TW200505629A - Polishing time controlling method and apparatus for chemical mechanical polishing process - Google Patents

Polishing time controlling method and apparatus for chemical mechanical polishing process

Info

Publication number
TW200505629A
TW200505629A TW092121343A TW92121343A TW200505629A TW 200505629 A TW200505629 A TW 200505629A TW 092121343 A TW092121343 A TW 092121343A TW 92121343 A TW92121343 A TW 92121343A TW 200505629 A TW200505629 A TW 200505629A
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
polishing
mechanical polishing
controlling method
time controlling
Prior art date
Application number
TW092121343A
Other languages
Chinese (zh)
Other versions
TWI249454B (en
Inventor
Alan Su
Jason C S Chu
Original Assignee
Promos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promos Technologies Inc filed Critical Promos Technologies Inc
Priority to TW92121343A priority Critical patent/TWI249454B/en
Publication of TW200505629A publication Critical patent/TW200505629A/en
Application granted granted Critical
Publication of TWI249454B publication Critical patent/TWI249454B/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A polishing time controlling method for chemical mechanical polishing process is provided. First, the data of wafer cassette is detected and the pat count is acquired. Then the data and the pat count is input to the chemical mechanical polishing feedback system, and the polishing time is acquired from the chemical mechanical polishing feedback system according to the data and the pat count. At last the polishing time is output to the chemical mechanical polishing apparatus for polishing the wafer in the wafer cassette with the polishing time.
TW92121343A 2003-08-05 2003-08-05 Polishing time controlling method and apparatus for chemical mechanical polishing process TWI249454B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92121343A TWI249454B (en) 2003-08-05 2003-08-05 Polishing time controlling method and apparatus for chemical mechanical polishing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92121343A TWI249454B (en) 2003-08-05 2003-08-05 Polishing time controlling method and apparatus for chemical mechanical polishing process

Publications (2)

Publication Number Publication Date
TW200505629A true TW200505629A (en) 2005-02-16
TWI249454B TWI249454B (en) 2006-02-21

Family

ID=37430122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92121343A TWI249454B (en) 2003-08-05 2003-08-05 Polishing time controlling method and apparatus for chemical mechanical polishing process

Country Status (1)

Country Link
TW (1) TWI249454B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113561050A (en) * 2021-07-22 2021-10-29 北京烁科精微电子装备有限公司 Method, device and system for controlling wafer transmission time

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113561050A (en) * 2021-07-22 2021-10-29 北京烁科精微电子装备有限公司 Method, device and system for controlling wafer transmission time

Also Published As

Publication number Publication date
TWI249454B (en) 2006-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees