TW200505629A - Polishing time controlling method and apparatus for chemical mechanical polishing process - Google Patents
Polishing time controlling method and apparatus for chemical mechanical polishing processInfo
- Publication number
- TW200505629A TW200505629A TW092121343A TW92121343A TW200505629A TW 200505629 A TW200505629 A TW 200505629A TW 092121343 A TW092121343 A TW 092121343A TW 92121343 A TW92121343 A TW 92121343A TW 200505629 A TW200505629 A TW 200505629A
- Authority
- TW
- Taiwan
- Prior art keywords
- chemical mechanical
- polishing
- mechanical polishing
- controlling method
- time controlling
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing time controlling method for chemical mechanical polishing process is provided. First, the data of wafer cassette is detected and the pat count is acquired. Then the data and the pat count is input to the chemical mechanical polishing feedback system, and the polishing time is acquired from the chemical mechanical polishing feedback system according to the data and the pat count. At last the polishing time is output to the chemical mechanical polishing apparatus for polishing the wafer in the wafer cassette with the polishing time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92121343A TWI249454B (en) | 2003-08-05 | 2003-08-05 | Polishing time controlling method and apparatus for chemical mechanical polishing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92121343A TWI249454B (en) | 2003-08-05 | 2003-08-05 | Polishing time controlling method and apparatus for chemical mechanical polishing process |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200505629A true TW200505629A (en) | 2005-02-16 |
TWI249454B TWI249454B (en) | 2006-02-21 |
Family
ID=37430122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92121343A TWI249454B (en) | 2003-08-05 | 2003-08-05 | Polishing time controlling method and apparatus for chemical mechanical polishing process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI249454B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113561050A (en) * | 2021-07-22 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Method, device and system for controlling wafer transmission time |
-
2003
- 2003-08-05 TW TW92121343A patent/TWI249454B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113561050A (en) * | 2021-07-22 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Method, device and system for controlling wafer transmission time |
Also Published As
Publication number | Publication date |
---|---|
TWI249454B (en) | 2006-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200507145A (en) | System and method for integrating in-situ metrology within a wafer process | |
TWI264763B (en) | Load-lock technique | |
AU2003253873A1 (en) | Apparatus and method for backfilling a semiconductor wafer process chamber | |
EP1655765A4 (en) | Exposure method and exposure apparatus, stage unit, and device manufacturing method | |
AU2001274162A1 (en) | Cryptography method and smart card microcircuit | |
TW200605210A (en) | Method and processing system for controlling a chamber cleaning process | |
SG152294A1 (en) | Stage drive method and stage unit, exposure apparatus, and device manufacturing method | |
HUP0302879A2 (en) | Method and apparatus for controlling flow of data between data processing systems via a memory | |
FI20021984A (en) | Present and systems for performing speech operations and a device | |
EG23786A (en) | Method and device for convening a layer of bulk material on a grid | |
SG166038A1 (en) | Device and method for wet treating disc-like substrates | |
GB2383657A (en) | Handler for floating-point denormalized numbers | |
TW200722561A (en) | Method of surface reconstruction for silicon carbide substrate | |
WO2004011984A3 (en) | Retainer, exposure apparatus, and semiconductor device fabrication method | |
DK1727395T3 (en) | Method and apparatus for inductive charging of hearing aids | |
TW200719090A (en) | Apparatus for and method of processing substrate subjected to exposure process | |
WO2009120722A3 (en) | Methods and apparatus for conserving electronic device manufacturing resources | |
WO2005022602A3 (en) | A method and apparatus for semiconductor processing | |
TW200605174A (en) | Feed forward spacer width control in semiconductor manufacturing | |
TW200505629A (en) | Polishing time controlling method and apparatus for chemical mechanical polishing process | |
TW200701383A (en) | Systems and methods for tool monitoring | |
ATE467584T1 (en) | DEVICE FOR SEPARATING AND TRANSFERING OBJECTS, AND TRANSFER DEVICE FOR USE IN THIS DEVICE | |
TW200610314A (en) | A device and method for a programmable hand-held device for use in a semiconductor manufacturing environmen | |
TW200611303A (en) | Semiconductor manufacturing equipment and semiconductor manufacturing method | |
MY134686A (en) | Apparatus and method for reducing substrate warpage |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |