ATE493753T1 - Bühnenantriebsverfahren und bühnenantriebsvorrichtung, belichtungsvorrichtung und bauelemente-herstellungsverfahren - Google Patents
Bühnenantriebsverfahren und bühnenantriebsvorrichtung, belichtungsvorrichtung und bauelemente-herstellungsverfahrenInfo
- Publication number
- ATE493753T1 ATE493753T1 AT05704182T AT05704182T ATE493753T1 AT E493753 T1 ATE493753 T1 AT E493753T1 AT 05704182 T AT05704182 T AT 05704182T AT 05704182 T AT05704182 T AT 05704182T AT E493753 T1 ATE493753 T1 AT E493753T1
- Authority
- AT
- Austria
- Prior art keywords
- state
- optical system
- stage
- projection optical
- stage drive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 6
- 239000007788 liquid Substances 0.000 abstract 3
- JUJBNYBVVQSIOU-UHFFFAOYSA-M sodium;4-[2-(4-iodophenyl)-3-(4-nitrophenyl)tetrazol-2-ium-5-yl]benzene-1,3-disulfonate Chemical compound [Na+].C1=CC([N+](=O)[O-])=CC=C1N1[N+](C=2C=CC(I)=CC=2)=NC(C=2C(=CC(=CC=2)S([O-])(=O)=O)S([O-])(=O)=O)=N1 JUJBNYBVVQSIOU-UHFFFAOYSA-M 0.000 abstract 2
- 230000007704 transition Effects 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Prostheses (AREA)
- Eyeglasses (AREA)
- Optics & Photonics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004025837 | 2004-02-02 | ||
| JP2004300566 | 2004-10-14 | ||
| PCT/JP2005/001076 WO2005074014A1 (ja) | 2004-02-02 | 2005-01-27 | ステージ駆動方法及びステージ装置、露光装置、並びにデバイス製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE493753T1 true ATE493753T1 (de) | 2011-01-15 |
Family
ID=34829444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05704182T ATE493753T1 (de) | 2004-02-02 | 2005-01-27 | Bühnenantriebsverfahren und bühnenantriebsvorrichtung, belichtungsvorrichtung und bauelemente-herstellungsverfahren |
Country Status (11)
| Country | Link |
|---|---|
| US (15) | US7589822B2 (de) |
| EP (9) | EP2287894B1 (de) |
| JP (16) | JP4910394B2 (de) |
| KR (16) | KR101673826B1 (de) |
| CN (1) | CN101685263B (de) |
| AT (1) | ATE493753T1 (de) |
| DE (1) | DE602005025596D1 (de) |
| IL (7) | IL226841A (de) |
| SG (5) | SG152294A1 (de) |
| TW (14) | TWI437374B (de) |
| WO (1) | WO2005074014A1 (de) |
Families Citing this family (198)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| SG10201603067VA (en) | 2003-04-11 | 2016-05-30 | Nikon Corp | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
| TWI433212B (zh) | 2003-06-19 | 2014-04-01 | 尼康股份有限公司 | An exposure apparatus, an exposure method, and an element manufacturing method |
| EP2804048A1 (de) * | 2003-08-29 | 2014-11-19 | Nikon Corporation | Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung |
| US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| US20070030467A1 (en) * | 2004-02-19 | 2007-02-08 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
| JP4220423B2 (ja) * | 2004-03-24 | 2009-02-04 | 株式会社東芝 | レジストパターン形成方法 |
| KR101181683B1 (ko) * | 2004-03-25 | 2012-09-19 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법, 및 디바이스 제조 방법 |
| WO2005124833A1 (ja) * | 2004-06-21 | 2005-12-29 | Nikon Corporation | 露光装置及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法 |
| EP3306647A1 (de) | 2004-10-15 | 2018-04-11 | Nikon Corporation | Belichtungsvorrichtung und vorrichtungsherstellungsverfahren |
| US7119876B2 (en) * | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| KR101318037B1 (ko) * | 2004-11-01 | 2013-10-14 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| TWI393170B (zh) * | 2004-11-18 | 2013-04-11 | 尼康股份有限公司 | A position measuring method, a position control method, a measuring method, a loading method, an exposure method, an exposure apparatus, and a device manufacturing method |
| KR20070100865A (ko) * | 2004-12-06 | 2007-10-12 | 가부시키가이샤 니콘 | 기판 처리 방법, 노광 방법, 노광 장치 및 디바이스 제조방법 |
| US7528931B2 (en) * | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20070258068A1 (en) * | 2005-02-17 | 2007-11-08 | Hiroto Horikawa | Exposure Apparatus, Exposure Method, and Device Fabricating Method |
| USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
| WO2006118258A1 (ja) | 2005-04-28 | 2006-11-09 | Nikon Corporation | 露光方法及び露光装置、並びにデバイス製造方法 |
| WO2007018127A1 (ja) * | 2005-08-05 | 2007-02-15 | Nikon Corporation | ステージ装置及び露光装置 |
| KR101388345B1 (ko) * | 2005-09-09 | 2014-04-22 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| US7633073B2 (en) * | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7871933B2 (en) * | 2005-12-01 | 2011-01-18 | International Business Machines Corporation | Combined stepper and deposition tool |
| US8953148B2 (en) | 2005-12-28 | 2015-02-10 | Nikon Corporation | Exposure apparatus and making method thereof |
| CN102636966B (zh) | 2005-12-28 | 2014-12-03 | 株式会社尼康 | 曝光方法及曝光装置、以及元件制造方法 |
| WO2007080523A1 (en) * | 2006-01-10 | 2007-07-19 | Koninklijke Philips Electronics N.V. | Maglev object positioning apparatus and method for positioning an object and maintaining position with high stability |
| EP2857902B1 (de) | 2006-01-19 | 2016-04-20 | Nikon Corporation | Immersionsbelichtungsvorrichtung, Immersionsbelichtungsverfahren, und Verfahren zur Herstellung einer Vorrichtung |
| SG170012A1 (en) * | 2006-02-21 | 2011-04-29 | Nikon Corp | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
| KR20130057496A (ko) | 2006-02-21 | 2013-05-31 | 가부시키가이샤 니콘 | 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법 |
| CN101385120B (zh) * | 2006-02-21 | 2012-09-05 | 株式会社尼康 | 测定装置及方法、处理装置及方法、图案形成装置及方法、曝光装置及方法、以及元件制造方法 |
| JP5077770B2 (ja) | 2006-03-07 | 2012-11-21 | 株式会社ニコン | デバイス製造方法、デバイス製造システム及び測定検査装置 |
| US7230676B1 (en) * | 2006-03-13 | 2007-06-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7310132B2 (en) * | 2006-03-17 | 2007-12-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7760324B2 (en) * | 2006-03-20 | 2010-07-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TWI454859B (zh) | 2006-03-30 | 2014-10-01 | 尼康股份有限公司 | 移動體裝置、曝光裝置與曝光方法以及元件製造方法 |
| WO2007135990A1 (ja) | 2006-05-18 | 2007-11-29 | Nikon Corporation | 露光方法及び装置、メンテナンス方法、並びにデバイス製造方法 |
| JP2008004928A (ja) | 2006-05-22 | 2008-01-10 | Nikon Corp | 露光方法及び装置、メンテナンス方法、並びにデバイス製造方法 |
| JP5019170B2 (ja) | 2006-05-23 | 2012-09-05 | 株式会社ニコン | メンテナンス方法、露光方法及び装置、並びにデバイス製造方法 |
| WO2007139017A1 (ja) * | 2006-05-29 | 2007-12-06 | Nikon Corporation | 液体回収部材、基板保持部材、露光装置、及びデバイス製造方法 |
| SG172681A1 (en) | 2006-06-09 | 2011-07-28 | Nikon Corp | Movable-body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| CN100456138C (zh) * | 2006-06-13 | 2009-01-28 | 上海微电子装备有限公司 | 浸没式光刻机浸液流场维持系统 |
| KR20090033170A (ko) | 2006-06-30 | 2009-04-01 | 가부시키가이샤 니콘 | 메인터넌스 방법, 노광 방법 및 장치 및 디바이스 제조 방법 |
| US8570484B2 (en) * | 2006-08-30 | 2013-10-29 | Nikon Corporation | Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid |
| EP2071611B1 (de) | 2006-08-31 | 2019-05-01 | Nikon Corporation | Mobilkörperantriebssystem und mobilkörperantriebsverfahren, strukturerzeugungsvorrichtung und verfahren, belichtungsvorrichtung und verfahren, bauelementeherstellungsverfahren und entscheidungsverfahren |
| SG10201407395SA (en) | 2006-08-31 | 2014-12-30 | Nikon Corp | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
| TWI597585B (zh) | 2006-08-31 | 2017-09-01 | Nippon Kogaku Kk | Exposure method and exposure apparatus, and device manufacturing method |
| KR101770082B1 (ko) | 2006-09-01 | 2017-08-21 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
| SG10201407218XA (en) | 2006-09-01 | 2015-01-29 | Nippon Kogaku Kk | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
| US7872730B2 (en) * | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
| JP5120377B2 (ja) * | 2006-09-29 | 2013-01-16 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
| US20080158531A1 (en) * | 2006-11-15 | 2008-07-03 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| JP5055971B2 (ja) | 2006-11-16 | 2012-10-24 | 株式会社ニコン | 表面処理方法及び表面処理装置、露光方法及び露光装置、並びにデバイス製造方法 |
| US7973910B2 (en) * | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
| JP5089143B2 (ja) * | 2006-11-20 | 2012-12-05 | キヤノン株式会社 | 液浸露光装置 |
| US20080156356A1 (en) | 2006-12-05 | 2008-07-03 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
| WO2008146819A1 (ja) * | 2007-05-28 | 2008-12-04 | Nikon Corporation | 露光装置、デバイス製造方法、洗浄装置、及びクリーニング方法並びに露光方法 |
| US8164736B2 (en) | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
| US7737515B2 (en) * | 2007-06-20 | 2010-06-15 | New Jersey Institute Of Technology | Method of assembly using array of programmable magnets |
| JP5630634B2 (ja) * | 2007-07-13 | 2014-11-26 | 株式会社ニコン | 露光方法及び装置、並びにデバイス製造方法 |
| US9025126B2 (en) | 2007-07-31 | 2015-05-05 | Nikon Corporation | Exposure apparatus adjusting method, exposure apparatus, and device fabricating method |
| US8421994B2 (en) | 2007-09-27 | 2013-04-16 | Nikon Corporation | Exposure apparatus |
| US8279399B2 (en) | 2007-10-22 | 2012-10-02 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| KR101470671B1 (ko) * | 2007-11-07 | 2014-12-08 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| SG185261A1 (en) | 2007-12-11 | 2012-11-29 | Nikon Corp | Movable body apparatus, exposure apparatus and pattern formation apparatus, and device manufacturing method |
| US8964166B2 (en) | 2007-12-17 | 2015-02-24 | Nikon Corporation | Stage device, exposure apparatus and method of producing device |
| US20090153824A1 (en) * | 2007-12-17 | 2009-06-18 | Kla-Tencor Corporation | Multiple chuck scanning stage |
| SG183058A1 (en) * | 2007-12-17 | 2012-08-30 | Nikon Corp | Exposure apparatus, exposure method and device manufacturing method |
| CN101681809B (zh) * | 2007-12-28 | 2012-04-25 | 株式会社尼康 | 曝光装置、曝光方法以及器件制造方法 |
| US8269945B2 (en) * | 2007-12-28 | 2012-09-18 | Nikon Corporation | Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method |
| US8237916B2 (en) * | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
| JP5369443B2 (ja) | 2008-02-05 | 2013-12-18 | 株式会社ニコン | ステージ装置、露光装置、露光方法、及びデバイス製造方法 |
| KR20100124245A (ko) | 2008-02-08 | 2010-11-26 | 가부시키가이샤 니콘 | 위치 계측 시스템 및 위치 계측 방법, 이동체 장치, 이동체 구동 방법, 노광 장치 및 노광 방법, 패턴 형성 장치, 그리고 디바이스 제조 방법 |
| JP2009218564A (ja) * | 2008-02-12 | 2009-09-24 | Canon Inc | 露光装置及びデバイス製造方法 |
| US20100039628A1 (en) * | 2008-03-19 | 2010-02-18 | Nikon Corporation | Cleaning tool, cleaning method, and device fabricating method |
| KR20100128352A (ko) | 2008-04-11 | 2010-12-07 | 가부시키가이샤 니콘 | 스테이지장치, 노광장치 및 디바이스 제조방법 |
| US8654306B2 (en) * | 2008-04-14 | 2014-02-18 | Nikon Corporation | Exposure apparatus, cleaning method, and device fabricating method |
| US8786829B2 (en) | 2008-05-13 | 2014-07-22 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8228482B2 (en) | 2008-05-13 | 2012-07-24 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8817236B2 (en) | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
| EP2283310A4 (de) | 2008-05-22 | 2011-11-02 | Micronic Laser Systems Ab | Verfahren und vorrichtung zur überlappungskompensation zwischen in folge angeordneten schichten auf einem werkstück |
| US9176393B2 (en) | 2008-05-28 | 2015-11-03 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
| TW201003053A (en) * | 2008-07-10 | 2010-01-16 | Nikon Corp | Deformation measuring apparatus, exposure apparatus, jig for deformation measuring apparatus, position measuring method and device manufacturing method |
| TW201017347A (en) * | 2008-10-31 | 2010-05-01 | Nikon Corp | Exposure device, exposure method, and device manufacturing method |
| EP2189849B1 (de) | 2008-11-21 | 2015-12-16 | ASML Netherlands B.V. | Lithographievorrichtung mit einer Wechselbrücke |
| EP2196857A3 (de) | 2008-12-09 | 2010-07-21 | ASML Netherlands BV | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| US9062260B2 (en) | 2008-12-10 | 2015-06-23 | Chevron U.S.A. Inc. | Removing unstable sulfur compounds from crude oil |
| US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
| US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
| US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
| US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US8896806B2 (en) | 2008-12-29 | 2014-11-25 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US20100196832A1 (en) | 2009-01-30 | 2010-08-05 | Nikon Corporation | Exposure apparatus, exposing method, liquid immersion member and device fabricating method |
| JP5482784B2 (ja) | 2009-03-10 | 2014-05-07 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| US8202671B2 (en) | 2009-04-28 | 2012-06-19 | Nikon Corporation | Protective apparatus, mask, mask forming apparatus, mask forming method, exposure apparatus, device fabricating method, and foreign matter detecting apparatus |
| US20100296074A1 (en) * | 2009-04-30 | 2010-11-25 | Nikon Corporation | Exposure method, and device manufacturing method |
| US20110085152A1 (en) * | 2009-05-07 | 2011-04-14 | Hideaki Nishino | Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method |
| US20100323303A1 (en) * | 2009-05-15 | 2010-12-23 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, and device fabricating method |
| US8395758B2 (en) | 2009-05-15 | 2013-03-12 | Nikon Corporation | Exposure apparatus and device manufacturing method |
| US8970820B2 (en) * | 2009-05-20 | 2015-03-03 | Nikon Corporation | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method |
| US8792084B2 (en) * | 2009-05-20 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| IT1399285B1 (it) * | 2009-07-03 | 2013-04-11 | Applied Materials Inc | Sistema di lavorazione substrato |
| US20110032495A1 (en) | 2009-08-07 | 2011-02-10 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| KR101494493B1 (ko) | 2009-08-07 | 2015-02-17 | 가부시키가이샤 니콘 | 이동체 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| US8514395B2 (en) | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
| US8493547B2 (en) | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
| US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
| US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
| US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
| US20110199591A1 (en) * | 2009-10-14 | 2011-08-18 | Nikon Corporation | Exposure apparatus, exposing method, maintenance method and device fabricating method |
| KR20170113709A (ko) | 2009-11-09 | 2017-10-12 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법, 노광 장치의 메인터넌스 방법, 노광 장치의 조정 방법, 및 디바이스 제조 방법 |
| US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
| US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
| DE102009054653A1 (de) * | 2009-12-15 | 2011-06-16 | Carl Zeiss Smt Gmbh | Spiegel für den EUV-Wellenlängenbereich, Substrat für einen solchen Spiegel, Verwendung einer Quarzschicht für ein solches Substrat, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel oder einem solchen Substrat und Projetktionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
| CN103135365A (zh) | 2009-12-28 | 2013-06-05 | 株式会社尼康 | 液浸构件、液浸构件的制造方法、曝光装置、及元件制造方法 |
| CN102714141B (zh) | 2010-01-08 | 2016-03-23 | 株式会社尼康 | 液浸构件、曝光装置、曝光方法及元件制造方法 |
| JP2011156678A (ja) * | 2010-01-29 | 2011-08-18 | Sony Corp | 3次元造形装置、3次元造形物の製造方法及び3次元造形物 |
| JP5842808B2 (ja) | 2010-02-20 | 2016-01-13 | 株式会社ニコン | 瞳強度分布を調整する方法 |
| US20110222031A1 (en) * | 2010-03-12 | 2011-09-15 | Nikon Corporation | Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
| NL2006506A (en) * | 2010-04-28 | 2011-10-31 | Asml Netherlands Bv | A component of an immersion system, an immersion lithographic apparatus and a device manufacturing method. |
| US20120013863A1 (en) | 2010-07-14 | 2012-01-19 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
| US20120013864A1 (en) | 2010-07-14 | 2012-01-19 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
| US8937703B2 (en) | 2010-07-14 | 2015-01-20 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
| US20120012191A1 (en) | 2010-07-16 | 2012-01-19 | Nikon Corporation | Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
| US20120019804A1 (en) | 2010-07-23 | 2012-01-26 | Nikon Corporation | Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium |
| US20120019802A1 (en) | 2010-07-23 | 2012-01-26 | Nikon Corporation | Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium |
| US20120019803A1 (en) | 2010-07-23 | 2012-01-26 | Nikon Corporation | Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium |
| US8418773B2 (en) | 2010-09-10 | 2013-04-16 | Jason Cerrano | Fire-fighting control system |
| JP5510299B2 (ja) * | 2010-12-13 | 2014-06-04 | ウシオ電機株式会社 | 露光装置および露光方法 |
| EP2469339B1 (de) * | 2010-12-21 | 2017-08-30 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| US20120188521A1 (en) | 2010-12-27 | 2012-07-26 | Nikon Corporation | Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium |
| US20120162619A1 (en) | 2010-12-27 | 2012-06-28 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium |
| US9030057B2 (en) | 2011-06-24 | 2015-05-12 | Nikon Corporation | Method and apparatus to allow a plurality of stages to operate in close proximity |
| US20130016329A1 (en) | 2011-07-12 | 2013-01-17 | Nikon Corporation | Exposure apparatus, exposure method, measurement method, and device manufacturing method |
| US9329496B2 (en) | 2011-07-21 | 2016-05-03 | Nikon Corporation | Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium |
| US9256137B2 (en) | 2011-08-25 | 2016-02-09 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| US20130050666A1 (en) | 2011-08-26 | 2013-02-28 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| US8794610B2 (en) * | 2011-09-20 | 2014-08-05 | Mitutoyo Corporation | Two-dimension precision transfer equipment, three-dimension precision transfer equipment, and coordinate measuring machine |
| NL2009345A (en) * | 2011-09-28 | 2013-04-02 | Asml Netherlands Bv | Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods. |
| WO2013073538A1 (ja) | 2011-11-17 | 2013-05-23 | 株式会社ニコン | エンコーダ装置、移動量計測方法、光学装置、並びに露光方法及び装置 |
| US20130135594A1 (en) | 2011-11-25 | 2013-05-30 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium |
| US20130169944A1 (en) | 2011-12-28 | 2013-07-04 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, program, and recording medium |
| US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
| CN103199046B (zh) * | 2012-01-05 | 2015-09-09 | 沈阳新松机器人自动化股份有限公司 | 晶圆缺口边缘中心预对准方法 |
| US9323160B2 (en) | 2012-04-10 | 2016-04-26 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium |
| US9268231B2 (en) | 2012-04-10 | 2016-02-23 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium |
| CN104364881A (zh) * | 2012-04-13 | 2015-02-18 | 株式会社尼康 | 移动体装置、曝光装置以及器件制造方法 |
| US9823580B2 (en) | 2012-07-20 | 2017-11-21 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium |
| CN108613638B (zh) | 2012-10-02 | 2020-09-18 | 株式会社尼康 | 曝光装置及曝光方法、以及器件制造方法 |
| US9568828B2 (en) | 2012-10-12 | 2017-02-14 | Nikon Corporation | Exposure apparatus, exposing method, device manufacturing method, program, and recording medium |
| US9494870B2 (en) | 2012-10-12 | 2016-11-15 | Nikon Corporation | Exposure apparatus, exposing method, device manufacturing method, program, and recording medium |
| US9772564B2 (en) * | 2012-11-12 | 2017-09-26 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method |
| HK1215330A1 (en) | 2012-11-20 | 2016-08-19 | Nikon Corporation | Exposure device, mobile device, and device manufacturing method |
| US10242903B2 (en) | 2012-11-30 | 2019-03-26 | Nikon Corporation | Suction device, carry-in method, carrier system and exposure apparatus, and device manufacturing method |
| KR101450713B1 (ko) * | 2012-12-05 | 2014-10-16 | 세메스 주식회사 | 기판 처리 장치 |
| WO2014096299A1 (en) * | 2012-12-20 | 2014-06-26 | Asml Netherlands B.V. | Lithographic apparatus and table for use in such an apparatus |
| US9651873B2 (en) | 2012-12-27 | 2017-05-16 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium |
| JP6119242B2 (ja) | 2012-12-27 | 2017-04-26 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| US9720331B2 (en) | 2012-12-27 | 2017-08-01 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium |
| US9352073B2 (en) | 2013-01-22 | 2016-05-31 | Niko Corporation | Functional film |
| US9057955B2 (en) | 2013-01-22 | 2015-06-16 | Nikon Corporation | Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method |
| WO2014132923A1 (ja) | 2013-02-28 | 2014-09-04 | 株式会社ニコン | 摺動膜、摺動膜が形成された部材、及びその製造方法 |
| JP5344105B1 (ja) | 2013-03-08 | 2013-11-20 | ウシオ電機株式会社 | 光配向用偏光光照射装置及び光配向用偏光光照射方法 |
| JP6178092B2 (ja) * | 2013-03-28 | 2017-08-09 | 株式会社荏原製作所 | ステージ装置及び電子線応用装置 |
| KR101794744B1 (ko) | 2013-08-14 | 2017-12-01 | 에프이아이 컴파니 | 하전 입자 비임 시스템용 회로 프로브 |
| JP6369472B2 (ja) | 2013-10-08 | 2018-08-08 | 株式会社ニコン | 液浸部材、露光装置及び露光方法、並びにデバイス製造方法 |
| US9927726B2 (en) * | 2013-10-09 | 2018-03-27 | Asml Netherlands B.V. | Polarization independent interferometer |
| US20150187540A1 (en) * | 2013-12-27 | 2015-07-02 | Canon Kabushiki Kaisha | Drawing apparatus and method of manufacturing article |
| JP6481242B2 (ja) * | 2014-10-29 | 2019-03-13 | 新シコー科技株式会社 | レンズ駆動装置、カメラ装置及び電子機器 |
| WO2016136689A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びにデバイス製造方法 |
| HK1246871A1 (en) | 2015-02-23 | 2018-09-14 | Nikon Corporation | Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method |
| EP3264180B1 (de) | 2015-02-23 | 2020-01-08 | Nikon Corporation | Substratverarbeitungssystem und substratverarbeitungsverfahren und vorrichtungsherstellungsverfahren |
| US9927723B2 (en) * | 2015-03-24 | 2018-03-27 | Applied Materials, Inc. | Apparatus and methods for on-the-fly digital exposure image data modification |
| CN107430356B (zh) | 2015-03-25 | 2021-02-26 | 株式会社尼康 | 布局方法、标记检测方法、曝光方法、测量装置、曝光装置、以及组件制造方法 |
| WO2016159200A1 (ja) * | 2015-03-31 | 2016-10-06 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
| JP6700932B2 (ja) * | 2016-04-20 | 2020-05-27 | キヤノン株式会社 | 検出装置、検出方法、プログラム、リソグラフィ装置、および物品製造方法 |
| JP6353487B2 (ja) * | 2016-05-26 | 2018-07-04 | 株式会社サーマプレシジョン | 投影露光装置及びその投影露光方法 |
| WO2017209132A1 (ja) * | 2016-05-31 | 2017-12-07 | 株式会社ニコン | マーク検出装置及びマーク検出方法、計測装置、露光装置及び露光方法、並びに、デバイス製造方法 |
| JP6929024B2 (ja) * | 2016-07-06 | 2021-09-01 | キヤノン株式会社 | 光学装置、露光装置及び物品の製造方法 |
| KR102566162B1 (ko) * | 2016-08-23 | 2023-08-10 | 삼성전자주식회사 | 웨이퍼 검사 장치 및 이를 이용한 웨이퍼 검사 방법 |
| JP7081490B2 (ja) | 2016-09-27 | 2022-06-07 | 株式会社ニコン | レイアウト情報提供方法、レイアウト情報、決定方法、プログラム、並びに情報記録媒体 |
| JP6883655B2 (ja) * | 2017-02-03 | 2021-06-09 | エーエスエムエル ネザーランズ ビー.ブイ. | 露光装置 |
| US11125814B2 (en) * | 2017-02-22 | 2021-09-21 | Sintokogio, Ltd. | Test system |
| US10009119B1 (en) * | 2017-03-06 | 2018-06-26 | The Boeing Company | Bandgap modulation for underwater communications and energy harvesting |
| CN110869855B (zh) | 2017-07-14 | 2024-11-19 | Asml荷兰有限公司 | 量测设备和衬底平台输送装置系统 |
| JP6985102B2 (ja) * | 2017-10-31 | 2021-12-22 | 株式会社ディスコ | レーザー加工装置 |
| JP7060995B2 (ja) * | 2018-03-30 | 2022-04-27 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、および物品の製造方法 |
| JP7212701B2 (ja) * | 2018-05-31 | 2023-01-25 | アプライド マテリアルズ インコーポレイテッド | デジタルリソグラフィシステムでのマルチ基板処理 |
| CN110773513B (zh) * | 2018-07-30 | 2022-12-20 | 佳能株式会社 | 清洁设备和清洁设备的控制方法 |
| JP2020022010A (ja) * | 2018-07-30 | 2020-02-06 | キヤノン株式会社 | 清掃装置及び清掃方法 |
| CN110858551B (zh) * | 2018-08-24 | 2025-02-14 | 禾宬科技有限公司 | 半导体清洗装置及方法 |
| TWI721307B (zh) * | 2018-09-21 | 2021-03-11 | 禾宬科技有限公司 | 半導體清洗裝置及方法 |
| JP7265020B2 (ja) * | 2019-02-28 | 2023-04-25 | エーエスエムエル ネザーランズ ビー.ブイ. | ステージシステム及びリソグラフィ装置 |
| KR20220011903A (ko) | 2020-07-22 | 2022-02-03 | 삼성전자주식회사 | 식기 세척기 |
| US11094499B1 (en) * | 2020-10-04 | 2021-08-17 | Borries Pte. Ltd. | Apparatus of charged-particle beam such as electron microscope comprising sliding specimen table within objective lens |
| JP7631148B2 (ja) * | 2021-08-26 | 2025-02-18 | 株式会社Screenホールディングス | 描画装置および描画方法 |
| KR20240058311A (ko) * | 2022-10-26 | 2024-05-03 | 삼성전자주식회사 | 기판 처리 장치 |
Family Cites Families (345)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US478661A (en) | 1892-07-12 | Henri tudor | ||
| US723963A (en) * | 1902-10-01 | 1903-03-31 | Howard H Willson | Temporary binder. |
| GB1242527A (en) | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
| US3626560A (en) | 1970-06-04 | 1971-12-14 | Cogsdill Tool Prod | Sizing and finishing device for external surfaces |
| US4026653A (en) | 1975-05-09 | 1977-05-31 | Bell Telephone Laboratories, Incorporated | Proximity printing method |
| US4341164A (en) | 1980-06-13 | 1982-07-27 | Charles H. Ruble | Folding camp table |
| US4346164A (en) | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
| US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
| JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
| JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
| US4465363A (en) | 1981-11-27 | 1984-08-14 | Hoechst Aktiengesellschaft | Cleaning device for cleaning the peripheral surface of a photoconductive drum in an electrophotographic copier |
| JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
| JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
| JPS59228356A (ja) | 1983-06-09 | 1984-12-21 | Matsushita Electric Ind Co Ltd | 空気電池の収納ケ−ス |
| DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
| US4650983A (en) | 1983-11-07 | 1987-03-17 | Nippon Kogaku K. K. | Focusing apparatus for projection optical system |
| DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
| JPS6122249A (ja) | 1984-07-11 | 1986-01-30 | Tokyo Keiki Co Ltd | 超音波探傷器 |
| JPS6144429A (ja) | 1984-08-09 | 1986-03-04 | Nippon Kogaku Kk <Nikon> | 位置合わせ方法、及び位置合せ装置 |
| US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
| JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
| JPS62121417A (ja) | 1985-11-22 | 1987-06-02 | Hitachi Ltd | 液浸対物レンズ装置 |
| JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
| JP2940553B2 (ja) | 1988-12-21 | 1999-08-25 | 株式会社ニコン | 露光方法 |
| JP2897355B2 (ja) | 1990-07-05 | 1999-05-31 | 株式会社ニコン | アライメント方法,露光装置,並びに位置検出方法及び装置 |
| US5121256A (en) * | 1991-03-14 | 1992-06-09 | The Board Of Trustees Of The Leland Stanford Junior University | Lithography system employing a solid immersion lens |
| JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
| JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
| US5243195A (en) | 1991-04-25 | 1993-09-07 | Nikon Corporation | Projection exposure apparatus having an off-axis alignment system and method of alignment therefor |
| JP3200874B2 (ja) | 1991-07-10 | 2001-08-20 | 株式会社ニコン | 投影露光装置 |
| JPH0562877A (ja) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | 光によるlsi製造縮小投影露光装置の光学系 |
| JP3203719B2 (ja) | 1991-12-26 | 2001-08-27 | 株式会社ニコン | 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法 |
| JPH05304072A (ja) | 1992-04-08 | 1993-11-16 | Nec Corp | 半導体装置の製造方法 |
| US5469963A (en) * | 1992-04-08 | 1995-11-28 | Asyst Technologies, Inc. | Sealable transportable container having improved liner |
| JPH06124873A (ja) * | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
| JP2753930B2 (ja) | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
| JP3316833B2 (ja) | 1993-03-26 | 2002-08-19 | 株式会社ニコン | 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法 |
| KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
| JPH06208058A (ja) | 1993-01-13 | 1994-07-26 | Olympus Optical Co Ltd | 顕微鏡対物レンズ |
| US5591958A (en) * | 1993-06-14 | 1997-01-07 | Nikon Corporation | Scanning exposure method and apparatus |
| JP3412704B2 (ja) | 1993-02-26 | 2003-06-03 | 株式会社ニコン | 投影露光方法及び装置、並びに露光装置 |
| JP3635684B2 (ja) | 1994-08-23 | 2005-04-06 | 株式会社ニコン | 反射屈折縮小投影光学系、反射屈折光学系、並びに投影露光方法及び装置 |
| JPH09311278A (ja) | 1996-05-20 | 1997-12-02 | Nikon Corp | 反射屈折光学系 |
| JP3747951B2 (ja) | 1994-11-07 | 2006-02-22 | 株式会社ニコン | 反射屈折光学系 |
| US5636066A (en) | 1993-03-12 | 1997-06-03 | Nikon Corporation | Optical apparatus |
| JP3747958B2 (ja) | 1995-04-07 | 2006-02-22 | 株式会社ニコン | 反射屈折光学系 |
| US5534970A (en) | 1993-06-11 | 1996-07-09 | Nikon Corporation | Scanning exposure apparatus |
| JP3265503B2 (ja) | 1993-06-11 | 2002-03-11 | 株式会社ニコン | 露光方法及び装置 |
| DE69429131T2 (de) | 1993-06-18 | 2002-07-11 | Hitachi Maxell Ltd., Osaka | Elektrochemisches Element mit flüssigem organischem Elektrolyten |
| JP3212199B2 (ja) * | 1993-10-04 | 2001-09-25 | 旭硝子株式会社 | 平板型陰極線管 |
| JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
| US6989647B1 (en) | 1994-04-01 | 2006-01-24 | Nikon Corporation | Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device |
| US5874820A (en) | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
| US7365513B1 (en) | 1994-04-01 | 2008-04-29 | Nikon Corporation | Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device |
| US5528118A (en) | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
| JP3395801B2 (ja) | 1994-04-28 | 2003-04-14 | 株式会社ニコン | 反射屈折投影光学系、走査型投影露光装置、及び走査投影露光方法 |
| JP3555230B2 (ja) | 1994-05-18 | 2004-08-18 | 株式会社ニコン | 投影露光装置 |
| JPH07335748A (ja) | 1994-06-07 | 1995-12-22 | Miyazaki Oki Electric Co Ltd | 半導体素子の製造方法 |
| US5715064A (en) * | 1994-06-17 | 1998-02-03 | International Business Machines Corporation | Step and repeat apparatus having enhanced accuracy and increased throughput |
| KR0124189B1 (ko) * | 1994-07-29 | 1997-11-25 | 배순훈 | 다중광학계를 갖춘 광픽업장치 |
| USRE38438E1 (en) | 1994-08-23 | 2004-02-24 | Nikon Corporation | Catadioptric reduction projection optical system and exposure apparatus having the same |
| JPH0883753A (ja) * | 1994-09-13 | 1996-03-26 | Nikon Corp | 焦点検出方法 |
| US5623853A (en) | 1994-10-19 | 1997-04-29 | Nikon Precision Inc. | Precision motion stage with single guide beam and follower stage |
| JPH08136475A (ja) | 1994-11-14 | 1996-05-31 | Kawasaki Steel Corp | 板状材の表面観察装置 |
| JP3387075B2 (ja) | 1994-12-12 | 2003-03-17 | 株式会社ニコン | 走査露光方法、露光装置、及び走査型露光装置 |
| JPH08171054A (ja) | 1994-12-16 | 1996-07-02 | Nikon Corp | 反射屈折光学系 |
| US5677758A (en) | 1995-02-09 | 1997-10-14 | Mrs Technology, Inc. | Lithography System using dual substrate stages |
| US6008500A (en) | 1995-04-04 | 1999-12-28 | Nikon Corporation | Exposure apparatus having dynamically isolated reaction frame |
| DE69604524T2 (de) * | 1995-04-25 | 2000-04-13 | Canon K.K., Tokio/Tokyo | Abtastbelichtungsapparat und Belichtungsverfahren unter Verwendung desselben |
| JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
| JPH08316124A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
| US5751404A (en) * | 1995-07-24 | 1998-05-12 | Canon Kabushiki Kaisha | Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates |
| JP3526042B2 (ja) | 1995-08-09 | 2004-05-10 | 株式会社ニコン | 投影露光装置 |
| JPH0954443A (ja) * | 1995-08-18 | 1997-02-25 | Nikon Corp | 露光方法及び装置 |
| JPH09232213A (ja) | 1996-02-26 | 1997-09-05 | Nikon Corp | 投影露光装置 |
| US5964441A (en) | 1996-04-01 | 1999-10-12 | Lear Corporation | Linkage assembly with extruded hole member |
| JPH103039A (ja) | 1996-06-14 | 1998-01-06 | Nikon Corp | 反射屈折光学系 |
| JPH1020195A (ja) | 1996-06-28 | 1998-01-23 | Nikon Corp | 反射屈折光学系 |
| US5825043A (en) | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
| JP4029182B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 露光方法 |
| JP4029180B2 (ja) * | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
| WO1998024115A1 (en) | 1996-11-28 | 1998-06-04 | Nikon Corporation | Aligner and method for exposure |
| JP4029181B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置 |
| JP4029183B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
| US5815246A (en) | 1996-12-24 | 1998-09-29 | U.S. Philips Corporation | Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device |
| EP1197801B1 (de) | 1996-12-24 | 2005-12-28 | ASML Netherlands B.V. | Lithographisches Gerät mit zwei Objekthaltern |
| JPH10209039A (ja) | 1997-01-27 | 1998-08-07 | Nikon Corp | 投影露光方法及び投影露光装置 |
| JP3612920B2 (ja) | 1997-02-14 | 2005-01-26 | ソニー株式会社 | 光学記録媒体の原盤作製用露光装置 |
| USRE40043E1 (en) | 1997-03-10 | 2008-02-05 | Asml Netherlands B.V. | Positioning device having two object holders |
| JPH10255319A (ja) | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | 原盤露光装置及び方法 |
| JP3747566B2 (ja) | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
| JP3817836B2 (ja) | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
| JPH1116816A (ja) | 1997-06-25 | 1999-01-22 | Nikon Corp | 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法 |
| US5900354A (en) * | 1997-07-03 | 1999-05-04 | Batchelder; John Samuel | Method for optical inspection and lithography |
| IL135139A0 (en) | 1997-09-19 | 2001-05-20 | Nikon Corp | Stage apparatus, scanning type exposure apparatus, and device produced with the same |
| JP2000106340A (ja) | 1997-09-26 | 2000-04-11 | Nikon Corp | 露光装置及び走査露光方法、並びにステージ装置 |
| JP4210871B2 (ja) | 1997-10-31 | 2009-01-21 | 株式会社ニコン | 露光装置 |
| WO1999027568A1 (en) | 1997-11-21 | 1999-06-03 | Nikon Corporation | Projection aligner and projection exposure method |
| JPH11176727A (ja) * | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
| US6897963B1 (en) | 1997-12-18 | 2005-05-24 | Nikon Corporation | Stage device and exposure apparatus |
| AU1682899A (en) | 1997-12-18 | 1999-07-05 | Nikon Corporation | Stage device and exposure apparatus |
| JP4264676B2 (ja) * | 1998-11-30 | 2009-05-20 | 株式会社ニコン | 露光装置及び露光方法 |
| US6208407B1 (en) | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
| WO1999049504A1 (fr) | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
| JP2000058436A (ja) | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
| KR20010075157A (ko) | 1998-09-17 | 2001-08-09 | 오노 시게오 | 투영광학계의 조정방법 |
| WO2000033359A2 (en) * | 1998-12-02 | 2000-06-08 | Kensington Laboratories, Inc. | Specimen holding robotic arm end effector |
| JP2000187338A (ja) | 1998-12-24 | 2000-07-04 | Canon Inc | 露光装置およびデバイス製造方法 |
| JP2000216082A (ja) * | 1999-01-27 | 2000-08-04 | Nikon Corp | ステ―ジ装置および露光装置 |
| KR20020006670A (ko) * | 1999-03-12 | 2002-01-24 | 시마무라 테루오 | 노광장치 및 노광방법, 그리고 디바이스 제조방법 |
| JP4365934B2 (ja) | 1999-05-10 | 2009-11-18 | キヤノン株式会社 | 露光装置、半導体製造装置およびデバイス製造方法 |
| JP4504479B2 (ja) | 1999-09-21 | 2010-07-14 | オリンパス株式会社 | 顕微鏡用液浸対物レンズ |
| JP2001118773A (ja) * | 1999-10-18 | 2001-04-27 | Nikon Corp | ステージ装置及び露光装置 |
| WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
| TW546551B (en) | 1999-12-21 | 2003-08-11 | Asml Netherlands Bv | Balanced positioning system for use in lithographic apparatus |
| EP1111471B1 (de) | 1999-12-21 | 2005-11-23 | ASML Netherlands B.V. | Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung |
| TWI223734B (en) * | 1999-12-21 | 2004-11-11 | Asml Netherlands Bv | Crash prevention in positioning apparatus for use in lithographic projection apparatus |
| US6995930B2 (en) | 1999-12-29 | 2006-02-07 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
| US7187503B2 (en) | 1999-12-29 | 2007-03-06 | Carl Zeiss Smt Ag | Refractive projection objective for immersion lithography |
| JP2001267239A (ja) | 2000-01-14 | 2001-09-28 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
| JP2001241439A (ja) | 2000-02-25 | 2001-09-07 | Canon Inc | 静圧軸受を備えた移動装置 |
| SG107560A1 (en) | 2000-02-25 | 2004-12-29 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
| JP2001313250A (ja) | 2000-02-25 | 2001-11-09 | Nikon Corp | 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法 |
| US6426790B1 (en) * | 2000-02-28 | 2002-07-30 | Nikon Corporation | Stage apparatus and holder, and scanning exposure apparatus and exposure apparatus |
| KR100945707B1 (ko) * | 2000-02-28 | 2010-03-05 | 가부시키가이샤 니콘 | 스테이지장치와 홀더, 및 주사형 노광장치 그리고 노광장치 |
| US20020041377A1 (en) | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
| JP2002014005A (ja) | 2000-04-25 | 2002-01-18 | Nikon Corp | 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置 |
| WO2001084241A1 (en) | 2000-05-03 | 2001-11-08 | Silicon Valley Group, Inc. | Non-contact seal using purge gas |
| TW591653B (en) * | 2000-08-08 | 2004-06-11 | Koninkl Philips Electronics Nv | Method of manufacturing an optically scannable information carrier |
| JP4405071B2 (ja) | 2000-10-23 | 2010-01-27 | パナソニック株式会社 | 送り装置及びそれを具備する光ディスク原盤記録装置 |
| KR100866818B1 (ko) | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | 투영광학계 및 이 투영광학계를 구비한 노광장치 |
| JP2002305140A (ja) * | 2001-04-06 | 2002-10-18 | Nikon Corp | 露光装置及び基板処理システム |
| US20020163629A1 (en) | 2001-05-07 | 2002-11-07 | Michael Switkes | Methods and apparatus employing an index matching medium |
| JP2002339853A (ja) * | 2001-05-16 | 2002-11-27 | Nissan Motor Co Ltd | 充電ステーション |
| KR100423783B1 (ko) * | 2001-06-13 | 2004-03-22 | 제일모직주식회사 | 인조 대리석의 제조 공정 |
| US6788385B2 (en) | 2001-06-21 | 2004-09-07 | Nikon Corporation | Stage device, exposure apparatus and method |
| TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
| WO2003010802A1 (en) * | 2001-07-26 | 2003-02-06 | Nikon Corporation | Stage apparatus, exposure system and exposure method, and device production method |
| US6680774B1 (en) * | 2001-10-09 | 2004-01-20 | Ultratech Stepper, Inc. | Method and apparatus for mechanically masking a workpiece |
| US6665054B2 (en) | 2001-10-22 | 2003-12-16 | Nikon Corporation | Two stage method |
| US7134668B2 (en) * | 2001-10-24 | 2006-11-14 | Ebara Corporation | Differential pumping seal apparatus |
| JP2003249443A (ja) | 2001-12-21 | 2003-09-05 | Nikon Corp | ステージ装置、ステージ位置管理方法、露光方法及び露光装置、並びにデバイス製造方法 |
| WO2003065427A1 (en) * | 2002-01-29 | 2003-08-07 | Nikon Corporation | Exposure device and exposure method |
| US20050003048A1 (en) * | 2002-02-11 | 2005-01-06 | Edizone, Lc | Electrolyte-containing orally soluble films |
| US7190527B2 (en) | 2002-03-01 | 2007-03-13 | Carl Zeiss Smt Ag | Refractive projection objective |
| DE10229249A1 (de) | 2002-03-01 | 2003-09-04 | Zeiss Carl Semiconductor Mfg | Refraktives Projektionsobjektiv mit einer Taille |
| US7154676B2 (en) | 2002-03-01 | 2006-12-26 | Carl Zeiss Smt A.G. | Very-high aperture projection objective |
| US7092069B2 (en) | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
| DE10229818A1 (de) | 2002-06-28 | 2004-01-15 | Carl Zeiss Smt Ag | Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem |
| DE10210899A1 (de) | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
| TW200305927A (en) * | 2002-03-22 | 2003-11-01 | Nippon Kogaku Kk | Exposure apparatus, exposure method and manufacturing method of device |
| WO2003085708A1 (en) | 2002-04-09 | 2003-10-16 | Nikon Corporation | Exposure method, exposure device, and device manufacturing method |
| KR20040104691A (ko) | 2002-05-03 | 2004-12-10 | 칼 짜이스 에스엠테 아게 | 높은 개구를 갖는 투영 대물렌즈 |
| JP4360064B2 (ja) * | 2002-06-10 | 2009-11-11 | 株式会社ニコン | ステージ装置および露光装置 |
| WO2004019128A2 (en) | 2002-08-23 | 2004-03-04 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
| TW559895B (en) * | 2002-09-27 | 2003-11-01 | Taiwan Semiconductor Mfg | Exposure system and exposure method thereof |
| US7093375B2 (en) | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
| US6988326B2 (en) | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Phobic barrier meniscus separation and containment |
| US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
| US7383843B2 (en) | 2002-09-30 | 2008-06-10 | Lam Research Corporation | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| US6954993B1 (en) | 2002-09-30 | 2005-10-18 | Lam Research Corporation | Concentric proximity processing head |
| US6788477B2 (en) | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
| CN101424881B (zh) | 2002-11-12 | 2011-11-30 | Asml荷兰有限公司 | 光刻投射装置 |
| CN100568101C (zh) | 2002-11-12 | 2009-12-09 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
| EP1420300B1 (de) | 2002-11-12 | 2015-07-29 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7372541B2 (en) | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TWI232357B (en) | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| DE60335595D1 (de) | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
| EP1420299B1 (de) | 2002-11-12 | 2011-01-05 | ASML Netherlands B.V. | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
| SG131766A1 (en) | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| DE10253679A1 (de) | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren |
| DE10258718A1 (de) | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives |
| JP4701606B2 (ja) * | 2002-12-10 | 2011-06-15 | 株式会社ニコン | 露光方法及び露光装置、デバイス製造方法 |
| EP1429190B1 (de) | 2002-12-10 | 2012-05-09 | Canon Kabushiki Kaisha | Belichtungsapparat und -verfahren |
| JP4645027B2 (ja) * | 2002-12-10 | 2011-03-09 | 株式会社ニコン | 露光装置及び露光方法、デバイス製造方法 |
| DE10257766A1 (de) | 2002-12-10 | 2004-07-15 | Carl Zeiss Smt Ag | Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage |
| KR20110086130A (ko) | 2002-12-10 | 2011-07-27 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| JP4232449B2 (ja) | 2002-12-10 | 2009-03-04 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
| JP4352874B2 (ja) | 2002-12-10 | 2009-10-28 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| EP1573730B1 (de) | 2002-12-13 | 2009-02-25 | Koninklijke Philips Electronics N.V. | Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht |
| US7010958B2 (en) | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
| US7399978B2 (en) | 2002-12-19 | 2008-07-15 | Koninklijke Philips Electronics N.V. | Method and device for irradiating spots on a layer |
| EP1579435B1 (de) | 2002-12-19 | 2007-06-27 | Koninklijke Philips Electronics N.V. | Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts |
| US6781670B2 (en) | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
| US7090964B2 (en) | 2003-02-21 | 2006-08-15 | Asml Holding N.V. | Lithographic printing with polarized light |
| JP4604452B2 (ja) * | 2003-02-26 | 2011-01-05 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| US7206059B2 (en) | 2003-02-27 | 2007-04-17 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
| US6943941B2 (en) | 2003-02-27 | 2005-09-13 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
| US7029832B2 (en) | 2003-03-11 | 2006-04-18 | Samsung Electronics Co., Ltd. | Immersion lithography methods using carbon dioxide |
| US20050164522A1 (en) | 2003-03-24 | 2005-07-28 | Kunz Roderick R. | Optical fluids, and systems and methods of making and using the same |
| ATE426914T1 (de) | 2003-04-07 | 2009-04-15 | Nikon Corp | Belichtungsgerat und verfahren zur herstellung einer vorrichtung |
| JP4488004B2 (ja) | 2003-04-09 | 2010-06-23 | 株式会社ニコン | 液浸リソグラフィ流体制御システム |
| WO2004093160A2 (en) | 2003-04-10 | 2004-10-28 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
| JP4656057B2 (ja) | 2003-04-10 | 2011-03-23 | 株式会社ニコン | 液浸リソグラフィ装置用電気浸透素子 |
| EP2667253B1 (de) | 2003-04-10 | 2015-06-10 | Nikon Corporation | System zur Umgebungskontrolle mittels Vakuum-Rückförderung für eine Immersionslithografievorrichtung |
| KR101745223B1 (ko) | 2003-04-10 | 2017-06-08 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템 |
| JP4582089B2 (ja) | 2003-04-11 | 2010-11-17 | 株式会社ニコン | 液浸リソグラフィ用の液体噴射回収システム |
| SG189557A1 (en) | 2003-04-11 | 2013-05-31 | Nikon Corp | Cleanup method for optics in immersion lithography |
| SG10201603067VA (en) * | 2003-04-11 | 2016-05-30 | Nikon Corp | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
| ATE542167T1 (de) | 2003-04-17 | 2012-02-15 | Nikon Corp | Lithographisches immersionsgerät |
| JP4025683B2 (ja) | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | パターン形成方法及び露光装置 |
| JP4146755B2 (ja) | 2003-05-09 | 2008-09-10 | 松下電器産業株式会社 | パターン形成方法 |
| TWI295414B (en) | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| JP4552853B2 (ja) * | 2003-05-15 | 2010-09-29 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| EP1480065A3 (de) | 2003-05-23 | 2006-05-10 | Canon Kabushiki Kaisha | Optisches Projektionssystem, Belichtungsapparat, und Verfahren zur Herstellung einer Vorrichtung |
| TWI503865B (zh) * | 2003-05-23 | 2015-10-11 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
| JP2004349645A (ja) | 2003-05-26 | 2004-12-09 | Sony Corp | 液浸差動排液静圧浮上パッド、原盤露光装置および液侵差動排液による露光方法 |
| TWI442694B (zh) | 2003-05-30 | 2014-06-21 | Asml Netherlands Bv | 微影裝置及元件製造方法 |
| US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7684008B2 (en) | 2003-06-11 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4084710B2 (ja) | 2003-06-12 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
| JP4054285B2 (ja) | 2003-06-12 | 2008-02-27 | 松下電器産業株式会社 | パターン形成方法 |
| US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
| TWI433212B (zh) | 2003-06-19 | 2014-04-01 | 尼康股份有限公司 | An exposure apparatus, an exposure method, and an element manufacturing method |
| JP4029064B2 (ja) | 2003-06-23 | 2008-01-09 | 松下電器産業株式会社 | パターン形成方法 |
| JP4084712B2 (ja) | 2003-06-23 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
| JP4343597B2 (ja) | 2003-06-25 | 2009-10-14 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP2005019616A (ja) | 2003-06-25 | 2005-01-20 | Canon Inc | 液浸式露光装置 |
| EP1498778A1 (de) | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| DE60308161T2 (de) | 2003-06-27 | 2007-08-09 | Asml Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
| JP3862678B2 (ja) | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| US6809794B1 (en) | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
| EP1494074A1 (de) | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| WO2005006026A2 (en) | 2003-07-01 | 2005-01-20 | Nikon Corporation | Using isotopically specified fluids as optical elements |
| EP2466382B1 (de) | 2003-07-08 | 2014-11-26 | Nikon Corporation | Wafertisch für die Immersionslithografie |
| SG109000A1 (en) | 2003-07-16 | 2005-02-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7384149B2 (en) | 2003-07-21 | 2008-06-10 | Asml Netherlands B.V. | Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system |
| EP1500982A1 (de) | 2003-07-24 | 2005-01-26 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
| US7309345B2 (en) * | 2003-07-25 | 2007-12-18 | Boston Scientific-Scimed, Inc. | Method and system for delivering an implant utilizing a lumen reducing member |
| US7006209B2 (en) | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
| KR101641011B1 (ko) | 2003-07-28 | 2016-07-19 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법 |
| EP1503244A1 (de) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung |
| JP4492239B2 (ja) | 2003-07-28 | 2010-06-30 | 株式会社ニコン | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
| US7326522B2 (en) | 2004-02-11 | 2008-02-05 | Asml Netherlands B.V. | Device manufacturing method and a substrate |
| US7175968B2 (en) | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
| US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2005057294A (ja) | 2003-08-07 | 2005-03-03 | Asml Netherlands Bv | インタフェースユニット、該インタフェースユニットを含むリソグラフィ投影装置、及びデバイス製造方法 |
| US7700267B2 (en) | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
| US7579135B2 (en) | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
| US7061578B2 (en) | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
| US7085075B2 (en) | 2003-08-12 | 2006-08-01 | Carl Zeiss Smt Ag | Projection objectives including a plurality of mirrors with lenses ahead of mirror M3 |
| US6844206B1 (en) | 2003-08-21 | 2005-01-18 | Advanced Micro Devices, Llp | Refractive index system monitor and control for immersion lithography |
| US7070915B2 (en) | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
| TWI245163B (en) | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US6954256B2 (en) | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
| US7014966B2 (en) | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
| KR101371917B1 (ko) | 2003-09-03 | 2014-03-07 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
| JP4378136B2 (ja) | 2003-09-04 | 2009-12-02 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP3870182B2 (ja) * | 2003-09-09 | 2007-01-17 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| US6961186B2 (en) | 2003-09-26 | 2005-11-01 | Takumi Technology Corp. | Contact printing using a magnified mask image |
| EP1519231B1 (de) | 2003-09-29 | 2005-12-21 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| US7158211B2 (en) | 2003-09-29 | 2007-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1519230A1 (de) | 2003-09-29 | 2005-03-30 | ASML Netherlands B.V. | Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung |
| US7369217B2 (en) | 2003-10-03 | 2008-05-06 | Micronic Laser Systems Ab | Method and device for immersion lithography |
| JP2005136374A (ja) | 2003-10-06 | 2005-05-26 | Matsushita Electric Ind Co Ltd | 半導体製造装置及びそれを用いたパターン形成方法 |
| EP1524558A1 (de) | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| EP1524557A1 (de) | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographischer Apparat und Methode zur Herstellung einer Vorrichtung |
| US7678527B2 (en) | 2003-10-16 | 2010-03-16 | Intel Corporation | Methods and compositions for providing photoresist with improved properties for contacting liquids |
| US7411653B2 (en) | 2003-10-28 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus |
| US7352433B2 (en) | 2003-10-28 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2005159322A (ja) | 2003-10-31 | 2005-06-16 | Nikon Corp | 定盤、ステージ装置及び露光装置並びに露光方法 |
| US20070105050A1 (en) | 2003-11-05 | 2007-05-10 | Dsm Ip Assets B.V. | Method and apparatus for producing microchips |
| US7924397B2 (en) | 2003-11-06 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-corrosion layer on objective lens for liquid immersion lithography applications |
| JP2005150290A (ja) | 2003-11-13 | 2005-06-09 | Canon Inc | 露光装置およびデバイスの製造方法 |
| EP1531362A3 (de) | 2003-11-13 | 2007-07-25 | Matsushita Electric Industrial Co., Ltd. | Vorrichtung zur Herstellung von Halbleitern und Methode zur Bildung von Mustern |
| JP4295712B2 (ja) | 2003-11-14 | 2009-07-15 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及び装置製造方法 |
| US7545481B2 (en) | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8854602B2 (en) | 2003-11-24 | 2014-10-07 | Asml Netherlands B.V. | Holding device for an optical element in an objective |
| DE10355301B3 (de) | 2003-11-27 | 2005-06-23 | Infineon Technologies Ag | Verfahren zur Abbildung einer Struktur auf einen Halbleiter-Wafer mittels Immersionslithographie |
| US7125652B2 (en) | 2003-12-03 | 2006-10-24 | Advanced Micro Devices, Inc. | Immersion lithographic process using a conforming immersion medium |
| JP2005175016A (ja) | 2003-12-08 | 2005-06-30 | Canon Inc | 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法 |
| JP2005175034A (ja) | 2003-12-09 | 2005-06-30 | Canon Inc | 露光装置 |
| WO2005106589A1 (en) | 2004-05-04 | 2005-11-10 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus and immersion liquid therefore |
| KR101200654B1 (ko) | 2003-12-15 | 2012-11-12 | 칼 짜이스 에스엠티 게엠베하 | 고 개구율 및 평평한 단부면을 가진 투사 대물렌즈 |
| JP2007516613A (ja) | 2003-12-15 | 2007-06-21 | カール・ツアイス・エスエムテイ・アーゲー | 少なくとも1つの液体レンズを備えるマイクロリソグラフィー投影対物レンズとしての対物レンズ |
| JP4308638B2 (ja) | 2003-12-17 | 2009-08-05 | パナソニック株式会社 | パターン形成方法 |
| JP4323946B2 (ja) | 2003-12-19 | 2009-09-02 | キヤノン株式会社 | 露光装置 |
| JP5102492B2 (ja) | 2003-12-19 | 2012-12-19 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 結晶素子を有するマイクロリソグラフィー投影用対物レンズ |
| US20050185269A1 (en) | 2003-12-19 | 2005-08-25 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
| US7460206B2 (en) | 2003-12-19 | 2008-12-02 | Carl Zeiss Smt Ag | Projection objective for immersion lithography |
| JP2005183656A (ja) * | 2003-12-19 | 2005-07-07 | Canon Inc | 露光装置 |
| US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE10360788A1 (de) | 2003-12-23 | 2005-07-28 | Marconi Communications Gmbh | Optisches Kommunikationsnetz und Komponente dafür |
| US7589818B2 (en) | 2003-12-23 | 2009-09-15 | Asml Netherlands B.V. | Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
| US7119884B2 (en) | 2003-12-24 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20050147920A1 (en) | 2003-12-30 | 2005-07-07 | Chia-Hui Lin | Method and system for immersion lithography |
| US7088422B2 (en) | 2003-12-31 | 2006-08-08 | International Business Machines Corporation | Moving lens for immersion optical lithography |
| JP4371822B2 (ja) | 2004-01-06 | 2009-11-25 | キヤノン株式会社 | 露光装置 |
| JP4429023B2 (ja) | 2004-01-07 | 2010-03-10 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| US20050153424A1 (en) | 2004-01-08 | 2005-07-14 | Derek Coon | Fluid barrier with transparent areas for immersion lithography |
| CN102207608B (zh) | 2004-01-14 | 2013-01-02 | 卡尔蔡司Smt有限责任公司 | 反射折射投影物镜 |
| EP1716457B9 (de) | 2004-01-16 | 2012-04-04 | Carl Zeiss SMT GmbH | Projektionssystem mit einem polarisationsmodulierenden optischen Element mit variabler Dicke |
| WO2005069078A1 (en) | 2004-01-19 | 2005-07-28 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus with immersion projection lens |
| WO2005071491A2 (en) | 2004-01-20 | 2005-08-04 | Carl Zeiss Smt Ag | Exposure apparatus and measuring device for a projection lens |
| US7026259B2 (en) | 2004-01-21 | 2006-04-11 | International Business Machines Corporation | Liquid-filled balloons for immersion lithography |
| US7391501B2 (en) | 2004-01-22 | 2008-06-24 | Intel Corporation | Immersion liquids with siloxane polymer for immersion lithography |
| US8054947B2 (en) * | 2004-02-02 | 2011-11-08 | Eicon Networks Corporation | Apparatus and method for multiplexing communication signals |
| US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| US7990516B2 (en) | 2004-02-03 | 2011-08-02 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with liquid detection apparatus |
| JP2007520893A (ja) | 2004-02-03 | 2007-07-26 | ロチェスター インスティテュート オブ テクノロジー | 流体を使用したフォトリソグラフィ法及びそのシステム |
| EP1716454A1 (de) | 2004-02-09 | 2006-11-02 | Carl Zeiss SMT AG | Projektionsobjektiv für eine mikrolithographische projektionsbelichtungsvorrichtung |
| US7050146B2 (en) | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1714192A1 (de) | 2004-02-13 | 2006-10-25 | Carl Zeiss SMT AG | Projektionsobjektiv für eine mikrolithographische projektionsbelichtungsvorrichtung |
| EP1721201A1 (de) | 2004-02-18 | 2006-11-15 | Corning Incorporated | Katadioptrisches abbildungssystem zur abbildung mit hoher numerischer apertur mit tief-ultraviolett-licht |
| JP2005236087A (ja) | 2004-02-20 | 2005-09-02 | Nikon Corp | 露光装置 |
| JP2005259789A (ja) | 2004-03-09 | 2005-09-22 | Nikon Corp | 検知システム及び露光装置、デバイス製造方法 |
| US20050205108A1 (en) | 2004-03-16 | 2005-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for immersion lithography lens cleaning |
| JP2005268700A (ja) | 2004-03-22 | 2005-09-29 | Nikon Corp | ステージ装置及び露光装置 |
| US7027125B2 (en) | 2004-03-25 | 2006-04-11 | International Business Machines Corporation | System and apparatus for photolithography |
| JP2005285881A (ja) * | 2004-03-29 | 2005-10-13 | Nikon Corp | ステージ装置及び露光装置 |
| US7084960B2 (en) | 2004-03-29 | 2006-08-01 | Intel Corporation | Lithography using controlled polarization |
| US7227619B2 (en) | 2004-04-01 | 2007-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7034917B2 (en) | 2004-04-01 | 2006-04-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
| US7295283B2 (en) | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| WO2005098504A1 (en) | 2004-04-08 | 2005-10-20 | Carl Zeiss Smt Ag | Imaging system with mirror group |
| US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7271878B2 (en) | 2004-04-22 | 2007-09-18 | International Business Machines Corporation | Wafer cell for immersion lithography |
| US7244665B2 (en) | 2004-04-29 | 2007-07-17 | Micron Technology, Inc. | Wafer edge ring structures and methods of formation |
| US7379159B2 (en) | 2004-05-03 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1747499A2 (de) | 2004-05-04 | 2007-01-31 | Nikon Corporation | Vorrichtung und verfahren zur bereitstellung eines fluids für die immersionslithographie |
| US7091502B2 (en) | 2004-05-12 | 2006-08-15 | Taiwan Semiconductor Manufacturing, Co., Ltd. | Apparatus and method for immersion lithography |
| KR20170028451A (ko) | 2004-05-17 | 2017-03-13 | 칼 짜이스 에스엠티 게엠베하 | 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈 |
| US7616383B2 (en) | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101833247B (zh) | 2004-06-04 | 2013-11-06 | 卡尔蔡司Smt有限责任公司 | 微光刻投影曝光系统的投影物镜的光学测量的测量系统 |
| JP4913041B2 (ja) | 2004-06-04 | 2012-04-11 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 強度変化の補償を伴う投影系及びそのための補償素子 |
| US7057702B2 (en) * | 2004-06-23 | 2006-06-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7463330B2 (en) | 2004-07-07 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP3919782B2 (ja) * | 2004-10-08 | 2007-05-30 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| EP3306647A1 (de) | 2004-10-15 | 2018-04-11 | Nikon Corporation | Belichtungsvorrichtung und vorrichtungsherstellungsverfahren |
| US7119876B2 (en) | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7700365B2 (en) | 2004-10-29 | 2010-04-20 | Mayo Foundation For Medical Education And Research | Vitamin D deficiencies |
| US7583357B2 (en) | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE102004061462A1 (de) * | 2004-12-17 | 2006-07-06 | Delphi Technologies, Inc., Troy | Verfahren und Vorrichtung zur Motorsteuerung bei einem Kraftfahrzeug |
| US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG124351A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7161659B2 (en) * | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
| JP5019170B2 (ja) * | 2006-05-23 | 2012-09-05 | 株式会社ニコン | メンテナンス方法、露光方法及び装置、並びにデバイス製造方法 |
| JP4442904B2 (ja) * | 2006-07-21 | 2010-03-31 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP5304072B2 (ja) | 2007-07-18 | 2013-10-02 | ヤマハ株式会社 | 力覚制御装置、鍵盤楽器、力覚制御方法およびプログラム |
| TWI452546B (zh) * | 2012-12-28 | 2014-09-11 | Univ Chienkuo Technology | Hybrid large - scale collapse model |
-
2004
- 2004-02-02 US US10/588,029 patent/US7589822B2/en not_active Expired - Fee Related
-
2005
- 2005-01-27 EP EP10186147.4A patent/EP2287894B1/de not_active Expired - Lifetime
- 2005-01-27 SG SG200903003-2A patent/SG152294A1/en unknown
- 2005-01-27 KR KR1020157001506A patent/KR101673826B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020117003626A patent/KR101187618B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020187002348A patent/KR20180011877A/ko not_active Abandoned
- 2005-01-27 WO PCT/JP2005/001076 patent/WO2005074014A1/ja not_active Ceased
- 2005-01-27 EP EP15185639.0A patent/EP2998982B1/de not_active Expired - Lifetime
- 2005-01-27 AT AT05704182T patent/ATE493753T1/de not_active IP Right Cessation
- 2005-01-27 SG SG200903000-8A patent/SG152291A1/en unknown
- 2005-01-27 KR KR1020117003587A patent/KR101235523B1/ko not_active Expired - Fee Related
- 2005-01-27 EP EP10186153.2A patent/EP2284866B1/de not_active Expired - Lifetime
- 2005-01-27 EP EP15171838.4A patent/EP2960927B1/de not_active Expired - Lifetime
- 2005-01-27 SG SG2012080503A patent/SG185343A1/en unknown
- 2005-01-27 KR KR1020117003627A patent/KR101187615B1/ko not_active Expired - Fee Related
- 2005-01-27 JP JP2005517477A patent/JP4910394B2/ja not_active Expired - Fee Related
- 2005-01-27 CN CN2009101689947A patent/CN101685263B/zh not_active Expired - Lifetime
- 2005-01-27 KR KR1020147017029A patent/KR101590742B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020117026306A patent/KR101276512B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020127019814A patent/KR101288139B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020157028041A patent/KR101698290B1/ko not_active Expired - Fee Related
- 2005-01-27 EP EP15179672.9A patent/EP2980834B1/de not_active Expired - Lifetime
- 2005-01-27 SG SG2013076823A patent/SG195559A1/en unknown
- 2005-01-27 KR KR1020067012095A patent/KR101187616B1/ko not_active Expired - Fee Related
- 2005-01-27 DE DE602005025596T patent/DE602005025596D1/de not_active Expired - Lifetime
- 2005-01-27 SG SG2012080495A patent/SG185342A1/en unknown
- 2005-01-27 EP EP05704182A patent/EP1713113B1/de not_active Expired - Lifetime
- 2005-01-27 EP EP10186140.9A patent/EP2287893B1/de not_active Expired - Lifetime
- 2005-01-27 KR KR1020117003628A patent/KR101191061B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020177000846A patent/KR101824373B1/ko not_active Expired - Fee Related
- 2005-01-27 EP EP10186134.2A patent/EP2267759B1/de not_active Ceased
- 2005-01-27 KR KR1020127019812A patent/KR101476015B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020137031485A patent/KR101539877B1/ko not_active Expired - Fee Related
- 2005-01-27 EP EP16186291.7A patent/EP3139401A1/de not_active Withdrawn
- 2005-01-27 KR KR1020127015767A patent/KR101276423B1/ko not_active Expired - Fee Related
- 2005-01-27 KR KR1020117003625A patent/KR101187614B1/ko not_active Expired - Fee Related
- 2005-02-02 TW TW098120057A patent/TWI437374B/zh not_active IP Right Cessation
- 2005-02-02 TW TW098120060A patent/TWI437376B/zh not_active IP Right Cessation
- 2005-02-02 TW TW107106822A patent/TW201823875A/zh unknown
- 2005-02-02 TW TW101103185A patent/TWI521312B/zh not_active IP Right Cessation
- 2005-02-02 TW TW098115103A patent/TWI443475B/zh not_active IP Right Cessation
- 2005-02-02 TW TW103100487A patent/TWI564673B/zh not_active IP Right Cessation
- 2005-02-02 TW TW101146582A patent/TWI498680B/zh not_active IP Right Cessation
- 2005-02-02 TW TW098120058A patent/TWI437375B/zh not_active IP Right Cessation
- 2005-02-02 TW TW094103146A patent/TWI390358B/zh not_active IP Right Cessation
- 2005-02-02 TW TW104118470A patent/TWI596440B/zh not_active IP Right Cessation
- 2005-02-02 TW TW106100843A patent/TWI627511B/zh not_active IP Right Cessation
- 2005-02-02 TW TW101103186A patent/TWI499870B/zh not_active IP Right Cessation
- 2005-02-02 TW TW098120061A patent/TWI436170B/zh not_active IP Right Cessation
- 2005-02-02 TW TW104127655A patent/TWI578114B/zh not_active IP Right Cessation
-
2006
- 2006-08-01 IL IL226841A patent/IL226841A/en active IP Right Grant
- 2006-08-01 IL IL226838A patent/IL226838A/en active IP Right Grant
- 2006-08-01 IL IL177221A patent/IL177221A/en active IP Right Grant
-
2007
- 2007-04-20 US US11/785,860 patent/US8045136B2/en not_active Expired - Fee Related
- 2007-06-22 US US11/812,919 patent/US9632431B2/en not_active Expired - Fee Related
-
2009
- 2009-05-08 US US12/453,386 patent/US20090231564A1/en not_active Abandoned
- 2009-08-05 US US12/461,246 patent/US8547528B2/en not_active Expired - Fee Related
- 2009-08-05 US US12/461,244 patent/US8553203B2/en not_active Expired - Fee Related
-
2010
- 2010-01-22 JP JP2010012363A patent/JP4952802B2/ja not_active Expired - Fee Related
- 2010-01-22 JP JP2010012364A patent/JP4952803B2/ja not_active Expired - Fee Related
- 2010-03-24 US US12/659,894 patent/US9665016B2/en not_active Expired - Fee Related
- 2010-10-07 US US12/923,784 patent/US8711328B2/en not_active Expired - Fee Related
- 2010-10-07 US US12/923,783 patent/US8724079B2/en active Active
- 2010-10-07 US US12/923,786 patent/US8736808B2/en active Active
- 2010-10-07 US US12/923,785 patent/US8705002B2/en not_active Expired - Fee Related
-
2011
- 2011-02-14 JP JP2011028992A patent/JP5287897B2/ja not_active Expired - Fee Related
- 2011-02-14 JP JP2011028991A patent/JP5287896B2/ja not_active Expired - Fee Related
- 2011-06-07 JP JP2011127624A patent/JP5287932B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-29 JP JP2012078251A patent/JP5344061B2/ja not_active Expired - Fee Related
- 2012-03-29 JP JP2012078281A patent/JP5333622B2/ja not_active Expired - Fee Related
- 2012-03-30 US US13/435,780 patent/US9684248B2/en not_active Expired - Fee Related
-
2013
- 2013-04-08 JP JP2013080851A patent/JP5488741B2/ja not_active Expired - Fee Related
- 2013-06-09 IL IL226838A patent/IL226838A0/en unknown
- 2013-06-09 IL IL226840A patent/IL226840A/en active IP Right Grant
- 2013-06-09 IL IL226839A patent/IL226839A/en active IP Right Grant
- 2013-06-09 IL IL226841A patent/IL226841A0/en unknown
- 2013-12-26 JP JP2013268680A patent/JP5630557B2/ja not_active Expired - Fee Related
-
2014
- 2014-06-13 JP JP2014122324A patent/JP5761430B2/ja not_active Expired - Fee Related
-
2015
- 2015-01-16 JP JP2015006834A patent/JP5930083B2/ja not_active Expired - Fee Related
- 2015-03-19 US US14/663,084 patent/US10007196B2/en not_active Expired - Fee Related
- 2015-06-22 JP JP2015124507A patent/JP5935929B2/ja not_active Expired - Fee Related
- 2015-09-08 US US14/847,746 patent/US10139737B2/en not_active Expired - Fee Related
-
2016
- 2016-01-15 JP JP2016006012A patent/JP6052439B2/ja not_active Expired - Fee Related
- 2016-07-04 JP JP2016132653A patent/JP6222301B2/ja not_active Expired - Fee Related
-
2017
- 2017-05-29 JP JP2017105222A patent/JP6327385B2/ja not_active Expired - Fee Related
-
2018
- 2018-11-20 US US16/196,416 patent/US20190086815A1/en not_active Abandoned
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE493753T1 (de) | Bühnenantriebsverfahren und bühnenantriebsvorrichtung, belichtungsvorrichtung und bauelemente-herstellungsverfahren | |
| ATE429031T1 (de) | Belichtungsverfahren | |
| WO2009060585A1 (ja) | 露光装置及び露光方法、並びにデバイス製造方法 | |
| ATE353814T1 (de) | Elektronisch, servobetätigte fahrradgangschaltung und zugehöriges verfahren | |
| DE602005021653D1 (de) | Belichtungsgeräte, belichtungsverfahren und bauelemente-herstellungsverfahren | |
| EP1783821A4 (de) | Belichtungssystem und bauelementeherstellungsverfahren | |
| TW200801847A (en) | Immersion lithography fluid control system | |
| WO2005031467A3 (en) | Microlithographic projection exposure | |
| TW200741818A (en) | Exposure apparatus and device manufacturing method | |
| WO2004011984A3 (en) | Retainer, exposure apparatus, and semiconductor device fabrication method | |
| EP3046135A3 (de) | Belichtungsvorrichtung und vorrichtungsherstellungsverfahren | |
| TW200635688A (en) | Apparatus of laser processing device and the method for the same | |
| ATE340425T1 (de) | Ansteuerschaltung und verfahren zum betreiben eines halbleiterlasers | |
| TW200618046A (en) | Controlling critical dimensions of structures formed on a wafer in semiconductor processing | |
| DE60316747D1 (de) | Kühlungsmechanismus für ein elektrisches gesteuertes Teil einer Spritzgiessmaschine sowie Kühlverfahren | |
| EP1596425A4 (de) | Transferverfahren, belichtungsverfahren und belichtungseinrichtung und bauelementherstellungsverfahren | |
| KR101602782B1 (ko) | 웨이퍼 마킹 방법 | |
| GB0613124D0 (en) | Optical image stabilizer | |
| TW200739285A (en) | Pattern forming method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method | |
| DK1772206T3 (da) | Tyndplade samt fremgangsmåde og apparat til fremstilling af en tynd plade | |
| TW200643591A (en) | Image-taking apparatus and projection module | |
| TW200632546A (en) | A method for manufacturing semiconductor devices using a photo acid generator | |
| ATE329726T1 (de) | Antriebsvorrichtung zum bewegen von plattenelementen in bearbeitungsstationen | |
| TW200717161A (en) | Color wheel unit and fabrication method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |