JP2007505501A - フィールドプレートを有するワイドバンドギャップトランジスタデバイス - Google Patents
フィールドプレートを有するワイドバンドギャップトランジスタデバイス Download PDFInfo
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- JP2007505501A JP2007505501A JP2006526270A JP2006526270A JP2007505501A JP 2007505501 A JP2007505501 A JP 2007505501A JP 2006526270 A JP2006526270 A JP 2006526270A JP 2006526270 A JP2006526270 A JP 2006526270A JP 2007505501 A JP2007505501 A JP 2007505501A
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- gate
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- 125000006850 spacer group Chemical group 0.000 claims abstract description 145
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 230000005684 electric field Effects 0.000 claims abstract description 11
- 230000004888 barrier function Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 35
- 230000006911 nucleation Effects 0.000 claims description 20
- 238000010899 nucleation Methods 0.000 claims description 20
- 229910002601 GaN Inorganic materials 0.000 claims description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 17
- 238000002161 passivation Methods 0.000 claims description 13
- 230000009467 reduction Effects 0.000 claims description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical group [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 14
- 239000003989 dielectric material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000012811 non-conductive material Substances 0.000 description 4
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000407 epitaxy Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000005533 two-dimensional electron gas Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000575 Ir alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000010893 electron trap Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013101 initial test Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 229910021339 platinum silicide Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- -1 spinet Chemical compound 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D44/00—Charge transfer devices
- H10D44/40—Charge-coupled devices [CCD]
- H10D44/45—Charge-coupled devices [CCD] having field effect produced by insulated gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50157603P | 2003-09-09 | 2003-09-09 | |
| US10/930,160 US7501669B2 (en) | 2003-09-09 | 2004-08-31 | Wide bandgap transistor devices with field plates |
| PCT/US2004/029345 WO2005029589A1 (en) | 2003-09-09 | 2004-09-08 | Wide bandgap transistor devices with field plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007505501A true JP2007505501A (ja) | 2007-03-08 |
| JP2007505501A5 JP2007505501A5 (enExample) | 2007-09-06 |
Family
ID=34228870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006526270A Pending JP2007505501A (ja) | 2003-09-09 | 2004-09-08 | フィールドプレートを有するワイドバンドギャップトランジスタデバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US7501669B2 (enExample) |
| EP (4) | EP1665385B1 (enExample) |
| JP (1) | JP2007505501A (enExample) |
| KR (1) | KR101108300B1 (enExample) |
| CN (2) | CN1938859B (enExample) |
| CA (1) | CA2536030A1 (enExample) |
| WO (1) | WO2005029589A1 (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008535241A (ja) * | 2005-04-01 | 2008-08-28 | レイセオン・カンパニー | 改善されたフィールドプレートを備える半導体デバイス |
| JP2009021362A (ja) * | 2007-07-11 | 2009-01-29 | Sumitomo Electric Ind Ltd | Iii族窒化物電子デバイス、iii族窒化物電子デバイスのための積層体ウエハ、およびiii族窒化物電子デバイスを作製する方法 |
| JP2010538582A (ja) * | 2007-09-07 | 2010-12-09 | レイセオン カンパニー | トランジスタ電力増幅器のための入力回路及びそのような回路を設計するための方法 |
| JP2013503483A (ja) * | 2009-08-28 | 2013-01-31 | トランスフォーム インコーポレーテッド | フィールドプレートを有する半導体デバイス |
| JP2013141000A (ja) * | 2007-03-23 | 2013-07-18 | Cree Inc | 半導体デバイス |
| JP2014090037A (ja) * | 2012-10-29 | 2014-05-15 | Advanced Power Device Research Association | 半導体装置 |
| US9041064B2 (en) | 2006-11-21 | 2015-05-26 | Cree, Inc. | High voltage GaN transistor |
| US9419124B2 (en) | 2001-07-24 | 2016-08-16 | Cree, Inc. | Insulating gate AlGaN/GaN HEMT |
| US9935190B2 (en) | 2014-07-21 | 2018-04-03 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| US10043898B2 (en) | 2013-03-13 | 2018-08-07 | Transphorm Inc. | Enhancement-mode III-nitride devices |
| US10224401B2 (en) | 2016-05-31 | 2019-03-05 | Transphorm Inc. | III-nitride devices including a graded depleting layer |
| US11322599B2 (en) | 2016-01-15 | 2022-05-03 | Transphorm Technology, Inc. | Enhancement mode III-nitride devices having an Al1-xSixO gate insulator |
| JP2023550828A (ja) * | 2020-11-27 | 2023-12-05 | 華為技術有限公司 | 半導体デバイスおよびその製造方法 |
Families Citing this family (201)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1665358B1 (en) * | 2003-09-09 | 2020-07-01 | The Regents of The University of California | Fabrication of single or multiple gate field plates |
| US7501669B2 (en) | 2003-09-09 | 2009-03-10 | Cree, Inc. | Wide bandgap transistor devices with field plates |
| TWI295085B (en) * | 2003-12-05 | 2008-03-21 | Int Rectifier Corp | Field effect transistor with enhanced insulator structure |
| US7045404B2 (en) * | 2004-01-16 | 2006-05-16 | Cree, Inc. | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof |
| US8174048B2 (en) * | 2004-01-23 | 2012-05-08 | International Rectifier Corporation | III-nitride current control device and method of manufacture |
| US7573078B2 (en) | 2004-05-11 | 2009-08-11 | Cree, Inc. | Wide bandgap transistors with multiple field plates |
| US7550783B2 (en) | 2004-05-11 | 2009-06-23 | Cree, Inc. | Wide bandgap HEMTs with source connected field plates |
| US9773877B2 (en) * | 2004-05-13 | 2017-09-26 | Cree, Inc. | Wide bandgap field effect transistors with source connected field plates |
| US20060073621A1 (en) * | 2004-10-01 | 2006-04-06 | Palo Alto Research Center Incorporated | Group III-nitride based HEMT device with insulating GaN/AlGaN buffer layer |
| US9640649B2 (en) * | 2004-12-30 | 2017-05-02 | Infineon Technologies Americas Corp. | III-nitride power semiconductor with a field relaxation feature |
| WO2006080109A1 (ja) * | 2005-01-25 | 2006-08-03 | Fujitsu Limited | Mis構造を有する半導体装置及びその製造方法 |
| US11791385B2 (en) * | 2005-03-11 | 2023-10-17 | Wolfspeed, Inc. | Wide bandgap transistors with gate-source field plates |
| US7615774B2 (en) * | 2005-04-29 | 2009-11-10 | Cree.Inc. | Aluminum free group III-nitride based high electron mobility transistors |
| US20060255377A1 (en) * | 2005-05-12 | 2006-11-16 | Der-Wei Tu | Field effect transistor with novel field-plate structure |
| WO2006132419A1 (ja) * | 2005-06-10 | 2006-12-14 | Nec Corporation | 電界効果トランジスタ |
| CN101238561B (zh) * | 2005-06-10 | 2011-08-24 | 日本电气株式会社 | 场效应晶体管 |
| US20070018199A1 (en) * | 2005-07-20 | 2007-01-25 | Cree, Inc. | Nitride-based transistors and fabrication methods with an etch stop layer |
| US7548112B2 (en) * | 2005-07-21 | 2009-06-16 | Cree, Inc. | Switch mode power amplifier using MIS-HEMT with field plate extension |
| US8183595B2 (en) * | 2005-07-29 | 2012-05-22 | International Rectifier Corporation | Normally off III-nitride semiconductor device having a programmable gate |
| JP4751150B2 (ja) | 2005-08-31 | 2011-08-17 | 株式会社東芝 | 窒化物系半導体装置 |
| EP1938385B1 (en) | 2005-09-07 | 2014-12-03 | Cree, Inc. | Transistors with fluorine treatment |
| US7948011B2 (en) * | 2005-09-16 | 2011-05-24 | The Regents Of The University Of California | N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor |
| US20070138515A1 (en) * | 2005-12-19 | 2007-06-21 | M/A-Com, Inc. | Dual field plate MESFET |
| JP2009522812A (ja) * | 2006-01-09 | 2009-06-11 | インターナショナル レクティファイアー コーポレイション | 電界緩和機能を有するiii族窒化物電力半導体 |
| US7709269B2 (en) | 2006-01-17 | 2010-05-04 | Cree, Inc. | Methods of fabricating transistors including dielectrically-supported gate electrodes |
| US7592211B2 (en) * | 2006-01-17 | 2009-09-22 | Cree, Inc. | Methods of fabricating transistors including supported gate electrodes |
| US8264003B2 (en) * | 2006-03-20 | 2012-09-11 | International Rectifier Corporation | Merged cascode transistor |
| US7408208B2 (en) | 2006-03-20 | 2008-08-05 | International Rectifier Corporation | III-nitride power semiconductor device |
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| KR100770132B1 (ko) * | 2006-10-30 | 2007-10-24 | 페어차일드코리아반도체 주식회사 | 질화물계 반도체 소자 |
| US8283699B2 (en) * | 2006-11-13 | 2012-10-09 | Cree, Inc. | GaN based HEMTs with buried field plates |
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| US7838904B2 (en) * | 2007-01-31 | 2010-11-23 | Panasonic Corporation | Nitride based semiconductor device with concave gate region |
| JP4691060B2 (ja) * | 2007-03-23 | 2011-06-01 | 古河電気工業株式会社 | GaN系半導体素子 |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2434546A1 (en) | 2012-03-28 |
| KR101108300B1 (ko) | 2012-01-25 |
| US8120064B2 (en) | 2012-02-21 |
| CN1938859A (zh) | 2007-03-28 |
| EP2437303A1 (en) | 2012-04-04 |
| US20070235761A1 (en) | 2007-10-11 |
| CA2536030A1 (en) | 2005-03-31 |
| EP1665385A1 (en) | 2006-06-07 |
| CN1938859B (zh) | 2011-11-23 |
| US20090224288A1 (en) | 2009-09-10 |
| WO2005029589A1 (en) | 2005-03-31 |
| EP2432021B1 (en) | 2021-06-09 |
| CN102306658A (zh) | 2012-01-04 |
| US7501669B2 (en) | 2009-03-10 |
| KR20060071415A (ko) | 2006-06-26 |
| EP1665385B1 (en) | 2020-11-11 |
| US9397173B2 (en) | 2016-07-19 |
| EP2432021A1 (en) | 2012-03-21 |
| US20050051796A1 (en) | 2005-03-10 |
| US7928475B2 (en) | 2011-04-19 |
| US20120132959A1 (en) | 2012-05-31 |
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