JP2016171162A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000001301 oxygen Substances 0.000 claims abstract description 29
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 29
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000007423 decrease Effects 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract 5
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 70
- 230000007547 defect Effects 0.000 description 13
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 150000002431 hydrogen Chemical class 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000005533 two-dimensional electron gas Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Abstract
【解決手段】半導体装置100は、半導体層30と、半導体層30上に設けられ、半導体層30に接続された第1電極50と、半導体層30上に設けられ、半導体層30に接続され、第1電極50の横に設けられた第2電極51と、半導体層30上に設けられたゲート絶縁膜53と、第1電極50と第2電極51との間に設けられ、ゲート絶縁膜53を介して半導体層30上に設けられた第3電極52と、を備える。ゲート絶縁膜53は、第1電極50と第2電極51との間において半導体層30側に設けられ、シリコン窒化物を含む第1層53aと、第1電極50と第3電極52との間及び第2電極51と第3電極52との間において第1層53a上に設けられ、シリコン窒化物を含み、第1層53aよりも酸素をより多く含む第2層53bと、を有する。
【選択図】図1
Description
Claims (4)
- 半導体層と、
前記半導体層上に設けられ、前記半導体層に接続された第1電極と、
前記半導体層上に設けられ、前記半導体層に接続され、前記第1電極の横に設けられた第2電極と、
前記半導体層上に設けられた絶縁膜と、
前記第1電極と前記第2電極との間に設けられ、前記絶縁膜を介して前記半導体層上に設けられた第3電極と、
を備え、
前記絶縁膜は、前記第1電極と前記第2電極との間において前記半導体層側に設けられ、シリコン窒化物を含む第1層と、
前記第1電極と前記第3電極との間および前記第2電極と前記第3電極との間において前記第1層上に設けられ、シリコン窒化物および酸素を含む第2層と、
を有する半導体装置。 - 前記第2層に含まれる酸素の濃度は、前記第2層内において、前記第1層の側の方が相対的に低くなっている請求項1記載の半導体装置。
- 前記第2層に含まれる酸素の濃度は、前記第1層に向かうほど低くなっている請求項1または2に記載の半導体装置。
- 半導体層と、
前記半導体層上に設けられ、前記半導体層に接続された第1電極と、
前記半導体層上に設けられ、前記半導体層に接続され、前記第1電極の横に設けられた第2電極と、
前記半導体層上に設けられ、シリコン窒化物および酸素を含む絶縁膜と、
前記第1電極と前記第2電極との間に設けられ、前記絶縁膜を介して前記半導体層上に設けられた第3電極と、
を備え、
前記絶縁膜は、前記第1電極と前記第3電極との間および前記第2電極と前記第3電極との間において酸素を含み、
前記酸素の濃度は、前記半導体層の側に向かうほど低くなっている半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015049047A JP2016171162A (ja) | 2015-03-12 | 2015-03-12 | 半導体装置 |
US14/831,233 US9852911B2 (en) | 2015-03-12 | 2015-08-20 | Field effect transistor |
TW104129059A TW201633542A (zh) | 2015-03-12 | 2015-09-02 | 半導體裝置 |
CN201510553491.7A CN105977296A (zh) | 2015-03-12 | 2015-09-02 | 半导体装置 |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015049047A JP2016171162A (ja) | 2015-03-12 | 2015-03-12 | 半導体装置 |
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JP2016171162A true JP2016171162A (ja) | 2016-09-23 |
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JP2015049047A Pending JP2016171162A (ja) | 2015-03-12 | 2015-03-12 | 半導体装置 |
Country Status (4)
Country | Link |
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US (1) | US9852911B2 (ja) |
JP (1) | JP2016171162A (ja) |
CN (1) | CN105977296A (ja) |
TW (1) | TW201633542A (ja) |
Families Citing this family (2)
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CN111341840B (zh) * | 2020-03-04 | 2021-07-16 | 中国科学院半导体研究所 | 场效应晶体管器件 |
CN111463274A (zh) * | 2020-03-25 | 2020-07-28 | 西北工业大学 | 基于氮化镓外延异质结的常开型hemt器件及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010232452A (ja) * | 2009-03-27 | 2010-10-14 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
JP2013077629A (ja) * | 2011-09-29 | 2013-04-25 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
JP2014123667A (ja) * | 2012-12-21 | 2014-07-03 | Sumitomo Electric Device Innovations Inc | 半導体装置の製造方法 |
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JP4385205B2 (ja) * | 2002-12-16 | 2009-12-16 | 日本電気株式会社 | 電界効果トランジスタ |
US7501669B2 (en) * | 2003-09-09 | 2009-03-10 | Cree, Inc. | Wide bandgap transistor devices with field plates |
JP2006032552A (ja) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | 窒化物含有半導体装置 |
WO2006080109A1 (ja) | 2005-01-25 | 2006-08-03 | Fujitsu Limited | Mis構造を有する半導体装置及びその製造方法 |
US20070018199A1 (en) * | 2005-07-20 | 2007-01-25 | Cree, Inc. | Nitride-based transistors and fabrication methods with an etch stop layer |
JP5065616B2 (ja) | 2006-04-21 | 2012-11-07 | 株式会社東芝 | 窒化物半導体素子 |
JP2013157407A (ja) * | 2012-01-27 | 2013-08-15 | Fujitsu Semiconductor Ltd | 化合物半導体装置及びその製造方法 |
JP5900315B2 (ja) | 2012-02-16 | 2016-04-06 | ソニー株式会社 | 半導体装置および半導体装置の製造方法 |
JP5662367B2 (ja) | 2012-03-26 | 2015-01-28 | 株式会社東芝 | 窒化物半導体装置およびその製造方法 |
JP6276150B2 (ja) * | 2014-09-16 | 2018-02-07 | 株式会社東芝 | 半導体装置 |
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- 2015-03-12 JP JP2015049047A patent/JP2016171162A/ja active Pending
- 2015-08-20 US US14/831,233 patent/US9852911B2/en active Active
- 2015-09-02 TW TW104129059A patent/TW201633542A/zh unknown
- 2015-09-02 CN CN201510553491.7A patent/CN105977296A/zh not_active Withdrawn
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010232452A (ja) * | 2009-03-27 | 2010-10-14 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
JP2013077629A (ja) * | 2011-09-29 | 2013-04-25 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
JP2014123667A (ja) * | 2012-12-21 | 2014-07-03 | Sumitomo Electric Device Innovations Inc | 半導体装置の製造方法 |
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CN105977296A (zh) | 2016-09-28 |
US9852911B2 (en) | 2017-12-26 |
TW201633542A (zh) | 2016-09-16 |
US20160268389A1 (en) | 2016-09-15 |
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