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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW095105011ApriorityCriticalpatent/TW200731020A/en
Publication of TW200731020ApublicationCriticalpatent/TW200731020A/en
A method of semiconductor exposure is provided for exposing a wafer with a semiconductor exposure apparatus. The semiconductor exposure apparatus at least consists of an exposure lens, a stage for supporting the wafer, and a liquid circulating equipment, wherein the liquid circulating equipment applies a liquid between the wafer and the exposure lens during exposure. The feature is to use at least an alignment light source to perform an alignment operation for the stage before exposure, wherein the alignment light source has a particular wavelength which minimizes the effect on the alignment light source due to the evaporation of the liquid, thereby preventing the alignment operation from impacting by the liquid.
TW095105011A2006-02-152006-02-15Methods of semiconductor exposure and controlling the semiconductor exposure apparatus
TW200731020A
(en)