ATE461799T1 - Verringerung von anziehungskräften zwischen siliziumscheiben - Google Patents
Verringerung von anziehungskräften zwischen siliziumscheibenInfo
- Publication number
- ATE461799T1 ATE461799T1 AT06757883T AT06757883T ATE461799T1 AT E461799 T1 ATE461799 T1 AT E461799T1 AT 06757883 T AT06757883 T AT 06757883T AT 06757883 T AT06757883 T AT 06757883T AT E461799 T1 ATE461799 T1 AT E461799T1
- Authority
- AT
- Austria
- Prior art keywords
- attraction forces
- silicon discs
- reducing attraction
- reducing
- discs
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69545105P | 2005-07-01 | 2005-07-01 | |
PCT/NO2006/000244 WO2007004890A1 (en) | 2005-07-01 | 2006-06-26 | Reduction of attraction forces between silicon wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE461799T1 true ATE461799T1 (de) | 2010-04-15 |
Family
ID=36997754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06757883T ATE461799T1 (de) | 2005-07-01 | 2006-06-26 | Verringerung von anziehungskräften zwischen siliziumscheiben |
Country Status (8)
Country | Link |
---|---|
US (1) | US7967915B2 (de) |
EP (1) | EP1926580B1 (de) |
JP (1) | JP2008545268A (de) |
KR (1) | KR101243268B1 (de) |
CN (1) | CN101213058B (de) |
AT (1) | ATE461799T1 (de) |
DE (1) | DE602006013159D1 (de) |
WO (1) | WO2007004890A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010095627A (ja) * | 2008-10-16 | 2010-04-30 | Denki Kagaku Kogyo Kk | 搬送用組成物及び部材の搬送方法 |
EP2388809A4 (de) * | 2009-01-13 | 2014-07-09 | Watanabe M & Co Ltd | Wafertrennvorrichtung, wafertrenn-/übertragungsvorrichtung, wafertrennverfahren, wafertrenn-/übertragungsverfahren und trenn-/übertragungsverfahren für solarzellenwafer |
DE102010022289A1 (de) * | 2009-09-17 | 2011-05-26 | Gebrüder Decker GmbH & Co. KG | Vorrichtung und Verfahren zum Reinigen von Wafern II |
JP4668350B1 (ja) * | 2010-05-28 | 2011-04-13 | イーティーシステムエンジニアリング株式会社 | 半導体ウェーハの分離装置 |
JP5619542B2 (ja) * | 2010-09-08 | 2014-11-05 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体基板の処理方法及び半導体装置の製造方法 |
JP6114116B2 (ja) * | 2013-05-31 | 2017-04-12 | 信越化学工業株式会社 | 基板処理方法及び太陽電池の製造方法 |
CN216072103U (zh) * | 2020-07-10 | 2022-03-18 | 深圳灵创智能有限公司 | 取料设备 |
JP7441779B2 (ja) | 2020-12-14 | 2024-03-01 | クアーズテック徳山株式会社 | 被加工物の切断方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2655173B2 (ja) * | 1988-07-14 | 1997-09-17 | エムテック株式会社 | 半導体ウェーハの分離方法及び装置 |
DE4100526A1 (de) * | 1991-01-10 | 1992-07-16 | Wacker Chemitronic | Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben |
JP3524267B2 (ja) * | 1996-06-04 | 2004-05-10 | 三菱マテリアル株式会社 | ウェハの剥離装置 |
JPH1022239A (ja) * | 1996-06-29 | 1998-01-23 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法およびその洗浄装置 |
JP3494202B2 (ja) * | 1997-09-30 | 2004-02-09 | 荒川化学工業株式会社 | ウェハー状ワーク洗浄方法並びに当該洗浄方法に用いる洗浄バスケット及び洗浄ハウジング |
US6210795B1 (en) * | 1998-10-26 | 2001-04-03 | Nashua Corporation | Heat-sealable adhesive label with spacer particles |
FR2788375B1 (fr) * | 1999-01-11 | 2003-07-18 | Gemplus Card Int | Procede de protection de puce de circuit integre |
JP2000208449A (ja) * | 1999-01-12 | 2000-07-28 | Mitsubishi Materials Corp | ウェ―ハの剥離方法および剥離装置 |
JP4578637B2 (ja) * | 2000-07-24 | 2010-11-10 | サムコ オレゴン コーポレーション | 間隔保持具及びこれを用いた切断方法 |
JP2003100667A (ja) * | 2001-09-27 | 2003-04-04 | Itec Co Ltd | ウエハ状ワークの分離洗浄方法及び分離洗浄装置 |
DE10220468A1 (de) * | 2002-05-07 | 2003-11-20 | Scanwafer Gmbh | Verfahren und Vorrichtung zur Reinigung von Wafern |
-
2006
- 2006-06-26 KR KR1020077031035A patent/KR101243268B1/ko active IP Right Grant
- 2006-06-26 DE DE602006013159T patent/DE602006013159D1/de active Active
- 2006-06-26 JP JP2008519199A patent/JP2008545268A/ja active Pending
- 2006-06-26 EP EP06757883A patent/EP1926580B1/de active Active
- 2006-06-26 AT AT06757883T patent/ATE461799T1/de not_active IP Right Cessation
- 2006-06-26 WO PCT/NO2006/000244 patent/WO2007004890A1/en active Application Filing
- 2006-06-26 US US11/988,132 patent/US7967915B2/en active Active
- 2006-06-26 CN CN2006800242555A patent/CN101213058B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US7967915B2 (en) | 2011-06-28 |
JP2008545268A (ja) | 2008-12-11 |
CN101213058B (zh) | 2012-04-25 |
KR101243268B1 (ko) | 2013-03-13 |
EP1926580B1 (de) | 2010-03-24 |
WO2007004890A1 (en) | 2007-01-11 |
DE602006013159D1 (de) | 2010-05-06 |
CN101213058A (zh) | 2008-07-02 |
US20090117713A1 (en) | 2009-05-07 |
KR20080042773A (ko) | 2008-05-15 |
EP1926580A1 (de) | 2008-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |