法 |
CN112309899A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112309900A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN118422165A (zh) | 2019-08-05 | 2024-08-02 | Asm Ip私人控股有限公司 | 用于化学源容器的液位传感器 |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
JP2021031769A (ja) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
KR20210024420A (ko) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (ko) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
KR20210029663A (ko) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11624113B2 (en) | 2019-09-13 | 2023-04-11 | Asm Ip Holding B.V. | Heating zone separation for reactant evaporation system |
US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
KR20210042810A (ko) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법 |
TWI846953B (zh) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理裝置 |
KR20210043460A (ko) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체 |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (zh) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽之拓撲選擇性膜形成之方法 |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (ko) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
KR20210048408A (ko) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 증착 반응기 매니폴드 |
US20210123134A1 (en) * | 2019-10-24 | 2021-04-29 | Entegris, Inc. | Sublimation ampoule with level sensing |
KR20210050453A (ko) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조 |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (ko) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (ko) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
KR20210065848A (ko) | 2019-11-26 | 2021-06-04 | 에이에스엠 아이피 홀딩 비.브이. | 제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법 |
CN112951697A (zh) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885693A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885692A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
JP7527928B2 (ja) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板処理装置、基板処理方法 |
KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN114787414A (zh) * | 2019-12-11 | 2022-07-22 | 朗姆研究公司 | 液体前体汽化器 |
TW202125596A (zh) | 2019-12-17 | 2021-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成氮化釩層之方法以及包括該氮化釩層之結構 |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
KR20210089079A (ko) | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 채널형 리프트 핀 |
TW202140135A (zh) | 2020-01-06 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體供應總成以及閥板總成 |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR102675856B1 (ko) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
JP7113964B2 (ja) * | 2020-01-28 | 2022-08-05 | 株式会社アルバック | 蒸着源、蒸着装置 |
TW202130846A (zh) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成包括釩或銦層的結構之方法 |
TW202146882A (zh) | 2020-02-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統 |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
TW202203344A (zh) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | 專用於零件清潔的系統 |
KR20210116249A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법 |
KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
CN113394086A (zh) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | 用于制造具有目标拓扑轮廓的层结构的方法 |
KR20210124042A (ko) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
TW202146689A (zh) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | 阻障層形成方法及半導體裝置的製造方法 |
TW202145344A (zh) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
KR20210128343A (ko) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조 |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
TW202146831A (zh) | 2020-04-24 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法 |
JP2021172884A (ja) | 2020-04-24 | 2021-11-01 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体 |
KR20210134226A (ko) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
TW202147543A (zh) | 2020-05-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 半導體處理系統 |
KR20210141379A (ko) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
TW202146699A (zh) | 2020-05-15 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統 |
KR20210143653A (ko) | 2020-05-19 | 2021-11-29 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210145078A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
KR102702526B1 (ko) | 2020-05-22 | 2024-09-03 | 에이에스엠 아이피 홀딩 비.브이. | 과산화수소를 사용하여 박막을 증착하기 위한 장치 |
TW202201602A (zh) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202212620A (zh) | 2020-06-02 | 2022-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法 |
TW202218133A (zh) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
TW202217953A (zh) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
KR102707957B1 (ko) | 2020-07-08 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
TW202219628A (zh) | 2020-07-17 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於光微影之結構與方法 |
TW202204662A (zh) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
CN112097114A (zh) * | 2020-08-07 | 2020-12-18 | 安徽亚格盛电子新材料有限公司 | 一种精确制备液态mo源和氢气混合气的装置 |
US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
KR20220027026A (ko) | 2020-08-26 | 2022-03-07 | 에이에스엠 아이피 홀딩 비.브이. | 금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템 |
TW202229601A (zh) | 2020-08-27 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統 |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US12009224B2 (en) | 2020-09-29 | 2024-06-11 | Asm Ip Holding B.V. | Apparatus and method for etching metal nitrides |
KR20220045900A (ko) | 2020-10-06 | 2022-04-13 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치 |
CN114293174A (zh) | 2020-10-07 | 2022-04-08 | Asm Ip私人控股有限公司 | 气体供应单元和包括气体供应单元的衬底处理设备 |
TW202229613A (zh) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 於階梯式結構上沉積材料的方法 |
KR20220053482A (ko) | 2020-10-22 | 2022-04-29 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리 |
TW202223136A (zh) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於在基板上形成層之方法、及半導體處理系統 |
US11834740B2 (en) * | 2020-11-10 | 2023-12-05 | Applied Materials, Inc. | Apparatus, system, and method for generating gas for use in a process chamber |
TW202235649A (zh) | 2020-11-24 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 填充間隙之方法與相關之系統及裝置 |
TW202235675A (zh) | 2020-11-30 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 注入器、及基板處理設備 |
US11578406B2 (en) * | 2020-12-08 | 2023-02-14 | Applied Materials, Inc. | Ampoule for a semiconductor manufacturing precursor |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
TW202231903A (zh) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成 |
US12037684B2 (en) * | 2021-02-26 | 2024-07-16 | Entegris, Inc. | Solids vaporizer |
EP4056730B1 (en) | 2021-03-10 | 2024-07-17 | SK Inc. | Container for feeding a precursor material |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
US11584990B2 (en) | 2021-07-02 | 2023-02-21 | Applied Materials, Inc. | Bottom fed sublimation bed for high saturation efficiency in semiconductor applications |
CN115896744A (zh) * | 2021-08-17 | 2023-04-04 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
CN113897593B (zh) * | 2021-09-13 | 2023-08-11 | 浙江陶特容器科技股份有限公司 | 一种固态前驱体源存储升华器 |
CN114318300B (zh) * | 2021-12-30 | 2024-05-10 | 拓荆科技股份有限公司 | 一种半导体加工设备及其反应腔室、工艺管路穿腔模块 |
WO2024051920A1 (en) | 2022-09-06 | 2024-03-14 | Sk Inc. | Container for feeding a precursor material |
KR20240074489A (ko) | 2022-11-21 | 2024-05-28 | (주)지오엘리먼트 | 세정 장치를 구비한 기화 시스템 및 이를 세정하는 세정 방법 |
KR20240074503A (ko) | 2022-11-21 | 2024-05-28 | (주)지오엘리먼트 | 세정 장치를 구비한 기화 시스템 및 이를 세정하는 세정 방법 |
KR20240092507A (ko) | 2022-12-14 | 2024-06-24 | (주)지오엘리먼트 | 버퍼 캐니스터를 구비한 전구체 공급 시스템 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070176A (ja) * | 1983-09-27 | 1985-04-20 | Fujitsu Ltd | 固体ソ−ス蒸発ボンベ |
JPH04292406A (ja) * | 1991-03-19 | 1992-10-16 | Mitsubishi Cable Ind Ltd | 超電導mocvd用ガス化容器 |
JPH0519351U (ja) * | 1991-08-15 | 1993-03-09 | 三菱電線工業株式会社 | 超電導mocvd用蒸発器 |
JPH08279497A (ja) * | 1995-04-07 | 1996-10-22 | Hitachi Ltd | 半導体製造装置および半導体装置 |
Family Cites Families (155)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1265863A (en) | 1915-01-13 | 1918-05-14 | William G Abbott Jr | Evaporator. |
US2447789A (en) | 1945-03-23 | 1948-08-24 | Polaroid Corp | Evaporating crucible for coating apparatus |
US2721064A (en) * | 1951-10-03 | 1955-10-18 | Hugo O Reichardt | Carbonating device |
US2769624A (en) * | 1953-07-16 | 1956-11-06 | Okey S Burnside | Air cleaner and moistener for carburetors |
US2902574A (en) | 1958-02-03 | 1959-09-01 | Hughes Aircraft Co | Source for vapor deposition |
US3405251A (en) | 1966-05-31 | 1968-10-08 | Trw Inc | Vacuum evaporation source |
US3647197A (en) | 1970-04-27 | 1972-03-07 | Ford Motor Co | Vacuum deposition |
US3740043A (en) | 1970-05-26 | 1973-06-19 | Republic Steel Corp | Apparatus for vaporizing molten metal |
US3834682A (en) * | 1972-06-19 | 1974-09-10 | American Hospital Supply Corp | Mixing column for medical humidifier and method of humidifying inhalable gases |
US3920882A (en) * | 1973-04-16 | 1975-11-18 | Owens Illinois Inc | N-type dopant source |
JPS58519B2 (ja) | 1975-07-25 | 1983-01-06 | タナカキキンゾクコウギヨウ カブシキガイシヤ | ロジウムメツキヨク |
DE2536013A1 (de) | 1975-08-13 | 1977-03-03 | Bosch Gmbh Robert | Verfahren zur verbesserung der haltbarkeit von aus siliciumoxiden bestehenden schutzschichten |
GB1559978A (en) | 1976-12-01 | 1980-01-30 | Gen Electric Co Ltd | Chemical vapour deposition processes |
US4190965A (en) * | 1979-01-15 | 1980-03-04 | Alternative Pioneering Systems, Inc. | Food dehydrator |
JPS55160424A (en) * | 1979-05-31 | 1980-12-13 | Fujitsu Ltd | Vapor phase epitaxial device |
JPS58126973A (ja) * | 1982-01-22 | 1983-07-28 | Hitachi Ltd | 薄膜形成用ソ−ス供給装置 |
JPH01147254A (ja) | 1987-12-04 | 1989-06-08 | Matsushita Electric Ind Co Ltd | 強制給排気式温風機 |
JPH0817804B2 (ja) * | 1987-12-23 | 1996-02-28 | 雪印乳業株式会社 | 殺菌剤気化装置 |
DE3801147A1 (de) * | 1988-01-16 | 1989-07-27 | Philips Patentverwaltung | Vorrichtung zum erzeugen eines mit dem dampf eines wenig fluechtigen stoffes angereicherten gasstroms |
JPH0623565Y2 (ja) * | 1988-03-28 | 1994-06-22 | 日本電気株式会社 | Cvd装置用原料収納容器 |
JPH0269389A (ja) * | 1988-08-31 | 1990-03-08 | Toyo Stauffer Chem Co | 有機金属気相成長法における固体有機金属化合物の飽和蒸気生成方法 |
JP2711327B2 (ja) | 1988-10-14 | 1998-02-10 | 住友電気工業株式会社 | 気相エピタキシヤル成長用クラスト形成装置 |
JPH0726364Y2 (ja) * | 1989-06-23 | 1995-06-14 | 日本酸素株式会社 | 気相成長装置用の固形原料供給装置 |
JPH0372387A (ja) | 1989-08-11 | 1991-03-27 | Brother Ind Ltd | 現像電極清掃装置 |
US5104695A (en) | 1989-09-08 | 1992-04-14 | International Business Machines Corporation | Method and apparatus for vapor deposition of material onto a substrate |
JP2611009B2 (ja) * | 1989-09-12 | 1997-05-21 | 株式会社エステック | 有機金属化合物の気化供給装置 |
DE3931189A1 (de) | 1989-09-19 | 1991-03-28 | Philips Patentverwaltung | Vorrichtung und verfahren zum erzeugen eines mit dem dampf eines wenig fluechtigen stoffes angereicherten gasstroms |
EP0420596B1 (en) * | 1989-09-26 | 1996-06-19 | Canon Kabushiki Kaisha | Gas feeding device and deposition film forming apparatus employing the same |
JP2614338B2 (ja) * | 1990-01-11 | 1997-05-28 | 株式会社東芝 | 液体ソース容器 |
US5020476A (en) | 1990-04-17 | 1991-06-04 | Ds Research, Inc. | Distributed source assembly |
JPH0436469A (ja) * | 1990-06-01 | 1992-02-06 | Sharp Corp | Cvd原料供給方法及びこれに用いる固体原料 |
US5840897A (en) * | 1990-07-06 | 1998-11-24 | Advanced Technology Materials, Inc. | Metal complex source reagents for chemical vapor deposition |
US5362328A (en) | 1990-07-06 | 1994-11-08 | Advanced Technology Materials, Inc. | Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem |
US5711816A (en) | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
JPH04228562A (ja) | 1990-12-27 | 1992-08-18 | Mitsubishi Electric Corp | 薄膜形成装置 |
JPH04333572A (ja) | 1991-05-10 | 1992-11-20 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 酸化物超電導体用mo原料の気化方法 |
JPH0598445A (ja) | 1991-07-05 | 1993-04-20 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 有機金属化学気相蒸着用原料容器 |
JP2885969B2 (ja) | 1991-07-08 | 1999-04-26 | 富士写真フイルム株式会社 | マイクロフィルムリーダ |
US5336324A (en) | 1991-12-04 | 1994-08-09 | Emcore Corporation | Apparatus for depositing a coating on a substrate |
ES2115048T3 (es) | 1991-12-13 | 1998-06-16 | Advanced Tech Materials | Aparato y procedimiento para la descarga de reactivos no volatiles. |
JPH05214537A (ja) * | 1992-01-30 | 1993-08-24 | Nec Corp | 固体昇華用の気化器 |
ATE201721T1 (de) | 1993-03-18 | 2001-06-15 | Advanced Tech Materials | Verfahren und vorrichtung zur zuführung von reagenzien in dampfform in einen cvd-reaktor |
US5377429A (en) | 1993-04-19 | 1995-01-03 | Micron Semiconductor, Inc. | Method and appartus for subliming precursors |
US5607002A (en) | 1993-04-28 | 1997-03-04 | Advanced Delivery & Chemical Systems, Inc. | Chemical refill system for high purity chemicals |
KR960010901A (ko) | 1994-09-30 | 1996-04-20 | 김광호 | 고체 유기화합물 전용 버블러 장치 |
FR2727322B1 (fr) | 1994-11-30 | 1996-12-27 | Kodak Pathe | Procede pour la sublimation d'un materiau solide et dispositif pour la mise en oeuvre du procede |
US5553188A (en) | 1995-02-24 | 1996-09-03 | Mks Instruments, Inc. | Vaporizer and liquid delivery system using same |
JPH0940489A (ja) | 1995-03-30 | 1997-02-10 | Pioneer Electron Corp | Mocvdの固体原料供給方法及び供給装置 |
US5553395A (en) | 1995-05-31 | 1996-09-10 | Hughes Aircraft Company | Bubbler for solid metal organic source material and method of producing saturated carrying gas |
US5764849A (en) | 1996-03-27 | 1998-06-09 | Micron Technology, Inc. | Solid precursor injector apparatus and method |
JPH1025576A (ja) * | 1996-04-05 | 1998-01-27 | Dowa Mining Co Ltd | Cvd成膜法における原料化合物の昇華方法 |
US5917140A (en) | 1996-05-21 | 1999-06-29 | Advanced Technology Materials, Inc. | Sorbent-based fluid storage and dispensing vessel with enhanced heat transfer means |
DE19638100C1 (de) | 1996-09-18 | 1998-03-05 | Fraunhofer Ges Forschung | Vorrichtung zum Erzeugen eines dampfförmigen Reaktionsproduktes aus Feststoffteilen |
US6130160A (en) * | 1996-10-02 | 2000-10-10 | Micron Technology, Inc. | Methods, complexes and system for forming metal-containing films |
US5874131A (en) * | 1996-10-02 | 1999-02-23 | Micron Technology, Inc. | CVD method for forming metal-containing films |
US6413476B1 (en) | 1996-12-05 | 2002-07-02 | Mary F. Barnhart | Aromatic diffuser with replaceable cartridge |
JP3645682B2 (ja) | 1997-03-18 | 2005-05-11 | 三菱電機株式会社 | Cu成膜用CVD装置 |
US6409839B1 (en) | 1997-06-02 | 2002-06-25 | Msp Corporation | Method and apparatus for vapor generation and film deposition |
AU8487298A (en) * | 1997-07-18 | 1999-02-10 | Advanced Technology Materials, Inc. | Liquid delivery system comprising upstream pressure control means |
US6018065A (en) | 1997-11-10 | 2000-01-25 | Advanced Technology Materials, Inc. | Method of fabricating iridium-based materials and structures on substrates, iridium source reagents therefor |
US6143191A (en) | 1997-11-10 | 2000-11-07 | Advanced Technology Materials, Inc. | Method for etch fabrication of iridium-based electrode structures |
JP3967455B2 (ja) * | 1998-03-30 | 2007-08-29 | Dowaホールディングス株式会社 | カリウム含有薄膜及びその製法 |
US6136725A (en) | 1998-04-14 | 2000-10-24 | Cvd Systems, Inc. | Method for chemical vapor deposition of a material on a substrate |
JPH11302286A (ja) | 1998-04-17 | 1999-11-02 | Kojundo Chem Lab Co Ltd | バリウムストロンチウムβ−ジケトネートとその製造 方法及びそれを用いたバリウムストロンチウム含有酸 化物誘電体薄膜の製造方法 |
US6620256B1 (en) | 1998-04-28 | 2003-09-16 | Advanced Technology Materials, Inc. | Non-plasma in-situ cleaning of processing chambers using static flow methods |
US6107634A (en) | 1998-04-30 | 2000-08-22 | Eaton Corporation | Decaborane vaporizer |
JPH11342328A (ja) * | 1998-06-01 | 1999-12-14 | Japan Pionics Co Ltd | 気化器及び気化供給方法 |
JP2000012218A (ja) | 1998-06-23 | 2000-01-14 | Tdk Corp | 有機el素子の製造装置および製造方法 |
US6210485B1 (en) | 1998-07-21 | 2001-04-03 | Applied Materials, Inc. | Chemical vapor deposition vaporizer |
JP2000104172A (ja) | 1998-07-28 | 2000-04-11 | Toshiba Corp | 成膜方法,成膜装置及び固形原料 |
US20010003603A1 (en) | 1998-07-28 | 2001-06-14 | Kabushiki Kaisha Toshiba | Cvd film formation method and apparatus using molded solid body and the molded solid body |
US6225237B1 (en) * | 1998-09-01 | 2001-05-01 | Micron Technology, Inc. | Method for forming metal-containing films using metal complexes with chelating O- and/or N-donor ligands |
US6281124B1 (en) * | 1998-09-02 | 2001-08-28 | Micron Technology, Inc. | Methods and systems for forming metal-containing films on substrates |
US6454860B2 (en) | 1998-10-27 | 2002-09-24 | Applied Materials, Inc. | Deposition reactor having vaporizing, mixing and cleaning capabilities |
US20030101938A1 (en) | 1998-10-27 | 2003-06-05 | Applied Materials, Inc. | Apparatus for the deposition of high dielectric constant films |
US6202591B1 (en) | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
JP2000192243A (ja) * | 1998-12-24 | 2000-07-11 | Nissin Electric Co Ltd | 気化器メンテナンス方法 |
JP2000239843A (ja) * | 1999-02-17 | 2000-09-05 | Nippon Sanso Corp | 金属薄膜の製造方法 |
WO2000065127A1 (en) | 1999-04-27 | 2000-11-02 | Tokyo Electron Limited | Apparatus and method for delivery of vapor to a cvd chamber |
US6184403B1 (en) * | 1999-05-19 | 2001-02-06 | Research Foundation Of State University Of New York | MOCVD precursors based on organometalloid ligands |
JP2000345345A (ja) | 1999-06-04 | 2000-12-12 | Mitsubishi Electric Corp | Cvd装置およびcvd装置用気化装置 |
US6206972B1 (en) | 1999-07-08 | 2001-03-27 | Genus, Inc. | Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes |
JP2001049434A (ja) * | 1999-08-10 | 2001-02-20 | Asahi Denka Kogyo Kk | TiN膜の形成方法及び電子部品の製造方法 |
US6444038B1 (en) * | 1999-12-27 | 2002-09-03 | Morton International, Inc. | Dual fritted bubbler |
JP2001059161A (ja) | 1999-08-20 | 2001-03-06 | Tdk Corp | 有機薄膜の製造装置および製造方法 |
JP3909792B2 (ja) * | 1999-08-20 | 2007-04-25 | パイオニア株式会社 | 化学気相成長法における原料供給装置及び原料供給方法 |
US6288403B1 (en) | 1999-10-11 | 2001-09-11 | Axcelis Technologies, Inc. | Decaborane ionizer |
US6473564B1 (en) | 2000-01-07 | 2002-10-29 | Nihon Shinku Gijutsu Kabushiki Kaisha | Method of manufacturing thin organic film |
DE10005820C1 (de) | 2000-02-10 | 2001-08-02 | Schott Glas | Gasversorungsvorrichtung für Precursoren geringen Dampfdrucks |
DE10007059A1 (de) | 2000-02-16 | 2001-08-23 | Aixtron Ag | Verfahren und Vorrichtung zur Herstellung von beschichteten Substraten mittels Kondensationsbeschichtung |
JP4233724B2 (ja) | 2000-02-25 | 2009-03-04 | 株式会社デンソー | 薄膜の形成方法 |
US6237529B1 (en) | 2000-03-03 | 2001-05-29 | Eastman Kodak Company | Source for thermal physical vapor deposition of organic electroluminescent layers |
WO2001083084A1 (en) | 2000-05-03 | 2001-11-08 | Advanced Technology Materials, Inc. | Gas cabinet assembly comprising sorbent-based gas storage and delivery system |
EP1160355B1 (en) * | 2000-05-31 | 2004-10-27 | Shipley Company LLC | Bubbler |
US6581915B2 (en) * | 2000-07-27 | 2003-06-24 | The Procter & Gamble Company | Dispensing device for dispensing scents |
US6887337B2 (en) | 2000-09-19 | 2005-05-03 | Xactix, Inc. | Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto |
DE10048759A1 (de) * | 2000-09-29 | 2002-04-11 | Aixtron Gmbh | Verfahren und Vorrichtung zum Abscheiden insbesondere organischer Schichten im Wege der OVPD |
US6443435B1 (en) | 2000-10-23 | 2002-09-03 | Applied Materials, Inc. | Vaporization of precursors at point of use |
JP2002270523A (ja) * | 2001-03-13 | 2002-09-20 | Ricoh Co Ltd | 窒素化合物供給装置および窒素化合物供給方法および成膜装置 |
US6561498B2 (en) | 2001-04-09 | 2003-05-13 | Lorex Industries, Inc. | Bubbler for use in vapor generation systems |
DE10118130A1 (de) | 2001-04-11 | 2002-10-17 | Aixtron Ag | Vorrichtung oder Verfahren zum Abscheiden von insbesondere kristallinen Schichten auf insbesondere kristallinen Substraten aus der Gasphase |
US6431118B1 (en) | 2001-05-21 | 2002-08-13 | Imagine Gold, L.L.C. | Apparatus and method for providing humidified air to a terrarium |
TW539822B (en) | 2001-07-03 | 2003-07-01 | Asm Inc | Source chemical container assembly |
US6718126B2 (en) | 2001-09-14 | 2004-04-06 | Applied Materials, Inc. | Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition |
US6701066B2 (en) | 2001-10-11 | 2004-03-02 | Micron Technology, Inc. | Delivery of solid chemical precursors |
US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
JP3932874B2 (ja) | 2001-11-27 | 2007-06-20 | 三菱マテリアル株式会社 | 有機金属化学蒸着法用ルテニウム化合物及び該化合物により得られたルテニウム含有薄膜 |
TW200300701A (en) | 2001-11-30 | 2003-06-16 | Asml Us Inc | High flow rate bubbler system and method |
US20030111014A1 (en) | 2001-12-18 | 2003-06-19 | Donatucci Matthew B. | Vaporizer/delivery vessel for volatile/thermally sensitive solid and liquid compounds |
US6620225B2 (en) | 2002-01-10 | 2003-09-16 | Advanced Technology Materials, Inc. | Adsorbents for low vapor pressure fluid storage and delivery |
US7601225B2 (en) | 2002-06-17 | 2009-10-13 | Asm International N.V. | System for controlling the sublimation of reactants |
US7524374B2 (en) | 2002-07-17 | 2009-04-28 | Applied Materials, Inc. | Method and apparatus for generating a precursor for a semiconductor processing system |
JP3945455B2 (ja) | 2002-07-17 | 2007-07-18 | 株式会社豊田中央研究所 | 粉末成形体、粉末成形方法、金属焼結体およびその製造方法 |
US7186385B2 (en) | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
US7300038B2 (en) | 2002-07-23 | 2007-11-27 | Advanced Technology Materials, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
US6921062B2 (en) * | 2002-07-23 | 2005-07-26 | Advanced Technology Materials, Inc. | Vaporizer delivery ampoule |
US6915592B2 (en) | 2002-07-29 | 2005-07-12 | Applied Materials, Inc. | Method and apparatus for generating gas to a processing chamber |
JP4585852B2 (ja) | 2002-07-30 | 2010-11-24 | エーエスエム アメリカ インコーポレイテッド | 基板処理システム、基板処理方法及び昇華装置 |
US6797337B2 (en) | 2002-08-19 | 2004-09-28 | Micron Technology, Inc. | Method for delivering precursors |
US6841141B2 (en) | 2002-09-26 | 2005-01-11 | Advanced Technology Materials, Inc. | System for in-situ generation of fluorine radicals and/or fluorine-containing interhalogen (XFn) compounds for use in cleaning semiconductor processing chambers |
US6779378B2 (en) | 2002-10-30 | 2004-08-24 | Asm International N.V. | Method of monitoring evaporation rate of source material in a container |
US6863021B2 (en) | 2002-11-14 | 2005-03-08 | Genus, Inc. | Method and apparatus for providing and integrating a general metal delivery source (GMDS) with atomic layer deposition (ALD) |
US6991671B2 (en) | 2002-12-09 | 2006-01-31 | Advanced Technology Materials, Inc. | Rectangular parallelepiped fluid storage and dispensing vessel |
US7018940B2 (en) | 2002-12-30 | 2006-03-28 | Genus, Inc. | Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes |
KR20050004379A (ko) | 2003-07-02 | 2005-01-12 | 삼성전자주식회사 | 원자층 증착용 가스 공급 장치 |
US6837939B1 (en) | 2003-07-22 | 2005-01-04 | Eastman Kodak Company | Thermal physical vapor deposition source using pellets of organic material for making OLED displays |
US6909839B2 (en) | 2003-07-23 | 2005-06-21 | Advanced Technology Materials, Inc. | Delivery systems for efficient vaporization of precursor source material |
JP2005046941A (ja) | 2003-07-31 | 2005-02-24 | Canon Inc | ケーブル微動ユニット付きステージ装置 |
US7261118B2 (en) | 2003-08-19 | 2007-08-28 | Air Products And Chemicals, Inc. | Method and vessel for the delivery of precursor materials |
US7109113B2 (en) | 2004-01-30 | 2006-09-19 | Micron Technology, Inc. | Solid source precursor delivery system |
WO2006009872A1 (en) | 2004-06-22 | 2006-01-26 | Arkema Inc. | Direct injection chemical vapor deposition method |
US20060037540A1 (en) | 2004-08-20 | 2006-02-23 | Rohm And Haas Electronic Materials Llc | Delivery system |
US20060185597A1 (en) | 2004-11-29 | 2006-08-24 | Kenji Suzuki | Film precursor evaporation system and method of using |
US7638002B2 (en) | 2004-11-29 | 2009-12-29 | Tokyo Electron Limited | Multi-tray film precursor evaporation system and thin film deposition system incorporating same |
US7488512B2 (en) | 2004-11-29 | 2009-02-10 | Tokyo Electron Limited | Method for preparing solid precursor tray for use in solid precursor evaporation system |
US7708835B2 (en) | 2004-11-29 | 2010-05-04 | Tokyo Electron Limited | Film precursor tray for use in a film precursor evaporation system and method of using |
US7484315B2 (en) | 2004-11-29 | 2009-02-03 | Tokyo Electron Limited | Replaceable precursor tray for use in a multi-tray solid precursor delivery system |
US7722720B2 (en) | 2004-12-08 | 2010-05-25 | Rohm And Haas Electronic Materials Llc | Delivery device |
DE102004062552A1 (de) | 2004-12-24 | 2006-07-06 | Aixtron Ag | Vorrichtung zum Verdampfen von kondensierten Stoffen |
US20070042119A1 (en) | 2005-02-10 | 2007-02-22 | Larry Matthysse | Vaporizer for atomic layer deposition system |
EP1866074A4 (en) | 2005-03-16 | 2017-01-04 | Entegris Inc. | System for delivery of reagents from solid sources thereof |
US7651570B2 (en) | 2005-03-31 | 2010-01-26 | Tokyo Electron Limited | Solid precursor vaporization system for use in chemical vapor deposition |
US7485338B2 (en) | 2005-03-31 | 2009-02-03 | Tokyo Electron Limited | Method for precursor delivery |
US20070194470A1 (en) | 2006-02-17 | 2007-08-23 | Aviza Technology, Inc. | Direct liquid injector device |
EP1860208B1 (en) | 2006-05-22 | 2014-10-15 | Rohm and Haas Electronic Materials LLC | Film deposition method |
US20080241805A1 (en) | 2006-08-31 | 2008-10-02 | Q-Track Corporation | System and method for simulated dosimetry using a real time locating system |
US8986456B2 (en) | 2006-10-10 | 2015-03-24 | Asm America, Inc. | Precursor delivery system |
KR101480971B1 (ko) | 2006-10-10 | 2015-01-09 | 에이에스엠 아메리카, 인코포레이티드 | 전구체 전달 시스템 |
US9109287B2 (en) | 2006-10-19 | 2015-08-18 | Air Products And Chemicals, Inc. | Solid source container with inlet plenum |
US8708320B2 (en) | 2006-12-15 | 2014-04-29 | Air Products And Chemicals, Inc. | Splashguard and inlet diffuser for high vacuum, high flow bubbler vessel |
KR20080076173A (ko) | 2007-02-15 | 2008-08-20 | 삼성전자주식회사 | 금속 산화막 패턴 형성 방법 및 이를 이용한 반도체 소자의형성 방법 |
US7846256B2 (en) * | 2007-02-23 | 2010-12-07 | Tokyo Electron Limited | Ampule tray for and method of precursor surface area |
US9034105B2 (en) | 2008-01-10 | 2015-05-19 | American Air Liquide, Inc. | Solid precursor sublimator |
US8146896B2 (en) | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Chemical precursor ampoule for vapor deposition processes |
JP6070176B2 (ja) | 2012-12-27 | 2017-02-01 | 大日本印刷株式会社 | 転写箔 |
-
2002
- 2002-07-23 US US10/201,518 patent/US6921062B2/en not_active Expired - Lifetime
-
2003
- 2003-07-01 EP EP03739362A patent/EP1539336B1/en not_active Expired - Lifetime
- 2003-07-01 CN CNA2007100063142A patent/CN101033537A/zh active Pending
- 2003-07-01 JP JP2004523054A patent/JP4843218B2/ja not_active Expired - Lifetime
- 2003-07-01 AU AU2003245757A patent/AU2003245757A1/en not_active Abandoned
- 2003-07-01 SG SG2010071553A patent/SG179319A1/en unknown
- 2003-07-01 KR KR1020087024621A patent/KR20080098448A/ko active Search and Examination
- 2003-07-01 WO PCT/US2003/020825 patent/WO2004010463A2/en active Application Filing
- 2003-07-01 SG SG10201502354RA patent/SG10201502354RA/en unknown
- 2003-07-01 CN CNA2008101661966A patent/CN101476115A/zh active Pending
- 2003-07-01 KR KR1020057001240A patent/KR101152715B1/ko active IP Right Grant
- 2003-07-01 KR KR1020127003114A patent/KR101178030B1/ko active IP Right Grant
- 2003-07-01 KR KR1020107026815A patent/KR101178002B1/ko active IP Right Grant
- 2003-07-01 EP EP11153870A patent/EP2361672A3/en not_active Withdrawn
- 2003-07-01 CN CNB038177161A patent/CN100438960C/zh not_active Expired - Lifetime
- 2003-07-01 SG SG200700523-4A patent/SG167665A1/en unknown
- 2003-07-21 TW TW092119793A patent/TWI303461B/zh not_active IP Right Cessation
-
2009
- 2009-01-23 US US12/358,723 patent/US7828274B2/en not_active Expired - Lifetime
- 2009-12-14 JP JP2009283359A patent/JP5538857B2/ja not_active Expired - Lifetime
-
2010
- 2010-11-05 US US12/940,969 patent/US8128073B2/en not_active Expired - Fee Related
-
2012
- 2012-02-16 US US13/398,814 patent/US8444120B2/en not_active Expired - Lifetime
-
2013
- 2013-04-13 US US13/862,412 patent/US9004462B2/en not_active Expired - Fee Related
-
2014
- 2014-01-29 JP JP2014013897A patent/JP6230431B2/ja not_active Expired - Lifetime
-
2015
- 2015-04-08 JP JP2015079307A patent/JP6293699B2/ja not_active Expired - Lifetime
- 2015-04-14 US US14/686,274 patent/US20150218696A1/en not_active Abandoned
- 2015-07-31 US US14/815,805 patent/US9469898B2/en not_active Expired - Lifetime
-
2016
- 2016-01-26 JP JP2016011999A patent/JP6157025B2/ja not_active Expired - Lifetime
- 2016-10-17 US US15/295,662 patent/US10465286B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070176A (ja) * | 1983-09-27 | 1985-04-20 | Fujitsu Ltd | 固体ソ−ス蒸発ボンベ |
JPH04292406A (ja) * | 1991-03-19 | 1992-10-16 | Mitsubishi Cable Ind Ltd | 超電導mocvd用ガス化容器 |
JPH0519351U (ja) * | 1991-08-15 | 1993-03-09 | 三菱電線工業株式会社 | 超電導mocvd用蒸発器 |
JPH08279497A (ja) * | 1995-04-07 | 1996-10-22 | Hitachi Ltd | 半導体製造装置および半導体装置 |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9469898B2 (en) | 2002-07-23 | 2016-10-18 | Entegris, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
US10465286B2 (en) | 2002-07-23 | 2019-11-05 | Entegris, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
JP2016000866A (ja) * | 2004-06-01 | 2016-01-07 | インテグリス・インコーポレーテッド | ガスと蒸発材料との接触を促進するのを助ける方法及び装置 |
JP2007211346A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Electron Ltd | 膜前駆体蒸発システムにおいて使用される膜前駆体のトレーおよびその使用方法 |
JP2010502833A (ja) * | 2006-08-31 | 2010-01-28 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 制御された固体モルフォロジを利用する、固体前駆体に基づいた流体の送出 |
WO2012168924A1 (en) * | 2011-06-09 | 2012-12-13 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Supply apparatus and method of solid material gas |
JP2012255193A (ja) * | 2011-06-09 | 2012-12-27 | Air Liquide Japan Ltd | 固体材料ガスの供給装置および供給方法 |
JP2013028854A (ja) * | 2011-07-29 | 2013-02-07 | Air Liquide Japan Ltd | 固体材料ガスの供給装置および供給方法 |
WO2015029457A1 (en) | 2013-09-02 | 2015-03-05 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for producing pyromellitic dianhydride, pyromellitic dianhydride produced by the method, and apparatus therefor |
JP2016529281A (ja) * | 2013-09-02 | 2016-09-23 | 日本エア・リキード株式会社 | ピロメリット酸二無水物の製造方法、該方法により製造されたピロメリット酸二無水物、ピロメリット酸二無水物の供給方法および供給装置 |
US9856269B2 (en) | 2013-09-02 | 2018-01-02 | L'Air Liquide, SociétéAnonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Method for producing pyromellitic dianhydride, pyromellitic dianhydride produced by the method, and apparatus therefor |
JP2019513646A (ja) * | 2016-04-19 | 2019-05-30 | インテグリス・インコーポレーテッド | 不正開放防止化学薬品パッケージ |
JP2019007073A (ja) * | 2017-06-21 | 2019-01-17 | 日本エア・リキード株式会社 | 固体材料容器およびその固体材料容器に固体材料が充填されている固体材料製品 |
WO2018234285A1 (en) | 2017-06-21 | 2018-12-27 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | SOLID-MATERIAL CONTAINER AND SOLID-MATERIAL PRODUCT WITH SOLID MATTER CHARGED WITH SOLID-MATERIAL CONTAINER |
JP6324609B1 (ja) * | 2017-06-21 | 2018-05-16 | 日本エア・リキード株式会社 | 固体材料容器およびその固体材料容器に固体材料が充填されている固体材料製品 |
KR20200033258A (ko) * | 2017-06-21 | 2020-03-27 | 레르 리키드 쏘시에떼 아노님 뿌르 레뜌드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 고형물 용기, 및 고형물 용기에 충전된 고형물을 갖는 고형물 제품 |
KR102647546B1 (ko) * | 2017-06-21 | 2024-03-15 | 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 고형물 용기, 및 고형물 용기에 충전된 고형물을 갖는 고형물 제품 |
JPWO2019058969A1 (ja) * | 2017-09-21 | 2020-03-26 | 株式会社Kokusai Electric | 貯留容器、気化器、基板処理装置および半導体装置の製造方法 |
WO2019058969A1 (ja) * | 2017-09-21 | 2019-03-28 | 株式会社Kokusai Electric | 貯留容器、気化器、基板処理装置および半導体装置の製造方法 |
JP7299891B2 (ja) | 2017-12-14 | 2023-06-28 | インテグリス・インコーポレーテッド | 改良型アンプル蒸発装置およびベッセル |
JP2021507104A (ja) * | 2017-12-14 | 2021-02-22 | インテグリス・インコーポレーテッド | 改良型アンプル蒸発装置およびベッセル |
JP2021190487A (ja) * | 2020-05-27 | 2021-12-13 | 大陽日酸株式会社 | 固体材料供給装置 |
JP7478028B2 (ja) | 2020-05-27 | 2024-05-02 | 大陽日酸株式会社 | 固体材料供給装置 |
JP2023057341A (ja) * | 2021-10-11 | 2023-04-21 | 株式会社リンテック | 気化器 |
WO2023062849A1 (ja) * | 2021-10-11 | 2023-04-20 | 株式会社リンテック | 気化器 |
JP7045743B1 (ja) | 2021-10-11 | 2022-04-01 | 株式会社リンテック | 気化器 |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6157025B2 (ja) | 蒸発器配送アンプル及びその利用方法 | |
JP6133954B2 (ja) | ガスと蒸発材料との接触を促進するのを助ける方法及び装置 | |
US20030111014A1 (en) | Vaporizer/delivery vessel for volatile/thermally sensitive solid and liquid compounds | |
KR102447291B1 (ko) | 개선된 앰플 증발기 및 용기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20051202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20060227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060703 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060703 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090813 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20091113 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20091120 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100427 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100723 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100730 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100827 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100927 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110221 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110520 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110930 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111007 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4843218 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141014 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |