IT1399285B1 - Sistema di lavorazione substrato - Google Patents
Sistema di lavorazione substratoInfo
- Publication number
- IT1399285B1 IT1399285B1 ITUD2009A000129A ITUD20090129A IT1399285B1 IT 1399285 B1 IT1399285 B1 IT 1399285B1 IT UD2009A000129 A ITUD2009A000129 A IT UD2009A000129A IT UD20090129 A ITUD20090129 A IT UD20090129A IT 1399285 B1 IT1399285 B1 IT 1399285B1
- Authority
- IT
- Italy
- Prior art keywords
- processing system
- substrate processing
- substrate
- processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000129A IT1399285B1 (it) | 2009-07-03 | 2009-07-03 | Sistema di lavorazione substrato |
EP09736883.1A EP2449576B1 (en) | 2009-07-03 | 2009-10-02 | Substrate processing system |
KR1020127003141A KR20120039695A (ko) | 2009-07-03 | 2009-10-02 | 기판 처리 시스템 |
CN200980160266.XA CN102473588B (zh) | 2009-07-03 | 2009-10-02 | 基材处理系统 |
PCT/EP2009/062845 WO2011000442A1 (en) | 2009-07-03 | 2009-10-02 | Substrate processing system |
US13/382,043 US20120109355A1 (en) | 2009-07-03 | 2009-10-02 | Substrate processing system |
JP2012516528A JP2012531729A (ja) | 2009-07-03 | 2009-10-02 | 基板処理システム |
TW099121871A TWI424581B (zh) | 2009-07-03 | 2010-07-02 | 基材處理系統及處理基材之方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000129A IT1399285B1 (it) | 2009-07-03 | 2009-07-03 | Sistema di lavorazione substrato |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20090129A1 ITUD20090129A1 (it) | 2011-01-04 |
IT1399285B1 true IT1399285B1 (it) | 2013-04-11 |
Family
ID=41683198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD2009A000129A IT1399285B1 (it) | 2009-07-03 | 2009-07-03 | Sistema di lavorazione substrato |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120109355A1 (it) |
EP (1) | EP2449576B1 (it) |
JP (1) | JP2012531729A (it) |
KR (1) | KR20120039695A (it) |
CN (1) | CN102473588B (it) |
IT (1) | IT1399285B1 (it) |
TW (1) | TWI424581B (it) |
WO (1) | WO2011000442A1 (it) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102393609B (zh) * | 2011-11-12 | 2014-03-05 | 哈尔滨工业大学 | 过梁式单/双导轨双驱步进扫描双工件台交换装置与方法 |
DE102012205252A1 (de) | 2012-03-30 | 2013-10-02 | JRT Photovoltaics GmbH & Co. KG | Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten |
DE102012205249A1 (de) | 2012-03-30 | 2013-10-02 | JRT Photovoltaics GmbH & Co. KG | Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten |
ITUD20120061A1 (it) * | 2012-04-13 | 2013-10-14 | Applied Materials Italia Srl | Procedimento per il controllo di uno schema stampato su un substrato |
KR101471130B1 (ko) * | 2013-07-16 | 2014-12-11 | 숭실대학교산학협력단 | 평면 모터 장치 및 이를 이용한 공정 장치 |
KR102176282B1 (ko) | 2013-07-25 | 2020-11-09 | 삼성전기주식회사 | PCB 로딩/언로딩(loading/unloading) 장치 |
CN103779244B (zh) * | 2014-01-21 | 2017-06-13 | 谢创 | 一种板上芯片封装键合自动生产线 |
CN112103230A (zh) * | 2014-12-02 | 2020-12-18 | 应用材料意大利有限公司 | 在生产太阳能电池基板上印刷的装置及传输该基板的方法 |
TWI676227B (zh) | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | 半導體工藝設備 |
ITUB20161142A1 (it) | 2016-02-29 | 2017-08-29 | Vismunda Srl | Metodo e impianto produttivo automatico per la stampa su celle fotovoltaiche. |
JP6703785B2 (ja) * | 2016-05-09 | 2020-06-03 | キヤノン株式会社 | 基板処理装置、および物品製造方法 |
WO2018048842A1 (en) * | 2016-09-12 | 2018-03-15 | Applied Materials, Inc. | Semiconductor process equipment |
DE102017204630A1 (de) * | 2017-03-20 | 2018-09-20 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung |
KR101951187B1 (ko) * | 2017-06-26 | 2019-04-29 | 주식회사 에스에프에이 | 인라인 잉크젯 시스템 |
US10507991B2 (en) * | 2018-05-08 | 2019-12-17 | Applied Materials, Inc. | Vacuum conveyor substrate loading module |
DE102018210558A1 (de) * | 2018-06-28 | 2019-02-28 | Heidelberger Druckmaschinen Ag | Druckvorrichtung mit einem Planarmotorsystem |
WO2020072507A1 (en) | 2018-10-04 | 2020-04-09 | Applied Materials, Inc. | Transport system |
US11521870B2 (en) * | 2020-07-08 | 2022-12-06 | Applied Materials, Inc. | Annealing chamber |
CN111730968B (zh) * | 2020-08-05 | 2021-06-18 | 苏州迈为科技股份有限公司 | 印刷装置 |
TWI767828B (zh) * | 2021-08-27 | 2022-06-11 | 開必拓數據股份有限公司 | 應用於具有卷對卷機構的設備的馬達控制系統 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5715064A (en) * | 1994-06-17 | 1998-02-03 | International Business Machines Corporation | Step and repeat apparatus having enhanced accuracy and increased throughput |
JP3501559B2 (ja) * | 1995-06-27 | 2004-03-02 | キヤノン株式会社 | リニア・モータ装置 |
JPH10223527A (ja) * | 1996-12-06 | 1998-08-21 | Nikon Corp | 露光装置 |
WO1998028665A1 (en) * | 1996-12-24 | 1998-07-02 | Koninklijke Philips Electronics N.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
JP3626504B2 (ja) * | 1997-03-10 | 2005-03-09 | アーエスエム リソグラフィ ベスローテン フェンノートシャップ | 2個の物品ホルダを有する位置決め装置 |
US6206964B1 (en) * | 1997-11-10 | 2001-03-27 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
JP2001057325A (ja) * | 1999-08-17 | 2001-02-27 | Nikon Corp | ステージ装置及び露光装置 |
EP1111471B1 (en) * | 1999-12-21 | 2005-11-23 | ASML Netherlands B.V. | Lithographic projection apparatus with collision preventing device |
JP2002116239A (ja) * | 2000-10-06 | 2002-04-19 | Yokogawa Electric Corp | デバイス検査装置 |
US6927505B2 (en) * | 2001-12-19 | 2005-08-09 | Nikon Corporation | Following stage planar motor |
JP4096359B2 (ja) * | 2003-03-10 | 2008-06-04 | セイコーエプソン株式会社 | 製造対象物の製造装置 |
WO2005015615A1 (ja) * | 2003-08-07 | 2005-02-17 | Nikon Corporation | 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法 |
JP4112472B2 (ja) * | 2003-10-21 | 2008-07-02 | 株式会社東芝 | 半導体装置の製造方法及び半導体装置の製造装置 |
JP4345476B2 (ja) * | 2003-12-26 | 2009-10-14 | 日本精工株式会社 | 露光装置 |
CN100552879C (zh) * | 2004-02-02 | 2009-10-21 | 尼康股份有限公司 | 载台驱动方法及载台装置、曝光装置、及元件制造方法 |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
JP2005294468A (ja) * | 2004-03-31 | 2005-10-20 | Canon Inc | 位置決め装置、露光装置及びデバイス製造方法 |
TWI454859B (zh) * | 2006-03-30 | 2014-10-01 | 尼康股份有限公司 | 移動體裝置、曝光裝置與曝光方法以及元件製造方法 |
US7973910B2 (en) * | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
DE102007003224A1 (de) * | 2007-01-15 | 2008-07-17 | Thieme Gmbh & Co. Kg | Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen |
JP2009049377A (ja) * | 2007-07-24 | 2009-03-05 | Nikon Corp | 移動体駆動システム、露光装置、露光方法、及びデバイス製造方法 |
ITUD20070198A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento |
ITUD20070195A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Procedimento di produzione e controllo di piastre per elettronica e relativo apparato |
JP2009136065A (ja) * | 2007-11-29 | 2009-06-18 | Canon Inc | 平面モータおよびそれを用いたステージ |
US8711327B2 (en) * | 2007-12-14 | 2014-04-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
JP4871337B2 (ja) * | 2008-09-18 | 2012-02-08 | Nskテクノロジー株式会社 | 露光装置 |
US8413578B2 (en) * | 2008-11-19 | 2013-04-09 | Illinois Tool Works Inc. | Modular printing system having vertically separated pass through conveyor system |
-
2009
- 2009-07-03 IT ITUD2009A000129A patent/IT1399285B1/it active
- 2009-10-02 WO PCT/EP2009/062845 patent/WO2011000442A1/en active Application Filing
- 2009-10-02 KR KR1020127003141A patent/KR20120039695A/ko not_active Application Discontinuation
- 2009-10-02 US US13/382,043 patent/US20120109355A1/en not_active Abandoned
- 2009-10-02 EP EP09736883.1A patent/EP2449576B1/en not_active Not-in-force
- 2009-10-02 CN CN200980160266.XA patent/CN102473588B/zh not_active Expired - Fee Related
- 2009-10-02 JP JP2012516528A patent/JP2012531729A/ja active Pending
-
2010
- 2010-07-02 TW TW099121871A patent/TWI424581B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ITUD20090129A1 (it) | 2011-01-04 |
TWI424581B (zh) | 2014-01-21 |
TW201110403A (en) | 2011-03-16 |
JP2012531729A (ja) | 2012-12-10 |
KR20120039695A (ko) | 2012-04-25 |
CN102473588A (zh) | 2012-05-23 |
US20120109355A1 (en) | 2012-05-03 |
EP2449576B1 (en) | 2017-01-25 |
CN102473588B (zh) | 2015-06-03 |
WO2011000442A1 (en) | 2011-01-06 |
EP2449576A1 (en) | 2012-05-09 |
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