DE602006002955D1 - Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger - Google Patents

Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger

Info

Publication number
DE602006002955D1
DE602006002955D1 DE602006002955T DE602006002955T DE602006002955D1 DE 602006002955 D1 DE602006002955 D1 DE 602006002955D1 DE 602006002955 T DE602006002955 T DE 602006002955T DE 602006002955 T DE602006002955 T DE 602006002955T DE 602006002955 D1 DE602006002955 D1 DE 602006002955D1
Authority
DE
Germany
Prior art keywords
substrate
processing
producing
component
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006002955T
Other languages
English (en)
Inventor
Erich Thallner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE602006002955D1 publication Critical patent/DE602006002955D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
    • G03F9/7061—Scanning probe microscopy, e.g. AFM, scanning tunneling microscopy

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
DE602006002955T 2006-03-08 2006-03-08 Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger Active DE602006002955D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06004734A EP1832933B1 (de) 2006-03-08 2006-03-08 Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger

Publications (1)

Publication Number Publication Date
DE602006002955D1 true DE602006002955D1 (de) 2008-11-13

Family

ID=36782507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006002955T Active DE602006002955D1 (de) 2006-03-08 2006-03-08 Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger

Country Status (4)

Country Link
EP (1) EP1832933B1 (de)
JP (4) JP4908270B2 (de)
AT (1) ATE409893T1 (de)
DE (1) DE602006002955D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9478501B2 (en) 2006-03-08 2016-10-25 Erich Thallner Substrate processing and alignment
NL1036215A1 (nl) * 2007-12-11 2009-06-15 Asml Netherlands Bv Lithographic method and carrier substrate.
NL2004735A (en) 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5573054B2 (ja) * 2009-09-08 2014-08-20 株式会社ニコン 基板処理方法、基板処理装置、及びデバイスの製造方法
DE102015108901A1 (de) * 2015-06-05 2016-12-08 Ev Group E. Thallner Gmbh Verfahren zum Ausrichten von Substraten vor dem Bonden
AU2017353824B2 (en) * 2016-11-03 2021-04-22 Molecular Imprints, Inc. Substrate loading system
WO2019012495A1 (ja) 2017-07-14 2019-01-17 エーエスエムエル ネザーランズ ビー．ブイ． 計測装置
JP7480049B2 (ja) 2018-02-27 2024-05-09 エーファウ・グループ・エー・タルナー・ゲーエムベーハー マークフィールドならびにポジションを特定する方法および装置
KR102578750B1 (ko) * 2018-12-27 2023-09-13 캐논 톡키 가부시키가이샤 얼라인먼트 시스템, 성막 장치, 성막 방법, 및 전자 디바이스 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4861162A (en) * 1985-05-16 1989-08-29 Canon Kabushiki Kaisha Alignment of an object
JPH0269958A (ja) * 1988-09-05 1990-03-08 Nec Corp 半導体ウエーハ用ホルダ
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
JP2001332490A (ja) * 2000-03-14 2001-11-30 Nikon Corp 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
US20020127865A1 (en) * 2001-03-08 2002-09-12 Motorola, Inc. Lithography method for forming semiconductor devices with sub-micron structures on a wafer and apparatus
US6955767B2 (en) * 2001-03-22 2005-10-18 Hewlett-Packard Development Company, Lp. Scanning probe based lithographic alignment
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
JP2005167166A (ja) * 2003-12-01 2005-06-23 Bussan Nanotech Research Institute Inc 位置制御可能なパターン形成装置及び位置制御方法
JP2005215508A (ja) * 2004-01-30 2005-08-11 Nikon Corp 基板及び露光装置並びに露光システム
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP2005317653A (ja) * 2004-04-27 2005-11-10 Nippon Mini Computer System Kk 分散制御型枚葉搬送システム
EP1617293A1 (de) * 2004-07-14 2006-01-18 Universität Kassel Verfahren und Vorrichtung zum Ausrichten von einem ersten Gegenstand zu einem zweiten Gegenstand

Also Published As

Publication number Publication date
JP2011228747A (ja) 2011-11-10
JP2014090180A (ja) 2014-05-15
JP2007300072A (ja) 2007-11-15
JP2015029134A (ja) 2015-02-12
JP4908270B2 (ja) 2012-04-04
EP1832933B1 (de) 2008-10-01
JP6096733B2 (ja) 2017-03-15
EP1832933A1 (de) 2007-09-12
ATE409893T1 (de) 2008-10-15

Similar Documents

Publication Publication Date Title
DE602006002955D1 (de) Verfahren zur Herstellung eines Bauelements und Apparat zur Prozessierung eines Substrats, sowie Substratträger
DE602008004195D1 (de) Verfahren zum Bestimmen der Oberflächengüte eines Trägers und zugehörige Maschine zur Transformation des Trägers
SG141386A1 (en) Method and apparatus for performing model-based opc for pattern decomposed features
ATE550319T1 (de) Verfahren zur herstellung eines aminoacetylpyrrolidincarbonitrilderivats
ATE490037T1 (de) Verfahren zur herstellung einer mikronadel oder eines mikroimplantats
ATE450813T1 (de) Verfahren zur erzeugung eines musters
ATE534454T1 (de) Verfahren zum einbringen einer lösung in eine verdampfungs-kühlanlage
TW200505617A (en) Method and apparatus for removing an edge region of a layer applied to a substrate and for coating a substrate and a substrate
TW200717470A (en) Method and apparatus for manufacturing of magneto-resistance effect element
ATE431963T1 (de) Vorrichtung und verfahren zur oberflächenbehandlung von substraten
DE602006017480D1 (de) Oxidkomplexlaminat, Verfahren zur Herstellung eines Oxidkomplexlaminats und Vorrichtung
DE602006021418D1 (de) Neue organische verbindung und verfahren zur herstellung einer mit radioaktivem halogen markierten organischen verbindung unter anwendung davon
DE60325562D1 (de) Verfahren zur herstellung eines dünnen kautschukglieds, kautschukwalzvorrichtung und kautschukwalzverfahren
ATE511991T1 (de) Verfahren zum separieren von wenigstens zwei brücken eines segmentierten transportsystems für bedruckstoffe
DE602005015399D1 (de) Verfahren zur Herstellung eines ringförmigen Magnetes und Vorrichtung zu deren Herstellung
ATE518256T1 (de) Verfahren zur herstellung eines nitrid-halbleiter-bauelements
ATE424966T1 (de) Vorrichtung zum halten eines turbinenblattes und verfahren zur blattbearbeitung unter der verwendung dieser haltevorrichtung
TW200705117A (en) Measuring apparatus, exposure apparatus, and device manufacturing method
DE602004029691D1 (de) Verfahren zur einführung eines gens in pflanzenmaterial
ATE438649T1 (de) Verfahren zur herstellung von dorzolamid
ATE496902T1 (de) Verfahren zur herstellung eines 1,2- alkylencarbonats
ATE523351T1 (de) Verfahren zur herstellung eines datenträgers und dadurch hergestellter datenträger
DE50303629D1 (de) Vorrichtung zur Behandlung von Biopsieproben sowie Verfahren zu deren Verwendung
ATE477574T1 (de) Optischer datenträger und verfahren zur herstellung eines optischen datenträgers
ATE477887T1 (de) Werkzeug zum bearbeiten von oberflächen und verfahren zur herstellung eines solchen werkzeugs

Legal Events

Date Code Title Description
8364 No opposition during term of opposition