IT1399285B1 - Sistema di lavorazione substrato - Google Patents

Sistema di lavorazione substrato

Info

Publication number
IT1399285B1
IT1399285B1 ITUD2009A000129A ITUD20090129A IT1399285B1 IT 1399285 B1 IT1399285 B1 IT 1399285B1 IT UD2009A000129 A ITUD2009A000129 A IT UD2009A000129A IT UD20090129 A ITUD20090129 A IT UD20090129A IT 1399285 B1 IT1399285 B1 IT 1399285B1
Authority
IT
Italy
Prior art keywords
processing system
substrate processing
substrate
processing
Prior art date
Application number
ITUD2009A000129A
Other languages
English (en)
Inventor
Marco Galiazzo
Andrea Baccini
Tommaso Vercesi
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000129A priority Critical patent/IT1399285B1/it
Priority to EP09736883.1A priority patent/EP2449576B1/en
Priority to KR1020127003141A priority patent/KR20120039695A/ko
Priority to CN200980160266.XA priority patent/CN102473588B/zh
Priority to PCT/EP2009/062845 priority patent/WO2011000442A1/en
Priority to US13/382,043 priority patent/US20120109355A1/en
Priority to JP2012516528A priority patent/JP2012531729A/ja
Priority to TW099121871A priority patent/TWI424581B/zh
Publication of ITUD20090129A1 publication Critical patent/ITUD20090129A1/it
Application granted granted Critical
Publication of IT1399285B1 publication Critical patent/IT1399285B1/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
ITUD2009A000129A 2009-07-03 2009-07-03 Sistema di lavorazione substrato IT1399285B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato
EP09736883.1A EP2449576B1 (en) 2009-07-03 2009-10-02 Substrate processing system
KR1020127003141A KR20120039695A (ko) 2009-07-03 2009-10-02 기판 처리 시스템
CN200980160266.XA CN102473588B (zh) 2009-07-03 2009-10-02 基材处理系统
PCT/EP2009/062845 WO2011000442A1 (en) 2009-07-03 2009-10-02 Substrate processing system
US13/382,043 US20120109355A1 (en) 2009-07-03 2009-10-02 Substrate processing system
JP2012516528A JP2012531729A (ja) 2009-07-03 2009-10-02 基板処理システム
TW099121871A TWI424581B (zh) 2009-07-03 2010-07-02 基材處理系統及處理基材之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato

Publications (2)

Publication Number Publication Date
ITUD20090129A1 ITUD20090129A1 (it) 2011-01-04
IT1399285B1 true IT1399285B1 (it) 2013-04-11

Family

ID=41683198

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato

Country Status (8)

Country Link
US (1) US20120109355A1 (it)
EP (1) EP2449576B1 (it)
JP (1) JP2012531729A (it)
KR (1) KR20120039695A (it)
CN (1) CN102473588B (it)
IT (1) IT1399285B1 (it)
TW (1) TWI424581B (it)
WO (1) WO2011000442A1 (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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CN102393609B (zh) * 2011-11-12 2014-03-05 哈尔滨工业大学 过梁式单/双导轨双驱步进扫描双工件台交换装置与方法
DE102012205252A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
DE102012205249A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
ITUD20120061A1 (it) * 2012-04-13 2013-10-14 Applied Materials Italia Srl Procedimento per il controllo di uno schema stampato su un substrato
KR101471130B1 (ko) * 2013-07-16 2014-12-11 숭실대학교산학협력단 평면 모터 장치 및 이를 이용한 공정 장치
KR102176282B1 (ko) 2013-07-25 2020-11-09 삼성전기주식회사 PCB 로딩/언로딩(loading/unloading) 장치
CN103779244B (zh) * 2014-01-21 2017-06-13 谢创 一种板上芯片封装键合自动生产线
CN112103230A (zh) * 2014-12-02 2020-12-18 应用材料意大利有限公司 在生产太阳能电池基板上印刷的装置及传输该基板的方法
TWI676227B (zh) 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
ITUB20161142A1 (it) 2016-02-29 2017-08-29 Vismunda Srl Metodo e impianto produttivo automatico per la stampa su celle fotovoltaiche.
JP6703785B2 (ja) * 2016-05-09 2020-06-03 キヤノン株式会社 基板処理装置、および物品製造方法
WO2018048842A1 (en) * 2016-09-12 2018-03-15 Applied Materials, Inc. Semiconductor process equipment
DE102017204630A1 (de) * 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
KR101951187B1 (ko) * 2017-06-26 2019-04-29 주식회사 에스에프에이 인라인 잉크젯 시스템
US10507991B2 (en) * 2018-05-08 2019-12-17 Applied Materials, Inc. Vacuum conveyor substrate loading module
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
WO2020072507A1 (en) 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
CN111730968B (zh) * 2020-08-05 2021-06-18 苏州迈为科技股份有限公司 印刷装置
TWI767828B (zh) * 2021-08-27 2022-06-11 開必拓數據股份有限公司 應用於具有卷對卷機構的設備的馬達控制系統

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JPH10223527A (ja) * 1996-12-06 1998-08-21 Nikon Corp 露光装置
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JP3626504B2 (ja) * 1997-03-10 2005-03-09 アーエスエム リソグラフィ ベスローテン フェンノートシャップ 2個の物品ホルダを有する位置決め装置
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ITUD20070195A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Procedimento di produzione e controllo di piastre per elettronica e relativo apparato
JP2009136065A (ja) * 2007-11-29 2009-06-18 Canon Inc 平面モータおよびそれを用いたステージ
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JP4871337B2 (ja) * 2008-09-18 2012-02-08 Nskテクノロジー株式会社 露光装置
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Also Published As

Publication number Publication date
ITUD20090129A1 (it) 2011-01-04
TWI424581B (zh) 2014-01-21
TW201110403A (en) 2011-03-16
JP2012531729A (ja) 2012-12-10
KR20120039695A (ko) 2012-04-25
CN102473588A (zh) 2012-05-23
US20120109355A1 (en) 2012-05-03
EP2449576B1 (en) 2017-01-25
CN102473588B (zh) 2015-06-03
WO2011000442A1 (en) 2011-01-06
EP2449576A1 (en) 2012-05-09

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