ATE429031T1 - Belichtungsverfahren - Google Patents

Belichtungsverfahren

Info

Publication number
ATE429031T1
ATE429031T1 AT04771271T AT04771271T ATE429031T1 AT E429031 T1 ATE429031 T1 AT E429031T1 AT 04771271 T AT04771271 T AT 04771271T AT 04771271 T AT04771271 T AT 04771271T AT E429031 T1 ATE429031 T1 AT E429031T1
Authority
AT
Austria
Prior art keywords
wafer
wafer stage
interchange
exposure
stages
Prior art date
Application number
AT04771271T
Other languages
English (en)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of ATE429031T1 publication Critical patent/ATE429031T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT04771271T 2003-08-07 2004-08-05 Belichtungsverfahren ATE429031T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003288919 2003-08-07
PCT/JP2004/011244 WO2005015615A1 (ja) 2003-08-07 2004-08-05 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法

Publications (1)

Publication Number Publication Date
ATE429031T1 true ATE429031T1 (de) 2009-05-15

Family

ID=34131533

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04771271T ATE429031T1 (de) 2003-08-07 2004-08-05 Belichtungsverfahren

Country Status (9)

Country Link
US (3) US20060187431A1 (de)
EP (2) EP1995769A1 (de)
JP (2) JP4552146B2 (de)
KR (2) KR101181684B1 (de)
CN (2) CN100468624C (de)
AT (1) ATE429031T1 (de)
DE (1) DE602004020634D1 (de)
TW (1) TW200511390A (de)
WO (1) WO2005015615A1 (de)

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KR101549709B1 (ko) * 2006-11-09 2015-09-11 가부시키가이샤 니콘 유지 장치, 위치 검출 장치 및 노광 장치, 이동 방법, 위치검출 방법, 노광 방법, 검출계의 조정 방법, 그리고 디바이스 제조 방법
US7973910B2 (en) * 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
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US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
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US8902402B2 (en) 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
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CN101551599B (zh) * 2009-04-03 2011-07-20 清华大学 一种光刻机硅片台双台交换系统
CN101551598B (zh) * 2009-04-03 2010-12-01 清华大学 一种光刻机硅片台双台交换系统
US8792084B2 (en) * 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
US8553204B2 (en) * 2009-05-20 2013-10-08 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8446569B2 (en) * 2009-06-19 2013-05-21 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
US20110096306A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
US20110096318A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110096312A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110123913A1 (en) * 2009-11-19 2011-05-26 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
US20110128523A1 (en) * 2009-11-19 2011-06-02 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
CN101727019B (zh) * 2009-12-15 2011-05-11 清华大学 光刻机硅片台双台交换系统及其交换方法
CN101963763B (zh) * 2010-08-03 2012-06-06 哈尔滨工业大学 一种基于双驱双桥换台工位的双工件台高精度交换装置
CN102789143A (zh) * 2011-05-17 2012-11-21 川宝科技股份有限公司 曝光机标靶影像对位装置及使用该装置的曝光机
CN103782239B (zh) * 2011-08-30 2017-09-05 株式会社尼康 基板处理装置及基板处理方法、曝光方法及曝光装置、以及元件制造方法、及平板显示器的制造方法
EP2839052A4 (de) 2012-04-19 2015-06-10 Intevac Inc Doppelmaskenanordnung zur solarzellenherstellung
EP2852469B1 (de) 2012-04-26 2019-04-24 Intevac, Inc. Systemarchitektur für eine vakuumbehandlung
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
JP6082884B2 (ja) * 2012-06-12 2017-02-22 サンエー技研株式会社 露光装置、露光方法
TWM523958U (zh) * 2014-08-01 2016-06-11 應用材料股份有限公司 用於執行光刻製程的處理系統
JP6607923B2 (ja) * 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
JP6655925B2 (ja) * 2015-09-24 2020-03-04 東京エレクトロン株式会社 ステージ装置及びプローブ装置
CN105607428B (zh) * 2015-12-30 2018-04-17 深圳市鑫富宝科技有限公司 一种自动曝光机机构
JP6353487B2 (ja) * 2016-05-26 2018-07-04 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
WO2018180969A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法
CN109240048A (zh) * 2018-11-06 2019-01-18 无锡影速半导体科技有限公司 一种多工位工件台一次曝光成型直写光刻系统
DE102018132001A1 (de) * 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
CN111610699A (zh) * 2019-02-22 2020-09-01 上海微电子装备（集团）股份有限公司 一种掩模对准传感器和光刻机
CN110133470A (zh) * 2019-06-06 2019-08-16 德淮半导体有限公司 晶圆验收处理方法及装置
CN116314001B (zh) * 2023-05-18 2023-07-21 合肥安德科铭半导体科技有限公司 一种衬底封装设备及其封装方法

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Also Published As

Publication number Publication date
JPWO2005015615A1 (ja) 2007-10-04
EP1655765A1 (de) 2006-05-10
US20090251679A1 (en) 2009-10-08
CN1833309A (zh) 2006-09-13
CN101504512A (zh) 2009-08-12
US20060187431A1 (en) 2006-08-24
KR20060054426A (ko) 2006-05-22
EP1995769A1 (de) 2008-11-26
EP1655765A4 (de) 2008-01-30
EP1655765B1 (de) 2009-04-15
CN101504512B (zh) 2012-11-14
JP2009147385A (ja) 2009-07-02
WO2005015615A1 (ja) 2005-02-17
KR101181684B1 (ko) 2012-09-19
DE602004020634D1 (de) 2009-05-28
TW200511390A (en) 2005-03-16
CN100468624C (zh) 2009-03-11
US20100177295A1 (en) 2010-07-15
TWI343594B (de) 2011-06-11
JP5152067B2 (ja) 2013-02-27
KR20110106424A (ko) 2011-09-28
KR101205263B1 (ko) 2012-11-27
JP4552146B2 (ja) 2010-09-29

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